Mini LED finished product repair equipment

Abstract

A Mini LED finished product repair device comprises a rack, the rack is provided with a repair table used for placing a repair product, and a repair driving part used for driving the repair table to move in the direction and the Y-axis direction is arranged below the repair table; the positioning module is used for identifying bad points of the repaired product on the repair table; the glue removing module is used for removing glue, a glue film or a glue sticking layer on a defective point on the repaired product; the bonding pad cleaning module is used for cleaning the bonding pad on the bad point; the tin dispensing module is used for dispensing tin on the cleaned bonding pad; the mounting module comprises a material carrying assembly used for containing a new chip and a material taking and mounting assembly used for obtaining the new chip from the material carrying assembly and mounting the new chip on the tin-dispensed bonding pad; and the welding module is used for welding the mounted new chip on the bonding pad. By the adoption of the technical scheme, the Mini LED finished product repairing device has the advantages of being capable of repairing Mini LED finished products automatically, good in repairing consistency and high in repairing efficiency.

Description

Technical Field

[0001] This utility model relates to the field of Mini LED repair technology, specifically to a Mini LED finished product repair equipment. Background Technology

[0002] Currently, small-pitch Mini LED products are increasingly used in the market due to their advantages such as high efficiency and high brightness. However, because the spacing between LED beads is small, the production process is also more difficult. During the production process, LED chips are prone to damage, misalignment, omission, or detachment during transportation. This can lead to abnormal LED display issues such as dead LEDs, dim LEDs, bright LEDs, LED stringing, and color deviation after the LED board is lit. Therefore, it is necessary to rework LED boards with defective LED beads.

[0003] The current repair methods mainly include manual repair and equipment repair. Manual repair has poor consistency and low efficiency; while current equipment repair cannot repair finished Mini LED products that have already been molded and packaged. Utility Model Content

[0004] The purpose of this utility model is to address the defects and shortcomings of the existing technology by providing a Mini LED finished product repair equipment, which has the advantages of being able to repair Mini LED finished products, automated repair, good repair consistency, and high repair efficiency.

[0005] To achieve the above objectives, the first aspect of this utility model provides the following technical solution: a Mini LED finished product rework equipment, comprising: a frame,

[0006] The frame is equipped with:

[0007] A rework station is used to place rework products. A rework drive unit is provided below the rework station to drive the rework station to move in the X-axis and Y-axis directions.

[0008] The positioning module is used to identify defects in the products being repaired on the rework station;

[0009] The adhesive removal module is used to remove glue, adhesive film, or adhesive layer from defective parts of returned products;

[0010] The pad cleaning module is used to clean the pads on defective parts of reworked products;

[0011] The soldering module is used to apply solder to the cleaned pads.

[0012] The mounting module includes: a material carrier for holding a new chip, and a material pick-up and mounting component for picking up the new chip from the material carrier and mounting it onto the solder pad after soldering; and a soldering module for soldering the mounted new chip onto the solder pad.

[0013] The present invention further provides that the positioning module includes: an identification and positioning camera and a height measuring component;

[0014] The identification and positioning camera is used to identify and locate defects in the products being repaired on the rework platform; the height measuring component includes: a height measuring probe, and a height measuring lifting component for driving the height measuring probe to move on the Z-axis so that the height measuring probe can touch the products being repaired on the rework platform to measure the height of defects.

[0015] The present invention further includes the following: the glue removal module includes: a glue removal head, a glue removal lifting component for driving the glue removal head to move along the Z-axis direction, and a glue removal blowing component disposed on the side of the glue removal head facing the rework product for cleaning glue removal residue;

[0016] The pad cleaning module includes: a pad cleaning head, a cleaning lifting component for driving the pad cleaning head to move along the Z-axis direction so that the pad cleaning head can contact the reworked product to achieve cleaning, and a pad blowing component disposed on the side of the pad cleaning head to clean the residue on the pad.

[0017] The present invention further includes, in a further embodiment, the soldering module comprising: a soldering head and a soldering lifting component for driving the soldering head to move along the Z-axis direction, thereby bringing the soldering head closer to or away from the reworked product;

[0018] The welding module includes a welding head and a welding lifting component for driving the welding head to move along the Z-axis direction and moving the welding head closer to or away from the product to be repaired.

