Substrate polishing device and substrate production line

Abstract

The utility model discloses a substrate grinding device and a substrate production line, the substrate grinding device comprises an adsorption mechanism, a positioning assembly, a grinding assembly, a first lifting mechanism and a first translation mechanism, the adsorption mechanism comprises an adsorption base and a bearing assembly, the adsorption base is provided with a negative pressure groove, and the bearing assembly is connected above the negative pressure groove; a plurality of air suction holes are formed in the bearing assembly, the air suction holes are communicated with the negative pressure groove, and an air exhaust hole is formed in the negative pressure groove; the positioning assembly is used for positioning the ceramic substrate, the grinding assembly is used for grinding the ceramic substrate, and the first lifting mechanism and the second lifting mechanism are used for driving the grinding assembly to move. Automatic equipment is used for polishing the ceramic substrate, environmental protection is achieved, the working efficiency is high, by arranging the positioning assembly and the adsorption mechanism, precise positioning and stable adsorption of the substrate are completed, and substrate damage caused when the substrate is polished can be effectively avoided. The adsorption mechanism is provided with the adsorption base, the negative pressure groove and the bearing assembly, the adsorption effect is good, and the ceramic substrate is not prone to being damaged.

Description

Technical Field

[0001] This application relates to the field of materials processing, and in particular to a substrate polishing apparatus and a substrate production line. Background Technology

[0002] Ceramic substrates, as an important material, have wide applications in electronics, optoelectronics, and energy. Their excellent electrical properties and stable mechanical properties make them an ideal choice for various electronic and optoelectronic devices. However, due to the unique properties of ceramic substrates, they are brittle and hard. Furthermore, because the finished products are relatively thin, adhesive bonding and other fixing processes are often used in the initial processing. This results in adhesive residue and stains that are difficult to remove from the thin edges of the ceramic substrate. Currently, the removal methods mostly combine chemical methods with manual scraping. This method has a certain impact on the environment, is inefficient, and can easily damage the ceramic substrate. Utility Model Content

[0003] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes a substrate polishing device that can quickly clean away adhesive residue and printing stains on the thin edges of ceramic substrates. This device is environmentally friendly, reliable, and does not easily damage the ceramic substrate.

[0004] This application also proposes a substrate production line having the above-mentioned substrate polishing apparatus.

[0005] A substrate polishing apparatus according to a first aspect embodiment of this application includes:

[0006] An adsorption mechanism is provided, comprising an adsorption base and a support component. The adsorption base is provided with a negative pressure groove, and the support component is connected above the negative pressure groove. The upper surface of the support component is flat, and the support component is provided with a plurality of suction holes, which are connected to the negative pressure groove. The negative pressure groove is provided with an exhaust hole.

[0007] A positioning component is disposed on both sides of the support component for positioning the ceramic substrate;

[0008] A polishing component is disposed on one side of the support component and is used to polish the ceramic substrate on the support component;

[0009] The first lifting mechanism is connected to the grinding assembly and is used to drive the grinding assembly to move vertically.

[0010] The first translation mechanism, connected to the first lifting mechanism, is used to drive the horizontal displacement of the grinding assembly.

[0011] The substrate polishing apparatus according to the embodiments of this application has at least the following beneficial effects:

[0012] This embodiment of the application uses a first lifting mechanism and a first translation mechanism to drive the grinding assembly to grind the substrate, achieving automated processing and improving production efficiency. It also eliminates the need for chemical reagents for adhesive removal, making it more environmentally friendly. By setting up a positioning assembly and an adsorption mechanism, precise positioning and stable adsorption of the substrate are achieved, effectively preventing substrate damage during grinding. The adsorption mechanism is a combination of an adsorption base, a negative pressure groove, and a support assembly. Negative pressure is created within the negative pressure groove through an air extraction hole. A negative pressure is directly generated on the support assembly by an air extraction hole connected to the negative pressure groove. After the substrate is placed on the support assembly, simply evacuating the air extraction hole will adsorb and fix the substrate onto the support assembly. The adsorption method is simple and reliable, effectively preventing substrate movement and damage during grinding.

