Immersed evaporator

Abstract

The utility model discloses an immersed evaporator which comprises a base, a flow channel structure and a liquid supplementing structure are arranged on the surface of the base, the liquid supplementing structure is communicated with the flow channel structure, and the flow channel structure is covered with a film covering layer which is made of porous medium materials and is communicated in a one-way mode. According to the immersed evaporator, liquid is supplemented in time, cooling liquid is kept in the flow channel structure, the heat dissipation effect of the evaporator is improved, and the problem that in the prior art, heat dissipation of high heat flux of a data center is difficult to meet is solved.

Description

Technical Field

[0001] This utility model relates to the field of refrigeration technology, and in particular to an immersion evaporator. Background Technology

[0002] Since its emergence, immersion liquid cooling for data centers has seen its market share steadily increase. Given the current heat generation capacity of data centers, almost all systems used in the market are single-phase immersion liquid cooling systems. However, as data centers evolve towards higher power densities, single-phase immersion liquid cooling systems are approaching their heat dissipation limits. Phase change immersion liquid cooling systems, due to their boiling heat transfer characteristics, can achieve a higher heat transfer coefficient and a higher heat dissipation limit, making them a new trend in future data center cooling. However, as the computing power of data center chips increases, so does the heat generated. If not dissipated in time, heat accumulation leads to temperature rise, which can cause chip failure. The key to phase change immersion liquid cooling systems lies in the evaporator; its performance directly determines the performance and reliability of the data center. The evaporator is attached to the data center's chips, and the heat generated by the chips is transferred to the evaporator. The evaporator is immersed in the immersion liquid, which enters the evaporator's interior. Inside the evaporator, the immersion liquid absorbs heat and generates steam, forming numerous bubbles that carry away heat through a physical phase change, thus removing the heat transferred from the data center's chips. The current phase change immersion liquid cooling system suffers from the evaporator drying out of the internal immersion liquid under high heat flux density. If the liquid is not replenished in time, it will be difficult to meet the heat dissipation problem of high heat flux density in data centers. The heat dissipation effect is not ideal, and the data center will operate at high temperature for a long time. Utility Model Content

[0003] The purpose of this invention is to provide an immersion evaporator. After the evaporator is immersed in coolant, the coolant enters the flow channel structure from the replenishment structure, keeping the evaporator always filled with coolant. This improves the heat dissipation and cooling effect of the evaporator, removes the heat generated by the high-power devices attached to the evaporator, and has a good heat dissipation effect, meeting the heat dissipation requirements of high heat flux density in data centers.

[0004] To solve the above-mentioned technical problems, the technical solution provided by this utility model is: an immersion evaporator, including a base, the surface of which is provided with a flow channel structure and a liquid replenishment structure, the liquid replenishment structure being connected to the flow channel structure, and the flow channel structure being covered with a unidirectional membrane layer made of porous media material.

[0005] This invention employs the aforementioned technical solution. The base is designed to contact high-power devices in the data center, transferring heat generated by these devices to the base. The base is placed in coolant, which enters the flow channel structure through a replenishment structure. Within the flow channel structure, the coolant absorbs heat from the base. The vapor generated by the heated coolant during heat exchange can permeate and overflow through a unidirectional conductive coating layer. This allows for timely replenishment of coolant from the replenishment structure into the flow channel structure, carrying away heat transferred from the high-power devices and effectively improving the evaporator's heat dissipation performance, meeting the high heat flux density requirements of the data center. Furthermore, while the evaporator is immersed in coolant, the internal flow channel structure maintains a continuous supply of coolant, further enhancing the heat dissipation limit.

[0006] The aforementioned submerged evaporator has a coating layer comprising a microporous membrane and a fixed membrane covering the microporous membrane. During operation, the microporous membrane overflows with steam generated by the coolant during heat exchange. The fixed membrane, while fixing the microporous membrane, also functions as a unidirectional flow barrier, allowing only gas to pass through while preventing liquid from flowing across its surface. This unidirectional design ensures that only steam and liquid can overflow, preventing backflow into the flow channel structure. This allows coolant to flow from the replenishment structure into the flow channel structure, while steam is generated within the flow channel structure and permeates unidirectionally from both the coating layer and the fixed membrane, overflowing from the outside of the evaporator and carrying away heat.

