Optical transceiver module shell and optical transceiver module
By designing a heat dissipation component that can pass through the housing body in the optical transceiver module housing, the heat-conducting substrate is thermally coupled to the circuit board, and the heat-conducting fins directly absorb and dissipate heat energy, thus solving the problem of insufficient heat dissipation in the prior art and achieving a highly efficient heat dissipation effect.
Patent Information
- Application Number
- CN202423065246.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-11-29
- Filing Date
- 2024-12-12
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2034-12-12
AI Technical Summary
The existing heat dissipation structure of optical transceiver modules cannot meet the heat dissipation requirements under high transmission rates, resulting in a design bottleneck.
The design incorporates heat sinks that can penetrate the housing, thermally coupling the thermally conductive substrate with the circuit board. The thermally conductive fins directly absorb and dissipate internal heat, increasing heat dissipation efficiency.
It improves the heat dissipation efficiency of the optical transceiver module, avoids performance reduction or failure due to overheating, and meets the heat dissipation requirements of high transmission rates.
Smart Images
Figure CN223501205U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to an optical transceiver module, and more particularly to an optical transceiver module housing with a heat dissipation structure. Background Technology
[0002] In the field of optical communication, the transmission rate of optical transceiver modules is constantly increasing, and the power consumption during operation is also increasing, causing optical transceiver modules to operate at higher temperatures. To avoid overheating, some optical transceiver modules currently incorporate heat sinks on their housings to effectively dissipate internal heat. However, this architecture, where internal heat is first dissipated through the housing and then through the external heat sinks, is gradually becoming insufficient for applications with ever-increasing transmission rates, creating a design bottleneck for optical transceiver modules. Utility Model Content
[0003] In view of the problems in the prior art, the purpose of this utility model is to provide a housing for an optical transceiver module, wherein the heat dissipation component can pass through the housing body, thereby directly absorbing heat energy from the inside of the housing body and dissipating the absorbed heat energy outside the housing body, thus increasing the heat dissipation efficiency.
[0004] According to an embodiment of the present invention, an optical transceiver module housing includes a housing body and a heat sink. The housing body has an electronic device accommodating space and an opening communicating with the electronic device accommodating space. The heat sink is detachably assembled to the housing body. The heat sink includes a thermally conductive substrate and at least one thermally conductive fin fixed on the thermally conductive substrate. The thermally conductive substrate is housed within the electronic device accommodating space, and the at least one thermally conductive fin protrudes from the opening. Therefore, the heat sink can directly absorb heat energy from inside the housing body and dissipate the absorbed heat energy outside the housing body, thus increasing heat dissipation efficiency.
[0005] Another objective of this invention is to provide an optical transceiver module that includes the aforementioned optical transceiver module housing. Therefore, its heat dissipation component can pass through the housing body and can be directly thermally coupled to the light-emitting component housed inside the housing body, thereby increasing heat dissipation efficiency.
[0006] An optical transceiver module according to an embodiment of the present invention includes a circuit board assembly and the aforementioned optical transceiver module housing. The circuit board assembly has an edge connector. The circuit board assembly is housed in the electronic device housing space and extends out of the electronic device housing space to expose the edge connector. The thermally conductive substrate is thermally coupled to the circuit board assembly. Therefore, the heat sink can directly absorb heat energy from the circuit board assembly inside the housing and dissipate the absorbed heat energy outside the housing, thus increasing heat dissipation efficiency.
[0007] The advantages and spirit of this utility model can be further understood through the following detailed description of the utility model and the accompanying drawings. Attached Figure Description
[0008] Figure 1 This is a schematic diagram of an optical transceiver module according to one embodiment.
[0009] Figure 2 for Figure 1 A partially exploded view of the Zhongguang transceiver module.
[0010] Figure 3 for Figure 1 A cross-sectional view of the Zhongguang transceiver module along line XX.
[0011] Figure 4 for Figure 2 A top view of the upper heat sink of the optical transceiver module housing in the optical transceiver module.
[0012] Figure 5 for Figure 2 A top view of the lower heat sink of the optical transceiver module housing in the optical transceiver module.
[0013] Figure 6 This is a schematic diagram of an optical transceiver module according to another embodiment.