[0013] According to some embodiments of this application, the polishing assembly includes a first polishing unit and a second polishing unit. The surface of the first polishing unit is provided with a first polishing structure, and the surface of the second polishing unit is provided with a second polishing structure. The polishing precision of the first polishing structure and the second polishing structure is different.

[0014] According to some embodiments of this application, the first grinding unit is connected to a first gear, the first gear is connected to a first drive unit, the second grinding unit is connected to a second gear, the second gear is meshed with a third gear, and the third gear is meshed with the first gear.

[0015] According to some embodiments of this application, the positioning component includes a second driving unit, a first driving rod, and a swing arm. The second driving unit is connected to the first driving rod, and the first driving rod is connected to the swing arm. The first driving rod can rotate and reciprocate under the drive of the second driving unit, and the swing arm can rotate and reciprocate under the drive of the first driving rod. A positioning disk is provided on the swing arm.

[0016] According to some embodiments of this application, a gripping mechanism is also included, which is used to grip the ceramic substrate onto the support component before polishing and to grip the ceramic substrate away from the support component after polishing. The gripping mechanism is connected to a second lifting mechanism, and the second lifting mechanism is connected to a second translation mechanism.

[0017] According to some embodiments of this application, the gripping mechanism includes an adsorption component, a connecting rod, and a gripping plate. The adsorption component is connected to one end of the connecting rod. The connecting rod is provided with a first connecting hole, and the gripping plate is provided with a second connecting hole. A fastener is provided on the connecting rod, and the fastener passes through the first connecting hole and the second connecting hole. Both the first connecting hole and the second connecting hole are strip-shaped.

[0018] According to some embodiments of this application, the second lifting mechanism includes a third driving unit, the third driving unit is connected to a second driving rod, the second driving rod is connected to the gripping mechanism; the second translation mechanism includes a second slide rail, a second slider is slidably connected on the second slide rail, the second slider is connected to a fourth driving unit, and the second lifting mechanism is connected to the second slider.

[0019] According to some embodiments of this application, the first translation mechanism includes a first slide rail and a first slider, the first slider being slidably connected to the first slide rail, and the first lifting mechanism includes a third slider and a third slide rail, the third slider being fixedly connected to the first slider, and the third slide rail being slidably connected to the third slider.

[0020] According to some embodiments of this application, a dust cover is also included, which encloses the adsorption mechanism.

[0021] A substrate production line according to a second aspect of this application includes the substrate polishing apparatus described in the above embodiments.

[0022] The substrate production line according to the embodiments of this application has at least the following beneficial effects:

[0023] The substrate polishing apparatus of the above embodiment drives the polishing component to polish the substrate through a first lifting mechanism and a first translation mechanism, removing adhesive residue and printing stains from the substrate. This achieves automated processing, improves production efficiency, and eliminates the need for chemical reagents for adhesive removal, making it more environmentally friendly. By setting a positioning mechanism and an adsorption component, precise positioning and stable adsorption of the substrate are achieved, effectively preventing substrate damage during polishing. The adsorption mechanism is a combination of an adsorption base, a negative pressure groove, and a support component. Negative pressure is formed in the negative pressure groove through the air extraction hole. Negative pressure is directly generated on the support component by setting an air extraction hole that communicates with the negative pressure groove. After the substrate is placed on the support component, air is simply extracted through the air extraction hole to adsorb and fix the substrate on the support component. The adsorption method is simple and reliable, effectively preventing substrate movement and damage during polishing.

[0024] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0025] The accompanying drawings are used to provide a further understanding of the technical solutions disclosed in this application and form part of the specification. They are used together with the embodiments disclosed in this application to explain the technical solutions of this application and do not constitute a limitation on the technical solutions disclosed in this application.

