Wafer positioning and supporting device of uniform glue developing machine

Abstract

The utility model discloses a wafer positioning and supporting device of a uniform glue developing machine, which comprises a first positioning and supporting assembly and a second positioning and supporting assembly which are fixed on a platform of a rack, have the same structure and are oppositely arranged, and the first positioning and supporting assembly comprises a first fixed bottom plate fixed on the platform; a first wafer bracket is slidably mounted on the first fixing bottom plate, the first wafer bracket and a second wafer bracket of the second positioning bracket assembly are the same in sliding direction and are oppositely arranged, and a first positioning frame is further slidably mounted on the first fixing bottom plate; the first positioning frame is located above the first wafer bracket, the sliding direction of the first positioning frame is the same as that of the first wafer bracket, the first positioning frame and the second positioning frame are jointly matched to position a wafer, the wafer positioning and supporting device can position the wafer while supporting the wafer, adsorption of a vacuum chuck below is facilitated, and the wafer positioning and supporting device is simple in structure and convenient to use. And the accuracy of the glue dripping position is ensured.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a wafer positioning support device for a spin coater. Background Technology

[0002] In photoresist coating and developing machines, the wafer is placed on a rotating vacuum chuck, which then rotates the wafer. A dispensing pump then dispenses photoresist onto the center of the wafer. During rotation, the photoresist is evenly distributed across the wafer surface. However, current wafer support devices only support the wafer. The vacuum chuck rises and adheres to the bottom of the wafer, but during wafer feeding, positional deviations may occur. This can lead to inaccurate dispensing, resulting in poorer coating performance and affecting the uniformity of the photoresist. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a wafer positioning support device for a spin coater and developer. This wafer positioning support device can position the wafer while supporting it, which facilitates the adsorption of the vacuum chuck below and ensures the accuracy of the dispensing position.

[0004] To solve the above-mentioned technical problems, the technical solution of this utility model is: a wafer positioning support device for a spin coater and developer. The wafer positioning support device is fixed on the frame and includes a first positioning support assembly and a second positioning support assembly fixed on a platform of the frame. The first positioning support assembly and the second positioning support assembly have the same structure and are arranged opposite to each other. The first positioning support assembly includes a first fixed base plate fixed on the platform. A first wafer holder is slidably mounted on the first fixed base plate. The first wafer holder is driven by a first linear power device. The sliding direction of the first wafer holder and the second wafer holder of the second positioning support assembly are the same and they are arranged opposite to each other. A first positioning frame is also slidably mounted on the first fixed base plate. The first positioning frame is driven by a first positioning sliding device. The first positioning frame is located above the first wafer holder and its sliding direction is the same as that of the first wafer holder. The first positioning frame and the second positioning frame of the second positioning support assembly cooperate to position the wafer.

[0005] As a preferred embodiment, the first positioning frame includes a positioning frame connecting seat, on which an arc-shaped positioning part is provided, the arc-shaped positioning part being positioned and engaged with the edge of the wafer.

[0006] As a preferred embodiment, the first positioning sliding device includes a first positioning cylinder fixed to the first fixed base plate, the piston rod of the first positioning cylinder is connected to a first slider, the positioning frame connecting seat is mounted on the first slider, and a buffer device is provided between the positioning frame connecting seat and the first slider.

[0007] As a preferred embodiment, the positioning frame connecting seat is provided with a strip-shaped hole, the extension direction of the strip-shaped hole is the same as the sliding direction of the first slider, a connecting bolt is constrained in the strip-shaped hole, the connecting bolt connects the positioning frame connecting seat to the first slider, and an elastic buffer is also pressed and installed in the strip-shaped hole.

[0008] As a preferred embodiment, the elastic buffer is a spring or an elastic packing.

[0009] As a preferred embodiment, the first fixed base plate is further provided with a position detection sensor for detecting the sliding position of the positioning frame connecting seat, and the positioning frame connecting seat is provided with a detection mating part that corresponds to and cooperates with the position detection sensor.

[0010] As a preferred embodiment, the first linear power device includes a first cylinder, which is fixed to the first fixed base plate, and the piston rod of the first cylinder is detachably fixed to the first wafer carrier via a connecting block.