[0019] The present invention further comprises the following: the material carrier assembly includes a material carrier turntable, a turntable driving assembly, a plurality of crystal disks, and a chip recognition camera; each crystal disk is arranged circumferentially along the material carrier turntable; the chip recognition camera is located above the material carrier turntable; the turntable driving assembly includes: a turntable rotation driving component for driving the material carrier turntable to rotate, and a turntable movement driving component for driving the material carrier turntable to move in the X-axis and Y-axis directions; the chip recognition camera cooperates with the turntable driving assembly to move a new chip required from one of the crystal disks to directly below the chip recognition camera;

[0020] The pick-and-place assembly includes: an adsorption head located directly below the chip recognition camera and below the material carrier turntable for adsorbing the wafer; an adsorption lifting component for driving the adsorption head to move along the Z-axis and bring the adsorption head closer to the wafer; a ejector pin disposed inside the adsorption head and protruding upward to lift a new chip on the wafer; a pick-and-place head disposed above the material carrier turntable; a transfer drive component for driving the pick-and-place head closer to or away from the material carrier assembly; and a lifting drive component for driving the pick-and-place head to move along the Z-axis and bring the pick-and-place head closer to or away from the rework station or the wafer.

[0021] The present invention further includes: a chip detection module located on the path along which the transfer drive drives the pick-up and placement head to move, for detecting the quality of the new chip;

[0022] The chip inspection module includes: a transfer station, a first inspection camera positioned directly above the transfer station, a second inspection camera positioned on the side of the transfer station and below the pick-up and placement head to inspect the bottom of the new chip, and a waste bin positioned on the side of the transfer station.

[0023] The present invention further comprises: a pick-up head for transferring chips from the carrier assembly to the transfer station and a placement head for placing chips from the transfer station onto rework products; the lifting drive comprises: a pick-up lifting drive for driving the pick-up head to move along the Z-axis and a placement lifting drive for driving the placement head to move along the Z-axis; the pick-up and placement assembly further comprises: a rotation drive for driving the placement head to rotate to correct the angle of the new chip.

[0024] The present invention further includes a chip cleaning module for cleaning defective chips on both sides of the transfer platform, including a transfer blowing component and a transfer suction component disposed on the opposite side of the transfer blowing component, so as to suck away and remove defective chips on the transfer platform.

[0025] A cleaning brush is vertically installed inside the waste bin. The cleaning brush can move along the X-axis or Y-axis inside the waste bin to clean the mounting head.

[0026] After adopting the above technical solution, the beneficial effects of this utility model are as follows:

[0027] 1. In this utility model, the Mini LED finished product rework equipment includes: a frame, a rework table, a positioning module, a glue removal module, a pad cleaning module, a soldering module, a mounting module, and a soldering module. The rework table, positioning module, glue removal module, pad cleaning module, soldering module, mounting module, and soldering module are all mounted on the frame, enabling the rework of Mini LED products that have already been manufactured. A rework drive component is located at the bottom of the rework table to drive it to move along the X and Y axes on the frame. The rework drive component can move the rework table to various modules on the frame, allowing each module to effectively perform rework operations on the products on the rework table, achieving integrated and automated product rework.

[0028] 2. In this utility model, the positioning module also includes a height measurement module. The height measurement module measures the height information of the defective points, enabling a thorough understanding of these points. The obtained height information is transmitted to other modules, allowing them to accurately address the defects on the reworked products and achieve good rework results. The height measurement module prevents deformation of the reworked products caused by being fixed in the reflow oven or rework station, ensuring precise processing of defects by other modules and guaranteeing the quality of the reworked products.

[0029] 3. In this utility model, the rework equipment also includes a chip detection module for detecting the quality of new chips, avoiding the replacement of defective new chips with new ones that would fail to achieve the desired rework effect and improving the rework success rate. Specifically, the chip detection module is located on the path of the transfer drive unit that drives the pick-up and placement head, allowing chip detection and transfer to be achieved directly through the pick-up and placement module without the need for an additional chip transfer device. This improves the efficiency of the rework equipment and reduces its cost. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 This is a schematic diagram of the structure of this utility model;

[0032] Figure 2 This is a structural schematic diagram from another perspective of the present invention;

[0033] Figure 3 This is a structural schematic diagram from another perspective of the present invention;

[0034] Figure 4 This is a schematic diagram of the rework station of this utility model;