[0026] Figure 1This is a schematic diagram of the overall structure of the substrate polishing apparatus according to an embodiment of this application;

[0027] Figure 2 This is a schematic diagram of the adsorption mechanism of the substrate polishing apparatus in an embodiment of this application;

[0028] Figure 3 This is a schematic diagram of the positioning component structure of the substrate polishing apparatus according to an embodiment of this application;

[0029] Figure 4 This is a schematic diagram of the grinding component structure of the substrate grinding apparatus according to an embodiment of this application;

[0030] Figure 5 This is a schematic diagram of the gripping mechanism of the substrate polishing apparatus according to an embodiment of this application.

[0031] Reference numerals: Substrate polishing device 100; Adsorption mechanism 110; Adsorption base 111; Supporting component 112; Negative pressure groove 113; Air extraction hole 114; Air suction hole 115; Positioning component 120; Second drive unit 121; First drive rod 122; Swing arm 123; Positioning disk 124; Polishing component 130; First polishing unit 131; Second polishing unit 132; Third gear 133; First polishing structure 134; Second polishing structure 135; First gear 136; Second gear 137 7; First lifting mechanism 140; Third slider 141; Third slide rail 142; First translation mechanism 150; First slide rail 151; First slider 152; Gripping mechanism 160; Adsorption assembly 161; Connecting rod 162; Gripping plate 163; First connecting hole 164; Second connecting hole 165; Fastener 166; Second lifting mechanism 170; Third drive unit 171; Second drive rod 172; Second translation mechanism 180; Second slide rail 181; Second slider 182; Dust cover 190. Detailed Implementation

[0032] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0033] In the description of this application, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0034] In the description of this application, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0035] In the description of this application, unless otherwise expressly defined, terms such as "setup," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this application in conjunction with the specific content of the technical solution.

[0036] In the description of this application, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0037] Due to the unique properties of its material, ceramic substrates are brittle and hard. Because the finished product is relatively thin, adhesive bonding and other fixing processes are often used in the initial processing. This often results in adhesive residue and stains that are difficult to remove from the thin edges of the ceramic substrate. In related technologies, removing adhesive residue and stains from ceramic substrates typically involves a combination of chemical methods and manual scraping. This method has a certain impact on the environment, is inefficient, and can easily damage the ceramic substrate.

[0038] This application uses automated equipment to polish ceramic substrates without the need for chemical reagents, which is more environmentally friendly. However, if the ceramic substrate is not accurately positioned or is not firmly adsorbed when using the equipment for polishing, it is easy to damage the ceramic substrate during the operation of the polishing component. In order to solve this problem, this application proposes a substrate polishing device that is less likely to damage the substrate during polishing.

[0039] The following is for reference. Figures 1-5 Describes a substrate polishing apparatus 100 according to an embodiment of this application.

[0040] like Figure 1 , 2As shown in the figure, this application discloses a substrate polishing device 100, including an adsorption mechanism 110, a positioning component 120, a polishing component 130, a first lifting mechanism 140, and a first translation mechanism 150. The adsorption mechanism 110 is used to adsorb and fix a ceramic substrate. The adsorption mechanism 110 includes an adsorption base 111 and a support component 112. A negative pressure groove 113 is provided on the adsorption base 111, and an air extraction hole 114 is provided on the negative pressure groove 113. The air extraction hole 114 can be used to extract air from the negative pressure groove 113. Vacuum processing creates negative pressure within the negative pressure groove 113. A support assembly 112 is connected above the negative pressure groove 113. The upper surface of the support assembly 112 is flat and used to place the ceramic substrate. The support assembly 112 has multiple suction holes 115 that communicate with the negative pressure groove 113. When the negative pressure groove 113 generates negative pressure through the extraction hole 114, it draws air from the outside through the suction holes 115, thus creating negative pressure at the suction holes 115. At this time, if the support assembly... When a ceramic substrate is placed on the support component 112, the suction holes firmly adhere the ceramic substrate to the support component 112. Multiple suction holes 115 are provided on the support component 112, allowing simultaneous adsorption of multiple points on the ceramic substrate, resulting in a stable adsorption effect and preventing positional displacement of the ceramic substrate under external force. The upper surface of the support component 112 is designed as a plane, facilitating the placement of the ceramic substrate and simultaneous adsorption of multiple points on it. Positioning components 120 are located on both sides of the support component 112 to position the ceramic substrate, preventing damage during polishing due to incorrect placement. A polishing component 130 is located on one side of the support component 112 for polishing the ceramic substrate on the support component 112. A first lifting mechanism 140 is connected to the polishing component 130 to drive the vertical displacement of the polishing component 130. A first translation mechanism 150 is connected to the first lifting mechanism 140 to drive the horizontal displacement of the polishing component 130.

