Electronic component module and wireless communication device provided with same

Abstract

The utility model provides an electronic component module and a wireless communication device provided with the electronic component module, wherein the electronic component module can be adhered to a member provided with a conductor pattern in a short time by means of a hot melt adhesive. An electronic component module bonded to a member provided with a conductor pattern by means of a hot melt adhesive, the electronic component module comprising: a first substrate; a coupling electrode which is provided on the first surface of the first substrate and which is electromagnetically coupled to the conductor pattern; and a second substrate provided on the first surface of the first substrate so as to cover the coupling electrode. The thermal resistance between the coupling electrode and the second substrate is smaller than the thermal resistance between the coupling electrode and the first substrate.

Description

Technical Field

[0001] This disclosure relates to electronic component modules and wireless communication devices having such electronic component modules. Background Technology

[0002] For example, Patent Document 1 discloses a method for manufacturing an RFID tag (wireless communication device) as follows: a base film (component) having an antenna pattern (conductor pattern) is conveyed toward a mounting position, and a packaged RFIC (Radio-Frequency Integrated Circuit) element (electronic component module) is attached to the antenna pattern at the mounting position. The packaged RFIC element attached to the tape is picked up, and the picked-up packaged RFIC element is attached (fixed) to the antenna pattern.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: International Publication No. 2018 / 012391 Utility Model Content

[0006] Problems to be solved by utility models

[0007] However, in the manufacturing method described in Patent Document 1, the packaged RFIC element needs to be peeled off and picked up, which takes time. In addition, there are cases where peeling off the RFIC element fails.

[0008] Alternatively, hot melt adhesives are considered as a method for attaching electronic component modules to the assembly. Hot melt adhesives are in a cured state outside of the bonding process, making them easier to handle compared to encapsulation. However, the hot melt adhesive needs to be heated during bonding to soften it, and this softening process takes time.

[0009] Therefore, the problem of this disclosure is to attach electronic component modules to components with conductor patterns in a short time using hot melt adhesive.

[0010] Solution for solving the problem

[0011] To solve the aforementioned technical problems, according to a solution of this disclosure,

[0012] An electronic component module is provided, wherein,

[0013] The electronic component module is attached to a component with a conductor pattern using a hot melt adhesive.

[0014] This electronic component module has:

[0015] First substrate;

[0016] A coupling electrode, disposed on a first surface of the first substrate on the component side, is coupled to the electromagnetic field of the conductor pattern; and

[0017] A second substrate is disposed on the first surface of the first substrate in a manner that covers the coupling electrode.

[0018] The thermal resistance between the coupling electrode and the second substrate is smaller than the thermal resistance between the coupling electrode and the first substrate.

[0019] Preferably, the electronic component module further includes a layer of hot melt adhesive, which is disposed on the surface of the second substrate opposite to the surface opposite to the surface of the first substrate.

[0020] Preferably, conductive particles are dispersed within the second substrate.

[0021] Preferably, the second substrate is made of a material having a higher thermal conductivity than the material of the first substrate.

[0022] Preferably, the second substrate is a layer of the hot melt adhesive.

[0023] Preferably, the first substrate is made of a material having an absorbance lower than that of the coupling electrode.

[0024] Preferably, the electronic component module further includes an IC chip disposed on a second surface of the first substrate on the side opposite to the first surface and electrically connected to the coupling electrode, wherein the IC chip is disposed on the second surface in such a manner that it does not overlap with the coupling electrode when viewed from above the first substrate.

[0025] Furthermore, according to another aspect of this disclosure,

[0026] A wireless communication device is provided, wherein,

[0027] This wireless communication device has the following features:

[0028] The electronic component module; and

[0029] An antenna component having an antenna pattern that is electromagnetically coupled to the coupling electrode of the electronic component module, for the electronic component module to be attached using a hot melt adhesive.

[0030] Effects of the utility model

[0031] According to this disclosure, electronic component modules can be attached to a component with a conductor pattern in a short time using a hot melt adhesive. Attached Figure Description

[0032] Figure 1This is a perspective view of a wireless communication device according to one embodiment of the present disclosure.

[0033] Figure 2 This is a top view of a wireless communication device.

[0034] Figure 3 This is an exploded 3D view of the RFIC module.

[0035] Figure 4 This is an exploded 3D view of the electronic components of the RFIC module.

[0036] Figure 5 This is the equivalent circuit diagram of a wireless communication device.