[0007] The aforementioned submersible evaporator features a flow channel structure formed by creating grooved microchannels, recessed fins, or etched channels on the base surface. Compared to slotted structures with smooth surfaces, this grooved microchannel structure increases the contact area with the coolant. Furthermore, the flow channel structure can be fabricated as recessed fins or etched channels on the base surface, further expanding the contact area between the base and the coolant and improving heat exchange efficiency.

[0008] The aforementioned submerged evaporator features a micro-nano structure surface treatment. This micro-nano structure treatment further increases the surface area of ​​the flow channel structure and the contact area between the flow channel structure and the coolant, thereby further increasing the heat exchange surface area and improving heat exchange efficiency.

[0009] The aforementioned submerged evaporator includes a liquid inlet channel in its replenishment structure. These channels are arranged side-by-side on the base and communicate with the flow channel structure. The liquid inlet channel is used to introduce coolant and is submerged in the coolant to ensure timely replenishment of the coolant to the flow channel structure for heat exchange.

[0010] The aforementioned submersible evaporator has uniformly distributed grooves on its base surface. The bottom of the liquid inlet channel is close to the grooves, and the gaps between them form microchannels. Coolant is introduced into the microchannels through the liquid inlet channel. The flow channel structure is formed by the cooperation between the liquid inlet channel and the grooves. The bottom cross-section of the grooves in the flow channel structure can be set as rectangular or arc-shaped. The uniform distribution of grooves can increase the surface area of ​​the flow channel structure, thereby improving heat exchange efficiency and heat dissipation effect.

[0011] In the aforementioned submersible evaporator, grooved microchannels are evenly distributed on the base surface. The bottom of the liquid inlet channel has several slots that fit the sidewalls of the grooves. These slots are inserted into the grooves, with a gap between the slot and the bottom wall of the groove. The insertion of the slots into the grooves ensures a tight connection between the liquid inlet channel and the grooved microchannels. The gap between the slots and the grooves allows coolant to pass through, resulting in high fluidity of the coolant within the grooved microchannels and effectively preventing poor fluidity from affecting heat dissipation.

[0012] The aforementioned submerged evaporator has a mounting bracket on its base, and the liquid inlet channel is embedded in the mounting bracket. The mounting bracket includes a horizontal mounting plate and vertical mounting plates positioned opposite each other at both ends of the horizontal mounting plate. The horizontal mounting plate has a first groove on its inner side, and the vertical mounting plate has a second groove. The liquid inlet channel is fixed in place by the first and second grooves. With the first and second grooves, the top end of the liquid inlet channel is embedded in the second groove, and the bottom end is embedded in the first groove, thus completing the installation of the liquid inlet channel and making installation and fixation convenient.

[0013] In the aforementioned submersible evaporator, a liquid suction core and / or a support column can be arranged within the hollow cavity of the liquid inlet channel. The liquid suction core serves to absorb liquid, while the support column supports the liquid inlet channel and strengthens the structural integrity; the liquid suction core and / or support column guides the coolant into the flow channel structure.

[0014] The aforementioned submerged evaporator has replenishment structure holes on the coating layer and the fixed membrane to accommodate the liquid inlet channel. These replenishment structure holes on the coating layer and the fixed membrane are designed to accommodate the installation of the liquid inlet channel.

