Heat dissipation device for electronic component and semiconductor test equipment
By designing specific fin groups and clamping structures in the heat sink, combined with fan cooling, the problem of poor heat dissipation in semiconductor testing equipment was solved, achieving more efficient heat dissipation and reduced flow resistance, thus ensuring the safety of electronic components.
Patent Information
- Application Number
- CN202422880065.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-25
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2034-11-25
AI Technical Summary
In the existing technology, the heat sink of semiconductor testing equipment has poor heat dissipation effect, which cannot effectively prevent power devices from overheating and burning out, and the heat sink has large flow resistance.
The design employs multiple fin groups, with the fins near the inner wall edge of each group having a shorter extension length than those near the middle of the inner wall, forming a cross-shaped gap to increase the heat dissipation area in the middle. The electronic components are tightly attached to the heat sink through a clamping structure, and air cooling is achieved in conjunction with a fan.
This improves the heat dissipation effect in the middle of the heat sink, reduces the temperature rise of electronic components, lowers the flow resistance of the heat sink, and ensures the safety and heat dissipation efficiency of electronic components.
Smart Images
Figure CN223503241U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of heat dissipation technology for electronic components, and in particular to a heat dissipation device for electronic components and a semiconductor testing equipment. Background Technology
[0002] As semiconductor testing equipment demands increasingly wider voltage ranges and higher levels of integration, power devices, influenced by their power consumption and device size, require greater heat dissipation and insulation under high voltage. Current solutions mostly involve applying thermal grease or a thermal pad to the bottom of the power device, covering it with an insulating sleeve, and then pressing the device firmly onto a heatsink using a clamping block. Due to material and structural limitations, it's impossible to prevent the power device from overheating and burning out. While some solutions combine heatsinks with fans for cooling, the heat dissipation effect is not ideal. Utility Model Content
[0003] One objective of this invention is to provide a heat dissipation device for electronic components, thereby solving the technical problem of poor heat dissipation performance of existing heat sinks.
[0004] A further objective of this invention is to reduce the flow resistance of the radiator itself.
[0005] Another objective of this invention is to provide a semiconductor testing device having the aforementioned heat dissipation device.
[0006] Specifically, this utility model provides a heat dissipation device for electronic components, including at least one heat sink and at least one fan, wherein at least one fan is mounted on at least one side of each heat sink, and each heat sink includes:
[0007] The housing is cuboid and hollow inside, and at least one electronic component is attached to the middle of at least one target sidewall of the housing.
[0008] At least one set of fins, each set of fins being disposed on the inner wall of the housing corresponding to the target sidewall, each set of fins including a plurality of fins extending from the inner wall toward the middle of the housing, wherein the extension length of the fins near the edge of the inner wall in each set of fins is less than the extension length of the fins near the middle of the inner wall.
[0009] Optionally, at least one electronic component is attached to the middle of each of the two opposing target sidewalls of the housing, and a set of fins is provided on the inner wall corresponding to each of the two target sidewalls.
[0010] Optionally, the number of fin groups is four, and the four fin groups are respectively disposed on the four inner walls of the shell.
[0011] Optionally, the plurality of fins in each fin group are arranged at intervals along the corresponding inner wall, and the extension length of the plurality of fins gradually increases from one end of the inner wall toward the middle of the inner wall, and gradually decreases from the middle of the inner wall toward the other end of the inner wall.
[0012] Optionally, multiple fins of the four fin groups define a cross-shaped gap inside the housing.
[0013] Optionally, each of the heat sinks further includes:
[0014] At least one clamping structure, each clamping structure being mounted on the target sidewall and connected to the housing, each clamping structure being used to press at least one electronic component against the target sidewall so that the heat sink can dissipate heat from the electronic component.
[0015] Optionally, each of the clamping structures includes:
[0016] The mounting bracket is installed on the side wall of the target and has a pivot.
[0017] A clamping member extends vertically along the housing and is rotatably connected to the rotating shaft;
[0018] An operating element is mounted on the clamping element. The operating element is configured to drive the clamping element to rotate around the pivot when operated, thereby causing the clamping element to clamp the electronic component and causing the electronic component to adhere to the target sidewall.