[0037] Figure 6 This is a cross-sectional view of a portion of a wireless communication device that includes the RFIC module that will be pasted beforehand.

[0038] Figure 7 This is an exploded perspective view of an RFIC module according to another embodiment of this disclosure.

[0039] Figure 8 This is a top view of a wireless communication device according to different embodiments of this disclosure.

[0040] Figure 9 This is an exploded perspective view of the RFIC module of a wireless communication device with different implementations.

[0041] Figure 10 This is an exploded perspective view of the electronic components of an RFIC module for a wireless communication device with different implementations.

[0042] Figure 11 This is a top view of a modified wireless communication device with different implementation methods.

[0043] Figure 12 This is a top view of a wireless communication device, which is another variation of a different implementation. Detailed Implementation

[0044] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0045] Figure 1 This is a perspective view of a wireless communication device according to one embodiment of the present disclosure. Figure 2 This is a top view of a wireless communication device. The X-Y-Z coordinate system in the figure is used to facilitate understanding of this disclosure and is not intended to limit this disclosure. The X-axis direction represents the length direction of the wireless communication device, the Y-axis direction represents the width direction, and the Z-axis direction represents the thickness direction.

[0046] like Figure 1 and Figure 2As shown, the wireless communication device 10 is strip-shaped and is used as a so-called RFID (Radio-Frequency Identification) tag.

[0047] Specifically, such as Figure 1 and Figure 2 As shown, the wireless communication device 10 has an antenna component 12 and an RFIC (Radio-Frequency Integrated Circuit) module 14 disposed on the antenna component 12.

[0048] The antenna component 12 of the wireless communication device 10 is strip-shaped (slender rectangular shape), including an antenna substrate 16 and antenna patterns 18A and 18B disposed on a surface 16a (the first main surface 12a of the antenna component 12) of the antenna substrate 16.

[0049] The antenna substrate 16 is a flexible, sheet-like component made of insulating materials such as polyimide resin. For example... Figure 1 and Figure 2 As shown, the antenna substrate 16 also includes surfaces 16a and 16b that function as a first main surface 12a and a second main surface 12b of the antenna member 12. Since the antenna substrate 16, a major component of the antenna member 12, is flexible, the antenna member 12 can also be flexible.

[0050] Antenna patterns 18A and 18B are used as antennas for wireless communication between the wireless communication device 10 and external communication devices (e.g., a reader / writer device if the wireless communication device 10 is used as an RFID tag). In this embodiment, antenna patterns 18A and 18B are conductor patterns made of metal foil such as silver, copper, or aluminum.

[0051] In addition, antenna patterns 18A and 18B include radiating portions 18Aa and 18Ba for receiving and transmitting waves, and coupling portions 18Ab and 18Bb for electrical connection with RFIC module 14.

[0052] In this embodiment, the radiating portions 18Aa and 18Ba of the antenna patterns 18A and 18B are dipole antennas and are zigzag-shaped. Furthermore, the radiating portions 18Aa and 18Ba extend from the coupling portions 18Ab and 18Bb located in the central portion along the length direction (X-axis direction) of the antenna substrate 16 toward both ends of the antenna substrate 16.

[0053] The coupling portions 18Ab and 18Bb of antenna patterns 18A and 18B are electrically connected to the coupling electrodes of RFIC module 14, as will be described in detail later. The coupling portions 18Ab and 18Bb are rectangular pads.

[0054] Figure 3This is an exploded 3D view of the RFIC module. Furthermore, Figure 4 It is an exploded 3D view of the electronic components of the RFIC module. Furthermore, Figure 5 This is the equivalent circuit diagram of a wireless communication device.

[0055] like Figure 3 and Figure 4 As shown, the RFIC module 14 is a device that performs wireless communication using antenna patterns 18A and 18B at communication frequencies such as the 900MHz band, i.e., the UHF band.

[0056] like Figure 3 As shown, in this embodiment, the RFIC module 14 is a multi-layered electronic component module that includes the electronic component 20. Specifically, the RFIC module 14 includes the electronic component 20 and a hot-melt adhesive layer 22 for attaching the electronic component 20 to the antenna member 12. Furthermore, in this embodiment, the RFIC module 14 includes a substrate 24 (second substrate), a top sheet 26, and an adhesive sheet 28 for attaching the top sheet 26 to the electronic component 20, which are located between the electronic component 20 and the hot-melt adhesive layer 22.