[0035] Figure 5 This is a structural schematic diagram of the positioning module and welding module of this utility model;

[0036] Figure 6 This is a schematic diagram of the adhesive removal module of this utility model;

[0037] Figure 7 This is a structural schematic diagram of the soldering module and the pad cleaning module of this utility model;

[0038] Figure 8 This is a schematic diagram of the mounting module of this utility model;

[0039] Figure 9 This is a schematic diagram of the material carrier assembly of this utility model;

[0040] Figure 10 This is a schematic diagram of the material feeding and mounting assembly of this utility model;

[0041] Figure 11 This is an exploded view of the structure of the adsorption head of this utility model;

[0042] Figure 12 This is an exploded view of the structure of the chip detection module of this utility model;

[0043] Figure 13 yes Figure 12 An enlarged view of point A;

[0044] Figure 14 This is a schematic diagram of the structure of the first linear module and the second linear module of this utility model.

[0045] Explanation of reference numerals in the attached diagram: 100, rack; 200, rework station; 300, positioning module; 400, adhesive removal module; 500, pad cleaning module; 600, soldering module; 700, soldering module; 210, rework drive unit; 221, lifting and fixing platform; 222, fixing nozzle; 310, identification and positioning camera; 320, height measuring probe; 330, height measuring lifting component; 410, adhesive removal head; 420, adhesive removal lifting component; 430, adhesive removal air blowing component; 510, pad cleaning head; 520, pad air blowing component; 530, pad suction component; 540, pressure sensing device; 550, cleaning lifting component; 610, soldering head; 620, soldering lifting component; 630, cleaning tray; 631, receiving tank; 800, material loading assembly; 900, material handling unit. Placement components; 810, Material carrier turntable; 820, Die disk; 830, Chip recognition camera; 840, Turntable rotation drive; 850, Turntable movement drive; 910, Adsorption head; 920, Adsorption lifting component; 911, Ejector pin; 912, Adsorption hole; 930, Chip detection module; 931, Transfer station; 932, First detection camera; 933, Second detection camera; 934, Waste bin; 940, Placement head; 950, Pick-up head; 951, Pick-up lifting drive; 941, Placement lifting drive; 942, Rotation drive; 935, Transfer air blowing component; 936, Transfer air suction component; 937, Cleaning brush; 710, Welding head; 720, Welding lifting component; 110, First linear module; 120, Second linear module. Detailed Implementation

[0046] The present invention will be further described in detail below with reference to the accompanying drawings.

[0047] This specific embodiment is merely an explanation of the present utility model and is not intended to limit the present utility model. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive element, but as long as they are within the scope of the claims of the present utility model, they are protected by patent law.

[0048] Example 1:

[0049] This embodiment relates to a Mini LED finished product repair equipment, such as... Figure 1-14 As shown, it includes: rack 100, rework station 200, positioning module 300, adhesive removal module 400, pad cleaning module 500, soldering module 600, mounting module and soldering module 700.

[0050] The rework station 200, positioning module 300, adhesive removal module 400, pad cleaning module 500, soldering module 600, mounting module and soldering module 700 are all mounted on the rack 100 to rework Mini LED products that have already been manufactured.

[0051] The rework table 200 is the part of the rework equipment used to place rework products. Rework products can be placed on the rework table 200 by a feeding device or manually. A rework drive unit 210 is provided at the bottom of the rework table 200 to drive the rework table 200 to move along the X and Y axes on the frame 100. The rework drive unit 210 can drive the rework table 200 to move to various modules on the frame 100, so that each module can better perform rework operations on the rework products on the rework table 200, realizing the integration and automation of product rework.

[0052] In this embodiment, a fixing device is provided at the bottom of the rework table 200 to securely fix the rework product onto the rework table 200, ensuring the stability of the rework product during the movement of the rework table 200 and other module operations; preventing the rework product from shaking or falling off the rework table 200, which could affect the rework effect and cause damage to normal points on the rework product. The fixing device includes: a lifting fixing platform 221 located at the bottom of the rework table 200, and fixing suction nozzles 222 located on both sides above the lifting fixing platform 221; when the rework product is placed on the rework table 200, the lifting fixing platform 221 rises, causing the fixing suction nozzles 222 above the lifting fixing platform 221 to contact the bottom of the rework product. The fixing suction nozzles 222 use negative pressure to adsorb and fix the rework product onto the rework table 200, ensuring a good rework effect. The fixing suction nozzles 222 adsorb the rework product from both sides, ensuring adsorption stability while maintaining the force balance of the rework product and preventing deformation. Of course, in other embodiments, the fixing device can also be configured in other forms to achieve good fixation of the reworked product. As a preferred solution, the rework station 200 is also provided with a lighting test device for connecting to the reworked product on the rework station 200 to perform a lighting test on the reworked product. Before and after the product is reworked, the lighting test device can cooperate with the positioning module 300 to find the condition and location of the defective points on the product to be reworked, and to check the effect of the product after rework.

