Inductor heat dissipation installation structure

Abstract

The utility model discloses an inductor heat dissipation installation structure which comprises a heat dissipation outer shell, a PCB, an inductor component and a heat conduction piece, the PCB, the inductor component and the heat conduction piece are installed in the heat dissipation outer shell, the PCB is connected with a fixing assembly, the inductor component is installed on the PCB through the fixing assembly, and the heat conduction piece is installed on the heat dissipation outer shell. And the heat conduction pieces are respectively arranged between the PCB and the heat dissipation shell and between the PCB and the inductance component. The inductor heat dissipation installation structure is simple in structure and low in cost, the heat dissipation efficiency is effectively improved, and the stability of products is enhanced.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology, specifically to an inductor heat dissipation mounting structure. Background Technology

[0002] An inductor is a component that converts electrical energy into magnetic energy and stores it. The structure of an inductor is similar to a transformer, but it has only one winding. An inductor has a certain inductance, which only impedes changes in current. If no current is flowing through the inductor, it will attempt to impede the current flow when the circuit is closed; if current is flowing through the inductor, it will attempt to maintain a constant current when the circuit is open. Inductors are also called chokes, reactors, or dynamic reactors.

[0003] Inductors are major heat-generating components in electronic products. Manufacturers often use methods such as adding fans (to increase airflow) or applying thermal paste to help dissipate heat from these components. However, adding fans can lead to dust accumulation inside the product, increasing the failure rate, while applying thermal paste can increase product costs and complicate the manufacturing process.

[0004] Therefore, an inductor heat dissipation mounting structure is needed to solve the above problems. Utility Model Content

[0005] To overcome the shortcomings of the existing technology, this utility model provides an inductive heat dissipation mounting structure that is simple in structure and low in cost, effectively improving heat dissipation efficiency and enhancing product stability.

[0006] The technical solution adopted by this utility model to solve its technical problem is:

[0007] An inductor heat dissipation mounting structure includes a heat dissipation shell and a PCB board, inductor components, and heat-conducting components mounted inside the heat dissipation shell. A fixing component is connected to the PCB board, and the inductor components are mounted on the PCB board through the fixing component. The heat-conducting components are respectively disposed between the PCB board, the heat dissipation shell, and the inductor components.

[0008] As a further improvement to the above technical solution, the heat dissipation shell is provided with multiple mounting posts inside, and the PCB board is fixedly connected to the mounting posts.

[0009] As a further improvement to the above technical solution, the fixing component includes a fixing nut post and a fixing screw. The fixing nut post is riveted or welded to the PCB board, the inductor is sleeved on the fixing nut post, and the fixing screw is fixed to the upper end of the fixing nut post.

[0010] As a further improvement to the above technical solution, an insulating pad is provided at the upper end of the inductor component, and the fixing screw passes through and presses onto the insulating pad.

[0011] As a further improvement to the above technical solution, the PCB board is provided with mounting through holes, and the fixing nut post passes through the mounting through holes.

[0012] As a further improvement to the above technical solution, the PCB board is provided with multiple heat dissipation holes, which are located around the mounting through holes.

[0013] As a further improvement to the above technical solution, the fixing nut post is made of copper.

[0014] As a further improvement to the above technical solution, the heat-conducting component is configured as heat-conducting silicone putty.

[0015] As a further improvement to the above technical solution, the heat dissipation shell has multiple heat dissipation fins extending outward from its outer surface.

[0016] As a further improvement to the above technical solution, the inner wall of the heat dissipation shell is provided with a plurality of mounting studs, and a sealing mesh plate is connected to the outside of the mounting studs.

[0017] The beneficial effects of this utility model are:

[0018] This utility model uses a fixing screw to effectively connect the inductor to a pre-set copper fixing nut post on the PCB board. Then, the heat of the inductor is effectively conducted to the heat dissipation housing through heat dissipation holes opened in the inductor mounting position on the PCB board, thermal conductive silicone putty, and heat dissipation housing. Its structure is relatively simple and effective, which can greatly reduce product costs and enhance product stability. Attached Figure Description

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0020] Figure 1 This is a schematic diagram of the structure of the inductive heat dissipation of this utility model;

[0021] Figure 2 This is an exploded structural diagram of the inductor heat dissipation mounting structure of this utility model;

[0022] Figure 3 This is a schematic diagram illustrating the application of the inductor heat dissipation mounting structure of this utility model.