[0057] like Figure 4 As shown, the electronic component 20 of the RFIC module 14 includes a substrate 30 (first substrate), an RFIC chip 32 mounted on one surface 30a of the substrate 30, a conductor pattern 34 formed on one surface 30a of the substrate 30, and a conductor pattern 36 formed on another surface 30b (first surface) of the substrate 30 opposite to one surface 30a.

[0058] The substrate 30 of the electronic component 20 of the RFIC module 14 is a thin plate-shaped insulating sheet, for example, made of insulating materials such as polyimide or liquid crystal polymer.

[0059] The RFIC chip 32 is an IC chip driven by the UHF band frequency (communication frequency), and has a structure in which various components are integrated into a semiconductor substrate made of semiconductor materials such as silicon. Furthermore, the RFIC chip 32 includes a first input / output terminal 32a and a second input / output terminal 32b. Moreover, as... Figure 5 As shown, the RFIC chip 32 includes an internal capacitor (capacitor: the inherent capacitance of the RFIC chip itself) C1.

[0060] The conductor pattern 34 is a pattern made of conductive materials such as silver, copper, and aluminum. The conductor pattern 34 includes two spiral coil sections 38 and 40.

[0061] A pad portion 38a is provided on the outer periphery of the coil portion 38 of the conductor pattern 34, which is electrically connected to the first input / output terminal 32a of the RFIC chip 32, for example, by means of solder (not shown). Furthermore, a pad portion 38b is provided on the center end of the coil portion 38 for electrical connection with the conductor pattern 36. Additionally, a pad portion 38d for electrical connection with the conductor pattern 36 is also provided at the top of the branch portion 38c, which branches off from the outer periphery (pad portion 38a) and center end (pad portion 38b) of the coil portion 38.

[0062] In addition, such as Figure 5 As shown, the coil section 38 functions as an inductor with inductance L1.

[0063] A pad portion 40a is provided on the outer periphery of the coil portion 40 of the conductor pattern 34, for example, by means of solder (not shown) to be electrically connected to the second input / output terminal 32b of the RFIC chip 32. Furthermore, a pad portion 40b for electrical connection with the conductor pattern 36 is provided on the center end of the coil portion 40. Additionally, a pad portion 40d for electrical connection with the conductor pattern 36 is also provided at the top of the branch portion 40c that branches off from the outer periphery (pad portion 40a) and center end (pad portion 40b) of the coil portion 40.

[0064] In addition, such as Figure 5 As shown, the coil section 40 functions as an inductor with inductance L2.

[0065] The conductor pattern 36 is a pattern made of conductive materials such as silver, copper, and aluminum. The conductor pattern 36 includes two spiral coil sections 42 and 44 and two coupling electrodes 46 and 48.

[0066] A pad portion 42a is provided at the center end of the coil portion 42 of the conductor pattern 36. The pad portion 42a is electrically connected to the pad portion 38b of the coil portion 38 of the conductor pattern 34 via an interlayer connecting conductor 50, such as a through-hole conductor that penetrates the substrate 30.

[0067] In addition, such as Figure 5 As shown, the coil section 42 functions as an inductor with inductance L3.

[0068] A pad portion 44a is provided at the center end of the coil portion 44 of the conductor pattern 36. The pad portion 44a is connected to the pad portion 40b of the coil portion 40 of the conductor pattern 34 via an interlayer connecting conductor 52, such as a through-hole conductor that penetrates the substrate 30.

[0069] In addition, such as Figure 5 As shown, the coil section 44 functions as an inductor with inductance L4.

[0070] The outer peripheral ends of the two coil sections 42 and 44 are electrically connected by a connecting section 54. The connecting section 54 functions as an inductive element with an inductance L5.

[0071] The coupling electrodes 46 and 48 of the conductor pattern 36 are electrodes for capacitive coupling with the coupling portions 18Ab and 18Bb of the antenna patterns 18A and 18B of the antenna member 12. In this embodiment, the coupling electrodes 46 and 48 are rectangular and arranged at intervals. Coil portions 42 and 44 and a connecting portion 54 are arranged between the coupling electrodes 46 and 48.

[0072] The coupling electrode 46 is electrically connected to the pad portion 38d of the coil portion 38 of the conductor pattern 34 via an interlayer connecting conductor 56, such as a through-hole conductor penetrating the substrate 30. The coupling electrode 48 is electrically connected to the pad portion 40d of the coil portion 40 via the interlayer connecting conductor 58.