[0014] Attached icon number
[0015] 1,1': Optical transceiver module
[0016] 12: Circuit board assembly
[0017] 120: Circuit board
[0018] 122: Board Edge Connector
[0019] 124, 126: Electronic components
[0020] 14: Optical transceiver module housing
[0021] 14a: Length direction
[0022] 142: Shell Body
[0023] 1422: Top Cover
[0024] 1422a: Opening
[0025] 1422b: Inner surface
[0026] 1422c: Vertical plate
[0027] 1424: Bottom Cover
[0028] 1424a: Opening
[0029] 142a: Electronic device housing space
[0030] 144,144': Upper heat sink
[0031] 1442: Thermally conductive substrate
[0032] 1442a: Fin connection part
[0033] 1442b: Stopping part
[0034] 1444: Thermal fins
[0035] 1446: Cover plate
[0036] 146: Lower heat sink
[0037] 1462: Thermally conductive substrate
[0038] 1462a: Fin connection part
[0039] 1462b: Stopping part
[0040] 1464: Thermal fins
[0041] 148, 150: Thermal conductive materials
[0042] Dv: Vertical direction Detailed Implementation
[0043] Please see Figures 1 to 3 According to one embodiment, an optical transceiver module 1 includes a circuit board assembly 12 and an optical transceiver module housing 14, the optical transceiver module housing 14 accommodating the circuit board assembly 12. The circuit board assembly 12 has an edge connector 122 exposed outside the optical transceiver module housing 14, which can be connected to a connector socket (not shown) of an optical transceiver module socket.
[0044] In this embodiment, the optical transceiver module housing 14 has a length direction 14a and includes a housing body 142 and two heat sinks (an upper heat sink 144 and a lower heat sink 146) detachably assembled to the housing body 142. The housing body 142 includes an upper cover 1422 and a lower cover 1424 in a vertical direction Dv (indicated by a double-headed arrow in the figure, perpendicular to the length direction 14a). The upper cover 1422 and the lower cover 1424 are connected to form an electronic device accommodating space 142a. The circuit board assembly 12 is accommodated in the electronic device accommodating space 142a and extends out of the electronic device accommodating space 142a with the board edge connector 122 exposed in the length direction 14a; wherein, the upper cover 1422 and the lower cover 1424 have corresponding restraint structures to restrain the long side (parallel to the length direction 14a) of the circuit board 120 of the circuit board assembly 12. The upper cover 1422 has an opening 1422a in the vertical direction Dv, which connects to the electronic device accommodating space 142a. The lower cover 1424 also has an opening 1424a in the vertical direction Dv, which connects to the electronic device accommodating space 142a. An upper heat sink 144 is assembled to the upper cover 1422, and the upper heat sink 144 extends partially into the electronic device accommodating space 142a through the opening 1422a and is exposed outside the opening 1422a. A lower heat sink 146 is assembled to the lower cover 1424, and the lower heat sink 146 extends partially into the electronic device accommodating space 142a through the opening 1424a and is exposed outside the opening 1424a. Both the upper heat sink 144 and the lower heat sink 146 are thermally coupled to the circuit board assembly 12 to directly absorb heat energy from the circuit board assembly 12 and dissipate the absorbed heat energy outside the housing body 142.
[0045] Please see Figures 2 to 4 ;in, Figure 4 This is a top view of the upper heat sink 144, with the hidden lines of the upper heat sink 144 shown as dashed lines. The upper heat sink 144 includes a thermally conductive substrate 1442, at least one thermally conductive fin 1444 fixed to the thermally conductive substrate 1442, and a cover plate 1446. The cover plate 1446 is disposed opposite to the thermally conductive substrate 1442 and fixedly connected to the at least one thermally conductive fin 1444. The thermally conductive substrate 1442 is housed within an electronic device housing space 142a. The at least one thermally conductive fin 1444 protrudes from the opening 1422a of the upper cover 1422 and extends beyond the housing body 142. The cover plate 1446 is located outside the housing body 142. The thermally conductive substrate 1442 has a fin connection portion 1442a (i.e., equivalent to...). Figure 4 The area enclosed by the middle link wire frame) and a stop 1442b (equivalent to Figure 4The area between the mid-frame and the outline of the thermally conductive substrate 1442 forms a rectangular frame. At least one thermally conductive fin 1444 is connected to the fin connection portion 1442a, and the stop portion 1442b has no fins. The stop portion 1442b is adjacent to and surrounds the fin connection portion 1442a. The thermally conductive substrate 1442 is larger than the opening 1422a of the upper cover 1422, so that the stop portion 1442b is stopped by the edge of the opening 1422a within the electronic device accommodating space 142a; in other words, the upper heat sink 144 will not detach from the housing body 142 from the opening 1422a, and the highest position of the cover plate 1446 (the height protruding relative to the upper cover 1422) is controlled, ensuring that the external dimensions of the optical transceiver module housing 14 conform to specifications. In actual assembly (using... Figure 2 From a visual perspective, the upper heat sink 144 moves upward from below the upper cover 1422 so that part of the structure passes through the opening 1422a and is then assembled to the upper cover 1422.