[0015] The beneficial effects of this invention are as follows: A simplified structure is adopted, ensuring that the coolant in the flow channel is maintained through the replenishment of the liquid by the replenishment structure, preventing it from drying out during the evaporator's dissipation of heat from high-power devices; the membrane layer made of porous dielectric material enhances heat exchange, and in conjunction with the fixed membrane, it allows only gas to overflow while preventing external liquid from seeping into the evaporator, ensuring the effectiveness of the unidirectional gas-liquid inlet / outlet channel; due to the connection between the liquid inlet structure and the flow channel structure, the liquid inlet structure can continuously introduce coolant into the flow channel structure, carrying away the heat generated by the CPU from the high-power devices through heat exchange, resulting in excellent heat dissipation. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural diagram of an immersion evaporator according to an embodiment of the present invention;

[0017] Figure 2 This is a cross-sectional structural diagram of an immersion evaporator according to an embodiment of the present invention;

[0018] Figure 3 yes Figure 2 An enlarged structural view of position A in a cross-sectional structural diagram of an immersion evaporator according to an embodiment of the present invention;

[0019] Figure 4 This is a top view of an embodiment of the present invention without a fixing membrane.

[0020] Figure 5 yes Figure 4 A schematic diagram of the cross-sectional structure in the AA direction;

[0021] Figure 6 yes Figure 4 A schematic diagram of the cross-sectional structure in the BB direction;

[0022] Figure 7 This is a schematic diagram of the base structure in an embodiment of this utility model;

[0023] Figure 8 yes Figure 7 Enlarged view of the partial structure of the central base at position B;

[0024] Figure 9 This is a cross-sectional view of the assembly structure of the liquid replenishment structure and the flow channel structure of an immersion evaporator according to the present invention;

[0025] Figure 10 yes Figure 9 Enlarged structural diagram at position C;

[0026] Figure 11 This is a schematic diagram of the structure of the coating layer in an embodiment of this utility model;

[0027] Figure 12 This is a schematic diagram of the structure of the fixing membrane in an embodiment of this utility model;

[0028] Figure 13 This is a schematic diagram of the liquid inlet channel in an embodiment of this utility model;

[0029] Figure 14 This is a structural schematic diagram of the fixing frame in an embodiment of this utility model.

[0030] Explanation of reference numerals in the attached drawings: Base 1, Fixing frame 11, Horizontal fixing plate 111, Vertical fixing plate 112, First groove 113, Second groove 114, Separator plate 115, Flow channel structure 2, Groove microchannel 21, Groove 22, Liquid replenishment structure 3, Liquid inlet channel 31, Groove opening 32, Coating layer 4, Fixing membrane 5, Liquid replenishment structure hole 6, High-power device 7. Detailed Implementation

[0031] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0032] Reference Figures 1 to 14 As shown, an immersion evaporator includes a base 1, wherein the back of the base 1 is in contact with a high-power device 7 in a data center, and the heat generated by the high-power device 7 during operation is transferred to the base 1. The contact surface between the base 1 and the high-power device 7 is indirectly in contact through thermally conductive silicone grease, which better facilitates the transfer of heat generated by the high-power device 7 to the base 1. In use, the evaporator is placed in a coolant, so that the base 1 is immersed in the coolant. A flow channel structure 2 and a liquid replenishment structure 3 are provided on the surface of the base 1. The liquid replenishment structure 3 connects to the flow channel structure 2 and the coolant-immersed liquid replenishment structure 3, allowing the coolant to enter the flow channel structure 2 from the liquid replenishment structure 3, so that the coolant can flow into the flow channel structure 2 on the base 1 in a timely manner. The flow channel structure 2 is covered with a unidirectional conductive coating layer 4 made of a porous dielectric material. Coolant enters the flow channel structure 2 to cool the base 1. After absorbing heat, the coolant forms steam, which then overflows from the coating layer 4 into the evaporator, thereby carrying away the heat transferred from the high-power device 7 to the base 1.

[0033] In this embodiment, when the pore size of the porous medium material in the coating layer 4 is smaller than a certain threshold, the liquid surface tension makes it difficult for the liquid to pass freely through the small pores. For water media, the pore size of the porous medium material is generally 5-10 μm (micrometers), which allows the coating layer 4 to have a unidirectional conduction function, allowing only gas to pass through but not liquid water. When the coolant is deionized water, a copper mesh with a mesh size of 200 or higher can be used as the porous medium material, which can also achieve the unidirectional conduction function of the coating layer 4.