[0011] As a preferred embodiment, the first wafer carrier includes a first wafer carrier plate, the first wafer carrier plate is provided with a strip-shaped mounting hole, a fixing bolt for fixing the first wafer carrier plate and the connecting block is installed in the strip-shaped mounting hole, and the first wafer carrier plate is provided with two support columns that protrude upward to support the bottom of the wafer.

[0012] After adopting the above technical solution, the effect of this utility model is as follows: The wafer positioning support device includes a first positioning support assembly and a second positioning support assembly fixed on a platform of the rack. The first and second positioning support assemblies have the same structure and are arranged opposite to each other. The first positioning support assembly includes a first fixed base plate fixed on the platform. A first wafer carrier is slidably mounted on the first fixed base plate. The first wafer carrier is driven by a first linear power device. The sliding directions of the first wafer carrier and the second wafer carrier of the second positioning support assembly are the same and they are arranged opposite to each other. A first positioning frame is also slidably mounted on the first fixed base plate. The first positioning frame is supported by a first positioning sliding device. The first positioning frame is located above the first wafer carrier and slides in the same direction as the first wafer carrier. The first positioning frame and the second positioning frame of the second positioning support assembly work together to position the wafer. Therefore, when the wafer is fed in by the feeding robot, the first wafer carrier of the first positioning support assembly and the second wafer carrier of the second positioning support assembly slide out to support the wafer. Then, the first positioning frame and the second positioning frame slide close to each other to position the wafer. After positioning, they reset, and the vacuum chuck located below rises to pick up the wafer. Then, the first wafer carrier and the second wafer carrier slide back to their original positions. In this way, the wafer is picked up by the vacuum chuck, which facilitates the dispensing operation and ensures accurate dispensing position.

[0013] Furthermore, the first positioning sliding device includes a first positioning cylinder fixed to the first fixed base plate, the piston rod of the first positioning cylinder is connected to a first slider, the positioning frame connecting seat is installed on the first slider, and a buffer device is provided between the positioning frame connecting seat and the first slider. This buffer device can play a buffering role when the first positioning frame and the second positioning frame position the wafer to avoid excessive positioning force.

[0014] Furthermore, since the positioning frame connecting seat is provided with a strip-shaped hole, the extension direction of the strip-shaped hole is the same as the sliding direction of the first slider, and a connecting bolt is constrained in the strip-shaped hole, the connecting bolt connects the positioning frame connecting seat to the first slider, and an elastic buffer is also squeezed and installed in the strip-shaped hole, the installation of the elastic buffer is very simple.

[0015] Furthermore, since the first fixed base plate is also provided with a position detection sensor for detecting the sliding position of the positioning frame connecting seat, and the positioning frame connecting seat is provided with a detection mating part that corresponds to and cooperates with the position detection sensor, the detection mating part can detect the sliding position of the positioning frame connecting seat. Only when the detection sensor detects the detection mating part will the sliding position of the positioning frame connecting seat stop. Therefore, the position of the first positioning frame can be accurately determined. Even if the elastic buffer changes due to changes in elastic force during long-term use, the sliding position of the first positioning frame can still be accurately controlled.

[0016] Furthermore, since the first wafer carrier includes a first wafer carrier plate, the first wafer carrier plate is provided with a strip-shaped mounting hole, and a fixing bolt for fixing the first wafer carrier plate to the connecting block is installed in the strip-shaped mounting hole. The first wafer carrier plate is provided with two upwardly protruding support columns to support the bottom of the wafer. The support columns can support the wafer and reduce the contact area, avoiding contamination of the wafer. The strip-shaped mounting hole and the fixing bolt can adjust the fixed position of the first wafer carrier plate, thereby flexibly adjusting the support position of the support columns. Attached Figure Description

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0018] Figure 1 This is a schematic diagram of the installation state structure of an embodiment of this utility model;

[0019] Figure 2 yes Figure 1 Top view;

[0020] Figure 3 This is a schematic diagram of the structure of the first positioning support assembly according to an embodiment of the present invention;

[0021] Figure 4 This is a structural schematic diagram of the first positioning support component of this utility model from another angle;

[0022] In the attached diagram: 1. Frame; 2. Platform; 3. First fixing plate; 4. First cylinder; 5. First wafer carrier; 51. First wafer carrier plate; 52. Strip mounting hole; 53. Support column; 6. Second wafer carrier; 7. First positioning cylinder; 8. First positioning frame; 81. Positioning frame connecting seat; 811. Strip hole; 812. Connecting bolt; 813. Elastic buffer; 82. Arc-shaped positioning part; 83. Detection mating part; 9. Position detection sensor; 10. First slider. Detailed Implementation

[0023] The present invention will be further described in detail below through specific embodiments.

