Horizontal dehumidification device

Abstract

The utility model relates to the technical field of dehumidification devices, and discloses a horizontal dehumidification device which comprises a shell, a semiconductor chilling plate, a heat dissipation assembly, a condensation assembly and a control assembly, the interior of the shell is divided into a plurality of areas in the horizontal direction, and the heat dissipation assembly, the semiconductor chilling plate and the control assembly are arranged in the different areas respectively. The hot face end of the semiconductor chilling plate exchanges heat with the heat dissipation assembly through the heat conduction assembly. The cold face end of the semiconductor chilling plate is provided with a condensation assembly, the condensation assembly exchanges heat with the cold face end of the semiconductor chilling plate, and the control assembly is electrically connected with the semiconductor chilling plate. Ventilation holes are formed in the surface of the shell. According to the dehumidification device, the semiconductor chilling plate, the heat dissipation assembly and the control assembly are distributed in the horizontal direction, the thickness of the dehumidification device in the vertical direction is reduced, the dehumidification device can be horizontally placed, and the dehumidification device is suitable for dehumidification of the environment with the limited height.

Description

Technical Field

[0001] This utility model relates to the field of dehumidification device technology, and in particular to a horizontal dehumidification device. Background Technology

[0002] A semiconductor dehumidifier is a device that uses a semiconductor cooling chip to condense water vapor in the air into liquid, thereby achieving a dehumidification effect.

[0003] The applicant's earlier Chinese patent application CN2023236573994 discloses an independent heat dissipation dehumidifier, including a housing and a control component. The housing contains a condensation chamber and a heat dissipation chamber, separated by a partition. A semiconductor condensation component is located within the condensation chamber, with its heating surface in contact with the partition. At least two fans, a first fan and a second fan, are located within the heat dissipation chamber, rotating in opposite or the same direction. The control component is positioned above the heat dissipation chamber, and the second fan is positioned below it, with the first fan located between the control component and the second fan. In this design, the condensation chamber and the heat dissipation chamber are not interconnected. The heat dissipation chamber employs a large-capacity ventilation design with multiple fans to effectively dissipate heat from the hot end of the semiconductor cooling chip, ensuring its normal operation. Furthermore, the large airflow does not affect the condensation effect of the cold end of the semiconductor cooling chip. However, this dehumidifier is designed for vertical placement, making it unsuitable for environments with limited height.

[0004] This invention overcomes the shortcomings of the prior art by providing a horizontal dehumidification device that can be placed horizontally and is suitable for dehumidifying environments with limited height. Utility Model Content

[0005] The main objective of this invention is to provide a horizontal dehumidification device. The device is horizontally positioned during operation and includes a housing, a thermoelectric cooler, a heat dissipation assembly, a condensation assembly, and a control assembly. The housing is divided into multiple horizontally oriented regions, with the heat dissipation assembly, thermoelectric cooler, and control assembly located in different regions. The hot end of the thermoelectric cooler exchanges heat with the heat dissipation assembly via a heat-conducting assembly. The cold end of the thermoelectric cooler is equipped with a condensation assembly, which exchanges heat with the cold end of the thermoelectric cooler. The control assembly is electrically connected to the thermoelectric cooler. Ventilation holes are provided on the surface of the housing.

[0006] Optionally, the interior of the shell is divided into a first region, a second region, and a third region in sequence along the horizontal direction;

[0007] The first region is provided with the heat dissipation component, the second region is provided with the semiconductor cooling chip and the condensation component, and the third region is provided with the control component.

[0008] Optionally, the heat dissipation component includes a cooling fan and cooling fins, the cooling fan and the cooling fins are arranged opposite to each other, the cooling fins are connected to the hot side of the semiconductor cooling chip through a thermally conductive component, the cooling fan is electrically connected to the control component, and the ventilation holes cover the housing area where the heat dissipation component is located.

[0009] Optionally, the heat dissipation fins are provided with grooves for accommodating the cooling fan.

[0010] Optionally, the heat-conducting component includes a heat-conducting block and a heat-conducting pipe. The heat-conducting block and the thermoelectric cooler are located in the same area, and the heat-conducting block is in contact with the hot side of the thermoelectric cooler. The heat-conducting pipe connects the heat-conducting block and the heat dissipation fins.

[0011] Optionally, the heat dissipation fins are composed of multiple parallel fins, the heat pipes pass through the fins, and the heat pipes are connected in series to form multiple fins constituting the heat dissipation fins.

[0012] Optionally, the condensation assembly includes a condenser and a liquid collection box. The condenser is disposed in the liquid collection box and includes a plurality of parallel condensation plates. The condenser is in contact with the cold side end of the semiconductor cooling chip. The bottom of the liquid collection box is a liquid collection area, and the condenser is located above the liquid collection area.