[0073] like Figure 5 As shown, a matching circuit 60 is formed by the coil portions 38 and 40 of conductor pattern 34, the coil portions 42 and 44 of conductor pattern 36, the connection portion 54, and the inherent capacitance C1 of RFIC chip 32. This matching circuit 60 is used to match the impedance between RFIC chip 32 and coupling electrodes 46 and 48 at a predetermined frequency (communication frequency).

[0074] Back Figure 3 A hot-melt adhesive layer 22 is provided on another surface 30b (i.e., the surface on the side of the antenna member 12) of the substrate 30 of the electronic component 20 of the RFIC module 14. Specifically, in this embodiment, the hot-melt adhesive layer 22 is provided on the other surface 30b of the substrate 30 with the film 24 (second substrate) between it and the other surface 30b of the substrate 30. Furthermore, the hot-melt adhesive layer 22 is provided on the substrate 30 to cover the coupling electrodes 46 and 48.

[0075] The hot melt adhesive constituting the hot melt adhesive layer 22 softens (partially melts) when heated from its cured state, and then solidifies again when cooled from its softened state. In this embodiment, the hot melt adhesive is a thermoplastic resin, such as EVA, that maintains its cured state without deformation at the temperature of the operating environment of the wireless communication device 10. Furthermore, in this embodiment, the cured hot melt adhesive layer 22 has insulating properties. Moreover, in this embodiment, the hot melt adhesive layer 22 has a melting temperature, for example, 70 to 200 degrees Celsius, lower than that of other components of the RFIC module 14, such as the substrate 30. During bonding, the hot melt adhesive layer 22 is softened, for example, by heating to approximately 95 degrees Celsius.

[0076] Figure 6This is a cross-sectional view of a portion of a wireless communication device that includes the RFIC module that will be pasted beforehand.

[0077] like Figure 6 As shown, a hot-melt adhesive layer 22 is positioned between the RFIC module 14 and the antenna component 12, bonding them together. Specifically, the RFIC module 14 is bonded to the antenna component 12 with the coupling electrode 46 facing the coupling portion 18Ab of the antenna pattern 18A and the coupling electrode 48 facing the coupling portion 18Bb of the antenna pattern 18B. Therefore, the coupling electrode 46 and the coupling portion 18Ab are capacitively coupled (e.g., with the hot-melt adhesive layer 22 and the substrate 24 positioned between the coupling electrode 46 and the coupling portion 18Ab). Figure 5 As shown, capacitor C2 is formed. In addition, coupling electrode 48 and coupling part 18Bb are capacitively coupled (forming capacitor C3) with hot melt adhesive layer 22 and substrate 24 between coupling electrode 48 and coupling part 18Bb.

[0078] The substrate 24 (second substrate) between the substrate 30 and the hot-melt adhesive layer 22 is made of an insulating material such as epoxy resin. Furthermore, the substrate 24 is disposed on another surface 30b of the substrate 30, covering the coupling electrodes 46 and 48. Moreover, the hot-melt adhesive layer 22 is provided on the surface of the substrate 24 opposite to the surface opposite to the substrate 30. The substrate 24 is, for example, hot-pressed onto the substrate 30.

[0079] Film 24 protects the conductor patterns 36 of coupling electrodes 46, 48 on another surface 30b of substrate 30. At the same time, film 24 suppresses deviations in the distance between coupling electrode 46 and coupling portion 18Ab of antenna pattern 18A and between coupling electrode 48 and coupling portion 18Bb of antenna pattern 18B, i.e., deviations in capacitance between them.

[0080] For example, when only a thermoplastic adhesive layer 22 exists between the coupling electrode 46 and the coupling portion 18Ab, it is difficult to manage the distance between them. That is, when bonding the RFIC module 14 to the antenna component 12, the thickness of the thermoplastic adhesive layer 22 needs to be managed to prevent a short circuit between the coupling electrode 46 and the coupling portion 18Ab. In contrast, when a substrate 24 exists between the coupling electrode 46 and the coupling portion 18Ab, the thickness of the substrate 24 is constant, thus preventing a short circuit between the coupling electrode 46 and the coupling portion 18Ab. Therefore, deviations in the distance between the coupling electrode 46 and the coupling portion 18Ab that could lead to a short circuit can be suppressed.

