Chip mounting device with positioning structure

Abstract

The utility model discloses a chip mounting device with a positioning structure, which belongs to the technical field of chip mounting and comprises a base, a first positioning frame is arranged on the top surface of the base, a second positioning frame is arranged on one side of the first positioning frame, a conveying belt is arranged on one side of the top surface of the base, and a support frame is mounted on the top surface of the base. According to the utility model, in the chip mounting process, as the second electric push rod drives the chip to descend, the mounting seat can be driven to descend, and meanwhile, the mounting seat can be in contact with the circuit board firstly, and as the chip continues to descend, the air bag can be extruded through the mounting frame, so that the chip can be mounted on the mounting seat; the air bag is arranged in the air outlet pipe, so that air in the air bag is sprayed out from the air outlet pipe and blows the surface of the circuit board, dust on the surface of the circuit board is blown away, deviation caused by the fact that dust affects the attaching effect during chip attaching is avoided, and attaching accuracy is guaranteed.

Description

Technical Field

[0001] This utility model belongs to the field of chip mounting technology, and in particular relates to a chip mounting device with a positioning structure. Background Technology

[0002] A chip is a silicon wafer containing integrated circuits. It is small in size and is the most important component in computers or other electronic devices. It mainly has the functions of computing and storage, and can process the data input into the computer. In use, it is generally mounted on a circuit board and works with other electronic components to exert its performance.

[0003] When connecting chips to circuit boards, the common practice is to first attach the chip to the circuit board and then use soldering or other methods to connect and fix the chip to the circuit board. However, during the chip mounting process, dust in the air can fall onto the circuit board, resulting in a certain gap between the chip and the circuit board after mounting. This can easily lead to deviations and affect the mounting effect. In order to solve the above problems, there is an urgent need for a chip mounting device with a positioning structure. Utility Model Content

[0004] The purpose of this invention is to solve the problem that dust residue on the circuit board surface causes a tiny gap between the chip and the current board during chip mounting, resulting in deviation. Therefore, this invention proposes a chip mounting device with a positioning structure.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a chip mounting device with a positioning structure, comprising a base, a first positioning frame on the top surface of the base, a second positioning frame on one side of the first positioning frame, a conveyor belt on one side of the top surface of the base, and a support frame mounted on the top surface of the base; a pushing component located on one side of the conveyor belt; and a suction component mounted on the top of the support frame.

[0006] The suction component includes a mounting frame, a suction cup mounted on the bottom surface of the mounting frame, mounting seats slidably mounted on both ends of the mounting frame, an airbag inside the mounting seat, an air outlet pipe mounted on one side of the airbag, and an air guide plate mounted on one side of the mounting seat.

[0007] As a further description of the above technical solution:

[0008] A second electric push rod is mounted on the top surface of the mounting frame, and a movable module is mounted on the top of the second electric push rod. The movable module is located at the top of the support frame.

[0009] As a further description of the above technical solution:

[0010] The mounting bracket has sliders installed at both ends, and the inner wall of the mounting base is provided with limiting grooves corresponding to the sliders.

[0011] As a further description of the above technical solution:

[0012] The airbag is located between the mounting bracket and the mounting base, the air outlet pipe passes through one side of the mounting base, and a protective pad is installed at the bottom of the mounting base.

[0013] As a further description of the above technical solution:

[0014] The pushing component includes a mounting plate, a guide plate is mounted on one side of the mounting plate, and a push plate is provided on the top surface of the guide plate.

[0015] As a further description of the above technical solution:

[0016] Connecting blocks are installed at both ends of the push plate, and a spring is installed on one side of the mounting plate. The other end of the spring is fixedly connected to the push plate.

[0017] As a further description of the above technical solution:

[0018] The push plate has a telescopic end of a first electric push rod installed on one side. The telescopic end of the first electric push rod passes through the mounting plate, and one end of the first electric push rod is fixedly connected to one side of the base.

[0019] As a further description of the above technical solution:

[0020] The mounting plate, guide plate, and push plate are all slidably connected to the base through a groove on one side of the base, and the guide plate corresponds to the second positioning frame.

[0021] In summary, due to the adoption of the above technical solution, the beneficial effects of this utility model are:

[0022] 1. In this utility model, during the chip mounting process, as the second electric push rod drives the chip to descend, it can also drive the mounting base to descend. At the same time, the mounting base can first contact the circuit board. As the chip continues to descend, the mounting bracket can squeeze the airbag, causing the gas in the airbag to be ejected from the air outlet and blown away the dust on the surface of the circuit board. This avoids the dust affecting the bonding effect during chip mounting and causing misalignment, thus ensuring the accuracy of bonding.