[0019] Optionally, the operating member is disposed on the top of the clamping member and is threadedly connected to the clamping member. The end of the operating member abuts against the target sidewall and is configured to drive the clamping member to rotate when rotated, so that the bottom of the clamping member clamps the electronic component.
[0020] Optionally, each of the heat sinks further includes:
[0021] At least one isolator, each of the isolators being disposed between the housing and at least one of the electronic components, for electrical isolation and thermal conduction.
[0022] In particular, this invention also provides a semiconductor testing device, including the aforementioned heat dissipation device.
[0023] In this invention, at least one electronic component is attached to the center of at least one target sidewall of the housing. Each fin group is located on the inner wall of the housing corresponding to the target sidewall. Each fin group includes multiple fins extending from the inner wall toward the center of the housing. The extension length of the fins near the edge of the inner wall in each fin group is less than the extension length of the fins near the center of the inner wall. This technical solution takes into account that the electronic component is attached to the center of the target sidewall of the housing, and the radiant heat in the central area of the heat sink is higher than that in the surrounding areas. Therefore, by making the extension length of the fins near the edge of the inner wall in each fin group less than the extension length of the fins near the center of the inner wall, it is equivalent to lengthening the central fins, increasing the heat dissipation area, thereby improving the heat dissipation effect in the center of the heat sink and reducing the temperature rise of the electronic component.
[0024] Furthermore, in this invention, the multiple fins of the four fin groups are defined inside the shell to form a cross-shaped gap, which can reduce the ineffective heat dissipation area and reduce the flow resistance of the heat sink itself.
[0025] The above and other objects, advantages and features of this utility model will become more apparent to those skilled in the art from the following detailed description of specific embodiments of this utility model in conjunction with the accompanying drawings. Attached Figure Description
[0026] The following sections will describe some specific embodiments of the present invention in a detailed manner by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar parts or components. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:
[0027] Figure 1 This is a schematic structural diagram of a heat dissipation device installed in a semiconductor testing device according to an embodiment of the present invention;
[0028] Figure 2 This is a schematic structural diagram of a heat dissipation device according to an embodiment of the present invention;
[0029] Figure 3 This is a schematic side view of a heat dissipation device according to an embodiment of the present invention;
[0030] Figure 4 This is a schematic partial enlarged view of a heat dissipation device according to an embodiment of the present invention;
[0031] Figure 5 This is a schematic structural diagram of electronic components and isolation components according to an embodiment of the present invention.
[0032] Figure label:
[0033] 100-Heat dissipation device, 200-Electronic components, 300-Semiconductor testing equipment, 10-Heat sink, 20-Fan, 11-Housing, 12-Fin assembly, 13-Clamping structure, 30-Isolation component, 40-PCB board, 111-Target sidewall, 121-Fin, 14-Gap, 131-Mounting bracket, 132-Shaft, 133-Operating component, 134-Clamping component. Detailed Implementation
[0034] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.
[0035] In the description of this utility model, it should be understood that the terms "upper", "lower", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0036] In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. When a feature "includes or contains" one or more of the features it covers, unless otherwise specifically described, this indicates that other features are not excluded and may be further included.
[0037] Unless otherwise expressly specified and limited, the terms "connection," "installation," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art should be able to understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0038] Unless otherwise specified, all terms (including technical and scientific terms) used in the description of this embodiment have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.