[0081] The top sheet 26 is a sheet-like component made of resin material such as PET (polyethylene terephthalate) and is disposed on one surface 30a of the substrate 30. The top sheet 26 is bonded to the substrate 30, for example, by means of an adhesive sheet 28 made of epoxy resin. Thus, the top sheet 26 (and the adhesive sheet 28) protect the IC chip 32 and conductor pattern 34 disposed on one surface 30a of the substrate 30. Here, the adhesive sheet 28 is not limited to thermosetting resin material. It is also possible to use an adhesive such as a hot melt adhesive in addition to thermosetting resin material. This improves the bonding strength between the top sheet 26 and the substrate 30, and furthermore, when the hot melt adhesive is more flexible than the thermosetting resin, the flexibility of the RFIC module can be improved.

[0082] According to such a wireless communication device 10, when antenna patterns 18A and 18B receive radio waves (signals) of a predetermined frequency (communication frequency) in the UHF band, a current corresponding to the signal flows from antenna patterns 18A and 18B to RFIC chip 32. RFIC chip 32 receives this current supply and is driven to output a current (signal) corresponding to information stored in its internal storage unit (not shown) to antenna patterns 18A and 18B. Then, radio waves (signals) corresponding to this current are radiated from antenna patterns 18A and 18B.

[0083] The structure of the wireless communication device 10 of this embodiment has now been described. From this point onward, the method of bonding the RFIC module 14 to the antenna member 12 by means of its hot melt adhesive layer 22 will be described.

[0084] like Figure 6 As shown, when the RFIC module 14 is bonded to the antenna component 12, the RFIC module 14 is first placed on the antenna component 12. For example, the RFIC module 14 is placed on the antenna component 12 using a mounting device (not shown). When the RFIC module 14 is placed on the antenna component 12, the hot melt adhesive layer 22 is in a cured state and does not have adhesive ability.

[0085] When the RFIC module 14 is placed on the antenna component 12, the hot melt adhesive layer 22 is heated and softened. In this embodiment, a heating device (not shown) emitting a laser LL (hollow arrow) is used to heat the hot melt adhesive layer 22. The RFIC module 14 is configured to heat the hot melt adhesive layer 22 using the laser LL.

[0086] Specifically, such as Figure 6As shown, the laser LL has a wavelength of approximately 900 nm and does not irradiate the hot melt adhesive layer 22, but instead irradiates the coupling electrodes 46 and 48 covered by the hot melt adhesive layer 22. The coupling electrodes 46 and 48 are heated by the laser LL, and their entirety reaches a high temperature. The heat H (solid arrow) moves from the coupling electrodes 46 and 48, which are in a high-temperature state, to the hot melt adhesive layer 22, resulting in the entire hot melt adhesive layer 22 being heated and softened. That is, the coupling electrodes 46 and 48 function as heat sinks. In contrast, when the laser LL directly irradiates the hot melt adhesive layer 22, there is a possibility that the portion of the hot melt adhesive layer 22 irradiated by the laser LL may over-melt, for example, become liquid, before the entire hot melt adhesive layer 22 softens.

[0087] In the case where the coupling electrodes 46 and 48 function as heat sinks using laser LL heating, the coupling electrodes 46 and 48 are preferably made of a material with high light absorption. For this purpose, the coupling electrodes 46 and 48 are preferably made of copper. When the coupling electrodes 46 and 48 are made of copper, an oxide film (a layer of copper oxide) with high light absorption is formed on their surface. As a result, the laser LL is not reflected but absorbed by the coupling electrodes 46 and 48.

[0088] In order to efficiently perform the heating of the hot melt adhesive layer 22 using coupling electrodes 46 and 48, the thermal resistance between the coupling electrodes 46 and 48 and the hot melt adhesive layer 22 is smaller than the thermal resistance between the coupling electrodes 46 and 48 and the substrate 30. Furthermore, the term "thermal resistance" as used in this specification refers to a value obtained by quantifying the difficulty of heat conduction; the larger the value, the more difficult it is for heat to conduct.

[0089] Furthermore, in this embodiment, the substrate 24 is located between the coupling electrodes 46, 48 and the hot melt adhesive layer 22. Therefore, the thermal resistance between the coupling electrodes 46, 48 and the substrate 24 is smaller than the thermal resistance between the coupling electrodes 46, 48 and the substrate 30.

[0090] Taking advantage of this difference in thermal resistance, most of the heat generated in the coupling electrodes 46 and 48, which are heated by the laser LL, moves through the substrate 24 to the hot melt adhesive layer 22. As a result, the hot melt adhesive layer 22 can be softened efficiently in a short time.

[0091] In order to make the thermal resistance between the coupling electrodes 46, 48 and the substrate 24 smaller than that between the coupling electrodes 46, 48 and the substrate 30, conductive particles such as carbon particles and aluminum particles are dispersed in the substrate 24 in this embodiment.