[0013] Optionally, the condensing assembly further includes a condensing fan, which is electrically connected to the control assembly. The condensing fan is embedded in the housing, and the housing in the area where the condensing assembly is located has ventilation holes, which are arranged opposite to the condensing fan. The channel between the condensing fins of the condenser communicates with the condensing fan and the ventilation holes to form an air duct.

[0014] Optionally, the liquid collection box is provided with a water outlet, which extends from the inside of the housing to the outside of the housing. The liquid collection area is recessed, and the lowest point of the liquid collection area is connected to the water outlet.

[0015] Optionally, the housing has a mounting surface, and a mounting plate extends outward from the mounting surface, the mounting plate having mounting holes.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] The horizontal dehumidification device provided by this utility model reduces the thickness of the dehumidification device in the vertical direction by distributing the semiconductor cooling chip, heat dissipation component and control component in the horizontal direction. The dehumidification device can be placed horizontally and is suitable for dehumidification in environments with limited height. Attached Figure Description

[0018] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements having the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0019] Figure 1 This is a schematic diagram of an embodiment of the horizontal dehumidification device of this utility model. Figure 1 ;

[0020] Figure 2 This is a schematic diagram of an embodiment of the horizontal dehumidification device of this utility model. Figure 2 ;

[0021] Figure 3 This is a schematic diagram of the hidden housing cover of an embodiment of the horizontal dehumidification device of this utility model;

[0022] Figure 4 This is a cross-sectional view of the horizontal dehumidification device of this utility model;

[0023] Figure 5 This is an explosion diagram of the horizontal dehumidification device of this utility model.

[0024] Figure label:

[0025] 100 - Housing; 101 - Ventilation hole; 102 - Mounting surface; 103 - Mounting hole; 110 - First area; 120 - Second area; 130 - Third area; 200 - Semiconductor cooling chip; 300 - Heat dissipation assembly; 310 - Cooling fan; 320 - Heat dissipation fins; 400 - Condensation assembly; 410 - Condenser; 420 - Liquid collection box; 421 - Water outlet; 430 - Condensation fan; 500 - Control assembly; 510 - Interface; 600 - Thermal conductive assembly; 610 - Thermal block; 620 - Heat pipe. Detailed Implementation

[0026] To facilitate understanding of this utility model, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as being "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as being "connected to" another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "vertical," "horizontal," "left," "right," "inner," "outer," and similar expressions used in this specification are for illustrative purposes only. In the description of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating relative importance or implying the number of indicated technical features. Thus, unless otherwise stated, features defined as "first" or "second" may explicitly or implicitly include one or more of that feature; "multiple" means two or more. The term "comprising" and any variations thereof mean non-exclusive inclusion, where one or more other features, integers, steps, operations, units, components, and / or combinations thereof may be present or added.

[0027] Furthermore, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly, for example, as a fixed connection, a detachable connection, or an integral connection; as a mechanical connection or an electrical connection; as a direct connection or an indirect connection through an intermediate medium, or as a connection within two components. All technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0028] Furthermore, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0029] Dehumidifiers are used to dehumidify environments and reduce humidity. They typically work by creating a low-temperature environment that condenses water vapor in the air into liquid, which is then collected and discharged, achieving dehumidification. Electrical equipment requires a dry environment to ensure its normal operation. Semiconductor cooling dehumidifiers have the advantages of small size and good dehumidification effect, and are commonly used for dehumidifying electrical cabinets. Semiconductor cooling chips, also called thermoelectric cooling chips, are a type of heat pump. Their simple structure allows for application in space-constrained environments and in situations without refrigerant contamination, offering the advantage of high reliability. However, the internal space of electrical cabinets is limited, often leaving little space for installing a dehumidifier. Especially in electrical cabinets with limited internal height, vertical dehumidifiers cannot be installed. Therefore, this invention provides a horizontal dehumidifier solution with the advantage of small thickness, meeting height safety requirements.

[0030] like Figure 1-5 The diagram shown is a schematic representation of an embodiment of the horizontal dehumidification device provided by this utility model.

[0031] Please refer to Figure 1-5 This horizontal dehumidifier embodiment operates horizontally and is suitable for dehumidifying environments with limited height, especially the environment inside electrical cabinets with limited height. This embodiment includes a housing 100, a semiconductor cooling chip 200, a heat dissipation assembly 300, a condensation assembly 400, and a control assembly 500.

[0032] The interior of the housing 100 is divided into multiple areas along the horizontal direction. The heat dissipation component 300, the semiconductor cooling chip 200 and the control component 500 are respectively located in different areas, and are distributed horizontally to reduce the overall height of the dehumidifier.