[0039] Figure 1 This is a schematic structural diagram of a heat dissipation device 100 installed in a semiconductor testing equipment 300 according to an embodiment of the present invention. Figure 2This is a schematic structural diagram of a heat dissipation device 100 according to an embodiment of the present invention. Figure 3 This is a schematic side view of a heat dissipation device 100 according to an embodiment of the present invention. Figure 4 This is a schematic partial enlarged view of a heat dissipation device 100 according to an embodiment of the present invention. Figures 1 to 4 As shown, in one specific embodiment, the heat dissipation device 100 for electronic components 200 includes at least one heat sink 10 and at least one fan 20. At least one fan 20 is installed on at least one side of each heat sink 10. Each heat sink 10 includes a housing 11 and at least one set of fins 12. The housing 11 is cuboid and hollow internally. At least one electronic component 200 is attached to the center of at least one target sidewall 111 of the housing 11. Each set of fins 12 is disposed on the inner wall of the housing 11 corresponding to the target sidewall 111. Each set of fins 12 includes multiple fins 121 extending from the inner wall toward the center of the housing 11. The extension length of the fins 121 near the edge of the inner wall in each set of fins 12 is less than the extension length of the fins 121 near the center of the inner wall. Here, the heat sink 10 is cooled by airflow through the fan 20, and the fins 121 within the heat sink 10 can increase the heat dissipation area and improve heat dissipation efficiency. The heat sink 10 is made of aluminum alloy.
[0040] This embodiment takes into account that the electronic component 200 is attached to the middle of the target sidewall 111 of the housing 11, and the radiant heat in the middle area of the heat sink 10 will be higher than that in the surrounding area. Therefore, the extension length of the fins 121 near the inner wall edge in each fin group 12 is less than the extension length of the fins 121 near the middle of the inner wall. This is equivalent to lengthening the middle fins 121, increasing the heat dissipation area, thereby improving the heat dissipation effect in the middle of the heat sink 10 and reducing the temperature rise of the electronic component 200.
[0041] In some embodiments, a fan 20 is mounted on one side of each heat sink 10, and the fan 20 is aligned with the hollow portion of the housing 11 to introduce airflow into the interior of the heat sink 10. In other embodiments, fans 20 may be mounted on both sides of each heat sink 10, depending on design requirements.
[0042] In some embodiments, at least one electronic component 200 is attached to the middle of each of the two opposing target sidewalls 111 of the housing 11, and a set of fin groups 12 is provided on the inner wall corresponding to each of the two target sidewalls 111. That is, as long as there are electronic components 200 attached to the target sidewalls 111 of the housing 11, there are fin groups 12, which can simultaneously dissipate heat from multiple electronic components 200, thereby improving heat dissipation efficiency.
[0043] In some embodiments, a plurality of electronic components 200 are attached to the middle of the two opposite target sidewalls 111 of the housing 11, and the plurality of electronic components 200 are arranged at intervals along the extending direction of the housing 11. The number of electronic components 200 attached to the target sidewalls 111 of the housing 11 is determined according to the extending length of the housing 11; the longer the extending length of the housing 11, the more electronic components 200 are attached to the target sidewalls 111. In this embodiment, multiple electronic components 200 are attached to each target sidewall 111, which can simultaneously dissipate heat from multiple electronic components 200.
[0044] In some embodiments, the number of fin groups 12 is four, and the four fin groups 12 are respectively disposed on the four inner walls of the housing 11. It can be understood that the housing 11 is square, so the housing 11 has four inner walls, and the fin groups 12 are disposed on the four inner walls of the housing 11, which can further improve the heat dissipation efficiency. Here, the housing 11 and each fin 121 of the fin group 12 are integrally formed.
[0045] In some embodiments, the plurality of fins 121 in each fin group 12 are spaced apart along the corresponding inner wall, and the extension length of the plurality of fins 121 gradually increases from one end of the inner wall toward the middle of the inner wall, and gradually decreases from the middle of the inner wall toward the other end of the inner wall. See [reference needed]. Figure 3 This can be understood as the plurality of fins 121 in each fin group 12 forming a triangle. Preferably, the plurality of fins 121 in each fin group 12 form an isosceles triangle. In other embodiments, the plurality of fins 121 in each fin group 12 can also form other shapes, as long as it is ensured that the extension length of the fins 121 on both sides is less than the length of the fin 121 in the middle.
[0046] In some embodiments, each fin group 12 has the same number of fins 121, and the multiple fins 121 of each fin group 12 form the same shape. In this way, multiple fin groups 12 form a regular shape inside the housing 11, making heat dissipation more uniform.