[0041] In the embodiments of this application, such as Figure 2 As shown, the air suction holes 115 on the carrier component 112 are arranged in multiple rows, with multiple air suction holes 115 in each row. Through the multi-point uniform distribution of the air suction holes 115, multiple positions on the ceramic substrate are simultaneously adsorbed, resulting in a better adsorption effect. Furthermore, the suction force on the ceramic substrate is dispersed throughout the ceramic substrate, avoiding concentrated suction force and preventing damage to the ceramic substrate.

[0042] In this embodiment, the ceramic substrate is first placed on the support component 112, and then the positioning component 120 is activated to accurately position the ceramic substrate. After positioning, the adsorption mechanism 110 is activated, and the ceramic substrate is firmly adsorbed onto the support component 112 through multi-point negative pressure, so that its position will not shift during the polishing process. Then, the first lifting mechanism drives the polishing component to descend to the designated position, and then the first translation mechanism is activated to drive the polishing component to move in the horizontal direction, thereby polishing the side of the ceramic substrate. Through the cooperation of the positioning component 120 and the adsorption mechanism 110, the ceramic substrate is kept in the correct position during polishing, so that a polishing allowance can be left during polishing to prevent damage to the ceramic substrate.

[0043] In some embodiments of this application, since only one side of the ceramic substrate needs to be coated with adhesive during processing, only one side of the ceramic substrate needs to be polished in the polishing and adhesive removal process. However, in other scenarios, multiple sides of the ceramic substrate need to be polished. Therefore, in other embodiments of this application, the adsorption mechanism 110 is provided with a rotatable structure that can drive the adsorption mechanism 110 to rotate, thereby polishing multiple sides of the ceramic substrate.

[0044] Furthermore, the connection between the bearing component 112 and the negative pressure groove 113 is a sealed structure. Because the connection is a sealed structure, the negative pressure groove 113 can only draw air from the air intake hole 115. The negative pressure at the air intake hole is stronger, and the adsorption effect is better.

[0045] In the embodiments of this application, such as Figure 4 As shown, the polishing assembly 130 includes a first polishing unit 131 and a second polishing unit 132. The surface of the first polishing unit 131 is provided with a first polishing structure 134, and the surface of the second polishing unit 132 is provided with a second polishing structure 135. The first polishing structure 134 and the second polishing structure 135 have different polishing precisions. By configuring the polishing assembly 130 as a combination of the first polishing unit 131 and the second polishing unit 132 with different polishing precisions, coarse and fine polishing processes can be performed on the ceramic substrate simultaneously, resulting in higher polishing efficiency.

