Novel indium electrolytic refining polar plate and conductive plate
By covering the surface of the indium-plated copper conductive plate with an In2O3 thin film layer and using an insulating limiting pad and limiting groove structure, the problems of oxidation and indium layer peeling of the indium-plated copper conductive plate were solved, achieving stable conductive contact of the indium electrolytic cell and improving the quality of refined indium.
Patent Information
- Application Number
- CN202423207594.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-25
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2034-12-25
AI Technical Summary
Traditional indium-plated copper conductive plates are prone to oxidation and indium layer peeling during use, resulting in poor conductive contact in the indium electrolytic cell, affecting the quality of refined indium and cell voltage fluctuations.
An In2O3 thin film layer is covered on the surface of the indium copper-plated conductive plate, and the cathode main board and the conductive rod are connected by an insulating limiting pad and a limiting groove structure to ensure that the conductive end of the conductive rod is connected to the indium copper-plated conductive plate and to avoid oxidation and peeling.
It improves the chemical stability of the indium-plated copper conductive plate, prevents corrosion, ensures good conductive contact in the indium electrolytic cell, extends service life, stabilizes cell voltage, and improves the quality of refined indium.
Smart Images
Figure CN223496668U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of indium production technology, and in particular to a novel indium electrolytic refining electrode plate and conductive plate. Background Technology
[0002] Currently, the cathode plate used for preparing high-purity indium by electrolysis mainly includes a cathode plate body and a copper strip (conductive rod) coated with a resin protective film on the top of the cathode plate body. The copper strip is connected to the cathode plate body, and the cathode plate body is a titanium plate. The copper strip has contact surfaces at both ends that are connected to the busbar copper bus (also known as indium-plated copper conductive plate).
[0003] However, traditional indium-plated copper conductive plates may oxidize and the indium layer may peel off during use, leading to corrosion and oxidation of the internal copper plate. This results in poor conductive contact in the indium electrolytic cell, causing cell voltage fluctuations and affecting the quality of refined indium. Utility Model Content
[0004] To solve or partially solve the problems existing in related technologies, this application provides a novel indium electrolytic refining electrode plate and conductive plate.
[0005] To achieve the above objectives, this application employs the following technical solution:
[0006] A novel indium electrolytic refining electrode plate and conductive plate include an anode main plate and a cathode main plate. The upper part of the cathode main plate is a connecting part, and the lower part is an electrolysis part. The novel indium electrolytic refining electrode plate and conductive plate also include:
[0007] A conductive rod having a connecting groove on it;
[0008] An indium-plated copper conductive plate has an In2O3 thin film layer covering its surface. An insulating limiting pad is adhered to the In2O3 thin film layer, and the insulating limiting pad has several limiting grooves.
[0009] Specifically, the cathode main board is connected to the conductive rod by engaging the connecting part with the connecting groove, and one end of the conductive rod and the anode main board are alternately arranged in the limiting groove so that the conductive rod and the anode main board are respectively connected to the indium copper plated conductive plate.
[0010] Optionally, the conductive rod comprises:
[0011] A copper core is covered by a stainless steel casing. One end of the copper core extends out of the stainless steel casing, while the other end is inside the stainless steel casing, and a plug is provided at that end.
[0012] The connecting groove is located on the stainless steel casing, and the connecting part of the cathode main board is inserted into the connecting groove to contact the copper core.
[0013] Optionally, a conductive head is provided at the end of the stainless steel casing away from the plug.
[0014] Optionally, the stainless steel casing is provided with lifting lugs.
[0015] Optionally, the conductive head is made of copper, and the stainless steel housing and lifting lugs are made of 316L stainless steel or duplex steel.
[0016] Optionally, the thickness of the insulating limiting pad is 5 mm.
[0017] The beneficial effects of this application are as follows: This application covers the surface of the indium plating layer with an In2O3 thin film layer. Compared with the traditional indium plating layer, the In2O3 thin film layer has higher chemical stability and a denser structure, making it difficult for corrosive media to penetrate. This effectively protects the indium-plated copper conductive plate from corrosion, thereby avoiding oxidation and peeling of the indium plating layer, ensuring good conductive contact in the indium electrolytic cell, preventing cell voltage fluctuations from affecting the quality of refined indium, and improving the service life of the indium-plated copper conductive plate.
