Wafer deflection heating device

Abstract

The utility model discloses a wafer deflection heating device which comprises an outer shell, the outer shell is provided with an installation inner cavity, a soaking plate driven by a forward and reverse deflection power device is rotatably installed in the installation inner cavity, a wafer bracket is vertically installed in the installation inner cavity in a sliding mode, and the wafer bracket is driven by a lifting power device fixed on the outer shell. The wafer bracket is provided with a supporting ring located outside the vapor chamber, the diameter of the supporting ring is larger than that of the vapor chamber, the upper end of the supporting ring is provided with a supporting structure for supporting the edge of the wafer, and the wafer deflection heating device changes the part in contact with the wafer by deflecting the vapor chamber. Therefore, the vapor chamber is more uniform in heating.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a wafer deflection heating device. Background Technology

[0002] In the spin coating and development process, wafers need to be heated and cooled to control their temperature for subsequent coating and spin coating. Current wafer heating devices are relatively simple, mainly consisting of a hot plate with spiral heating elements inside. These spiral heating elements are electrically heated, which can lead to uneven heating. Consequently, the surface of the hot plate will exhibit uneven temperature distribution due to differences in the power and heating performance of the heating elements. This results in localized high and low temperatures on the hot plate, leading to inconsistent heating of different parts of the wafer and an overall uneven wafer heating process. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a wafer deflection heating device, which changes the contact area with the wafer by deflecting the heat spreader, thereby making the heat spreader heat more uniform.

[0004] To solve the above-mentioned technical problems, the technical solution of this utility model is: a wafer deflection heating device, including an outer shell, the outer shell being provided with an inner cavity, a heat spreader driven by a forward and reverse deflection power device being rotatably installed in the inner cavity, a wafer holder being vertically slidably installed in the inner cavity, the wafer holder being driven by a lifting power device fixed on the outer shell, a support ring located outside the heat spreader being provided on the wafer holder, the diameter of the support ring being larger than the diameter of the heat spreader, and a support structure supporting the edge of the wafer being provided at the upper end of the support ring.

[0005] As a preferred embodiment, the support structure includes at least two arc-shaped support segments disposed at the upper end of the support ring, and the arc-shaped support segments are provided with support steps for supporting the edge of the wafer.

[0006] As a preferred embodiment, the upper end of the sidewall of the supporting step is provided with a rounded chamfer to facilitate wafer entry.

[0007] As a preferred embodiment, the wafer carrier includes a support ring, and a cylindrical tube is provided at the bottom of the support ring. The size of the cylindrical tube is larger than that of the heat spreader but smaller than that of the support ring, and a sliding connection structure is provided between the support ring and the mounting cavity.

[0008] As a preferred embodiment, the sliding connection structure includes at least two connecting sliders disposed on the outer wall of the cylindrical tube, and a mating groove is provided in the corresponding mounting cavity to slide and engage with the connecting sliders. Both the connecting sliders and the mating groove are vertically arranged.

[0009] As a preferred embodiment, the lifting power device includes two lifting cylinders, which are symmetrically arranged at the bottom of the outer casing. The piston rods of the lifting cylinders pass through the outer casing and are connected to the bottom of the cylindrical tube.

[0010] As a preferred embodiment, the piston rod of the lifting cylinder is provided with a slot at its top, and the cylindrical wall of the cylinder is inserted into the slot and fixed by bolts.

[0011] As a preferred embodiment, the upper edge of the outer casing is provided with a sealing ring that is fixed to the vertically movable upper cover.

[0012] As a preferred embodiment, the forward and reverse deflection power device includes a forward and reverse drive motor, the drive end of which is fixedly connected to the heat spreader plate.

[0013] After adopting the above technical solution, the effect of this utility model is as follows: The wafer deflection heating device includes a housing, the housing having an inner mounting cavity, a heat spreader driven by a forward and reverse deflection power device rotatably mounted within the inner mounting cavity, a wafer holder vertically slidingly mounted within the inner mounting cavity, the wafer holder being driven by a lifting power device fixed to the housing, and a support ring located outside the heat spreader on the wafer holder. The diameter of the support ring is larger than the diameter of the heat spreader, and a support is provided at the upper end of the support ring. The supporting structure at the edge of the wafer provides a flexible heating mechanism. During heating, after the wafer is placed on the vapor chamber and heated for a set time, the lifting device raises the wafer carrier. The supporting structure then supports the edge of the wafer above the vapor chamber. Subsequently, the forward and reverse deflection devices drive the vapor chamber to deflect at an angle. This shifts the position of areas with previously high temperatures on the vapor chamber. The wafer carrier then descends, placing the wafer back on the vapor chamber for heating. Repeating this process ensures more uniform heating of the wafer. The wafer carrier also serves as a support for the vapor chamber and the wafer loading / unloading robot. This deflection heating device improves the uniformity of wafer heating, meeting the requirements for subsequent coating processes.