[0034] In this embodiment, the base 1 can be made of copper, with its surface covered by flow channel structures 2, and pre-drilled screw holes for mating with the high-power device 7. The base 1 and the high-power device 7 can be connected and fixed by screws. In other embodiments, the base 1 and the high-power device 7 can also be connected and fixed by other methods, such as snap-fit ​​connection, bonding, or welding.

[0035] like Figure 7 and 8As shown, in this embodiment, a flow channel structure 2 is formed by forming grooved microchannels 21, recessed fins, or etched flow channels on the surface of the base 1. The grooved microchannels 21 are formed on the surface of the base 1, increasing the surface area and creating several alternating grooves. The recessed fins are sheet-like structures machined on the surface of the base 1, arranged side-by-side, increasing the surface area of ​​the base 1 and expanding the contact area with the coolant. The etched flow channels are formed on the surface of the base 1 through chemical reactions or physical impacts, creating an uneven surface structure that increases the surface area of ​​the base 1 and thus expands the contact area between the coolant and the base 1 surface. The flow channel structure 2 improves the contact area between the base 1 and the coolant, resulting in better heat dissipation.

[0036] Furthermore, the surface of the flow channel structure 2 undergoes micro / nano-structure processing. The depth and width of the trench microchannels 21, sunken fins, or etched flow channels on the surface of the base 1 can be rationally designed according to actual heat dissipation requirements. When high heat dissipation efficiency is required, their depth and width can be increased. By processing the surface of the flow channel structure 2 with micro / nano-structure technology, the surface area of ​​the flow channel structure 2 is further increased, allowing for better heat exchange upon contact with the coolant, removing more heat, improving heat conversion efficiency, and enhancing heat dissipation. The flow channel structure 2 includes, but is not limited to, microchannels, sunken fins, etched flow channels, and other microstructures. Figure 3 As shown, the flow channel structure 2 is formed on the surface of the base 1. The bottom of the liquid replenishment structure 3 is connected to the flow channel structure 2 and maintains a certain gap. Multiple liquid replenishment structures 3 arranged side by side are connected to each other through the flow channel structure 2 to form a channel for the flow of coolant, which improves the fluidity of coolant on the surface of the flow channel structure 2 and the area through which it flows.

[0037] like Figure 2As shown, the coating layer 4 includes a microporous membrane and a fixed membrane 5 covering the microporous membrane. The microporous membrane is made of AAO membrane, copper mesh, or foam layer, and the fixed membrane 5 is made of polytetrafluoroethylene membrane, PE membrane, or PVA membrane. Specifically, the porous media material of the coating layer 4 is made of AAO membrane or copper mesh or foam copper structure with different mesh sizes, and the fixed membrane 5 made of polytetrafluoroethylene membrane, PE membrane, or PVA membrane covers the coating layer 4. Among them, the AAO membrane is an inorganic alumina filter membrane, which allows gas and liquid to pass through its surface; the mesh size of the copper mesh or foam copper can be freely selected. When used in fluorinated liquid, the mesh size of the copper mesh or foam copper can be selected as 300 mesh, which also allows gas and liquid to pass through the surface of the copper mesh or foam copper. In practical use, the steam generated by the coolant in this embodiment needs to be discharged outside the base 1 to carry away heat and prevent heat accumulation that would affect the heat dissipation effect. The coating layer 4, made of AAO membrane, allows gas to pass through, and steam can overflow from the inside of the coating layer 4 to the outside of the evaporator. The coolant absorbs the heat transferred from the high-power device 7 on the base 1, and after generating steam, the steam overflows outside the base 1, carrying away the heat exchanged between the coolant and the base 1. To prevent the coolant from seeping into the flow channel structure 2 from the outside of the coating layer 4 and hindering steam evaporation, a fixing membrane 5 made of polytetrafluoroethylene (PTFE), PE, or PVA film is provided on the coating layer 4. This prevents the coolant from seeping into the flow channel structure 2 from the coating layer 4, allowing only unidirectional steam flow to the outside of the coating layer 4 to carry away the heat generated and transferred by the high-power device 7. The material of the fixing membrane 5 includes, but is not limited to, PTFE, PE, and PVA film.