[0092] In this embodiment, the substrate 30 is made of polyimide, and the film 24 is made of epoxy resin. The former has a thermal conductivity of 0.28–0.34 W / m·K, and the latter has a thermal conductivity of 0.3 W / m·K. Therefore, the thermal conductivity of the materials of the substrate 30 and the film 24 is approximately the same. That is, the thermal resistance between the coupling electrodes 46, 48 and the substrate 30 is substantially the same as the thermal resistance between the coupling electrodes 46, 48 and the film 24. Thus, in this embodiment, conductive particles are dispersed within the film 24.

[0093] When conductive particles with high thermal conductivity are dispersed within the substrate 24, heat easily moves from the coupling electrodes 46 and 48 into the substrate 24. Conversely, conductive particles are not dispersed within the substrate 30. Therefore, even if the materials of the substrate 24 and substrate 30 have substantially the same thermal conductivity, the thermal resistance between the coupling electrodes 46 and 48 and the substrate 24 can be made smaller than the thermal resistance between the coupling electrodes 46 and 48 and the substrate. Consequently, most of the heat H generated by the coupling electrodes 46 and 48 does not move to the substrate 30, but rather to the substrate 24.

[0094] Alternatively, the substrate 24 can be made of a material with a higher thermal conductivity than the material of the substrate 30, in addition to dispersing the conductive particles within it. Alternatively, the substrate 24 can be made of a material with a higher thermal conductivity than the material of the substrate 30, instead of dispersing the conductive particles within it. This also allows the thermal resistance between the coupling electrodes 46, 48 and the substrate 24 to be lower than the thermal resistance between the coupling electrodes 46, 48 and the substrate 30.

[0095] Furthermore, in this embodiment, such as Figure 6 As shown, the laser LL passes through the top plate 26, the adhesive sheet 28, and the substrate 30 to reach the coupling electrodes 46 and 48. Therefore, the top plate 26, the adhesive sheet 28, and the substrate 30 are made of light-transmitting materials. Particularly preferred is that the substrate 30 is made of a material having a lower absorbance than the coupling electrodes 46 and 48. This allows a higher light intensity laser LL to reach the coupling electrodes 46 and 48.

[0096] Moreover, in this embodiment, such as Figure 2 and Figure 3As shown, the RFIC chip 32 is disposed on one surface 30a of the substrate 30. Furthermore, the RFIC chip 32 is disposed on one surface 30a in such a way that it does not overlap with the coupling electrodes 46 and 48 when viewed from above (along the Z-axis). Specifically, in this embodiment, the coupling electrodes 46 and 48 are arranged at intervals along the length direction (X-axis direction). The RFIC chip 32 is located between these coupling electrodes 46 and 48. This suppresses the possibility of laser LL irradiating the RFIC chip 32, and the laser LL can reach the coupling electrodes 46 and 48 without being obstructed by the RFIC chip 32.

[0097] According to this embodiment, the RFIC module 14 can be attached to the antenna component 12 having antenna patterns 18A and 18B in a short time using a hot melt adhesive layer 22.

[0098] The above-described embodiments illustrate this disclosure, but the embodiments of this disclosure are not limited thereto.

[0099] For example, in the case of the above-described implementation, such as Figure 3 As shown, in the RFIC module 14, an insulating substrate 24 is located between the electronic component 20 and the hot melt adhesive layer 22. However, the embodiments disclosed herein are not limited to this.

[0100] Figure 7 This is an exploded perspective view of an RFIC module according to another embodiment of this disclosure.

[0101] like Figure 7 As shown, in another embodiment of the RFIC module 114, the hot melt adhesive layer 122 is directly disposed on the electronic component 20, similar to the substrate 24 in the above embodiment, covering the coupling electrodes 46 and 48. In this case, the thermal resistance between the coupling electrodes 46 and 48 and the hot melt adhesive layer 122 is smaller than the thermal resistance between the coupling electrodes 46 and 48 and the substrate 30.

[0102] Furthermore, in the case of the above-described implementation, such as Figure 3 As shown, a hot-melt adhesive layer 22 for bonding the RFIC module 14 and the antenna component 12 is disposed on the RFIC module 14. However, the embodiments of this disclosure are not limited thereto. The hot-melt adhesive layer 22 may also be disposed on the antenna component 12.

