Heat conduction bonding device

Abstract

A heat conduction bonding device is characterized in that the device comprises an L-shaped connecting frame, a double-guide-rod air cylinder is arranged on a vertical plate of the L-shaped connecting frame, the working end of the double-guide-rod air cylinder is connected with the bottom of a supporting frame, a protective shell is arranged at the top of the supporting frame, a control module is arranged in the protective shell, and the control module is connected with the working end of the double-guide-rod air cylinder. A heat conduction bonding mechanism is arranged at the bottom of the supporting frame and comprises a guide block, the guide block is movably connected into a first groove formed in the bottom of the supporting frame, the bottom of the supporting frame is further connected with a connecting plate through a first bolt, and the bottom end of the first bolt is in threaded connection with the connecting plate; the upper portion of the first bolt is movably connected into unthreaded holes formed in the guide block and the supporting frame, a first spring located outside the guide block is further arranged in the first groove, and the bottom end of the first spring abuts against the interior of a second groove formed in the top end face of the connecting plate.

Description

Technical Field

[0001] This utility model relates to the field of product assembly and installation, and in particular to a heat conduction bonding device. Background Technology

[0002] Currently, with the increasing global attention on new energy, the new energy market is rapidly emerging. The demand for energy storage continues to expand. From electric vehicles to aerospace, people's lives and production are increasingly inseparable from energy storage technology and equipment. Previously, the assembly of energy storage equipment was either done manually, by handling, or using single-function tools or equipment.

[0003] For equipment made of plastic, assembly can be carried out by heat sealing. However, in the traditional heat sealing process, the operator needs to hold the heating device. After the heating device comes into contact with the surface of the workpiece, the heat causes the contact part to melt. When the operator moves the heating device, the melted workpiece may move with the heating device while still sticking to it, affecting the positioning effect and work efficiency, and sometimes even causing safety accidents.

[0004] Even with automated heating operations, the aforementioned problem of "workpiece sticking" still exists.

[0005] Therefore, a method or apparatus is needed to solve the above problems. Summary of the Invention

[0006] This invention addresses the aforementioned shortcomings of existing technologies by proposing a heat conduction bonding device that features a simple structure, ingenious design, and reasonable layout. This device utilizes the thermal conduction effect to melt and bond plastic products, while ensuring that the melted products do not stick to the heating head.

[0007] The technical solution of this utility model is: a heat conduction bonding device, characterized in that: the device includes an L-shaped connecting frame 1, and a double guide rod cylinder 2 is provided on the upright plate of the L-shaped connecting frame 1, the working end of the double guide rod cylinder 2 being connected to the bottom of the support frame 3.

[0008] The top of the support frame 3 is provided with a protective shell 4, and the control module 5 is provided inside the protective shell 4. A heat conduction bonding mechanism is provided at the bottom of the support frame 3.

[0009] The heat conduction bonding mechanism includes a guide block 6, which is movably connected to a first groove in the bottom of the support frame 3. A connecting plate 8 is also connected to the bottom of the support frame 3 via a first bolt 7. The bottom end of the first bolt 7 is threadedly connected to the connecting plate 8, while the upper part of the first bolt 7 is movably connected to a light hole in the guide block 6 and the support frame 3. A first spring 9 is also provided in the first groove, located outside the guide block 6. The bottom end of the first spring 9 rests against a second groove 10 on the top surface of the connecting plate 8.

[0010] A heat conductor 11 is provided on the bottom end face of the connecting plate 8. The heat conductor 11 is pressed against the bottom end face of the connecting plate 8 by a heat-conducting shell 12. A heating head 13 is provided on the bottom end face of the heat-conducting shell 12, and the top end of the heating head 13 is in contact with the heat conductor 11.

[0011] The connecting plate 8 is provided with a pressing mechanism at both ends. The pressing mechanism includes a pressing column 14 that is movably connected to the connecting plate 8. The top end of the pressing column 14 is threaded with a limit nut 15. The lower part of the pressing column 14 is sleeved with a second spring 16. The bottom end of the pressing column 14 is a pressing head 17. The second spring 16 is located between the connecting plate 8 and the pressing head 17.

[0012] A heat insulation plate 18 is provided between the heat conductor 11, the heat-conducting housing 12 and the connecting plate 8.

[0013] The pressure column 14 is also fitted with an upper insulating and heat-insulating washer 19 and a lower insulating and heat-insulating washer 20. The upper insulating and heat-insulating washer 19 is located between the limiting nut 15 and the connecting plate 8, and the lower insulating and heat-insulating washer 20 is located between the second spring 16 and the connecting plate 8.

[0014] The pressure column 14 is movably connected inside the bushing 21, and the bushing 21 is disposed in the inner hole opened on the connecting plate 8.