[0038] like Figure 11 and 12 As shown, the coating layer 4 is provided with a replenishment structure hole 6 adapted to the liquid inlet channel 31. Accordingly, the liquid inlet channel 31 passes through the replenishment structure hole 6 and communicates with the flow channel structure 2.

[0039] In this embodiment, the fixing membrane 5 is a polytetrafluoroethylene (PTFE) membrane, and liquid replenishment structure pores 6 are pre-drilled on its surface. The PTFE membrane selected for fixing membrane 5 has 1.4 billion micropores / cm². 2 The pore size ranges from 0.1μm to 0.5μm.

[0040] The liquid replenishment structure 3 includes a hollow liquid inlet channel 31, which is arranged side-by-side on the base 1 and is connected to the flow channel structure 2. For example... Figure 11As shown, in this embodiment, the liquid inlet channel 31 is a hollow, flat cuboid structure with openings at both ends in the direction of coolant flow, forming a liquid inlet channel 31 through the hollow cavity. The liquid inlet channel 31 is surrounded by square plates, forming a hollow cuboid structure. In other embodiments, the liquid inlet channel 31 can also be configured in other shapes. Its function is to allow coolant to enter the evaporator through the liquid inlet channel 31 to achieve heat exchange when the evaporator is immersed in coolant. In other embodiments, the liquid inlet channel 31 can be in the shape of a circular tube, elliptical tube, square tube, etc.

[0041] like Figure 9 and Figure 10 As shown, the base 1 has uniformly arranged grooves 22 on its surface. The bottom of the liquid inlet channel 31 is close to the grooves 22, and the gap between them forms a groove microchannel 21. The liquid inlet channel 31 introduces coolant into the groove microchannel 21. The cross-section of the bottom of the groove of the flow channel structure 2 is rectangular or arc-shaped.

[0042] The grooved microchannels 21 are evenly distributed on the surface of the base 1. The bottom of the liquid inlet channel 31 is provided with several slots 32 that are adapted to the sidewalls of the grooves 22. The slots 32 are inserted into the grooves 22 and there is a gap between the slots 32 and the bottom wall of the grooves 22.

[0043] The slot 32 at the bottom of the liquid inlet channel 31 is used to fit into the groove 22. The side wall of the slot 32 and the side wall of the groove 22 fit together and engage. A gap is maintained between the slot 32 and the bottom wall of the groove 22, so that the coolant entering from the liquid inlet channel 31 can flow in the groove microchannel 21 and also in the gap between the groove 22 and the slot 32, which improves the fluidity, heat exchange efficiency and heat dissipation effect.

[0044] like Figure 1 As shown, a fixing frame 11 is provided on the base 1, and the liquid inlet channel 31 is embedded in the fixing frame 11.

[0045] See Figure 14The fixing frame 11 includes a horizontal fixing plate 111 and vertical fixing plates 112 disposed opposite to each other at both ends of the horizontal fixing plate 111. The horizontal fixing plate 111 has a first groove 113 on its inner side and a second groove 114 on its vertical fixing plate 112. The horizontal fixing plate 111 and the vertical fixing plate 112 are used to install and fix the liquid inlet channel 31 through the first groove 113 and the second groove 114. Fix the bracket 11 to the base 1. The horizontal fixing plate 111 is set on the surface of the base 1. The first groove 113 is set on the inner side of the horizontal fixing plate 111. The bottom end of the liquid inlet channel 31 of the liquid replenishment structure 3 is inserted into the first groove 113. The vertical fixing plate 112 is assembled. The vertical fixing plate 112 is set with a second groove 114. The second groove 114 is embedded in the top end of the liquid inlet channel 31. The two ends of the vertical fixing plate 112 can extend with connecting plates. Through holes are set on the connecting plates. The vertical fixing plate 112 and the horizontal fixing plate 111 can be connected and fixed by screws passing through the through holes and threaded onto the horizontal fixing plate 111.