[0053] First, the rework product placed on the rework station 200 is moved below the positioning module 300 by the rework drive unit 210. The positioning module 300 is used to locate the defective points on the rework product on the rework station 200, so as to facilitate the rework equipment to process the rework product.

[0054] In this embodiment, the positioning module 300 includes: a positioning camera 310 and a height measuring component. The positioning module 300 first obtains the location information of defective points on the rework product on the rework station 200 through the positioning camera 310, analyzes the type information of the defective points, and the positional relationship between multiple defective points, etc., and then measures the height information of the defective points through the height measuring module to achieve a thorough understanding of the defective points. The obtained height information of the defective points is transmitted to other modules, enabling them to accurately process the defective points on the rework product to achieve a good rework effect. The height measurement of the defective point height by the height measuring module can prevent deformation of the rework product caused by passing through the reflow oven or being fixed on the rework station 200, allowing other modules to accurately process the defective points and ensuring the rework quality of the rework product. As a preferred embodiment, the height measuring component includes: a height measuring probe 320 and a height measuring lifting component 330 for driving the height measuring probe 320 to move on the Z-axis. After the positioning camera 310 acquires the location information of the defective point, the rework drive 210 drives the rework table 200 to move so that the defective point is directly below the height measuring component. Then, the height measuring lifting component 330 drives the height measuring probe 320 to descend, allowing the height measuring probe 320 to touch the defective point on the rework product to obtain the height information of the defective point and measure its height. Of course, in other embodiments, the height measuring component can also be configured with other structures to achieve the measurement of the defective point's height and ensure good rework results.

[0055] Then, the rework products on the rework station 200 are moved under the drive of the rework drive unit 210 to the bottom of the adhesive removal module 400. The adhesive removal module 400 is used to remove the glue, adhesive film, or adhesive layer from the defective parts on the rework products. Since the rework products are finished Mini LED products, glue, adhesive film, or adhesive layer has been applied on the defective parts. Therefore, the adhesive removal module 400 needs to remove the glue, adhesive film, or adhesive layer on the defective parts before the defective chips and pads can be cleaned and replaced.

[0056] In this embodiment, the adhesive removal module 400 includes: an adhesive removal head 410, an adhesive removal lifting component 420, and an adhesive removal blowing component 430; the adhesive removal lifting component 420 is used to drive the adhesive removal head 410 to move along the Z-axis direction, so that the adhesive removal head 410 can approach or move away from the rework station 200 to achieve a good adhesive removal effect on the defective points; the adhesive removal blowing component 430 is disposed on one side of the adhesive removal head 410, facing the rework products on the rework station 200; during or after the adhesive removal process of the adhesive removal head 410, adhesive residue or other residues will be attached to the rework products. The adhesive removal blowing component 430 can blow air onto the defective points on the rework products to blow away the adhesive residues from the defective points, so as to avoid residues remaining or accumulating on the rework products and affecting subsequent rework processes and rework quality. As a preferred embodiment, the adhesive removal head 410 is configured as a laser adhesive removal head 410. Driven by the adhesive removal lifting component 420, the adhesive removal head 410 can move closer to or further away from the rework table 200. The laser range of the adhesive removal head 410 can be adjusted to suit the size and type of the defective point to be treated. The laser from the adhesive removal head 410 vaporizes the adhesive on the defective point, achieving a good adhesive removal effect. Of course, in other embodiments, the adhesive removal head 410 can be configured with other structures and use other methods to remove adhesive from the defective point, such as physical adhesive removal.