[0015] The heat-conducting housing 12 is fixedly connected to the connecting plate 8 by a second bolt 22. An insulating pad 23 is fitted onto the second bolt 22, and the insulating pad 23 is located between the end of the second bolt 22 and the heat-conducting housing 12.

[0016] There are multiple heating heads 13.

[0017] Compared with the prior art, this utility model has the following advantages:

[0018] This type of heat conduction bonding device features a simple structure, ingenious design, and reasonable layout. It addresses the problems encountered by traditional heat-sealing bonding devices by incorporating a unique structure. It utilizes a heat conductor as a heat source and forms a thermal bridge with the heating head in contact with the conductor, transferring heat from the conductor to the workpiece. The portion of the workpiece in contact with the heating head melts, facilitating the subsequent heat-sealing bonding operation. Simultaneously, it incorporates two symmetrically distributed pressing mechanisms. The pressure columns in these mechanisms adapt to the displacement of the heating head during the pressing process, consistently providing downward pressure to the workpiece as it leaves the surface. This ensures smooth separation of the workpiece from the heating head, preventing displacement caused by adhesion and effectively guaranteeing workpiece positioning accuracy, thus facilitating subsequent operations. Furthermore, the device is simple to manufacture and inexpensive, possessing numerous advantages and making it particularly suitable for widespread application in this field, with a promising market prospect. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural schematic diagram of an embodiment of the present utility model.

[0020] Figure 2 This is a cross-sectional view of the heat conduction bonding mechanism in an embodiment of this utility model. Detailed Implementation

[0021] The specific embodiments of this utility model will be described below with reference to the accompanying drawings. Figure 1 , Figure 2 As shown: A heat conduction bonding device includes an L-shaped connecting frame 1, on the upright plate of the L-shaped connecting frame 1, a double guide rod cylinder 2, the working end of the double guide rod cylinder 2 being connected to the bottom of a support frame 3.

[0022] The top of the support frame 3 is provided with a protective shell 4, and a control module 5 is provided inside the protective shell 4. A heat conduction bonding mechanism is provided at the bottom of the support frame 3. The double guide rod cylinder 2 is controlled by the control system in the control module 5.

[0023] The heat conduction bonding mechanism includes a guide block 6, which is movably connected to a first groove in the bottom of the support frame 3. A connecting plate 8 is also connected to the bottom of the support frame 3 via a first bolt 7. The bottom end of the first bolt 7 is threadedly connected to the connecting plate 8, while the upper part of the first bolt 7 is movably connected to a light hole in the guide block 6 and the support frame 3. A first spring 9 is also provided in the first groove, located outside the guide block 6. The bottom end of the first spring 9 rests against a second groove 10 on the top surface of the connecting plate 8.

[0024] A heat conductor 11 is provided on the bottom end face of the connecting plate 8. The heat conductor 11 is pressed against the bottom end face of the connecting plate 8 by a heat-conducting shell 12. A heating head 13 is provided on the bottom end face of the heat-conducting shell 12, and the top end of the heating head 13 is in contact with the heat conductor 11.

[0025] The connecting plate 8 is provided with a pressing mechanism at both ends. The pressing mechanism includes a pressing column 14 that is movably connected to the connecting plate 8. The top end of the pressing column 14 is threaded with a limit nut 15. The lower part of the pressing column 14 is sleeved with a second spring 16. The bottom end of the pressing column 14 is a pressing head 17. The second spring 16 is located between the connecting plate 8 and the pressing head 17.

[0026] A heat insulation plate 18 is provided between the heat conductor 11, the heat-conducting housing 12 and the connecting plate 8.

[0027] The pressure column 14 is also fitted with an upper insulating and heat-insulating washer 19 and a lower insulating and heat-insulating washer 20. The upper insulating and heat-insulating washer 19 is located between the limiting nut 15 and the connecting plate 8, and the lower insulating and heat-insulating washer 20 is located between the second spring 16 and the connecting plate 8.

[0028] The pressure column 14 is movably connected inside the bushing 21, and the bushing 21 is disposed in the inner hole opened on the connecting plate 8.

[0029] The heat-conducting housing 12 is fixedly connected to the connecting plate 8 by a second bolt 22. An insulating pad 23 is fitted onto the second bolt 22, and the insulating pad 23 is located between the end of the second bolt 22 and the heat-conducting housing 12.

[0030] There are multiple heating heads 13.

[0031] The working process of the heat conduction bonding device in this embodiment of the utility model is as follows: The L-shaped connecting frame 1 is fixedly installed on the basic bearing component such as the workbench or robotic arm. The two workpieces that need to be heat-bonded have been assembled at the front station and are transported to this device by the action of the conveyor belt. The pre-assembled workpieces are located below the heat conduction bonding mechanism of this device.