[0046] Furthermore, the inner side of the horizontal fixed plate 111 is provided with several partition plates 115, which are arranged parallel to the liquid inlet channel 31. The partition plates can act as structural reinforcing ribs and separate the parallel liquid inlet channels, maintaining a distance between them. When steam overflows from the gaps between the liquid inlet channels, it can prevent heat dissipation from being affected by the small gaps in the liquid inlet channels. A liquid suction core and / or support column can be arranged in the hollow cavity of the liquid inlet channel 31. The liquid suction core can draw in coolant. When the evaporator is immersed in coolant, the coolant enters the flow channel structure 2 through the liquid suction core. The height, wall thickness, width, and other parameters of the liquid inlet channel 31 can be determined based on simulation and measured data.

[0047] Combination Figures 2 to 5 As shown, in a specific implementation of this invention, the evaporator and the high-power device 7 can be connected by screws, and the evaporator and the high-power device 7 are in contact through thermally conductive silicone grease. The heat generated by the high-power device 7 during operation is transferred to the base 1 of the evaporator. The evaporator is placed in coolant, and the coolant enters the flow channel structure 2 through the replenishment structure 3. Figure 3 As shown in the enlarged view, the arrows marked inside the fluid replenishment structure 3 and the flow channel structure 2 indicate the flow direction of the coolant. The coolant enters the flow channel structure 2 to cool the base 1. After absorbing heat, the coolant generates vapor, which escapes and evaporates through the coating layer 4 and the fixed membrane 5, as shown in the enlarged view. Figure 3 As shown, the bar arrows located outside the fixed membrane 5 indicate the evaporation flow direction of the vapor generated by the coolant.

[0048] When the coating layer 4 is made of a material that allows only unidirectional steam passage, such as deionized water as the coolant, a copper mesh with a mesh size of 200 mesh or higher is selected. For water media, the pore size of the porous medium is generally 5-10 μm (micrometers), which allows the coating layer 4 to have unidirectional conduction, allowing only gas to pass through and not liquid water. A fixed membrane 5 may not be necessary. Figure 4 and Figure 5 As shown, steam overflows directly through the membrane layer 4.

[0049] The coolant exchanges heat inside the base 1, and the generated steam is promptly discharged and evaporated, effectively carrying away the heat generated by the high-power device 7 and transferred to the base 1, thus achieving a good cooling and heat dissipation effect.

[0050] This invention features a rational design that ensures a constant supply of coolant inside the evaporator, preventing it from drying out and guaranteeing effective heat dissipation. Steam can be promptly expelled, and the porous media material enhances evaporative heat transfer, achieving a heat flux density of 120 W / cm². 2 In addition, the coating layer 4 and the fixed membrane 5 work together to allow gas to escape, ensuring the effectiveness of the gas-liquid inlet and outlet channel, and providing a good cooling and heat dissipation effect.