[0014] Furthermore, since the support structure includes at least two arc-shaped support segments disposed at the upper end of the support ring, and the arc-shaped support segments are provided with support steps for supporting the wafer edge, the support steps on the arc-shaped support segments can stably support the wafer edge, while the small contact area can reduce heat conduction.

[0015] Furthermore, since the upper end of the side wall of the support step is designed with a circular chamfer to facilitate wafer entry, the wafer can enter the support step more smoothly.

[0016] Furthermore, since the wafer carrier includes a support ring, and a cylindrical tube is provided at the bottom of the support ring, the size of the cylindrical tube is larger than that of the heat spreader but smaller than that of the support ring. A sliding connection structure is provided between the support ring and the mounting cavity. The sliding connection structure includes at least two connecting sliders provided on the outer wall of the cylindrical tube. Correspondingly, a mating groove is provided in the mounting cavity to slide with the connecting sliders. Both the connecting sliders and the mating groove are vertically arranged. The sliding connection structure can ensure the smooth lifting and lowering of the cylindrical tube and also prevent its deflection.

[0017] Furthermore, since the upper edge of the outer shell is provided with a sealing ring that is fixed to the vertically movable upper cover, the upper cover can be lowered and sealed with the outer shell during the heating process, thereby reducing heat loss. Attached Figure Description

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0019] Figure 1 This is a schematic diagram of the installation state of an embodiment of this utility model;

[0020] Figure 2 This is a structural schematic diagram of an embodiment of the present utility model;

[0021] Figure 3 yes Figure 2 Main view;

[0022] Figure 4 yes Figure 3 Sectional view along AA;

[0023] Figure 5 This is a schematic diagram of the structure of the wafer carrier according to an embodiment of the present invention;

[0024] In the attached diagram: 1. Outer shell; 2. Forward and reverse deflection power unit; 3. Wafer tray; 31. Support ring; 32. Cylindrical tube; 33. Arc-shaped support section; 34. Connecting slider; 4. Lifting power unit; 5. Heat spreader; 6. Sealing ring; 7. Slot; 8. Top cover. Detailed Implementation

[0025] The present invention will be further described in detail below through specific embodiments.

[0026] like Figure 1-5As shown, a wafer deflection heating device includes a housing 1 with an inner cavity. A heat spreader 5 driven by a forward and reverse deflection power device 2 is rotatably mounted in the inner cavity. A wafer holder 3 is vertically slidably mounted in the inner cavity and is driven by a lifting power device 4 fixed to the housing 1. A support ring 31 located outside the heat spreader 5 is provided on the wafer holder 3. The diameter of the support ring 31 is larger than the diameter of the heat spreader 5. A support structure 33 supporting the edge of the wafer is provided at the upper end of the support ring 31.

[0027] In this embodiment, the support structure 33 includes at least two arc-shaped support segments disposed at the upper end of the support ring 31. Each arc-shaped support segment has a support step for supporting the edge of the wafer, and the upper end of the sidewall of the support step is chamfered to facilitate wafer entry. As shown in the accompanying drawings, the support structure 33 is higher than the heat spreader 5. A cylindrical tube 32 is disposed at the bottom of the support ring 31. The size of the cylindrical tube 32 is larger than that of the heat spreader 5 but smaller than that of the support ring 31. A sliding connection structure is provided between the support ring 31 and the mounting cavity.

[0028] A sealing ring 6 is provided at the upper edge of the outer shell 1, which is fixed to the vertically adjustable upper cover 8. The sliding connection structure includes at least two connecting sliders 34 provided on the outer wall of the cylindrical tube 32, and a mating groove is provided in the corresponding mounting cavity to slide with the connecting sliders 34. Both the connecting sliders 34 and the mating groove are vertically arranged.

[0029] In this embodiment, the lifting power device 4 includes two lifting cylinders symmetrically arranged at the bottom of the outer casing 1. The piston rods of the lifting cylinders penetrate the outer casing 1 and are connected to the bottom of the cylindrical tube 32. A slot 7 is provided at the top of the piston rods of the lifting cylinders, and the wall of the cylindrical tube 32 is inserted into the slot 7 and fixed by bolts. The forward and reverse deflection power device 2 includes forward and reverse drive motors, and the drive ends of the forward and reverse drive motors are fixedly connected to the heat spreader 5. Of course, other structures can also be used for the lifting power device 4 and the forward and reverse deflection power device 2.