[0046] In this embodiment, the first grinding unit 131 is cylindrical, and the first grinding structure 134 consists of multiple V-shaped grooves on the side surface of the first grinding unit 131. A protruding structure is formed between every two V-shaped grooves, and the edge of the protruding structure is sharp. When the first grinding unit 131 rotates, the sharp edge of the protruding structure grinds the side of the ceramic substrate. Similarly, the second grinding unit 132 is cylindrical, and the second grinding structure 135 consists of multiple V-shaped grooves on the side surface of the second grinding unit 132. A protruding structure is formed between every two V-shaped grooves, and the edge of the protruding structure is sharp. When the second grinding unit 132 rotates, the sharp edge of the protruding structure grinds the side of the ceramic substrate. The number of V-shaped grooves on the surfaces of the first grinding unit 131 and the second grinding unit 132 is different; the more V-shaped grooves there are, the higher the grinding precision.

[0047] In this embodiment, a first grinding unit 131 is connected to a first gear 136, which is connected to a first drive unit (not shown in the figure). A second grinding unit 132 is connected to a second gear 137, which meshes with a third gear 133. The third gear 133 meshes with the first gear 136. The first drive unit can be a motor or other drive structure. The first grinding unit 131 and the second grinding unit 132 are connected by gear meshing, thereby achieving synchronous rotation. This allows for rough grinding and fine grinding to be completed within one stroke, requiring only one drive unit. Furthermore, because the two grinding units move synchronously, they do not interfere with each other during operation, resulting in a reasonable structure and high work efficiency. By connecting the third gear 133 between the first gear 136 and the second gear 137, a certain distance is maintained between the two grinding units while ensuring their synchronicity, thus achieving a better grinding effect. The first drive unit can be a motor or other drive device.

[0048] In the embodiments of this application, such as Figure 3 As shown, the positioning assembly 120 includes a second drive unit 121, a first drive rod 122, and a swing arm 123. The second drive unit 121 is connected to the first drive rod 122, and the first drive rod 122 is connected to the swing arm 123. The first drive rod 122 can rotate and reciprocate under the drive of the second drive unit 121, and the swing arm 123 can rotate and reciprocate under the drive of the first drive rod 122. A positioning disk 124 is provided on the swing arm 123. In some embodiments, the second drive unit is a rotary positioning cylinder.

[0049] In this embodiment, after the ceramic substrate is placed on the support assembly 112, the positioning assembly 120 is activated. The second drive unit 121 drives the first drive rod 122 to rotate, and the second drive rod 122 drives the swing arm 123 to rotate, thereby rotating the positioning disk 124 on the swing arm 123 to the same height as the ceramic substrate. Then, the second drive unit 121 drives the first drive rod 122 to move towards the ceramic substrate, so that the positioning disk can push the ceramic substrate to the designated position to complete the positioning work. After the positioning is completed, the adsorption mechanism 110 is activated to fix the ceramic substrate on the support assembly 112. The positioning assembly 120 is reset, that is, the swing arm 123 retracts and rotates downward, so that the positioning assembly 120 can avoid the grinding assembly 130 and will not hinder the work of the grinding assembly 130.

[0050] In the embodiments of this application, such as Figure 1 , 5 As shown, the substrate polishing apparatus 100 also includes a gripping mechanism 160. The gripping mechanism 160 is used to grip the ceramic substrate onto the support assembly 112 before polishing and to remove the ceramic substrate from the support assembly 112 after polishing. The gripping mechanism 160 is connected to a second lifting mechanism 170, which is connected to a second translation mechanism 180. By setting the gripping mechanism 160, automated gripping of the ceramic substrate is achieved, improving work efficiency.

[0051] In this embodiment of the application, the gripping mechanism 160 includes an adsorption component 161, a connecting rod 162, and a gripping plate 163. The adsorption component 161 is connected to one end of the connecting rod 162. The connecting rod 162 is provided with a first connecting hole 164. The gripping plate 163 is provided with a second connecting hole 165. A fastener 166 is provided on the connecting rod 162. The fastener 166 passes through the first connecting hole 164 and the second connecting hole 165. Both the first connecting hole 164 and the second connecting hole 165 are strip-shaped.