[0046] In addition, in this embodiment, the entire opening 1422a of the top cover 1422 can be projected onto the heat-conducting substrate 1442 in the vertical direction, but this is not a limitation in practice. For example, only a portion of the opening 1422a may be projected onto the heat-conducting substrate 1442 (for example, the short side of the rectangular blocking portion 1442b protrudes from the opening 1422a, while the long side of the blocking portion 1442b is still covered by the top cover 1422); in this case, the blocking portion 1442b can still effectively block the edge of the opening 1422a, preventing the upper heat sink 144 from detaching from the shell body 142 from the opening 1422a. In addition, in practice, the blocking portion 1442b can be fixed to an inner surface 1422b of the top cover 1422 (see Figure 3 Examples include adhesive bonding, soldering, locking, and tight structural fitting.
[0047] In addition, such as Figure 2 and Figure 3 As shown, in the upper heat sink 144, the number of at least one heat-conducting fin 1444 is 6, but this is not a limitation in practice. The heat-conducting fin 1444 extends parallel to the length direction 14a of the upper heat sink 144 (or the optical transceiver module 1) and connects between the heat-conducting substrate 1442 and the cover plate 1446, forming multiple air channels (parallel to the length direction 14a). These air channels allow airflow (e.g., cooling airflow from the device into which the optical transceiver module 1 is inserted) to pass through, which can increase the heat dissipation efficiency of the heat-conducting fin 1444. In addition, the upper heat sink 144 is located between the vertical plates 1422c on both sides above the upper cover 1422, and the upper heat sink 144 and the vertical plates 1422c are substantially at the same height (relative to the top surface of the upper cover 1422 body). The top of the cover plate 1446 of the upper heat sink 144 has a flat surface, which facilitates the contact between the cover plate 1446 and the inner surface of the socket housing through its top after the optical transceiver module 1 is inserted into the socket, thereby increasing the heat dissipation efficiency.
[0048] like Figure 2 and Figure 3 As shown, in this embodiment, the circuit board assembly 12 has a plurality of electronic components 124 (selectively labeled) disposed on the side facing the heat sink 144. The thermally conductive substrate 1442 is thermally coupled to the electronic components 124 via a thermally conductive material 148 (e.g., but not limited to a thermally conductive sheet), so that the thermally conductive substrate 1442 can quickly absorb the heat generated by the electronic components 124 during operation, and prevent the electronic components 124 from overheating and thus reducing their performance or causing them to fail.
[0049] Please see Figure 2 , Figure 3 and Figure 5 ;in, Figure 5 This is a top view of the lower heat sink 146. The lower heat sink 146 includes a thermally conductive substrate 1462 and at least one thermally conductive fin 1464 (the number of which is seven, but is not limited to this in practice) fixed on the thermally conductive substrate 1462. The thermally conductive substrate 1462 is housed within an electronic device housing space 142a, and the at least one thermally conductive fin 1464 extends parallel to the length direction 14a and protrudes from the opening 1424a of the lower cover 1424. Similarly, the thermally conductive substrate 1462 has a fin connection portion 1462a (i.e., equivalent to...). Figure 5 The area enclosed by the middle link frame) and a stop 1462b (equivalent to Figure 5 The area between the mid-link wireframe and the outline of the thermally conductive substrate 1462 forms a rectangular frame. At least one thermally conductive fin 1464 is connected to the fin connection portion 1462a, and the stop portion 1462b has no fins. The stop portion 1462b is adjacent to and surrounds the fin connection portion 1462a. The thermally conductive substrate 1462 is larger than the opening 1424a of the lower cover 1424, such that the stop portion 1462b is stopped by the edge of the opening 1424a within the electronic device accommodating space 142a; in other words, the lower heat sink 146 will not detach from the housing body 142 from the opening 1424a, and the position of the lower heat sink 146 relative to the lower cover 1424 is controlled, ensuring that the external dimensions of the optical transceiver module housing 14 meet specifications. In actual assembly (using... Figure 2 From a visual perspective, the lower heat sink 146 moves downward from above the lower cover 1424 so that the at least one heat-conducting fin 1464 is placed in the opening 1422a, and then assembled to the lower cover 1424.
[0050] In addition, for other descriptions (including descriptions of variations) regarding the relative arrangement of the thermally conductive substrate 1462 and the opening 1424a, please refer directly to the description of the relative arrangement of the thermally conductive substrate 1442 of the upper heat sink 144 and the opening 1422a of the upper cover 1422 in the previous text, and will not be repeated here.