[0103] Furthermore, in the above-described implementation scenario, such as Figure 6 As shown, coupling electrodes 46 and 48 are heated by irradiation with laser LL. This is because coupling electrodes 46 and 48 are not exposed to the outside. However, the embodiments of this disclosure are not limited to this. For example, a portion of coupling electrodes 46 and 48 may be exposed, allowing a heat-conducting member to contact the exposed portion and heat the heat-conducting member.

[0104] Furthermore, in the above-described embodiment, in the wireless communication device 10, the coupling electrodes 46, 48 of the electronic components 20 of the RFIC module 14 are capacitively coupled to the coupling portions 18Ab, 18Bb of the antenna patterns 18A, 18B of the antenna member 12. Therefore, as... Figure 2 and Figure 6 As shown, the coupling electrodes 46 and 48 and the coupling portions 18Ab and 18Bb are spaced apart from each other in the thickness direction (Z-axis direction) of the wireless communication device 10. That is, they are electrically coupled. However, embodiments of this disclosure are not limited to electric field coupling.

[0105] Figure 8 This is a top view of a wireless communication device according to different embodiments of this disclosure. Furthermore, Figure 9 These are exploded perspective views of RFIC modules of wireless communication devices with different implementations. Furthermore, Figure 10 This is an exploded perspective view of the electronic components of an RFIC module for a wireless communication device with different implementations.

[0106] like Figure 8 As shown, in different embodiments of the wireless communication device 210, the antenna member 212 has an antenna pattern 218 magnetically coupled to the RFIC module 214. The antenna pattern 218 includes a generally "C"-shaped coupling portion 218a arranged to surround the RFIC module 214 when viewed along the thickness direction (Z-axis direction) of the wireless communication device 210, and straight radiating portions 218b and 218c extending from both ends of the coupling portion 218a in opposite directions to each other.

[0107] like Figure 9 As shown, the RFIC module 214 includes an electronic component 220, a substrate 24 and a top sheet 26 located between the electronic component 220 and the hot melt adhesive layer 22, and an adhesive sheet 28 for bonding the top sheet 26 to the electronic component 220. Alternatively, the substrate 24 may be omitted.

[0108] like Figure 10 As shown, the electronic component 220 includes a substrate 230, an RFIC chip 232 disposed on the substrate 230, and a coil conductor 246 (coupling electrode) disposed on the substrate 230 and electrically connected to the RFIC chip 232. The coil conductor 246 includes interlayer connection conductors 252 and 254, such as a spiral conductor pattern 248 disposed on one surface 230a of the substrate 230, a spiral conductor pattern 250 disposed on the other surface 230b, and a through-hole conductor penetrating the substrate 230 and electrically connecting the conductor patterns 248 and 250. The coil conductor 246 is disposed on the substrate 230 such that it surrounds the RFIC chip 232 when viewed along the thickness direction (Z-axis direction) of the wireless communication device 210.

[0109] According to such a wireless communication device 210, when the antenna pattern 218 receives radio waves, current flows into the coupling portion 218a of the antenna pattern 218, thereby generating a magnetic field in the coupling portion 218a. This magnetic field is used to flow current into the coil conductor 246 of the electronic component 220 of the RFIC module 214. The RFIC chip 232 receives this current supply and is driven to output a current corresponding to the information stored in its internal storage unit (not shown) to the coil conductor 246. The coil conductor 246 generates a magnetic field corresponding to the output current, and this magnetic field is used to flow current into the coupling portion 218a of the antenna pattern 218. As a result, the antenna pattern 218 radiates radio waves corresponding to the current.

[0110] Furthermore, according to this RFIC module 214, the coil conductor 246 is heated by laser irradiation. Using the coil conductor 246, the hot melt adhesive layer 22 is heated and softened, resulting in the RFIC module 214 being bonded to the antenna component 212 by means of the hot melt adhesive layer 22.

[0111] Furthermore, antenna patterns capable of magnetically coupling with such an RFIC module 214 can exist in a variety of forms.

[0112] Figure 11 and Figure 12 This is a top view of a wireless communication device with variations of different implementations.

[0113] For example, such as Figure 11 As shown, in a modified example of the wireless communication device 310, the antenna pattern 318 includes a generally "C"-shaped coupling portion 318a arranged in a manner surrounding the RFIC module 214, and zigzag radiating portions 318b and 318c extending from both ends of the coupling portion 318a in opposite directions to each other.

