LED illumination control circuit with power tube heat dissipation function

Abstract

The utility model discloses an LED illumination control circuit with a power tube heat dissipation function. The LED illumination control circuit comprises an MCU, a discharge circuit, a boost circuit and a battery charging circuit. The input end of the booster circuit is connected with the MCU and is used for receiving a PWM signal, and the output end of the booster circuit is connected with the battery charging circuit and is used for outputting a driving signal and outputting a voltage monitoring signal VS; the input end of the battery charging circuit is connected with the booster circuit and receives the driving signal and the voltage monitoring signal, and the output end of the battery charging circuit is connected with a battery and is used for charging the battery; the LED lamp further comprises a heat dissipation plate, and the MOS tube on the battery charging circuit is welded to the heat dissipation plate. According to the utility model, the boosted circuit is arranged to drive the MOS tube, and the heat dissipation plate is arranged to dissipate heat for the charging MOS tube when the MOS tube is conducted to charge the battery, so that the heat is greatly reduced, the damage degree of the power tube is reduced, and the service life of the controller is prolonged.

Description

Technical Field

[0001] This utility model relates to LED lighting systems, specifically an LED lighting control circuit with power tube heat dissipation function. Background Technology

[0002] In LED lighting systems, solar power is typically used during the day to charge batteries, while batteries power the system at night. During the day, the power transistors used for charging the batteries generate a lot of heat. Currently, fans and other methods are used to dissipate heat and cool the system, but the cooling effect is not good and affects the lifespan of the LED controller. Utility Model Content

[0003] To address the shortcomings of the prior art, this invention provides an LED lighting control circuit with power transistor heat dissipation function. This invention includes a discharge circuit to control LED lighting, a boost circuit to drive the MOSFET, and a heat sink to dissipate heat from the charging MOSFET when the MOSFET is conducting to charge the battery, greatly reducing heat generation, minimizing damage to the power transistor, and extending the lifespan of the controller.

[0004] To achieve the above technical objectives, the present invention adopts the following technical solution: an LED lighting control circuit with power transistor heat dissipation function, including an MCU, a discharge circuit, a boost circuit, and a battery charging circuit;

[0005] The input terminal of the discharge circuit is connected to the MCU to receive the LED control signal LED_T1_PB2 to control the lighting time and brightness of the LED; the output terminal is connected to LED-.

[0006] The input terminal of the boost circuit is connected to the MCU to receive PWM signals, and the output terminal is connected to the battery charging circuit to output drive signals and output voltage monitoring signals VS.

[0007] The input terminal of the battery charging circuit is connected to the boost circuit and receives the drive signal and the voltage monitoring signal, while the output terminal is connected to the battery for charging the battery.

[0008] It also includes a heat sink, on which the MOSFETs of the battery charging circuit are soldered.

[0009] The discharge circuit includes MOSFETs QNm1, QNm2, QNm3, QNm4, and QNm5. The gate of MOSFET QNm1 is connected to the Imax_out signal, the source of MOSFET QNm1 is grounded, and the drain of MOSFET QNm1 is connected to the gate of MOSFET QN5. The gate of MOSFET QNm5 is also connected to resistor R4, the gate of MOSFET QNm4, and the gate of MOSFET QNm2. Resistor R4 is connected to the MCU to receive the LED control signal LED_T1_PB2. The source of transistor QNm5 is connected to resistor RL1 and the source of MOSFET QNm2. Resistor RL1 is grounded. The drain of MOSFET QNm5 is connected to the drain of MOSFET QNm2. The source of MOSFET QNm2 is connected to resistor R5. Resistor R5 is connected to capacitor C8 and the output LED_I_AN0_PB1 signal. Capacitor C8 is grounded. The gate of MOSFET QNm3 is connected to the gate of MOSFET QNm2. The source of MOSFET QNm3 is connected to LED-. The drain of MOSFET QNm3 is connected to the drain of MOSFET QNm4. The source of MOSFET QNm3 is connected to LED-.