[0033] The hot side of the thermoelectric cooler 200 exchanges heat with the heat dissipation component 300 via the heat-conducting component 600. The heat dissipation component 300 is used to dissipate heat from the hot side of the thermoelectric cooler 200. The cold side of the thermoelectric cooler 200 is equipped with a condensation component 400, which exchanges heat with the cold side of the thermoelectric cooler 200. The condensation component 400 condenses water vapor in the air at low temperature to form liquid. The control component 500 is electrically connected to the thermoelectric cooler 200 and is used to control the operation of the thermoelectric cooler 200. Ventilation holes 101 are provided on the surface of the housing 100, connecting the interior of the dehumidifier to the external environment.

[0034] Specifically, the interior of the housing 100 is divided into three horizontally regions: a first region 110, a second region 120, and a third region 130. The first region 110 is equipped with a heat dissipation assembly 300, the second region 120 is equipped with a thermoelectric cooler 200 and a condensation assembly 400, and the third region 130 is equipped with a control assembly 500. The control assembly 500 is specifically a PCBA board, which has multiple interfaces 510 embedded in the surface of the housing 100. These interfaces 510 are used to connect communication cables, power cables, or other host computer devices.

[0035] In one embodiment, the heat dissipation assembly 300 includes a cooling fan 310 and heat dissipation fins 320. The cooling fan 310 and the heat dissipation fins 320 are disposed opposite to each other, and the heat dissipation fins 320 are connected to the hot end of the thermoelectric cooler 200 through a thermally conductive component 600. The heat dissipation fins 320 dissipate heat from the hot end of the thermoelectric cooler 200 through the thermally conductive component 600, and the cooling fan 310 is used for heat exchange between the heat dissipation fins 320 and the surrounding air, thereby reducing the temperature of the heat dissipation fins 320. The cooling fan 310 is electrically connected to a control component 500, and the control component 500 controls the cooling fan 310. Ventilation holes 101 cover the housing 100 where the heat dissipation assembly 300 is located to facilitate gas flow within the heat dissipation assembly 300 and improve heat exchange efficiency.

[0036] Furthermore, the heat dissipation fins 320 are provided with grooves 321, which are used to accommodate the cooling fan 310. The grooves 321 cover the lower end surface and the peripheral surface of the cooling fan 310, thereby increasing the heat exchange area.

[0037] In one embodiment, the heat-conducting component 600 includes a heat-conducting block 610 and a heat-conducting pipe 620. The heat-conducting block 610 and the thermoelectric cooler 200 are located in the same region, and the heat-conducting block 610 is in contact with the hot end of the thermoelectric cooler 200 for heat conduction from the hot end of the thermoelectric cooler 200. The heat-conducting pipe 620 connects the heat-conducting block 610 and the heat dissipation fins 320. The heat generated by the hot end of the thermoelectric cooler 200 is transferred to the heat-conducting block 610, and the heat from the heat-conducting block 610 is then transferred to the heat dissipation fins 320 through the heat-conducting pipe 620 for heat dissipation. There are multiple heat-conducting pipes 620, and the pipes 620 span the first region 110 where the heat dissipation component 300 is located and the second region 120 where the thermoelectric cooler 200 is located.

[0038] Furthermore, the heat dissipation fins 320 are composed of multiple parallel fins, through which heat pipes 620 pass, and the heat pipes 620 are connected in series to form multiple fins constituting the heat dissipation fins 320. That is, the heat pipes 620 pass through the interior of the heat dissipation fins 320 to achieve heat exchange, and also serve to connect and support the fins of the heat dissipation fins 320.

[0039] The heat-conducting block 610, heat-conducting pipe 610, and heat dissipation fins 320 are made of materials with high thermal conductivity, specifically copper.

[0040] In one embodiment, the condensation assembly 400 includes a condenser 410 and a collection box 420, with the condenser 410 disposed within the collection box 420. The condenser 410 includes multiple parallel condensation fins to increase the contact area with air. The condenser 410 is in contact with the cold side of the thermoelectric cooler 200, and the cooling energy generated by the thermoelectric cooler 200 is transferred to the condenser 410. The low-temperature condenser 410 condenses water vapor in the air, achieving a dehumidification effect. The bottom of the collection box 420 is a collection area, and the condenser 410 is located above this area. The water condensed by the condenser 410 drips into the collection box 420 under gravity, which is used for collecting the condensate.

[0041] Specifically, the semiconductor cooling chip 200, the heat-conducting block 610, and the condenser 410 are all housed in the liquid collection box 420. The side of the liquid collection box 420 has an opening for the heat-conducting pipe 610 to pass through.

[0042] Furthermore, the condensing assembly 400 also includes a condensing fan 430, which is electrically connected to the control assembly 500. The condensing fan 430 is embedded in the housing 100. The housing in the area where the condensing assembly 400 is located has ventilation holes 101, which are positioned opposite to the condensing fan 430. The channels between the condensing fins of the condenser 410 communicate with the condensing fan 430 and the ventilation holes to form an air duct.

