High-conductivity PCB

Abstract

The utility model relates to the technical field of high-conductivity PCBs, and discloses a high-conductivity PCB, which comprises a PCB mainboard, a heat dissipation assembly, a copper pipe, a first flat pipe, a second flat pipe, a connecting pipe and a heat dissipation fan, and is characterized in that a group of heat dissipation plates are fixedly connected to the lower end of the PCB mainboard, and the heat dissipation plates are made of graphene plates and can effectively absorb heat dissipated by the PCB mainboard, so that the heat dissipation efficiency of the PCB mainboard is improved, and the heat dissipation efficiency of the PCB mainboard is improved. A plurality of groups of copper pipes are fixedly mounted in the heat dissipation plate, the copper pipes can also absorb heat dissipated by the PCB mainboard, after the heat dissipation fan is started, external air can be quickly sucked into one group of copper pipes through the connecting pipes, and finally, most heat can be blown out from the air outlet holes by the air sucked by the heat dissipation fan; and air blown out by the heat dissipation fan can carry heat of the air to be blown out from the heat dissipation holes, and external air can neutralize a part of heat when passing through the heat dissipation holes and making contact with the copper pipe, so that a certain heat dissipation effect is achieved.

Description

Technical Field

[0001] This utility model relates to the field of high conductivity PCB technology, and in particular to a high conductivity PCB. Background Technology

[0002] High-conductivity PCBs have low resistivity, which can reduce circuit impedance, improve signal transmission speed and quality, reduce signal attenuation and distortion, and conduct heat more effectively, helping electronic components dissipate heat, reduce temperature, and improve circuit stability and reliability.

[0003] While traditional high-conductivity PCBs can reduce circuit impedance, prolonged operation at high temperatures can cause a sharp increase in both internal and external temperatures. High temperatures can lead to a decline in the performance of electronic components on the PCB, as well as signal transmission distortion, resulting in data errors or communication failures. Excessive temperature can also affect the PCB's operating efficiency. Utility Model Content

[0004] In order to solve the problems existing in the background art, the present invention provides a high conductivity PCB board with a good heat dissipation system and the ability to dissipate heat quickly.

[0005] To address the problems in the prior art, this utility model provides a high conductivity PCB board, including a PCB motherboard. A heat dissipation assembly is fixedly installed inside a heat sink. The heat dissipation assembly includes copper pipes, a first flat pipe, a second flat pipe, a connecting pipe, a cooling fan, a connecting shaft, a mounting bracket, and a power supply. The upper ends of multiple sets of copper pipes are fixedly connected to the lower end of the PCB motherboard. Horizontal copper pipes are connected to each other via the first flat pipe, and vertical copper pipes are fixedly connected to each other via the second flat pipe. All copper pipes, the first flat pipe, and the second flat pipe are made of copper. One end of the first flat pipe is connected to one set of first flat pipes, and the other end is fixedly connected to another set of first flat pipes. The second flat pipe is fixedly connected between two sets of obliquely oriented copper pipes. One end of the connecting pipe is fixedly connected to one set of copper pipes, and the other end is fixedly connected to the side wall of the heat sink. The cooling fan is installed inside the connecting pipe.

[0006] Specifically, one end of the connecting shaft is fixedly connected to one side of the cooling fan, the other end of the connecting shaft is fixedly connected to the inside of the mounting bracket, the mounting bracket is fixedly connected to the inner wall of the connecting pipe, the cooling fan and the power supply are connected by a wire, and the power supply is fixedly installed at the lower end of the heat sink.

[0007] Specifically, a heat dissipation layer is fixedly installed at the lower end of the PCB motherboard. The heat dissipation layer includes a heat sink, heat dissipation holes, and vent holes. The heat sink is fixedly connected to the lower end of the PCB motherboard.

[0008] Specifically, the heat sink is made of graphene sheet and is hollow inside. Multiple sets of heat dissipation holes are opened at the bottom of the heat sink, and each set of heat dissipation holes corresponds to a set of copper pipes. Multiple sets of vent holes are opened on both sides of the heat sink, and each set of vent holes corresponds to a set of connecting pipes.

[0009] Specifically, multiple sets of electronic components are fixedly connected to the upper end of the PCB motherboard, and a set of mounting holes are provided at each of the four top corners of the PCB motherboard.