[0010] It also includes a short-circuit protection circuit, which includes an operational amplifier Nm1. Pin 1 of the operational amplifier Nm1 is connected to resistors Rm3 and Rm2, capacitor Cm1, and diode Dm1. Resistor Rm3 is connected to LED_I, resistor Rm2 is connected to BAT-, capacitor Cm1 is grounded, diode Dm1 is connected to resistor Rm4, resistor Rm4 is connected to pin 4 of the operational amplifier Nm1, pin 2 of the operational amplifier Nm1 is grounded, pin 3 of the operational amplifier Nm1 is connected to resistors Rmz2 and Rmz1, resistor Rmz2 is connected to +3.30, and resistor Rmz1 is connected to the MCU to receive the con_Imax_PB4 signal; pin 5 of the operational amplifier Nm1 is connected to +3.30; pin 4 of the operational amplifier Nm1 is also connected to resistors Rm1 and Rm5. Resistor Rm1 is connected to the gate of the MOS transistor QNm in the discharge circuit to output the Imax_out signal, and resistor Rm5 is connected to the MCU to output the out_Imax_PB3 signal.

[0011] The boost circuit includes a boost chip Na1. The Vcc pin of boost chip Na1 is connected to a resistor Ra6, a Zener diode Daz1, and a capacitor Ca2. Resistor Ra6 is connected to SUN+, Zener diode Daz1 is grounded, and capacitor Ca2 is grounded. Pin 4 of boost chip Na1 is grounded. Pin 2 of boost chip Na1 is connected to resistor Ra1, which is connected to the CH_H_T1_PB0 pin of the MCU to receive PWM signals. Pin 3 of boost chip Na1 is connected to resistor Ra2, which is connected to the CH_L_T1_PA0 pin of the MCU to receive PWM signals. Pin 5 of boost chip Na1 is connected to resistor Ra4, which outputs a drive signal LO. Pin 7 of boost chip Na1 is connected to resistor Ra3, which outputs a drive signal HO. Drive signals LO and HO constitute the drive signal. Pin 6 of boost chip Na1 outputs a voltage monitoring signal VS.

[0012] The battery charging circuit includes a heat sink, on which are soldered MOSFETs QN1, QN2, QN3, QN4, and QN5. The QN1_SUN+ pin of MOSFET QN1 is connected to SUN+, and the QN1_conG pin is connected to diode D3, resistor Ra5, and diode Da2 respectively. Diode D3 is connected to SUN+, resistor Ra5 is connected to SUN+, and diode Da2 is connected to capacitor Ca1 and diode Da1 respectively. Capacitor Ca1 is connected to the QN3_VS pin of MOSFET QN3, and diode Da1 is connected to SUN+. The QN2_HO pin of MOSFET QN2 is connected to pin 7 of boost converter chip Na1 to receive the drive signal HO, and the QN2_VS pin of MOSFET QN2 is connected to pin 6 of boost converter chip Na1 to receive the voltage monitoring signal VS. The QN3_HO pin of MOSFET QN3... Pin 7 of boost converter chip Na1 is connected to receive the drive signal HO. Pin 6 of MOSFET QN3 (QN3_VS) is connected to boost converter chip Na1 to receive the voltage monitoring signal VS. Pin INS+ of MOSFET QN3 is connected to capacitor C101, which is grounded. Pin LO of MOSFET QN4 is connected to pin 5 of boost converter chip Na1 to receive the drive signal LO. Pin GND of MOSFET QN4 is grounded. Pin VS of MOSFET QN4 is connected to pin 6 of boost converter chip Na1 to receive the voltage monitoring signal VS and is connected to resistor R1 and inductor L respectively. Resistor R1 is connected to capacitor C2, which is grounded. Inductor L is connected to BAT+. Pin LO of MOSFET QN5 is connected to pin 5 of boost converter chip Na1 to receive the drive signal LO. Pin GND of MOSFET QN5 is grounded.