[0023] 2. In this utility model, before the suction cup picks up the chip, the chip can be pushed into the second positioning frame by the push plate and the guide plate. Under the action of the guide plate and the second positioning frame, the chip is positioned to a certain extent, thereby ensuring that the chip can be located in the middle position of the suction cup when the suction cup picks up the chip, thus ensuring the accuracy of the mounting after the chip is mounted on the surface of the circuit board. Attached Figure Description

[0024] Figure 1 This is a three-dimensional structural diagram of a chip mounting device with a positioning structure.

[0025] Figure 2 This is an exploded three-dimensional structural diagram of a chip mounting device with a positioning structure.

[0026] Figure 3 This is an exploded three-dimensional structural diagram of a push component in a chip mounting device with a positioning structure.

[0027] Figure 4 This is an exploded three-dimensional structural diagram of a component being picked up in a chip mounting device with a positioning structure.

[0028] Legend:

[0029] 1. Base; 2. First positioning frame; 3. Second positioning frame; 4. Conveyor belt; 5. Pushing assembly; 51. First electric push rod; 52. Mounting plate; 53. Spring; 54. Guide plate; 55. Connecting block; 56. Push plate; 6. Support frame; 7. Suction assembly; 71. Moving module; 72. Second electric push rod; 73. Mounting frame; 74. Suction cup; 75. Airbag; 76. Air outlet pipe; 77. Mounting seat; 78. Protective pad; 79. Air guide plate. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0031] In its specific implementation, such as Figures 1-4 This utility model provides a technical solution: a chip mounting device with a positioning structure, including a base 1, a first positioning frame 2 on the top surface of the base 1, a second positioning frame 3 on one side of the first positioning frame 2, a conveyor belt 4 on one side of the top surface of the base 1, and a support frame 6 installed on the top surface of the base 1; a pushing component 5 located on one side of the conveyor belt 4; and a suction component 7 installed on the top of the support frame 6.

[0032] The suction component 7 includes a mounting frame 73, a suction cup 74 mounted on the bottom surface of the mounting frame 73, mounting seats 77 slidably mounted on both ends of the mounting frame 73, an airbag 75 inside the mounting seat 77, an air outlet pipe 76 mounted on one side of the airbag 75, a wind guide plate 79 mounted on one side of the mounting seat 77, a second electric push rod 72 mounted on the top surface of the mounting frame 73, a moving module 71 mounted on the top of the second electric push rod 72, the moving module 71 being located at the top of the support frame 6, sliders mounted on both ends of the mounting frame 73, and a limiting groove corresponding to the sliders being provided on the inner wall of the mounting seat 77, the airbag 75 being located between the mounting frame 73 and the mounting seat 77, the air outlet pipe 76 passing through one side of the mounting seat 77, and a protective pad 78 mounted on the bottom end of the mounting seat 77.

[0033] Specifically, during chip mounting, the circuit board is placed in the first positioning frame 2, and the chip is pushed from the surface of the conveyor belt 4 to the second positioning frame 3 by the pushing component 5. Then, the moving module 71 moves the mounting bracket 73 and the suction cup 74 to the second positioning frame 3 and above the chip. The second electric push rod 72 drives the suction cup 74 to descend, thereby adsorbing and fixing the chip. At the same time, the moving module 71 moves the chip above the circuit board, and the second electric push rod 72 drives the suction cup 74 and the chip to descend. Simultaneously, the mounting base 77 descends and contacts the circuit board first. As the mounting bracket 73 continues to descend, the airbag 75 is gradually compressed, so that the gas in the airbag 75 is discharged from the air outlet 76 and guided by the air guide plate 79, thereby removing dust from the surface of the circuit board through the airflow.

[0034] like Figure 3 As shown, the push assembly 5 includes a mounting plate 52, a guide plate 54 is mounted on one side of the mounting plate 52, a push plate 56 is provided on the top surface of the guide plate 54, connecting blocks 55 are mounted on both ends of the push plate 56, a spring 53 is mounted on one side of the mounting plate 52, the other end of the spring 53 is fixedly connected to the push plate 56, the telescopic end of the first electric push rod 51 is mounted on one side of the push plate 56, the telescopic end of the first electric push rod 51 passes through the mounting plate 52, one end of the first electric push rod 51 is fixedly connected to one side of the base 1, the mounting plate 52, the guide plate 54 and the push plate 56 are all slidably connected to the base 1 through the groove opened on one side of the base 1, and the guide plate 54 corresponds to the second positioning frame 3;