[0030] During heating, after the wafer is placed onto the heat spreader 5 and heated for a certain period, the lifting cylinder drives the wafer carrier 3 to rise. The arc-shaped support section of the support structure 33 supports the edge of the wafer and is higher than the heat spreader 5. The sliding connection structure ensures that the cylindrical cylinder 32 remains smooth during the lifting process and avoids deflection. Then, the forward and reverse drive motors drive the heat spreader 5 to rotate forward or in the opposite direction by a certain angle. The areas with high local temperatures on the heat spreader 5 will change position by rotating. Then, the lifting cylinder drives the wafer carrier 3 to descend, placing the wafer back onto the heat spreader 5 for heating. Repeating the above actions ensures that different parts of the wafer are heated evenly. During the wafer heating process, the upper cover 8 descends and seals with the outer shell 1, reducing heat loss and improving the heating effect.

[0031] The wafer carrier 3 can be used as a support for the heat exchange plate 5 when it enters and exits the wafer loading and unloading robot.

[0032] The pneumatic system, servo motor, and lead screw mechanism mentioned in this embodiment are all conventional technologies. The 5th edition of the "Mechanical Design Handbook" (5th edition, 28th printing, Beijing, April 2008) discloses in detail the specific structure, principle, and other designs of cylinders, motors, and other transmission mechanisms, which are existing technologies with clear and straightforward structures. The 3rd edition of "Modern Practical Pneumatic Technology" (SMC training material) published by Machinery Industry Press on August 1, 2008, also discloses in detail vacuum components, gas circuits, and program control, indicating that the pneumatic structure in this embodiment is also existing technology and clear and straightforward. The book "Motor Drive and Speed ​​Regulation" published by Chemical Industry Press on July 1, 2015, also describes motor control and limit switches in detail. Therefore, the circuit and pneumatic connections are clear.

[0033] The above-described embodiments are merely preferred embodiments of the present utility model and are not intended to limit the scope of the present utility model. Any modifications and alterations to the technical solution of the present utility model without departing from its design spirit shall fall within the protection scope defined by the claims of the present utility model.

Claims

1. A wafer deflection heating device, comprising a housing, characterized in that: The outer casing is provided with an inner cavity for mounting. A heat spreader driven by a forward and reverse deflection power device is rotatably mounted in the inner cavity for mounting. A wafer carrier is vertically slidably mounted in the inner cavity for mounting. The wafer carrier is driven by a lifting power device fixed to the outer casing for mounting. A support ring located outside the heat spreader is provided on the wafer carrier for mounting. The diameter of the support ring is larger than the diameter of the heat spreader. A support structure for supporting the edge of the wafer is provided at the upper end of the support ring.

2. The wafer deflection heating device as described in claim 1, characterized in that: The support structure includes at least two arc-shaped support segments disposed at the upper end of the support ring, and the arc-shaped support segments are provided with support steps for supporting the edge of the wafer.

3. The wafer deflection heating device as described in claim 2, characterized in that: The upper end of the side wall of the supporting step is provided with a circular chamfer to facilitate wafer entry.

4. A wafer deflection heating device as described in any one of claims 1-3, characterized in that: The wafer carrier includes the support ring, and a cylindrical tube is provided at the bottom of the support ring. The size of the cylindrical tube is larger than that of the heat spreader but smaller than that of the support ring. A sliding connection structure is provided between the support ring and the mounting cavity.

5. The wafer deflection heating device as described in claim 4, characterized in that: The sliding connection structure includes at least two connecting sliders disposed on the outer wall of the cylindrical tube, and a mating groove is provided in the corresponding mounting cavity to slide with the connecting sliders. Both the connecting sliders and the mating groove are vertically arranged.

6. The wafer deflection heating device as described in claim 5, characterized in that: The lifting power device includes two lifting cylinders, which are symmetrically arranged at the bottom of the outer shell. The piston rod of the lifting cylinder passes through the outer shell and is connected to the bottom of the cylindrical tube.

7. The wafer deflection heating device as described in claim 6, characterized in that: The piston rod of the lifting cylinder has a slot at its top, and the cylindrical wall is inserted into the slot and fixed by bolts.

8. The wafer deflection heating device as described in claim 7, characterized in that: The upper edge of the outer casing is provided with a sealing ring that is fixed to the vertically movable upper cover.

9. The wafer deflection heating device as described in claim 1, characterized in that: The forward and reverse deflection power device includes a forward and reverse drive motor, and the drive end of the forward and reverse drive motor is fixedly connected to the heat spreader plate.

Images