[0051] In addition, such as Figure 2 and Figure 3As shown, the at least one heat-conducting fin 1464 of the lower heat sink 146 does not protrude from the opening 1424a (i.e., it does not protrude from the bottom surface of the lower cover 1424). Therefore, during the insertion of the optical transceiver module 1 into the socket, the at least one heat-conducting fin 1464 will not interfere with the aforementioned insertion operation. In this embodiment, the end of the at least one heat-conducting fin 1464 is substantially coplanar with the bottom surface of the lower cover 1424, but this is not a limitation in practice.
[0052] Similarly, such as Figure 2 and Figure 3 As shown, in this embodiment, the circuit board assembly 12 has a plurality of electronic components 126 (selectively labeled) disposed on the side facing the lower heat sink 146. The thermally conductive substrate 1462 is thermally coupled to the electronic components 126 via a thermally conductive material 150 (e.g., but not limited to a thermally conductive sheet), so that the thermally conductive substrate 1462 can quickly absorb the heat generated by the electronic components 126 during operation, and prevent the electronic components 126 from overheating and thus reducing their performance or causing them to fail.
[0053] As previously explained, in the optical transceiver module housing 14 of the optical transceiver module 1, the upper heat sink 144 and the lower heat sink 146 are combined with the upper cover 1422 and the lower cover 1424 respectively. Therefore, in practice, the upper heat sink 144, the lower heat sink 146, the upper cover 1422, and the lower cover 1424 can all be made of different materials. For example, the upper cover 1422 and the lower cover 1424 can be made of zinc alloy to provide the structural strength required by the optical transceiver module 1; the upper heat sink 144 and the lower heat sink 146 can be made of aluminum alloy, which has higher heat dissipation efficiency (compared to zinc alloy). However, this is not a limitation in practice. In addition, in this embodiment, the upper heat sink 144 has a cover plate 1446, and the lower heat sink 146 has heat-conducting fins 1464, but this is not a limitation in practice. For example, as Figure 6 The optical transceiver module 1' shown has a heat sink 144' without a top cover; in this example, the heat-conducting fins 1444 of the upper heat sink 144' are at the same height as the vertical plate 1422c. Furthermore, in this embodiment, the optical transceiver module housing 14 is provided with heat sinks on both the upper and lower sides (upper heat sink 144 and lower heat sink 146, respectively), but this is not a limitation in practice; for example, the optical transceiver module housing 14 may only have heat sinks on the upper or lower side (i.e., either the upper heat sink 144 or the lower heat sink 146 may be provided).
[0054] The above description is only a preferred embodiment of the present utility model. All equivalent changes and modifications made in accordance with the claims of the present utility model should be included in the scope of the present utility model.
Claims
1. A housing for an optical transceiver module, characterized in that, Include: A housing body having an electronic device accommodating space and an opening communicating with the electronic device accommodating space; as well as A heat sink is detachably assembled to the housing body. The heat sink includes a thermally conductive substrate and at least one thermally conductive fin fixed on the thermally conductive substrate. The thermally conductive substrate is housed within the electronic device housing space, and the at least one thermally conductive fin is exposed from the opening.
2. The optical transceiver module housing as described in claim 1, characterized in that, At least one heat-conducting fin extends out of the shell body from the opening.
3. The optical transceiver module housing as described in claim 1, characterized in that, The heat sink includes a cover plate that is disposed opposite to the heat-conducting substrate and fixedly connected to the at least one heat-conducting fin.
4. The optical transceiver module housing as described in claim 1, characterized in that, The thermally conductive substrate has a fin connection portion and a stop portion. The stop portion is adjacent to the fin connection portion and is stopped by the edge of the opening within the electronic device accommodating space.
5. The optical transceiver module housing as described in claim 4, characterized in that, The stop surrounds the fin connection.
6. The optical transceiver module housing as described in claim 4, characterized in that, The stop is fixed to an inner surface of the shell body.
7. The optical transceiver module housing as described in claim 1, characterized in that, The housing body includes an upper cover and a lower cover, which are connected to form an electronic device housing space, and the opening is provided on the upper cover or the upper cover.
8. The optical transceiver module housing as described in claim 1, characterized in that, The shell body and the heat sink are made of different materials.
9. The optical transceiver module housing as described in claim 1, characterized in that, At least one heat-conducting fin does not protrude from the opening.
10. An optical transceiver module, characterized in that, Include: The optical transceiver module housing as described in any one of claims 1 to 9; and A circuit board assembly having an edge connector, the circuit board assembly being housed in an electronic device housing space and extending out of the electronic device housing space to expose the edge connector, the thermally conductive substrate being thermally coupled to the circuit board assembly.
11. The optical transceiver module as described in claim 10, characterized in that, The circuit board assembly has an electronic component, and the thermally conductive substrate is thermally coupled to the electronic component via a thermally conductive material.