[0018] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description
[0019] The above and other objects, features and advantages of this application will become more apparent from the more detailed description of exemplary embodiments thereof in conjunction with the accompanying drawings, wherein the same reference numerals generally represent the same components in the exemplary embodiments thereof.
[0020] Figure 1 This is a front view showing the connection relationship between the conductive rod and the cathode motherboard as illustrated in an embodiment of this application;
[0021] Figure 2 This is a side view showing the connection relationship between the conductive rod and the cathode motherboard as illustrated in an embodiment of this application;
[0022] Figure 3 This is a schematic diagram of the structure of the conductive rod shown in the embodiments of this application;
[0023] Figure 4 This is a schematic diagram of the structure of the indium-plated copper conductive plate and the insulating limiting pad shown in the embodiments of this application.
[0024] Reference numerals: 1. Conductive rod, 2. Connecting groove, 3. Cathode main board, 4. Connecting part, 5. Electrolysis part, 6. Indium-plated copper conductive plate, 7. Insulating limiting pad, 8. Limiting groove, 9. Copper core, 10. Stainless steel sleeve, 11. Plug, 12. Conductive head, 13. Lifting lug. Detailed Implementation
[0025] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.
[0026] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0027] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention as the specific circumstances dictate.
[0028] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0029] In this invention, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0030] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.
[0031] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
[0032] To make the objectives, technical solutions, and beneficial effects of this application clearer, the preferred embodiments of this application will be described in detail below with reference to the accompanying drawings, so as to facilitate understanding by those skilled in the art.
[0033] Example 1:
[0034] See Figure 1 , Figure 2 , Figure 3 and Figure 4 A novel indium electrolytic refining electrode plate and conductive plate include an anode main plate and a cathode main plate 3. The upper part of the cathode main plate 3 is a connecting part 4, and the lower part is an electrolysis part 5. The novel indium electrolytic refining electrode plate and conductive plate also include:
[0035] A conductive rod 1, on which a connecting groove 2 is formed;
[0036] An indium copper-plated conductive plate 6 has an In2O3 thin film layer covering its surface. An insulating limiting pad 7 is adhered to the In2O3 thin film layer, and a plurality of limiting grooves 8 are formed on the insulating limiting pad 7.
[0037] Specifically, by engaging the connecting part 4 of the cathode main board 3 with the connecting groove 2, the cathode main board 3 is connected to the conductive rod 1. By staggering one end of the conductive rod 1 and the anode main board in the limiting groove 8, the conductive rod 1 and the anode main board are respectively connected to the indium copper plated conductive plate 6.
[0038] Specifically, one end of the conductive rod 1 is a conductive end, and the interior of the conductive rod 1 is equipped with a conductor. By inserting the connecting part 4 into the connecting groove 2, the cathode main plate 3 is connected to the conductive rod 1, thereby making the upper part of the cathode main plate 3 contact the conductor. Then, the cathode main plate 3 is welded to the conductive rod 1, and the electrolytic part 5 of the cathode main plate 3 is located in the electrolytic cell. The conductive end of the conductive rod 1 is embedded in the limiting groove 8, so that the conductive end is connected to the indium copper plate 6. The end of the conductive rod 1 away from the conductive end is placed on the insulating limiting pad 7, so that this end constitutes an insulating end. The upper side of the anode main plate is inserted into the limiting groove 8, so that the anode main plate is connected to the indium copper plate 6, and the rest of the anode main plate is located in the electrolytic cell.
[0039] Traditional indium-plated copper conductive plates 6 prevent the formation of verdigris and rust through indium plating, thus ensuring the quality of the conductive plate. However, although the surface of the indium-plated copper conductive plate 6 is treated with indium plating, after an electrolysis cycle of about 7 days, the indium plating layer on its surface will oxidize and peel off, leading to external corrosion and oxidation of the internal copper plate. This reduces the service life of the indium-plated copper conductive plate 6 and causes poor conductive contact in the indium electrolytic cell, with cell voltage fluctuations affecting the quality of refined indium. In this embodiment, an In2O3 thin film layer is covered on the surface of the indium plating layer. Compared with the traditional indium plating layer, the In2O3 thin film layer has higher chemical stability and a denser structure, making it difficult for corrosive media to penetrate. It can effectively protect the indium-plated copper conductive plate 6 from corrosion, thereby avoiding the oxidation and peeling of the indium plating layer. This ensures good conductive contact in the indium electrolytic cell, prevents cell voltage fluctuations from affecting the quality of refined indium, and improves the service life of the indium-plated copper conductive plate 6.