[0052] The gripping mechanism 160 uses the adsorption component 161 to flexibly grip the ceramic substrate, avoiding damage during gripping. By providing a strip-shaped first connecting hole 164 on the connecting rod 162 and a strip-shaped second connecting hole 165 on the gripping plate 163, the position of the connecting rod 162 on the gripping plate 163 can be adjusted, thereby adjusting the length of the connecting rod 162 extending beyond the gripping plate 163 to accommodate ceramic substrates of different sizes and improve the applicability of the gripping mechanism 160. In some embodiments, multiple connecting rods 162 are provided, each with an adsorption component 161. In some embodiments, four connecting rods 162 are provided, each with an adsorption component 161.

[0053] In this embodiment, the second lifting mechanism 170 includes a third drive unit 171, which is connected to a second drive rod 172. The second drive rod 172 is connected to the gripping mechanism 160. The second translation mechanism 180 includes a second slide rail 181, on which a second slider 182 is slidably connected. The second slider 182 is connected to a fourth drive unit, and the second lifting mechanism 170 is connected to the second slider 182. The gripping mechanism achieves vertical and horizontal movement through the second lifting mechanism 170 and the second translation mechanism 180, thereby enabling the gripping and handling of the ceramic substrate. The fourth drive unit can be a cylinder, hydraulic cylinder, motor, or other drive device.

[0054] In this embodiment of the application, the first translation mechanism 150 includes a first slide rail 151 and a first slider 152, the first slider 152 being slidably connected to the first slide rail 151, the first lifting mechanism 140 includes a third slider 141 and a third slide rail 142, the third slider 141 being fixedly connected to the first slider 152, the third slide rail 142 being slidably connected to the third slider 141, and the third slide rail 142 being connected to a fifth drive unit.

[0055] Through the first translation mechanism 150 and the first lifting mechanism 140, the grinding assembly 130 can achieve vertical and horizontal movement to complete the grinding work.

[0056] In this embodiment of the application, a dust cover 190 is also included, which encloses the adsorption mechanism 110.

[0057] By setting up a dust cover 190, the debris generated during grinding is blocked, preventing debris from flying around, reducing dust in the production environment, and improving the production environment.

[0058] This application also discloses a substrate production line that uses the substrate polishing device described in the above embodiments. The substrate polishing device 100 includes an adsorption mechanism 110, a positioning component 120, a polishing component 130, a first lifting mechanism 140, and a first translation mechanism 150. The adsorption mechanism 110 is used to adsorb and fix the ceramic substrate. The adsorption mechanism 110 includes an adsorption base 111 and a bearing component 112. A negative pressure groove 113 is provided on the adsorption base 111, and an air extraction hole 114 is provided on the negative pressure groove 113. A vacuum treatment can be performed on the negative pressure groove 113 through the air extraction hole 114, thereby improving the vacuum treatment of the negative pressure groove 113. A negative pressure is created within the negative pressure groove 113. A support component 112 is connected above the negative pressure groove 113. The upper surface of the support component 112 is flat and used to place a ceramic substrate. The support component 112 is provided with multiple suction holes 115, which communicate with the negative pressure groove 113. When the negative pressure groove 113 generates negative pressure through the suction hole 114, it will draw air from the outside through the suction holes 115, thus generating negative pressure at the suction holes 115. If a ceramic substrate is placed on the support component 112 at this time... The ceramic substrate is firmly adsorbed onto the support component 112 by the suction holes 115. Multiple suction holes 115 on the support component 112 allow for simultaneous adsorption of multiple points on the ceramic substrate, resulting in a stable adsorption effect and preventing positional displacement of the ceramic substrate under external force. The upper surface of the support component 112 is flat, facilitating the placement of the ceramic substrate and simultaneous adsorption of multiple points on it. Positioning components 120 are located on both sides of the support component 112 to position the ceramic substrate, preventing damage during polishing due to incorrect placement. A polishing component 130 is located on one side of the support component 112 to polish the ceramic substrate on the support component 112. A first lifting mechanism 140 is connected to the polishing component 130 to drive the vertical displacement of the polishing component 130. A first translation mechanism 150 is connected to the first lifting mechanism 140 to drive the horizontal displacement of the polishing component 130.