[0114] In addition, for example, such as Figure 12 As shown, in another variation of the wireless communication device 410, the antenna pattern 418 includes parallel, linear radiating portions 418a and 418b spaced apart, and a connecting portion 418c connecting one end of these radiating portions 418a and 418b to each other. The RFIC module 214 is surrounded by the two radiating portions 418a and 418b and the connecting portion 418c. Thus, the RFIC module 214 is magnetically coupled to the antenna pattern 418.

[0115] Furthermore, in the above-described embodiments, the electronic component modules and components bonded by means of the hot melt adhesive layer 22 are the RFIC module 14 and antenna component 12 of the wireless communication device, but the embodiments of this disclosure are not limited to this.

[0116] That is, the various methods disclosed herein are as follows.

[0117] The first method is an electronic component module, wherein the electronic component module is attached to a component having a conductor pattern by means of a hot melt adhesive. The electronic component module has: a first substrate; a coupling electrode disposed on a first surface of the first substrate on the component side, which is electromagnetically coupled to the conductor pattern; and a second substrate disposed on the first surface of the first substrate in a manner that covers the coupling electrode, wherein the thermal resistance between the coupling electrode and the second substrate is smaller than the thermal resistance between the coupling electrode and the first substrate.

[0118] In the second embodiment, the electronic component module according to the first embodiment further includes a layer of the hot melt adhesive, the layer of the hot melt adhesive being disposed on the surface of the second substrate opposite to the surface opposite to the surface of the first substrate.

[0119] In the third embodiment, conductive particles are dispersed within the second substrate according to the electronic component module of the first or second embodiment.

[0120] In the fourth embodiment, according to any one of the embodiments 1 to 3, the second substrate is made of a material having a higher thermal conductivity than the material of the first substrate.

[0121] In the fifth embodiment, according to the electronic component module of the first embodiment, the second substrate is a layer of the hot melt adhesive.

[0122] In the sixth embodiment, according to any one of the embodiments 1 to 5, the first substrate is made of a material having an absorbance lower than that of the coupling electrode.

[0123] In the seventh embodiment, the electronic component module according to any one of the embodiments 1 to 6 further includes an IC chip disposed on a second surface of the first substrate on the side opposite to the first surface and electrically connected to the coupling electrode, wherein the IC chip is disposed on the second surface in such a manner that it does not overlap with the coupling electrode when the first substrate is viewed from above.

[0124] The eighth method is a wireless communication device, wherein the wireless communication device has: an electronic component module of any one of the methods 1 to 7; and an antenna component having an antenna pattern coupled to the electromagnetic field of the coupling electrode of the electronic component module, for the electronic component module to be attached by means of a hot melt adhesive.

[0125] Industrial availability

[0126] This disclosure can be applied when bonding electronic component modules having coupling electrodes and components having conductor patterns that are capacitively or magnetically coupled to the coupling electrodes using hot melt adhesives.

Claims

1. An electronic component module, characterized in that, The electronic component module is attached to a component with a conductor pattern using a hot melt adhesive. This electronic component module has: First substrate; A coupling electrode is disposed on the first surface of the first substrate on the component side and is coupled to the electromagnetic field of the conductor pattern; as well as A second substrate is disposed on the first surface of the first substrate in a manner that covers the coupling electrode. The thermal resistance between the coupling electrode and the second substrate is smaller than the thermal resistance between the coupling electrode and the first substrate.

2. The electronic component module according to claim 1, characterized in that, The electronic component module also has a layer of hot melt adhesive, which is disposed on the surface of the second substrate opposite to the surface opposite to the surface of the first substrate.

3. The electronic component module according to claim 1 or 2, characterized in that, The second substrate is made of a material having a higher thermal conductivity than the material of the first substrate.

4. The electronic component module according to claim 1, characterized in that, The second substrate is a layer of the hot melt adhesive.

5. The electronic component module according to claim 1 or 2, characterized in that, The first substrate is made of a material having a lower absorbance than the coupling electrode.

6. The electronic component module according to claim 1 or 2, characterized in that, The electronic component module also includes an IC chip disposed on a second surface of the first substrate, opposite to the first surface, and electrically connected to the coupling electrode. The IC chip is disposed on the second surface in such a way that it does not overlap with the coupling electrode when viewed from above the first substrate.

7. A wireless communication device, characterized in that, This wireless communication device has the following features: The electronic component module according to any one of claims 1 to 6; and An antenna component having an antenna pattern that is electromagnetically coupled to the coupling electrode of the electronic component module, for the electronic component module to be attached using a hot melt adhesive.

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