[0043] The condenser fan 430 is used to accelerate the air heat exchange time of the condenser 410 and increase dehumidification efficiency. The air duct facilitates air circulation and increases the amount of dehumidification.

[0044] In addition, the liquid collection box 420 is provided with a water outlet 421, which extends from the inside of the housing 100 to the outside of the housing 100. The condensate collected in the liquid collection box 420 is discharged in a timely manner through the water outlet 421. Furthermore, the liquid collection area is concave, and the lowest point of the liquid collection area is connected to the water outlet 421, which facilitates the flow of liquid in the liquid collection box out through the water outlet 421.

[0045] In one embodiment, the housing 100 has a mounting surface 102, and a mounting plate extends outward from the mounting surface 102. The mounting plate has mounting holes 103. The mounting holes 103 can be used to install connecting structures such as screws or bolts, so as to achieve fixation in environments requiring dehumidification, such as electrical cabinets.

[0046] In summary, the horizontal dehumidification device embodiment of this utility model reduces the thickness of the dehumidification device in the vertical direction by distributing the semiconductor cooling chip, heat dissipation component and control component in the horizontal direction, and the dehumidification device can be placed horizontally, making it suitable for dehumidification in environments with limited height.

[0047] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Under the concept of this utility model, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of this utility model as described above. For the sake of brevity, they are not provided in detail. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A horizontal dehumidification device, characterized in that, The horizontal dehumidification device is placed horizontally during operation and includes a shell, a semiconductor refrigeration chip, a heat dissipation component, a condensation component, and a control component. The interior of the shell is divided into multiple regions along the horizontal direction. The heat dissipation component, the semiconductor refrigeration chip, and the control component are respectively located in different regions. The hot side of the semiconductor refrigeration chip exchanges heat with the heat dissipation component through a heat conduction component. The cold side of the thermoelectric cooler is provided with a condensation component, which exchanges heat with the cold side of the thermoelectric cooler. The control component is electrically connected to the thermoelectric cooler. The surface of the housing is provided with ventilation holes.

2. The horizontal dehumidification device according to claim 1, characterized in that, The interior of the shell is divided into a first region, a second region, and a third region in sequence along the horizontal direction; The first region is provided with the heat dissipation component, the second region is provided with the semiconductor cooling chip and the condensation component, and the third region is provided with the control component.

3. The horizontal dehumidification device according to claim 1, characterized in that, The heat dissipation assembly includes a cooling fan and cooling fins. The cooling fan and the cooling fins are arranged opposite to each other. The cooling fins are connected to the hot side of the semiconductor cooling chip through a thermally conductive component. The cooling fan is electrically connected to the control component. The ventilation holes cover the housing area where the heat dissipation assembly is located.

4. The horizontal dehumidification device according to claim 3, characterized in that, The heat dissipation fins are provided with grooves for accommodating the cooling fan.

5. The horizontal dehumidification device according to claim 3, characterized in that, The heat-conducting component includes a heat-conducting block and a heat-conducting pipe. The heat-conducting block and the thermoelectric cooler are located in the same area, and the heat-conducting block is in contact with the hot side of the thermoelectric cooler. The heat-conducting pipe connects the heat-conducting block and the heat dissipation fins.

6. The horizontal dehumidification device according to claim 5, characterized in that, The heat dissipation fins are composed of multiple parallel fins, and the heat pipes pass through the fins, with the heat pipes connecting multiple fins that make up the heat dissipation fins in series.

7. The horizontal dehumidification device according to claim 1, characterized in that, The condensation assembly includes a condenser and a liquid collection box. The condenser is disposed in the liquid collection box and includes a plurality of parallel condensation plates. The condenser is in contact with the cold side end of the semiconductor cooling chip. The bottom of the liquid collection box is a liquid collection area, and the condenser is located above the liquid collection area.

8. The horizontal dehumidification device according to claim 7, characterized in that, The condensing assembly also includes a condensing fan, which is electrically connected to the control assembly. The condensing fan is embedded in the housing. The housing in the area where the condensing assembly is located has ventilation holes, which are arranged opposite to the condensing fan. The channel between the condensing fins of the condenser is connected to the condensing fan and the ventilation holes to form an air duct.

9. The horizontal dehumidification device according to claim 7, characterized in that, The liquid collection box is provided with a water outlet, which extends from the inside of the housing to the outside of the housing. The liquid collection area is concave, and the lowest point of the liquid collection area is connected to the water outlet.

10. The horizontal dehumidification device according to claim 1, characterized in that, The housing has a mounting surface, and a mounting plate extends outward from the mounting surface. The mounting plate has mounting holes.

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