[0035] Specifically, during chip mounting, the chip can be transported via conveyor belt 4. Simultaneously, the first electric push rod 51 can be activated to move the push plate 56, which in turn moves the guide plate 54. When the guide plate 54 contacts the chip, the chip gradually slides into the groove formed by the guide plate 54. The chip moves along with the push plate 56. When the guide plate 54 contacts the second positioning frame 3, the guide plate 54 stops moving, and the chip gradually slides into the second positioning frame 3 under the continued push of the push plate 56, thereby ensuring the correct orientation of the chip when the suction cup 74 adsorbs the chip.

[0036] Working principle: During chip mounting, the chip is transported by the conveyor belt 4. Simultaneously, the first electric push rod 51 moves the push plate 56, which in turn moves the guide plate 54. When the guide plate 54 contacts the chip, the chip gradually slides into the groove formed by the guide plate 54. The chip moves along with the push plate 56. When the guide plate 54 contacts the second positioning frame 3, the guide plate 54 stops moving, and the chip, under the continued push of the push plate 56, gradually slides into the second positioning frame 3. Then, the mounting module 71 drives the chip mounting process. The frame 73 and suction cup 74 move to the top of the second positioning frame 3 and the chip. The second electric push rod 72 drives the suction cup 74 to descend, and the suction cup 74 adsorbs and fixes the chip. At the same time, the moving module 71 moves the chip to the top of the circuit board. The second electric push rod 72 drives the suction cup 74 and the chip to descend. At the same time, the mounting base 77 descends and contacts the circuit board first. At this time, as the mounting frame 73 continues to descend, the airbag 75 is gradually compressed, and the gas in the airbag 75 is discharged from the air outlet pipe 76 and guided by the air guide plate 79.

Claims

1. A chip mounting device with a positioning structure, characterized in that, include: The base (1) has a first positioning frame (2) on its top surface, a second positioning frame (3) on one side of the first positioning frame (2), a conveyor belt (4) on one side of the top surface of the base (1), and a support frame (6) installed on the top surface of the base (1). Pushing component (5), the pushing component (5) is located on one side of the conveyor belt (4); A suction assembly (7) is mounted on top of a support frame (6); The suction component (7) includes a mounting frame (73), a suction cup (74) is mounted on the bottom surface of the mounting frame (73), mounting seats (77) are slidably mounted on both ends of the mounting frame (73), an airbag (75) is provided inside the mounting seat (77), an air outlet pipe (76) is installed on one side of the airbag (75), and a wind guide plate (79) is installed on one side of the mounting seat (77).

2. The chip mounting device with a positioning structure according to claim 1, characterized in that, The mounting bracket (73) has a second electric push rod (72) mounted on its top surface. The second electric push rod (72) has a movable module (71) mounted on its top end. The movable module (71) is located at the top end of the support frame (6).

3. A chip mounting device with a positioning structure according to claim 2, characterized in that, The mounting bracket (73) has sliders installed at both ends, and the inner wall of the mounting base (77) is provided with limiting grooves corresponding to the sliders.

4. A chip mounting device with a positioning structure according to claim 3, characterized in that, The airbag (75) is located between the mounting bracket (73) and the mounting base (77), the air outlet pipe (76) passes through one side of the mounting base (77), and a protective pad (78) is installed at the bottom of the mounting base (77).

5. A chip mounting device with a positioning structure according to claim 1, characterized in that, The push component (5) includes a mounting plate (52), a guide plate (54) is mounted on one side of the mounting plate (52), and a push plate (56) is provided on the top surface of the guide plate (54).

6. A chip mounting apparatus with a positioning structure according to claim 5, characterized in that, The push plate (56) has connecting blocks (55) installed at both ends, and a spring (53) is installed on one side of the mounting plate (52). The other end of the spring (53) is fixedly connected to the push plate (56).

7. A chip mounting device with a positioning structure according to claim 5, characterized in that, The push plate (56) has a telescopic end of a first electric push rod (51) installed on one side. The telescopic end of the first electric push rod (51) passes through the mounting plate (52). One end of the first electric push rod (51) is fixedly connected to one side of the base (1).

8. A chip mounting apparatus with a positioning structure according to claim 6, characterized in that, The mounting plate (52), guide plate (54) and push plate (56) are all slidably connected to the base (1) through a groove opened on one side of the base (1), and the guide plate (54) corresponds to the second positioning frame (3).

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