[0047] In some embodiments, the multiple fins 121 of the four fin groups 12 define a cross-shaped gap 14 inside the housing 11, which can reduce ineffective heat dissipation areas and reduce the flow resistance of the heat sink 10 itself. The gap in the middle of the housing 11 prevents the air inlet of the housing 11 from being blocked, thus affecting heat dissipation. Furthermore, the cross-shaped gap 14 defined inside the housing 11 in this embodiment ensures both the heat exchange area of the fins 121 and improves heat exchange efficiency, and also ensures sufficient airflow at the air inlet of the housing 11. Here, the air inlet of the housing 11 is the side of the housing 11 where the fan 20 is installed. The four corners of the cross-shaped gap 14 correspond to the four corners of the housing 11.
[0048] In some embodiments, each heat sink 10 further includes at least one clamping structure 13, each clamping structure 13 being mounted on a target sidewall 111 and connected to the housing 11. Each clamping structure 13 is used to press at least one electronic component 200 against the target sidewall 111, so that the heat sink 10 dissipates heat from the electronic component 200. Here, the heat sink 10 is mounted above the PCB board 40, and the electronic component 200 is soldered onto the PCB board 40. The electronic component 200 and the heat sink 10 are not connected, so the clamping structure 13 is needed to clamp them.
[0049] This embodiment, by providing a clamping structure 13 on the outside of the heat sink 10, allows the electronic components 200 to be tightly attached to the housing 11 of the heat sink 10, resulting in better heat conduction.
[0050] In some embodiments, the number of clamping structures 13 is multiple, and the multiple clamping structures 13 are divided into two groups of clamping structures. The two groups of clamping structures are respectively disposed at two opposite target sidewalls 111 of the housing 11. Each group of clamping structures includes multiple clamping structures 13 arranged at intervals along the extension direction of the housing 11.
[0051] In some embodiments, the number of clamping structures 13 is the same as the number of electronic components 200. Each clamping structure 13 corresponds to one electronic component 200. In other embodiments, the number of clamping structures 13 may be different from the number of electronic components 200, and each clamping structure 13 may correspond to multiple electronic components 200, depending on the design requirements.
[0052] In some embodiments, each clamping structure 13 includes a mounting bracket 131, a clamping member 134, and an operating member 133. The mounting bracket 131 is mounted on the target sidewall 111 and has a pivot 132. The clamping member 134 extends vertically along the housing 11 and is rotatably connected to the pivot 132. The operating member 133 is mounted on the clamping member 134 and is configured to drive the clamping member 134 to rotate about the pivot 132 when operated, thereby causing the clamping member 134 to clamp the electronic component 200, so that the electronic component 200 is pressed against the target sidewall 111. In this embodiment, the electronic component 200 can be clamped by rotating the clamping member 134, which is relatively convenient to operate.
[0053] In some embodiments, the operating member 133 is disposed on top of the clamping member 134 and is threadedly connected to the clamping member 134. The end of the operating member 133 abuts against the target sidewall 111 and is configured to rotate the clamping member 134 when rotated, thereby clamping the electronic component 200 at the bottom of the clamping member 134. Here, the operating member 133 may be a bolt. See also... Figure 3When the bolt is turned, the top of the clamp 134 moves to the right. Due to the lever principle, the bottom of the clamp 134 moves to the left. After the required torque is reached, it is fixed by the self-locking thread, so that the bottom of the clamp 134 presses against the electronic component 200.
[0054] In some embodiments, multiple clamping structures located on the same side of the housing 11 share a single pivot 132. That is, multiple clamping members 134 can pass through a single pivot 132, see [reference needed]. Figure 4 .
[0055] Figure 5 This is a schematic structural diagram of electronic component 200 and isolator 30 according to an embodiment of the present invention. Figure 5 As shown, each heat sink 10 also includes at least one isolator 30, each isolator 30 being disposed between the housing 11 and at least one electronic component 200 for electrical isolation and heat conduction. Here, the electronic component 200 carries a high voltage of ±3500V, so it cannot be directly attached to the heat sink 10. Therefore, an isolator 30 is added between the heat sink 10 and the electronic component 200 for isolation and heat conduction, thus insulating the electronic component 200 from the heat sink 10. In this embodiment, one isolator 30 is provided between each electronic component 200 and the housing 11. In other embodiments, the number of isolators 30 provided between each electronic component 200 and the housing 11 can be selected according to specific design requirements.