[0023] Reference numerals: 1. Heat sink housing; 11. Mounting post; 12. Heat sink fin; 13. Mounting stud; 14. Sealing mesh plate; 2. PCB board; 21. Mounting through hole; 22. Heat dissipation hole; 3. Inductive components; 4. Thermal conductive components; 5. Fixing components; 51. Fixing nut post; 52. Fixing screw; 6. Insulating gasket. Detailed Implementation

[0024] The following will clearly and completely describe the concept, specific structure, and technical effects of this utility model in conjunction with embodiments and accompanying drawings, so as to fully understand the purpose, features, and effects of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, not all of them. Other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are all within the scope of protection of this utility model. Furthermore, all connections / connections involved in the patent do not simply refer to direct contact between components, but rather to the ability to form a better connection structure by adding or reducing connecting accessories according to specific implementation conditions. For example, fixed connections / fixed installations can use screw connections, bolt connections, pin connections, key connections, adhesive connections, mortise and tenon connections, welding, riveting, etc., as needed. For detachable connections, screw connections, bolt connections, threaded connections, snap-fit ​​connections, mortise and tenon connections, Velcro connections, etc., can be used as needed. The various technical features in this utility model can be combined interactively without contradicting each other.

[0025] Reference Figure 1 , Figure 3 An inductor heat dissipation mounting structure includes a heat dissipation shell 1, a PCB board 2, inductor components 3, and a heat-conducting component 4. The PCB board 2, inductor components 3, and heat-conducting component 4 are installed inside the heat dissipation shell 1. The heat dissipation shell 1, as the external protective layer and main heat dissipation medium of the entire product, is made of metal and has good thermal conductivity and heat dissipation performance to better dissipate internally generated heat. The PCB board 2 is fixedly connected to the heat dissipation shell 1, and a fixing component 5 is connected to the PCB board 2. The inductor components 3 are mounted on the PCB board 2 through the fixing component 5, thus fixing the inductor components 3 in place. The heat-conducting component 4 is also provided between the PCB board 2 and the heat dissipation shell 1, and between the PCB board 2 and the inductor components 3, separating the heat dissipation shell 1, PCB board 2, and inductor components 3. This provides sufficient heat dissipation space between the PCB board 2 and the inductor components 3. The heat conduction through the heat-conducting component 4 effectively improves the heat dissipation efficiency of the inductor, ensuring that the inductor maintains a stable temperature during operation, thereby extending its service life and reliability.

[0026] Reference Figure 1In this embodiment of the present invention, the heat dissipation shell 1 is provided with a plurality of mounting posts 11, which are evenly distributed. The PCB board 2 is fixedly connected to the mounting posts 11. The mounting posts 11 provide fixing points for the PCB board 2 to ensure that the PCB board 2 can maintain the correct position during installation, thereby avoiding loosening or displacement during subsequent use. At the same time, the mounting posts 11 also play a certain role in auxiliary heat dissipation, so that the PCB board 2 is not in close contact with the heat dissipation shell 1 and has sufficient heat dissipation space. In addition, the material of the mounting posts 11 can be a metal with good thermal conductivity, such as copper or aluminum, to transfer the heat on the PCB board 2 to the heat dissipation shell through heat conduction, and then exchange heat with the external environment through the heat sink of the heat dissipation shell, further enhancing the heat dissipation effect.

[0027] Reference Figure 2 In this embodiment of the present invention, the fixing component 5 includes a fixing nut post 51 and a fixing screw 52, ​​dividing the fixing component 5 into two parts to facilitate the installation and removal of the inductor component 3. A mounting through hole 21 is provided on the PCB board 2, and the fixing nut post 51 passes through the mounting through hole 21 and is fixed to the PCB board 2 by riveting or soldering. The inductor component 3 is sleeved on the fixing nut post 51, and the fixing screw 52 is fixed to the upper end of the fixing nut post 51, thus fixing the inductor component 3 to the PCB board 2. The fixing nut post 51 is made of copper, which has good thermal conductivity, helping to conduct the heat generated by the inductor to the PCB board 2 and improving the heat dissipation performance of the inductor component 3. Furthermore, the fixing screw 52 is a metal screw of appropriate size and length, effectively connecting and fixing the inductor component 3, the heat-conducting component 4, and the PCB board 2 into a single unit to ensure the firmness and reliability of the connection.