[0010] The beneficial effects of this utility model are:

[0011] This invention relates to a high-conductivity PCB board, in which a set of heat sinks is fixedly connected to the lower end of the PCB motherboard. The heat sink is made of graphene board, which can effectively absorb the heat dissipated by the PCB motherboard. Multiple sets of copper pipes are fixedly installed inside the heat sink. The horizontal copper pipes are connected by a first flat pipe, and the vertical copper pipes are fixedly connected by a second flat pipe. The connection between the copper pipes, the first flat pipe, and the second flat pipe forms a triangle, which can effectively improve its stability. The upper end of the copper pipe is fixedly connected to the lower end of the PCB motherboard, so the copper pipe can also absorb the heat dissipated by the PCB motherboard. After the cooling fan is started, it will quickly draw the outside air into one of the sets of copper pipes through the connecting pipe, and then push it back and forth into the interior of each copper pipe through multiple sets of first flat pipes and copper pipes. Finally, the air drawn in by the cooling fan will blow most of the heat out from the air outlet, thereby achieving a rapid heat dissipation effect. Attached Figure Description

[0012] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0013] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0014] Figure 2 This is a front view of the lower end of the overall structure of this utility model;

[0015] Figure 3 This is an exploded view of the connection structure of the heat sink, copper pillar and first flat tube in this utility model;

[0016] Figure 4 This is a side front view of the overall structure of this utility model;

[0017] Figure 5 for Figure 4 Enlarged view of point A in the middle.

[0018] In the diagram: 1. PCB motherboard; 110. Electronic component; 111. Mounting hole; 2. Heat dissipation layer; 210. Heat sink; 211. Heat dissipation hole; 212. Vent hole; 3. Heat dissipation assembly; 310. Copper pipe; 311. First flat pipe; 312. Second flat pipe; 313. Connecting pipe; 314. Cooling fan; 315. Connecting shaft; 316. Mounting bracket; 317. Power supply. Detailed Implementation

[0019] To make the technical methods, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0020] like Figure 1-5 As shown, to address the problems in the prior art, this utility model provides a high conductivity PCB board, including a PCB motherboard 1. The heat dissipation assembly 3 is fixedly installed inside a heat dissipation plate 210. The interior of the heat dissipation assembly 3 includes copper pipes 310, a first flat pipe 311, a second flat pipe 312, a connecting pipe 313, a cooling fan 314, a connecting shaft 315, a mounting bracket 316, and a power supply 317. The upper ends of multiple sets of copper pipes 310 are fixedly connected to the lower end of the PCB motherboard 1, and the horizontal copper pipes 310 are connected by the first flat pipe 311, while the vertically mounted copper pipes 310 are connected by the first flat pipe 311. Two flat tubes 312 are fixedly connected. The copper tube 310, the first flat tube 311, and the second flat tube 312 are all made of copper. One end of the first flat tube 311 is connected to one set of first flat tubes 311, and the other end of the first flat tube 311 is fixedly connected to another set of first flat tubes 311. The second flat tube 312 is fixedly connected between two sets of inclined copper tubes 310. One end of the connecting tube 313 is fixedly connected to one set of copper tubes 310, and the other end of the connecting tube 313 is fixedly connected to the side wall of the heat sink 210. The cooling fan 314 is installed inside the connecting tube 313.

[0021] This invention features a heat sink 210 fixedly connected to the lower end of a PCB motherboard 1. The heat sink 210 is made of graphene sheet, which effectively absorbs the heat dissipated by the PCB motherboard 1. Multiple copper pipes 310 are fixedly installed inside the heat sink 210. The horizontal copper pipes 310 are connected by a first flat pipe 311, and the vertical copper pipes 310 are fixedly connected by a second flat pipe 312. The copper pipes 310, the first flat pipe 311, and the second flat pipe 312 form a triangle, which effectively improves stability. Qualitatively, the upper end of the copper pipe 310 is fixedly connected to the lower end of the PCB motherboard 1, so the copper pipe 310 can also absorb the heat emitted by the PCB motherboard 1. After the cooling fan 314 is started, it will quickly draw the outside air into one of the copper pipes 310 through the connecting pipe 313, and then push it back and forth into the interior of each copper pipe 310 through multiple sets of first flat pipes 311 and copper pipes 310. Finally, the air drawn in by the cooling fan 314 will blow most of the heat out from the air outlet 212, thereby achieving the effect of rapid heat dissipation.

[0022] Preferably, one end of a connecting shaft 315 is fixedly connected to one side of the cooling fan 314, and the other end of the connecting shaft 315 is fixedly connected to the interior of a mounting bracket 316. The mounting bracket 316 is fixedly connected to the inner wall of a connecting pipe 313. The cooling fan 314 and the power supply 317 are connected by a wire. The power supply 317 is fixedly installed at the lower end of the heat sink 210. A set of heat dissipation layers 2 is fixedly installed at the lower end of the PCB motherboard 1. The interior of the heat dissipation layer 2 includes a heat sink 210, heat dissipation holes 211, and air vents 212. The heat sink 210 is fixedly connected to the lower end of the PCB motherboard 1. The material of the heat sink 210 is graphene board, and the interior is hollow. Multiple sets of heat dissipation holes 211 are opened at the bottom of the heat sink 210. Each set of heat dissipation holes 211 corresponds to a set of copper pipes 310. Multiple sets of air vents 212 are opened on both sides of the heat sink 210. Each set of air vents 212 corresponds to a set of connecting pipes 313.