[0024] like Figure 1-4 As shown, a wafer positioning support device for a spin coater is provided. The wafer positioning support device is fixed on a frame 1 and includes a first positioning support assembly and a second positioning support assembly fixed on a platform 2 of the frame 1. The first and second positioning support assemblies have the same structure and are arranged opposite to each other. In this embodiment, the structure of the first positioning support assembly is described as an example. The first positioning support assembly includes a first fixed base plate 3 fixed on the platform 2. A first wafer holder 5 is slidably mounted on the first fixed base plate 3. The first wafer holder 5 is driven by a first linear power device. The sliding directions of the first wafer holder 5 and the second wafer holder 6 of the second positioning support assembly are the same and opposite to each other, both sliding horizontally, and they are always sliding relative to each other. A first positioning frame 8 is also slidably mounted on the first fixed base plate 3. The first positioning frame 8 is driven by a first positioning sliding device. The first positioning frame 8 is located above the first wafer holder 5 and slides in the same direction as the first wafer holder 5. The first positioning frame 8 and the second positioning frame of the second positioning support assembly cooperate to position the wafer.

[0025] In this embodiment, the first positioning frame 8 includes a positioning frame connecting seat 81, on which an arc-shaped positioning part 82 is provided, and the arc-shaped positioning part 82 is positioned and engaged with the edge of the wafer. The first positioning sliding device includes a first positioning cylinder 7 fixed on a first fixed base plate 3, the piston rod of the first positioning cylinder 7 is connected to a first slider 10, the positioning frame connecting seat 81 is mounted on the first slider 10, and a buffer device is provided between the positioning frame connecting seat 81 and the first slider 10.

[0026] The positioning frame connecting seat 81 has a strip-shaped hole 811, the extension direction of which is the same as the sliding direction of the first slider 10. A connecting bolt 812 is constrained within the strip-shaped hole 811, connecting the positioning frame connecting seat 81 to the first slider 10. An elastic buffer 813 is also pressed and installed within the strip-shaped hole 811. The elastic buffer 813 can be a spring or elastic filler. In this embodiment, a spring is used.

[0027] The first fixed base plate 3 is also provided with a position detection sensor 9 for detecting the sliding position of the positioning frame connecting seat 81. The positioning frame connecting seat 81 is provided with a detection mating part 83 that corresponds to and cooperates with the position detection sensor 9. The first linear power device includes a first cylinder 4, which is fixed on the first fixed base plate 3. The piston rod of the first cylinder 4 is detachably fixed to the first wafer carrier 5 through a connecting block. The first wafer carrier 5 includes a first wafer carrier plate 51, which is provided with a strip-shaped mounting hole 52. A fixing bolt for fixing the first wafer carrier plate 51 to the connecting block is installed in the strip-shaped mounting hole 52. The first wafer carrier plate 51 is provided with two upwardly protruding support columns 53 for supporting the bottom of the wafer.

[0028] In actual installation and use, both the first positioning support assembly and the second positioning support assembly are equipped with protective covers. These protective covers are respectively mounted on the first fixed base plate 3 and the second fixed base plate. Figure 1 and Figure 2 In order to facilitate the display of the internal structure, the protective cover on the side where the first positioning support component is located has been hidden.

[0029] During operation, by adjusting the position of the fixing bolts in the strip mounting hole 52, the positions of the first wafer carrier plate 51 and the second wafer carrier plate 6 are adjusted. After the wafer is fed in by the feeding robot, the first cylinder 4 of the first linear power unit drives the first wafer carrier 5 to slide out, and the second cylinder of the second linear power unit drives the second wafer carrier 6 to slide out. The support columns 53 of the first wafer carrier 5 and the second wafer carrier 6 work together to support the wafer. Then, the first positioning cylinder 7 drives the first positioning frame 8, and the second positioning cylinder drives the second positioning frame. The first positioning frame 8 and the second positioning frame slide closer to each other to position the wafer. When the position detection sensor 9 detects the detection mating part 83, the sliding of the positioning frame connecting seat 81 stops, so the position of the first positioning frame 8 and the second positioning frame can be accurately determined. The vacuum chuck located below will rise and pick up the wafer. Then the first wafer carrier 5 and the second wafer carrier 6 slide back to their original positions. The wafer is picked up by the vacuum chuck for the dispensing operation, ensuring accurate dispensing position.