[0013] In summary, this utility model achieves the following technical effects:

[0014] This invention features a discharge circuit to control the duration and brightness of LED lighting, a short-circuit protection circuit to protect the discharge circuit, a boost circuit to drive the MOSFET, and a heat sink to quickly cool the charging MOSFET. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of an MCU;

[0016] Figure 2 This is a schematic diagram of the discharge circuit;

[0017] Figure 3 It is a short-circuit protection circuit;

[0018] Figure 4 This is a schematic diagram of a boost circuit;

[0019] Figure 5 This is a schematic diagram of a battery charging circuit;

[0020] Figure 6 This is a schematic diagram of the circuit principle of a MOSFET mounted on a heat sink. Detailed Implementation

[0021] The present invention will be further described in detail below with reference to the accompanying drawings.

[0022] This specific embodiment is merely an explanation of the present utility model and is not intended to limit the present utility model. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but as long as they are within the scope of the claims of the present utility model, they are protected by patent law.

[0023] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0024] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0025] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0026] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0027] Example:

[0028] An LED lighting control circuit with power transistor heat dissipation function includes an MCU, a discharge circuit, a boost circuit, and a battery charging circuit.

[0029] The input terminal of the discharge circuit is connected to the MCU to receive the LED control signal LED_T1_PB2 to control the lighting time and brightness of the LED; the output terminal is connected to LED-.

[0030] The input terminal of the boost circuit is connected to the MCU to receive PWM signals, and the output terminal is connected to the battery charging circuit to output drive signals and output voltage monitoring signals VS.

[0031] The input terminal of the battery charging circuit is connected to the boost circuit and receives the drive signal and the voltage monitoring signal, while the output terminal is connected to the battery for charging the battery.

[0032] It also includes a heat sink, on which the MOSFETs of the battery charging circuit are soldered.

[0033] It also includes a short-circuit protection circuit. The input of the short-circuit protection circuit is connected to the MCU to receive the con_Imax_PB4 signal, and the output is connected to the discharge circuit to output the Imax_out signal to the discharge circuit.

[0034] In this invention, the MCU sends an LED control signal LED_T1_PB2 to the discharge circuit to control the LED's illumination time and brightness. The MCU sends a PWM signal to the boost circuit to control the conduction of the MOSFET on the heat sink and monitor the voltage signal. The MCU sends a con_Imax_PB4 signal to the short-circuit protection circuit to control the output high and low levels of the short-circuit protection circuit, thereby controlling the short-circuit protection of the discharge circuit.

[0035] Furthermore, Figure 1 This is a schematic diagram of an MCU. Figure 2 This is a schematic diagram of a discharge circuit, which includes MOSFETs QNm1, QNm2, QNm3, QNm4, and QNm5. The gate of MOSFET QNm1 is connected to the Imax_out signal, the source of MOSFET QNm1 is grounded, and the drain of MOSFET QNm1 is connected to the gate of MOSFET QN5. The gate of MOSFET QNm5 is also connected to resistor R4, the gate of MOSFET QNm4, and the gate of MOSFET QNm2. Resistor R4 is connected to the MCU to receive the LED control signal LED_. T1_PB2, the source of MOSFET QNm5 is connected to resistor RL1 and the source of MOSFET QNm2, resistor RL1 is grounded, the drain of MOSFET QNm5 is connected to the drain of MOSFET QNm2; the source of MOSFET QNm2 is connected to resistor R5, resistor R5 is connected to capacitor C8, capacitor C8 is grounded; the gate of MOSFET QNm3 is connected to the gate of MOSFET QNm2, the source of MOSFET QNm3 is connected to LED-, the drain of MOSFET QNm3 is connected to the drain of MOSFET QNm4; the source of MOSFET QNm3 is connected to LED-.

[0036] The Imax_out signal comes from the short-circuit protection circuit and is used to protect against short circuits. The LED control signal LED_T1_PB2 comes from the MCU and is used to control the brightness and duration of the LEDs.