[0056] In some embodiments, the size of the isolator 30 is larger than the size of the electronic component 200. The isolator 30 is made of aluminum nitride. In other embodiments, the isolator 30 may be made of other materials.
[0057] In some embodiments, the isolator 30 can also be integrated with the electronic component 200, with gold plating on the isolator 30 and the electronic component 200 soldered onto the isolator 30.
[0058] This embodiment also provides a semiconductor testing apparatus 300, which includes the heat dissipation device 100 of any of the above embodiments. Details regarding the heat dissipation device 100 are not provided here.
[0059] In some embodiments, the semiconductor testing equipment 300 includes two heat dissipation devices 100, which are arranged side by side. See [reference needed]. Figure 1 and Figure 2 .
[0060] This embodiment takes into full account that the temperature of the area away from the electronic component 200 is higher. Therefore, by improving the fins 121 inside the heat sink 10, the length of the fins 121 near the high temperature area of the electronic component 200 is increased, which is equivalent to increasing the heat exchange area, thereby improving the heat dissipation effect and reducing the temperature rise of the electronic component 200.
[0061] Therefore, those skilled in the art should recognize that although many exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications conforming to the principles of the present invention can be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all such other variations or modifications.
Claims
1. A heat dissipation device for electronic components, characterized in that, Each heatsink includes at least one radiator and at least one fan, with at least one fan mounted on at least one side of each radiator, and each radiator comprising: The housing is cuboid and hollow inside, and at least one electronic component is attached to the middle of at least one target sidewall of the housing. At least one set of fins, each set of fins being disposed on the inner wall of the housing corresponding to the target sidewall, each set of fins including a plurality of fins extending from the inner wall toward the middle of the housing, wherein the extension length of the fins near the edge of the inner wall in each set of fins is less than the extension length of the fins near the middle of the inner wall.
2. The heat dissipation device according to claim 1, characterized in that, At least one electronic component is attached to the middle of each of the two opposing target sidewalls of the housing, and a set of fins is provided on the inner wall corresponding to each of the two target sidewalls.
3. The heat dissipation device according to claim 2, characterized in that, The number of fin groups is four, and the four fin groups are respectively disposed on the four inner walls of the shell.
4. The heat dissipation device according to claim 3, characterized in that, The multiple fins of each fin group are arranged at intervals along the corresponding inner wall, and the extension length of the multiple fins gradually increases from one end of the inner wall toward the middle of the inner wall, and gradually decreases from the middle of the inner wall toward the other end of the inner wall.
5. The heat dissipation device according to claim 4, characterized in that, The multiple fins of the four fin groups define a cross-shaped gap inside the shell.
6. The heat dissipation device according to claim 1, characterized in that, Each of the heat sinks also includes: At least one clamping structure, each clamping structure being mounted on the target sidewall and connected to the housing, each clamping structure being used to press at least one electronic component against the target sidewall so that the heat sink can dissipate heat from the electronic component.
7. The heat dissipation device according to claim 6, characterized in that, Each of the clamping structures includes: The mounting bracket is installed on the side wall of the target and has a pivot. A clamping member extends vertically along the housing and is rotatably connected to the rotating shaft; An operating element is mounted on the clamping element. The operating element is configured to drive the clamping element to rotate around the pivot when operated, thereby causing the clamping element to clamp the electronic component and causing the electronic component to adhere to the target sidewall.
8. The heat dissipation device according to claim 7, characterized in that, The operating component is disposed on the top of the clamping component and is threadedly connected to the clamping component. The end of the operating component abuts against the target sidewall and is configured to drive the clamping component to rotate when rotated, so that the bottom of the clamping component clamps the electronic component.
9. The heat dissipation device according to any one of claims 1-8, characterized in that, Each of the heat sinks also includes: At least one isolator, each of the isolators being disposed between the housing and at least one of the electronic components, for electrical isolation and thermal conduction.
10. A semiconductor testing device, characterized in that, Includes the heat dissipation device as described in any one of claims 1-9.