[0023] In this invention, multiple cooling fans 314 and a power supply 317 are connected by wires. The power supply 317 provides the cooling fans 314 with the power required for operation. Multiple cooling holes 211 are opened at the bottom of the heat sink 210. Each cooling hole 211 corresponds to a copper pipe 310. The air blown out by the cooling fans 314 also carries its heat and is blown out from the cooling holes 211. When the outside air comes into contact with the copper pipes 310 through the cooling holes 211, it can also neutralize some of the heat, thereby achieving a certain heat dissipation effect.

[0024] Working principle: A heat sink 210 is fixedly connected to the lower end of the PCB motherboard 1. The heat sink 210 is made of graphene board, which can effectively absorb the heat dissipated by the PCB motherboard 1. Multiple copper pipes 310 are fixedly installed inside the heat sink 210. The horizontal copper pipes 310 are connected by a first flat pipe 311, and the vertical copper pipes 310 are fixedly connected by a second flat pipe 312. The copper pipes 310, the first flat pipe 311, and the second flat pipe 312 form a triangle, which effectively improves stability. The upper end of the copper pipes 310 is fixedly connected to the lower end of the PCB motherboard 1, so the copper pipes 310 can also absorb the heat dissipated by the PCB motherboard 1. After the cooling fan 314 is started, it will quickly draw external air through the connecting pipe 313. The air is quickly drawn into one set of copper pipes 310, and then pushed back and forth into the interior of each copper pipe 310 through multiple sets of first flat pipes 311 and copper pipes 310. Finally, the air drawn in by the cooling fan 314 blows most of the heat out through the air outlet 212, thereby achieving a rapid heat dissipation effect. Multiple sets of cooling fans 314 are connected to the power supply 317 through wires. The power supply 317 provides the cooling fans 314 with the power required to operate. Multiple sets of heat dissipation holes 211 are opened at the bottom of the heat sink 210. Each set of heat dissipation holes 211 corresponds to a set of copper pipes 310. The air blown out by the cooling fan 314 also carries its heat and is blown out through the heat dissipation holes 211. When the outside air comes into contact with the copper pipes 310 through the heat dissipation holes 211, it can also neutralize some of the heat, thereby achieving a certain heat dissipation effect.

[0025] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The descriptions of the above embodiments and specifications are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of protection claimed by this utility model. Scope of Protection of this Utility Model.

Claims

1. A high conductivity PCB board, characterized in that: Including the PCB motherboard (1); Heat dissipation assembly (3), which is fixedly installed inside the heat dissipation plate (210), the interior of the heat dissipation assembly (3) includes copper pipe (310), first flat pipe (311), second flat pipe (312), connecting pipe (313), heat dissipation fan (314), connecting shaft (315), mounting bracket (316) and power supply (317). The upper ends of multiple sets of copper tubes (310) are fixedly connected to the lower end of the PCB motherboard (1), and the horizontal copper tubes (310) are connected by the first flat tube (311), and the vertical copper tubes (310) are fixedly connected by the second flat tube (312). The copper tubes (310), the first flat tube (311) and the second flat tube (312) are all made of copper. A first flat tube (311) is connected at one end to one set of first flat tubes (311), and the other end of the first flat tube (311) is fixedly connected to another set of first flat tubes (311). The second flat tube (312) is fixedly connected between two sets of inclined copper tubes (310); A connecting pipe (313) is fixedly connected at one end to a group of copper pipes (310), and at the other end to the side wall of a heat sink (210). Cooling fan (314) is installed inside the connecting pipe (313).

2. The high conductivity PCB board according to claim 1, characterized in that: One side of the cooling fan (314) is fixedly connected to one end of the connecting shaft (315), and the other end of the connecting shaft (315) is fixedly connected to the inside of the mounting bracket (316). The mounting bracket (316) is fixedly connected to the inner wall of the connecting pipe (313).

3. A high conductivity PCB board according to claim 2, characterized in that: The cooling fan (314) and the power supply (317) are connected by a wire, and the power supply (317) is fixedly installed at the lower end of the heat sink (210).

4. A high conductivity PCB board according to claim 1, characterized in that: A heat dissipation layer (2) is fixedly installed at the lower end of the PCB motherboard (1). The heat dissipation layer (2) includes a heat sink (210), heat dissipation holes (211) and an air outlet (212). The heat sink (210) is fixedly connected to the lower end of the PCB motherboard (1).

5. A high conductivity PCB board according to claim 2, characterized in that: The heat sink (210) is made of graphene sheet and is hollow inside. The bottom of the heat sink (210) has multiple sets of heat dissipation holes (211), each set of heat dissipation holes (211) corresponds to a set of copper pipes (310). The sides of the heat sink (210) have multiple sets of air vents (212), each set of air vents (212) corresponds to a set of connecting pipes (313).

6. A high conductivity PCB board according to claim 2, characterized in that: The upper end of the PCB motherboard (1) is fixedly connected to multiple sets of electronic components (110), and a set of mounting holes (111) are provided at each of the four top corners of the PCB motherboard (1).

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