[0030] The pneumatic system, servo motor and other actuators, gear transmission mechanism, and lead screw and nut mechanism mentioned in this embodiment are all current conventional technologies. The 5th edition of the "Mechanical Design Handbook" published in Beijing in April 2008 (5th edition, 28th printing) details the specific structure, principle, and other designs of cylinders, motors, and other transmission mechanisms, which are existing technologies with clear and straightforward structures. The 3rd edition of "Modern Practical Pneumatic Technology" SMC training materials published by Machinery Industry Press on August 1, 2008, details vacuum components, gas circuits, and program control, indicating that the pneumatic structure in this embodiment is also existing technology and clear and straightforward. The book "Motor Drive and Speed ​​Regulation" published by Chemical Industry Press on July 1, 2015, also details motor control and limit switches. Therefore, the circuit and pneumatic connections are clear.

[0031] The above-described embodiments are merely preferred embodiments of the present utility model and are not intended to limit the scope of the present utility model. Any modifications and alterations to the technical solution of the present utility model without departing from its design spirit shall fall within the protection scope defined by the claims of the present utility model.

Claims

1. A wafer positioning support device for a spin coater and developer, wherein the wafer positioning support device is fixed on the frame, characterized in that: The wafer positioning support device includes a first positioning support assembly and a second positioning support assembly fixed on a platform of the rack. The first and second positioning support assemblies have the same structure and are arranged opposite to each other. The first positioning support assembly includes a first fixed base plate fixed on the platform. A first wafer carrier is slidably mounted on the first fixed base plate. The first wafer carrier is driven by a first linear power device. The sliding directions of the first wafer carrier and the second wafer carrier of the second positioning support assembly are the same and they are arranged opposite to each other. A first positioning frame is also slidably mounted on the first fixed base plate. The first positioning frame is driven by a first positioning sliding device. The first positioning frame is located above the first wafer carrier and its sliding direction is the same as that of the first wafer carrier. The first positioning frame and the second positioning frame of the second positioning support assembly cooperate to position the wafer.

2. The wafer positioning support device for a spin coater as described in claim 1, characterized in that: The first positioning frame includes a positioning frame connecting seat, on which an arc-shaped positioning part is provided, which is positioned and engaged with the edge of the wafer.

3. The wafer positioning support device for a spin coater as described in claim 2, characterized in that: The first positioning sliding device includes a first positioning cylinder fixed to the first fixed base plate, a first slider connected to the piston rod of the first positioning cylinder, a positioning frame connecting seat mounted on the first slider, and a buffer device provided between the positioning frame connecting seat and the first slider.

4. The wafer positioning support device for a spin coater as described in claim 3, characterized in that: The positioning frame connecting seat is provided with a strip-shaped hole, the extension direction of the strip-shaped hole is the same as the sliding direction of the first slider, a connecting bolt is constrained in the strip-shaped hole, the connecting bolt connects the positioning frame connecting seat to the first slider, and an elastic buffer is also pressed and installed in the strip-shaped hole.

5. The wafer positioning support device for a spin coater as described in claim 4, characterized in that: The elastic buffer is a spring or an elastic packing.

6. The wafer positioning support device for a spin coater as described in claim 5, characterized in that: The first fixed base plate is also provided with a position detection sensor for detecting the sliding position of the positioning frame connecting seat, and the positioning frame connecting seat is provided with a detection mating part that corresponds to and cooperates with the position detection sensor.

7. The wafer positioning support device for a spin coater as described in claim 6, characterized in that: The first linear power device includes a first cylinder, which is fixed on the first fixed base plate, and the piston rod of the first cylinder is detachably fixed to the first wafer carrier through a connecting block.

8. The wafer positioning support device for a spin coater as described in claim 6, characterized in that: The first wafer carrier includes a first wafer carrier plate, which has a strip-shaped mounting hole. A fixing bolt for fixing the first wafer carrier plate to the connecting block is installed in the strip-shaped mounting hole. The first wafer carrier plate has two support columns that protrude upward to support the bottom of the wafer.

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