[0037] Figure 3This is a short-circuit protection circuit, which includes an operational amplifier Nm1. Pin 1 of the operational amplifier Nm1 is connected to resistors Rm3 and Rm2, capacitor Cm1, and diode Dm1. Resistor Rm3 is connected to LED_I, resistor Rm2 is connected to BAT-, capacitor Cm1 is grounded, diode Dm1 is connected to resistor Rm4, resistor Rm4 is connected to pin 4 of the operational amplifier Nm1, pin 2 of the operational amplifier Nm1 is grounded, pin 3 of the operational amplifier Nm1 is connected to resistors Rmz2 and Rmz1, resistor Rmz2 is connected to +3.30, and resistor Rmz1 is connected to the MCU to receive the con_Imax_PB4 signal; pin 5 of the operational amplifier Nm1 is connected to +3.30; pin 4 of the operational amplifier Nm1 is also connected to resistors Rm1 and Rm5. Resistor Rm1 is connected to the gate of the MOS transistor QNm in the discharge circuit to output the Imax_out signal, and resistor Rm5 is connected to the MCU to output the out_Imax_PB3 signal.

[0038] Among them, con_Imax_PB4 comes from the MCU. When con_Imax_PB4 is low, the operational amplifier Nm1 compares the system operating current and the reference voltage threshold. When a short circuit occurs, the system current is large, and the comparator operational amplifier Nm1 outputs out_Imax_PB3 as high to the microcontroller MCU. Imax_out is then used to shut down the output of the discharge circuit. When con_Imax_PB4 is high, the short circuit protection is released.

[0039] Figure 4 This is a schematic diagram of a boost circuit. The boost circuit includes a boost chip Na1. The Vcc pin of the boost chip Na1 is connected to a resistor Ra6, a Zener diode Daz1, and a capacitor Ca2. Resistor Ra6 is connected to SUN+, Zener diode Daz1 is grounded, and capacitor Ca2 is grounded. Pin 4 of the boost chip Na1 is grounded. Pin 2 of the boost chip Na1 is connected to resistor Ra1, which is connected to the CH_H_T1_PB0 pin of the MCU to receive PWM signals. Pin 3 of the boost chip Na1 is connected to resistor Ra2, which is connected to the CH_L_T1_PA0 pin of the MCU to receive PWM signals. Pin 5 of the boost chip Na1 is connected to resistor Ra4, which outputs a drive signal LO. Pin 7 of the boost chip Na1 is connected to resistor Ra3, which outputs a drive signal HO. The drive signals LO and HO constitute the drive signal. Pin 6 of the boost chip Na1 outputs a voltage monitoring signal VS.

[0040] Figure 5This is a schematic diagram of a battery charging circuit. The battery charging circuit includes a heat sink, on which are soldered MOSFETs QN1, QN2, QN3, QN4, and QN5. The QN1_SUN+ pin of MOSFET QN1 is connected to SUN+, and the QN1_conG pin is connected to diode D3, resistor Ra5, and diode Da2 respectively. Diode D3 is connected to SUN+, resistor Ra5 is connected to SUN+, and diode Da2 is connected to capacitor Ca1 and diode Da1 respectively. Capacitor Ca1 is connected to the QN3_VS pin of MOSFET QN3, and diode Da1 is connected to SUN+. The QN2_HO pin of MOSFET QN2 is connected to pin 7 of boost converter chip Na1 to receive the drive signal HO, and the QN2_VS pin of MOSFET QN2 is connected to pin 6 of boost converter chip Na1 to receive the voltage monitoring signal VS. The QN3_QN4_Voltage pin of MOSFET QN5 is connected to the MOSFET QN5_Voltage pin of MOSFET QN1. The N3_HO pin is connected to pin 7 of the boost converter chip Na1 to receive the drive signal HO. The QN3_VS pin of the MOSFET QN3 is connected to pin 6 of the boost converter chip Na1 to receive the voltage monitoring signal VS. The QN3_INS+ pin of the MOSFET QN3 is connected to capacitor C101, which is grounded. The QN4_LO pin of the MOSFET QN4 is connected to pin 5 of the boost converter chip Na1 to receive the drive signal LO. The QN4_GND pin of the MOSFET QN4 is grounded. The QN4_VS pin of the MOSFET QN4 is connected to pin 6 of the boost converter chip Na1 to receive the voltage monitoring signal VS and is connected to resistor R1 and inductor L respectively. Resistor R1 is connected to capacitor C2, which is grounded. Inductor L is connected to BAT+. The QN5_LO pin of the MOSFET QN5 is connected to pin 5 of the boost converter chip Na1 to receive the drive signal LO. The QN5_GND pin of the MOSFET QN5 is grounded.