[0059] Since the substrate production line uses the substrate polishing device in the above embodiments, it has at least all the beneficial effects of the substrate polishing device in the above embodiments.

[0060] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application. Furthermore, unless otherwise specified, the embodiments and features described in the embodiments of this application can be combined with each other.

Claims

1. A substrate polishing apparatus, characterized in that, include: An adsorption mechanism is provided, comprising an adsorption base and a support component. The adsorption base is provided with a negative pressure groove, and the support component is connected above the negative pressure groove. The upper surface of the support component is flat, and the support component is provided with a plurality of suction holes, which are connected to the negative pressure groove. The negative pressure groove is provided with an exhaust hole. A positioning component is disposed on both sides of the support component for positioning the ceramic substrate; A polishing component is disposed on one side of the support component and is used to polish the ceramic substrate on the support component; The first lifting mechanism is connected to the grinding assembly and is used to drive the grinding assembly to move vertically. The first translation mechanism, connected to the first lifting mechanism, is used to drive the horizontal displacement of the grinding assembly.

2. The substrate polishing apparatus according to claim 1, characterized in that, The polishing assembly includes a first polishing unit and a second polishing unit. The surface of the first polishing unit is provided with a first polishing structure, and the surface of the second polishing unit is provided with a second polishing structure. The polishing precision of the first polishing structure and the second polishing structure is different.

3. The substrate polishing apparatus according to claim 2, characterized in that, The first grinding unit is connected to a first gear, the first gear is connected to a first drive unit, the second grinding unit is connected to a second gear, the second gear is meshed with a third gear, and the third gear is meshed with the first gear.

4. The substrate polishing apparatus according to claim 1, characterized in that, The positioning assembly includes a second drive unit, a first drive rod, and a swing arm. The second drive unit is connected to the first drive rod, and the first drive rod is connected to the swing arm. The first drive rod can rotate and reciprocate under the drive of the second drive unit, and the swing arm can rotate and reciprocate under the drive of the first drive rod. A positioning disk is provided on the swing arm.

5. The substrate polishing apparatus according to claim 1, characterized in that, It also includes a gripping mechanism, which is used to grip the ceramic substrate onto the support component before polishing and to grip the ceramic substrate away from the support component after polishing. The gripping mechanism is connected to a second lifting mechanism, and the second lifting mechanism is connected to a second translation mechanism.

6. The substrate polishing apparatus according to claim 5, characterized in that, The gripping mechanism includes an adsorption component, a connecting rod, and a gripping plate. The adsorption component is connected to one end of the connecting rod. The connecting rod has a first connecting hole, and the gripping plate has a second connecting hole. The connecting rod has a fastener that passes through the first connecting hole and the second connecting hole. Both the first connecting hole and the second connecting hole are strip-shaped.

7. The substrate polishing apparatus according to claim 5, characterized in that, The second lifting mechanism includes a third drive unit, which is connected to a second drive rod, which is connected to the gripping mechanism; the second translation mechanism includes a second slide rail, on which a second slider is slidably connected, and the second slider is connected to a fourth drive unit, and the second lifting mechanism is connected to the second slider.

8. The substrate polishing apparatus according to claim 1, characterized in that, The first translation mechanism includes a first slide rail and a first slider, the first slider being slidably connected to the first slide rail. The first lifting mechanism includes a third slider and a third slide rail, the third slider being fixedly connected to the first slider, and the third slide rail being slidably connected to the third slider.

9. The substrate polishing apparatus according to claim 1, characterized in that, It also includes a dust cover that encloses the adsorption mechanism.

10. A substrate production line, characterized in that, Includes the substrate polishing apparatus according to any one of claims 1 to 9.

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