[0028] Specifically, an insulating gasket 6 is provided at the upper end of the inductor 3, and the fixing screw 52 passes through and presses onto the insulating gasket 6. The insulating gasket 6 is made of insulating material with flame retardant rating and is used to isolate the connection between the inductor 3 and the fixing screw 52 to ensure good fixing effect and electrical isolation.

[0029] Specifically, the PCB board 2 is provided with a plurality of heat dissipation holes 22. The heat dissipation holes 22 are located around the mounting through holes 21. The heat dissipation holes 22 can increase the heat dissipation area on the surface of the PCB board 2, thereby accelerating the dissipation of heat. When components such as inductors are working, they generate heat, which is transferred to the PCB board 2 by thermal conduction and dissipated to the surrounding environment by air convection in the heat dissipation holes 22, thereby reducing the temperature of the PCB board and components such as inductors.

[0030] Reference Figure 1In this embodiment of the utility model, the heat-conducting component 4 is set as heat-conducting silicone putty, which can fill gaps and conduct heat. Its thickness and size are customized according to the inductor size and the distance between the PCB board 2 and the heat dissipation shell 1 to ensure the best heat dissipation effect.

[0031] Reference Figure 3 In this embodiment of the present invention, a plurality of heat sinks 12 extend outward from the exterior of the heat dissipation shell 1. These heat sinks mainly increase the surface area to accelerate the transfer and dissipation of heat. When the heat inside the heat dissipation shell is transferred to the surface of the shell through thermal conduction, the heat sinks 12 can dissipate this heat more effectively to the surrounding environment to achieve a heat dissipation effect. In addition, in order to facilitate the installation of the PCB board 2 and the inductor components 3, the heat dissipation shell of this embodiment is provided with a detachable structure, and a plurality of mounting studs 13 are provided on the inner wall of the heat dissipation shell 1. A sealing mesh plate 14 is connected to the outside of the mounting studs 13. The sealing mesh plate 14 can allow the air inside the heat dissipation shell 1 to convect with the external air, thereby further playing a role in heat dissipation.

[0032] The above is a detailed description of the preferred embodiments of the present utility model. However, the present utility model is not limited to the described embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present utility model. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. An inductor heat dissipation mounting structure, characterized in that: The device includes a heat dissipation housing, a PCB board, inductor components, and heat-conducting components installed inside the heat dissipation housing. A fixing component is connected to the PCB board, and the inductor components are mounted on the PCB board through the fixing component. The heat-conducting components are respectively provided between the PCB board, the heat dissipation housing, and the inductor components.

2. The inductor heat dissipation mounting structure according to claim 1, characterized in that: The heat dissipation housing has multiple mounting posts inside, and the PCB board is fixedly connected to the mounting posts.

3. The inductor heat dissipation mounting structure according to claim 1, characterized in that: The fixing component includes a fixing nut post and a fixing screw. The fixing nut post is riveted or welded to the PCB board, the inductor is sleeved on the fixing nut post, and the fixing screw is fixed to the upper end of the fixing nut post.

4. The inductor heat dissipation mounting structure according to claim 3, characterized in that: An insulating pad is provided at the upper end of the inductor, and the fixing screw passes through and presses onto the insulating pad.

5. The inductor heat dissipation mounting structure according to claim 3, characterized in that: The PCB board is provided with mounting through holes, and the fixing nut post passes through the mounting through holes.

6. The inductor heat dissipation mounting structure according to claim 5, characterized in that: The PCB board has multiple heat dissipation holes, which are located around the mounting through holes.

7. The inductor heat dissipation mounting structure according to claim 3, characterized in that: The fixing nut post is made of copper.

8. The inductor heat dissipation mounting structure according to claim 1, characterized in that: The heat-conducting component is set as heat-conducting silicone putty.

9. The inductive heat dissipation mounting structure according to claim 1, characterized in that: The heat dissipation shell has multiple heat sinks extending outward from its outer surface.

10. The inductor heat dissipation mounting structure according to claim 1, characterized in that: The inner wall of the heat dissipation housing is provided with a plurality of mounting studs, and a sealing mesh plate is connected to the outside of the mounting studs.

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