[0041] The boost converter chip Na1 uses FD2103S / SOP8. CH_H_T1_PB0 represents the high level of the PWM signal, and CH_L_T1_PA0 represents the low level of the PWM signal. The drive signal HO represents a high-level output, and the drive signal LO represents a low-level output. This invention has high-level and low-level outputs corresponding to HO and LO respectively. HO controls MOSFETs QN2 and QN3 in the battery charging circuit. These two MOSFETs, acting as the high-level side, can deliver current to the load after being turned on. LO controls MOSFETs QN4 and QN5 in the battery charging circuit. These two MOSFETs, acting as the low-level side, can ground the high-level voltage after being turned on, forming a loop to charge BAT+. MOSFETs are power transistors. When charging the battery, the MOSFETs generate heat. These five MOSFETs are soldered onto a heat sink, which uses an aluminum substrate to quickly dissipate heat from the MOSFETs.

[0042] The voltage monitoring signal VS is used to monitor the voltage status of the MOSFET.

[0043] Figure 6 It is a circuit diagram of a MOSFET mounted on a heatsink. Figure 5 The diagram shows the specific connection of heat sinks MA1 and MA2. MA1 and MA2 both represent heat sinks that have simply been cut into two pieces from the middle.

[0044] During the day, the SUN+ solar panel charges the battery by turning on the MOSFET in the charging circuit through the boost circuit, thus forming a loop to charge the battery. At night, the SUN+ solar panel does not work, and the battery supplies power to the subsequent circuits and the controller.

[0045] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model shall fall within the scope of the technical solution of the present utility model.

Claims

1. An LED lighting control circuit with power transistor heat dissipation function, characterized in that: Includes MCU, discharge circuit, boost circuit, and battery charging circuit; The input terminal of the discharge circuit is connected to the MCU to receive the LED control signal LED_T1_PB2 to control the lighting time and brightness of the LED; the output terminal is connected to LED-. The input terminal of the boost circuit is connected to the MCU to receive PWM signals, and the output terminal is connected to the battery charging circuit to output drive signals and output voltage monitoring signals VS. The input terminal of the battery charging circuit is connected to the boost circuit and receives the drive signal and the voltage monitoring signal, while the output terminal is connected to the battery for charging the battery. It also includes a heat sink, on which the MOSFETs of the battery charging circuit are soldered.

2. The LED lighting control circuit with power transistor heat dissipation function according to claim 1, characterized in that: The discharge circuit includes MOSFETs QNm1, QNm2, QNm3, QNm4, and QNm5. The gate of MOSFET QNm1 is connected to the Imax_out signal, the source of MOSFET QNm1 is grounded, and the drain of MOSFET QNm1 is connected to the gate of MOSFET QN5. The gate of MOSFET QNm5 is also connected to resistor R4, the gate of MOSFET QNm4, and the gate of MOSFET QNm2. Resistor R4 is connected to the MCU to receive the LED control signal LED_T1_PB2. The source of transistor QNm5 is connected to resistor RL1 and the source of MOSFET QNm2. Resistor RL1 is grounded. The drain of MOSFET QNm5 is connected to the drain of MOSFET QNm2. The source of MOSFET QNm2 is connected to resistor R5. Resistor R5 is connected to capacitor C8 and the output LED_I_AN0_PB1 signal. Capacitor C8 is grounded. The gate of MOSFET QNm3 is connected to the gate of MOSFET QNm2. The source of MOSFET QNm3 is connected to LED-. The drain of MOSFET QNm3 is connected to the drain of MOSFET QNm4. The source of MOSFET QNm3 is connected to LED-.