[0040] Furthermore, the In2O3 thin film layer is prepared as follows: the indium-plated copper conductive plate 6 is immersed in an alkaline solution to allow it to passivate. Indium is directly oxidized to trivalent indium and a stable In2O3 thin film layer is formed at a higher potential. At this time, the indium plating layer is relatively stable and there is no peeling.
[0041] Example 2:
[0042] See Figure 3 and Figure 4 Based on Embodiment 1, and optionally, the conductive rod 1 further comprises:
[0043] A copper core 9 is covered by a stainless steel casing 10. One end of the copper core 9 extends out of the stainless steel casing 10, while the other end is located inside the stainless steel casing 10, and a plug 11 is provided at that end.
[0044] The connecting groove 2 is opened on the stainless steel housing 10, and the connecting part 4 of the cathode main board 3 is inserted into the connecting groove 2 and contacts the copper core 9.
[0045] Specifically, the size of the connecting part 4 is adapted to the size of the connecting groove 2. When installing the cathode main board 3, the top of the connecting part 4 is inserted into the connecting groove 2 so that it contacts the copper core 9, thereby completing the connection between the cathode main board 3 and the conductive rod 1. While ensuring that the cathode main board 3 can be installed smoothly, the area of the electrolytic part 5 is increased so that the cathode main board 3 can be attached with more indium.
[0046] After the cathode main board 3 is connected to the conductive rod 1, the stainless steel casing 10 is connected and fixed to the cathode main board 3 by laser spot welding. The plug 11 can seal the end of the copper core 9 that extends out of the stainless steel casing 10.
[0047] Further and optionally, a conductive head 12 is provided at the end of the stainless steel casing 10 away from the plug 11.
[0048] The conductive head 12 is the conductive end of the conductive rod 1. In the electrolysis operation, the conductive head 12 is embedded in the limiting groove 8 so that the conductive head 12 is connected to the indium copper plated conductive plate 6. One end of the plug 11 is placed on the insulating limiting pad 7 so that the end of the conductive rod 1 with the plug 11 forms an insulating end.
[0049] In conventional technology, both ends of the conductive rod 1 are conductive, which makes it easy for the two ends of the conductive rod 1 to connect with two conductive plates of different polarities on the electrolytic cell, resulting in a short circuit. In this embodiment, by setting a conductive head 12 on the conductive rod 1 to form a conductive end, and by placing the plug 11 on the insulating limiting pad 7 to form an insulating end, the two ends of the conductive rod 1 of the indium electrolytic refining electrode plate can be prevented from contacting the two conductive plates of different polarities in the electrolytic cell, so as to avoid short circuit.
[0050] In addition, placing the copper core 9 inside the stainless steel casing 10 can protect the copper core 9 from corrosion, thereby improving the corrosion resistance of the conductive rod 1. The conductive head 12 is directly connected to the indium-plated copper conductive plate 6, which has high conductivity and greatly reduces resistance, causing the cell voltage during the indium electrolysis process to drop significantly. This voltage drops as the deposition thickness of the cathode indium titanium plate increases, ultimately ensuring the conductivity of the cathode main board 3, reducing the DC power consumption of indium electrolysis, and extending the service life of the cathode main board 3 and the indium-plated copper conductive plate 6.
[0051] Furthermore, and optionally, the stainless steel housing 10 is provided with lifting lugs 13.
[0052] Specifically, the lower end of the lifting lug 13 is fixed to the outer surface of the stainless steel housing 10 by laser spot welding. By setting the lifting lug 13, it is convenient to move the conductive rod 1 and the cathode main board 3, thereby facilitating processing and maintenance.
[0053] Further and optionally, the conductive head 12 is made of copper, and the stainless steel housing 10 and the lifting lug 13 are made of 316L stainless steel or duplex steel.
[0054] The conductive head 12 is made of copper, which has excellent conductivity and can ensure the conductivity of the conductive rod 1. Considering that the stainless steel casing 10 and the lifting lug 13 need to have strong corrosion resistance, 316L stainless steel or duplex steel is selected. 316L stainless steel has advantages such as corrosion resistance, heat resistance, processing performance, environmental protection, strength and toughness, fatigue resistance, weather resistance, weldability and surface treatment performance. Duplex steel has high toughness, low brittle transition temperature, good resistance to intergranular corrosion and weldability, and has the advantages of pitting corrosion resistance, stress corrosion resistance and corrosion fatigue resistance.