[0051] In this specific implementation, the high-power device 7 is connected to the evaporator. Thermal grease is filled between the high-power device 7 and the base 1 to improve heat transfer efficiency. The high-power device 7 and the base 1 can be connected by screws. The evaporator is then placed in a coolant, which can be a fluorinated liquid or deionized water, or other coolants may be added. When the evaporator is submerged in coolant, the coolant enters the evaporator from the top of the replenishment structure 3 and flows into the flow channel structure 2 from the inlet channel 31. The heat transferred from the base 1 via the high-power device 7 exchanges heat with the coolant flowing into the flow channel structure 2. The heated coolant forms vapor and permeates outwards from the coating layer 4, completing the evaporation process. During evaporation, the coolant absorbs and carries away heat from the base 1, lowering its temperature. Due to the temperature difference between the base 1 and the high-power device 7, heat from the high-power device 7 is transferred to the base 1, thus cooling the high-power device 7. Because the replenishment structure 3 is immersed in the coolant, the coolant can be continuously replenished into the flow channel structure 2 as needed, preventing it from drying out. Furthermore, the generated vapor permeates through the coating layer 4 and the fixed membrane 5 and evaporates outwards, preventing it from overflowing from the inlet channel 31. This allows the coolant to enter the flow channel structure 2 from the inlet channel 31, and heat exchange causes the vapor generated by the coolant to overflow and evaporate outwards from the coating layer 4 and the fixed membrane 5, forming a stable flow, improving heat exchange efficiency, and carrying away more heat.

[0052] In summary, this utility model has been manufactured into actual samples as described in the specification and figures, and has undergone multiple use tests. The results of these tests demonstrate that this utility model can achieve its intended purpose, and its practical value is undeniable. The embodiments described above are merely illustrative examples of this utility model and are not intended to limit it in any way. Any person skilled in the art who makes partial modifications or alterations to the technical content disclosed in this utility model without departing from its technical features shall also fall within the scope of this utility model's technical features.

Claims

1. A submersible evaporator, comprising a base (1), characterized in that: The base (1) has a flow channel structure (2) and a liquid replenishment structure (3) on its surface. The liquid replenishment structure (3) is connected to the flow channel structure (2). The flow channel structure (2) is covered with a unidirectional membrane layer (4) made of porous media material.

2. The submersible evaporator according to claim 1, characterized in that: The coating layer (4) includes a microporous membrane and a fixed membrane (5) covering the microporous membrane.

3. The submersible evaporator according to claim 1, characterized in that: The flow channel structure (2) is formed by opening grooves, microchannels, sinking fins, or etching channels on the surface of the base (1).

4. The submersible evaporator according to claim 1 or 3, characterized in that: The surface of the flow channel structure (2) is treated with micro-nano structure technology.

5. The submersible evaporator according to claim 2, characterized in that: The replenishment structure (3) includes a liquid inlet channel (31), which is arranged side by side on the base (1) and is connected to the flow channel structure (2).

6. The submersible evaporator according to claim 5, characterized in that: The base (1) has uniformly arranged grooves (22) on its surface. The bottom of the liquid inlet channel (31) is close to the groove (22), and the gap between them forms a groove microchannel (21). The liquid inlet channel (31) introduces coolant into the groove microchannel (21).

7. The submersible evaporator according to claim 6, characterized in that: The groove microchannels (21) are evenly distributed on the surface of the base (1). The bottom of the liquid inlet channel (31) is provided with a number of slots (32) that are adapted to the sidewall of the groove (22). The slots (32) are connected to the groove (22) and there is a gap between the slots (32) and the bottom wall of the groove (22).

8. The submersible evaporator according to claim 5, characterized in that: The base (1) is provided with a fixing frame (11), and the liquid inlet channel (31) is embedded in the fixing frame (11). The fixing frame (11) includes a horizontal fixing plate (111) and a vertical fixing plate (112) disposed opposite to each other at both ends of the horizontal fixing plate (111). The horizontal fixing plate (111) is provided with a first groove (113) on its opposite inner side, and the vertical fixing plate (112) is provided with a second groove (114). The horizontal fixing plate (111) and the vertical fixing plate (112) are used to install and fix the liquid inlet channel (31) through the first groove (113) and the second groove (114).

9. The submersible evaporator according to claim 5, characterized in that: The hollow cavity of the liquid inlet channel (31) may be equipped with a liquid suction core and / or a support column.

10. The submersible evaporator according to claim 2, characterized in that: The coating layer (4) and the fixing membrane (5) are provided with replenishment structure holes (6) adapted to the liquid inlet channel (31).

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