[0032] The control system sends a signal to the double guide rod cylinder 2 in this device, and the double guide rod cylinder 2 drives the support frame 3 to move downward as a whole, so that the heating head 13 at the bottom of the heat conduction bonding mechanism contacts the designated position on the workpiece. The heat emitted by the heating head 13 melts the part of the workpiece that it contacts and achieves bonding between the two workpieces. During the above process, the pressure head 17 at the bottom of the pressure column 14 contacts the surface of the workpiece and moves upward relative to the connecting plate 8 as the support frame 3 moves downward. The second spring 16 sleeved outside the pressure column 14 is compressed.

[0033] After the heating head 13 has been in contact with the workpiece for the standard duration, the operator sends a signal to the double guide rod cylinder 2 in the device through the control system. The double guide rod cylinder 2 drives the support frame 3 to move upward as a whole. During this process, the pressure column 14, under the action of the second spring 16, is always pressed against the surface of the workpiece. That is, during the upward movement of the support frame 3, a downward force is always applied to the workpiece, thereby ensuring that the heating head 13 can smoothly detach from the workpiece, preventing the workpiece from sticking to the heating head 13, preventing the workpiece from shifting after bonding, and ensuring the bonding effect.

[0034] In order to prevent damage to the workpiece due to excessive pressure when the device performs the pressing action, the support frame 3 and the connecting plate 8 are designed as a flexible floating structure. When the device is not in operation, the support frame 3 and the connecting plate 8 do not contact each other under the action of the first spring 9, and there is a small gap between them. When the heat conduction bonding mechanism under the connecting plate 8 contacts the workpiece, the first spring 9 is compressed first, the bottom end face of the support frame 3 contacts the first groove opened on the top surface of the connecting plate 8, and transmits the pressure to the connecting plate 8 to ensure that the heating head 13 can press on the surface of the workpiece to be bonded.

[0035] The heating head 13 mentioned above can be one or more. When there are multiple heating heads 13, they can be distributed in an array. That is, the number, specific distribution form, and position of the heating heads 13 can be determined according to actual needs.

Claims

1. A heat-conducting adhesive device, characterized in that: The device includes an L-shaped connecting frame (1), on which a double-guide rod cylinder (2) is provided. The working end of the double-guide rod cylinder (2) is connected to the bottom of the support frame (3). The top of the support frame (3) is provided with a protective shell (4), and a control module (5) is provided inside the protective shell (4). A heat conduction bonding mechanism is provided at the bottom of the support frame (3). The heat conduction bonding mechanism includes a guide block (6), which is movably connected to a first groove at the bottom of the support frame (3). The bottom of the support frame (3) is also connected to a connecting plate (8) by a first bolt (7). The bottom end of the first bolt (7) is threadedly connected to the connecting plate (8), while the upper part of the first bolt (7) is movably connected to a light hole on the guide block (6) and the support frame (3). A first spring (9) is also provided in the first groove outside the guide block (6). The bottom end of the first spring (9) rests in a second groove (10) on the top surface of the connecting plate (8). A heat conductor (11) is provided on the bottom end face of the connecting plate (8). The heat conductor (11) is pressed against the bottom end face of the connecting plate (8) by a heat-conducting shell (12). A heating head (13) is provided on the bottom end face of the heat-conducting shell (12), and the top end of the heating head (13) is in contact with the heat conductor (11). The connecting plate (8) is provided with a pressing mechanism at both ends. The pressing mechanism includes a pressing column (14) that is movably connected to the connecting plate (8). The top end of the pressing column (14) is threaded with a limit nut (15). The lower part of the pressing column (14) is sleeved with a second spring (16). The bottom end of the pressing column (14) is a pressing head (17). The second spring (16) is located between the connecting plate (8) and the pressing head (17).

2. The heat conduction bonding device according to claim 1, characterized in that: A heat insulation plate (18) is provided between the heat conductor (11), the heat-conducting shell (12) and the connecting plate (8).

3. The heat conduction bonding device according to claim 1, characterized in that: The pressure column (14) is also fitted with an upper insulating heat-insulating washer (19) and a lower insulating heat-insulating washer (20). The upper insulating heat-insulating washer (19) is located between the limiting nut (15) and the connecting plate (8), and the lower insulating heat-insulating washer (20) is located between the second spring (16) and the connecting plate (8).

4. The heat conduction bonding device according to claim 1, characterized in that: The pressure column (14) is movably connected inside the bushing (21), which is located in the inner hole opened on the connecting plate (8).

5. The heat conduction bonding device according to claim 1, characterized in that: The heat-conducting shell (12) is fixedly connected to the connecting plate (8) by a second bolt (22). An insulating pad (23) is fitted on the second bolt (22), and the insulating pad (23) is located between the end of the second bolt (22) and the heat-conducting shell (12).

6. The heat conduction bonding device according to claim 1, characterized in that: The heating head (13) is multiple.

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