[0055] Further and optionally, the thickness of the insulating limiting pad 7 is 5 mm.
[0056] The thickness of the insulating limiting pad 7 can be selected according to the working environment. In this embodiment, a 5mm thick insulating limiting pad 7 is sufficient to meet the requirements.
[0057] In summary, this application covers the surface of the indium-plated layer with an In2O3 thin film layer. Compared with traditional indium-plated layers, the In2O3 thin film layer has higher chemical stability and a denser structure, making it difficult for corrosive media to penetrate. This effectively protects the indium-plated copper conductive plate 6 from corrosion, thereby preventing oxidation and peeling of the indium-plated layer, ensuring good conductive contact in the indium electrolytic cell, preventing cell voltage fluctuations from affecting the quality of refined indium, and improving the service life of the indium-plated copper conductive plate 6.
[0058] This application avoids short circuits by setting a conductive head 12 on the conductive rod 1 to form a conductive end and placing a plug 11 on the insulating limiting pad 7 to form an insulating end. This prevents the two ends of the conductive rod 1 of the indium electrolytic refining electrode plate from contacting the two conductive plates of different polarities in the electrolytic cell.
[0059] This application places the copper core 9 inside the stainless steel casing 10, which can protect the copper core 9 from corrosion, thereby improving the corrosion resistance of the conductive rod 1. The conductive head 12 is directly connected to the indium copper plated conductive plate 6, which has high conductivity and greatly reduces resistance, causing the cell voltage during the indium electrolysis process to drop significantly and decrease as the deposition thickness of the cathode indium titanium plate increases. Ultimately, this ensures the conductivity of the cathode main board 3, reduces the DC power consumption of indium electrolysis, and extends the service life of the cathode main board 3 and the indium copper plated conductive plate 6.
[0060] This application provides lifting lugs 13 on the stainless steel housing 10 to facilitate the movement of the conductive rod 1 and the cathode main board 3, thereby facilitating processing and maintenance.
[0061] Finally, it should be noted that the above preferred embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail through the above preferred embodiments, those skilled in the art should understand that various changes can be made to it in form and detail without departing from the scope defined by the claims of this application; the dimensions of the drawings are not related to the specific physical object, and the physical object dimensions can be arbitrarily changed.
Claims
1. A novel indium electrolytic refining electrode plate and conductive plate, comprising an anode main plate and a cathode main plate (3), wherein the upper part of the cathode main plate (3) is a connecting part (4) and the lower part is an electrolytic part (5), characterized in that, The novel indium electrolytic refining electrode plate and conductive plate also include: A conductive rod (1) has a connecting groove (2) on it; An indium copper plated conductive plate (6) has an In2O3 thin film layer covering its surface. An insulating limiting pad (7) is bonded to the In2O3 thin film layer. Several limiting grooves (8) are formed on the insulating limiting pad (7). In this process, the cathode main board (3) is connected to the conductive rod (1) by engaging the connecting part (4) with the connecting groove (2), and one end of the conductive rod (1) and the anode main board are alternately arranged in the limiting groove (8) so that the conductive rod (1) and the anode main board are respectively connected to the indium copper plated conductive plate (6).
2. The novel indium electrolytic refining electrode plate and conductive plate as described in claim 1, characterized in that, The conductive rod (1) includes: A copper core (9) is covered with a stainless steel casing (10). One end of the copper core (9) extends out of the stainless steel casing (10), and the other end is located inside the stainless steel casing (10). A plug (11) is provided at this end. The connecting groove (2) is opened on the stainless steel casing (10), and the connecting part (4) of the cathode main board (3) is inserted into the connecting groove (2) and contacts the copper core (9).
3. The novel indium electrolytic refining electrode plate and conductive plate as described in claim 2, characterized in that, The stainless steel casing (10) has a conductive head (12) at the end away from the plug (11).
4. The novel indium electrolytic refining electrode plate and conductive plate as described in claim 2, characterized in that, The stainless steel casing (10) is provided with a lifting lug (13).
5. The novel indium electrolytic refining electrode plate and conductive plate as described in claim 3, characterized in that, The conductive head (12) is made of copper, and the stainless steel shell (10) and the lifting lug (13) are made of 316L stainless steel or duplex steel.
6. The novel indium electrolytic refining electrode plate and conductive plate as described in claim 1, characterized in that, The thickness of the insulating limiting pad (7) is 5mm.