3. The LED lighting control circuit with power transistor heat dissipation function according to claim 1, characterized in that: It also includes a short-circuit protection circuit, which includes an operational amplifier Nm1. Pin 1 of the operational amplifier Nm1 is connected to resistors Rm3 and Rm2, capacitor Cm1, and diode Dm1. Resistor Rm3 is connected to LED_I, resistor Rm2 is connected to BAT-, capacitor Cm1 is grounded, diode Dm1 is connected to resistor Rm4, resistor Rm4 is connected to pin 4 of the operational amplifier Nm1, pin 2 of the operational amplifier Nm1 is grounded, pin 3 of the operational amplifier Nm1 is connected to resistors Rmz2 and Rmz1, resistor Rmz2 is connected to +3.30, and resistor Rmz1 is connected to the MCU to receive the con_Imax_PB4 signal; pin 5 of the operational amplifier Nm1 is connected to +3.30; pin 4 of the operational amplifier Nm1 is also connected to resistors Rm1 and Rm5. Resistor Rm1 is connected to the gate of the MOS transistor QNm in the discharge circuit to output the Imax_out signal, and resistor Rm5 is connected to the MCU to output the out_Imax_PB3 signal.

4. The LED lighting control circuit with power transistor heat dissipation function according to claim 1, characterized in that: The boost circuit includes a boost chip Na1. The Vcc pin of the boost chip Na1 is connected to a resistor Ra6, a Zener diode Daz1, and a capacitor Ca2. The resistor Ra6 is connected to SUN+, the Zener diode Daz1 is grounded, and the capacitor Ca2 is grounded. Pin 4 of the boost chip Na1 is grounded. Pin 2 of the boost chip Na1 is connected to a resistor Ra1, and the resistor Ra1 is connected to the CH_H_T1_PB0 pin of the MCU to receive PWM signals. Pin 3 of the boost chip Na1 is connected to resistor Ra2, which is connected to pin CH_L_T1_PA0 of the MCU to receive PWM signals; pin 5 of the boost chip Na1 is connected to resistor Ra4, which outputs the drive signal LO. Pin 7 of the boost chip Na1 is connected to resistor Ra3, and resistor Ra3 outputs drive signal HO; drive signal LO and drive signal HO together form the drive signal; pin 6 of the boost chip Na1 outputs voltage monitoring signal VS.

5. The LED lighting control circuit with power transistor heat dissipation function according to claim 1, characterized in that: The battery charging circuit includes MOSFETs QN1, QN2, QN3, QN4, and QN5. The QN1_SUN+ pin of MOSFET QN1 is connected to SUN+, and the QN1_conG pin is connected to diode D3, resistor Ra5, and diode Da2 respectively. Diode D3 is connected to SUN+, resistor Ra5 is connected to SUN+, and diode Da2 is connected to capacitor Ca1 and diode Da1 respectively. Capacitor Ca1 is connected to the QN3_VS pin of MOSFET QN3, and diode Da1 is connected to SUN+. The QN2_HO pin of MOSFET QN2 is connected to pin 7 of boost chip Na1 to receive the drive signal HO, and the QN2_VS pin of MOSFET QN2 is connected to pin 6 of boost chip Na1 to receive the voltage monitoring signal VS. The QN3_HO pin of MOSFET QN3 is connected to the boost chip... Pin 7 of chip Na1 is used to receive the drive signal HO. Pin QN3_VS of MOSFET QN3 is connected to pin 6 of boost chip Na1 to receive the voltage monitoring signal VS. Pin QN3_INS+ of MOSFET QN3 is connected to capacitor C101, which is grounded. Pin QN4_LO of MOSFET QN4 is connected to pin 5 of boost chip Na1 to receive the drive signal LO. Pin QN4_GND of MOSFET QN4 is grounded. Pin QN4_VS of MOSFET QN4 is connected to pin 6 of boost chip Na1 to receive the voltage monitoring signal VS and is connected to resistor R1 and inductor L respectively. Resistor R1 is connected to capacitor C2, which is grounded. Inductor L is connected to BAT+. Pin QN5_LO of MOSFET QN5 is connected to pin 5 of boost chip Na1 to receive the drive signal LO. Pin QN5_GND of MOSFET QN5 is grounded.

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