[0057] Afterwards, the reworked product, after removing the adhesive, will move under the pad cleaning module 500 driven by the rework drive 210. The pad cleaning module 500 is used to clean the pads on the defective points, that is, to clean the defective chip and solder residue on the defective points of the reworked product, so that the pads of the defective points are exposed and cleaned for replacement with new chips, thus realizing the rework of the defective points.

[0058] In this embodiment, the pad cleaning module 500 includes a pad cleaning head 510 and a cleaning drive assembly. The pad cleaning head 510 is used to remove objects (defective chips, solder, glue, capillary fibers, or other foreign matter) from the pads. The cleaning drive assembly drives the pad cleaning head 510 to move, allowing it to contact the objects above the pads. The movement of the pad cleaning head 510 physically removes the objects, scraping or removing them from the pads, thus cleaning them. As a preferred embodiment, the cleaning drive module includes a cleaning lifting member 550 for driving the pad head to move along the Z-axis, and a cleaning moving member for driving the pad head to move along the Y-axis.

[0059] When the pad cleaning head 510 cleans the materials on the pads, residue may be generated on or beside the pads, affecting the cleaning effect and hindering subsequent mounting and soldering. In this embodiment, a pad blowing component is provided on the side of the pad cleaning head 510. The pad blowing component faces the pad cleaning head 510 and generates airflow to blow away the residue on the pads, thereby cleaning the residue and achieving a good pad cleaning effect. As a preferred embodiment, the pad blowing assembly includes: a pad blowing component 520 disposed on one side of the pad cleaning head 510 facing the pad cleaning head 510, and a pad suction component 530 disposed on the other side of the pad cleaning head 510, opposite to the pad blowing component 520; the pad blowing component 520 and the pad suction component 530 cooperate to blow the residue off the pad and absorb the residue into the pad suction component 530, thereby achieving centralized collection of the residue and preventing the residue from contaminating the working environment of the equipment and affecting the normal operation of the equipment.

[0060] As a preferred embodiment, the pad cleaning module 500 also includes a pressure sensing device 540 disposed on the pad cleaning head 510 for sensing the pressure on the pad cleaning head 510. The pressure sensed by the pressure sensing device 540 can determine whether the pad cleaning head 510 is in contact with solder or the pad, and can also determine the thickness of the solder on the pad below the pad cleaning head 510. This allows for better control of the scraping force and thickness when cleaning the solder on the pad, avoiding damage to the pad and achieving a good pad cleaning effect.

[0061] The soldering module 600 is used to apply solder to cleaned pads, replenishing solder on defective pads to facilitate the subsequent soldering of new chips onto the pads. In this embodiment, the soldering module 600 includes a soldering head 610 and a soldering lifting component 620. The soldering lifting component 620 drives the soldering head 610 to move along the Z-axis, allowing the soldering head 610 to approach the reworked product to perform soldering on the cleaned pads.

[0062] As a preferred embodiment, it also includes: a cleaning disk 630 and a cleaning drive module;

[0063] During the soldering process, some solder residue may remain on the soldering tip 610. This solder can stick and solidify on the tip, affecting its soldering performance. A cleaning tray 630 is located below the soldering tip 610 and has a receiving groove 631 containing cleaning cotton. A cleaning drive module drives the soldering tip 610 and / or the cleaning tray 630, causing the tip to insert into the cleaning cotton. The cleaning cotton removes the residual solder from the tip, leaving the solder inside, thus cleaning the tip and ensuring a clean soldering effect. The cleaning cotton is removable within the receiving groove 631, facilitating replacement and ensuring its continued cleaning capability, allowing the cleaning structure to be used sustainably.

[0064] In this embodiment, the receiving groove 631 is circular and located in the center of the cleaning tray 630. Of course, in other embodiments, the receiving groove 631 can also be of other shapes. As a preferred embodiment, the bottom of the cleaning tray 630 is provided with a rotary drive 942 for driving the cleaning tray 630 to rotate. Driven by the rotary drive 942, the cleaning tray 630 rotates, and the position of the receiving groove 631 in the center of the cleaning tray 630 remains unchanged, while the relative position of the cleaning cotton contained in the receiving groove 631 changes. When the cleaning drive module performs cleaning without adjustment, the solder tip 610 can also be smoothly inserted into the receiving groove 631, but the position of the solder tip 610 inserted into the cleaning cotton will change, so that different parts of the cleaning cotton are used to clean the solder tip 610, ensuring that the cleaning cotton maintains sufficient cleaning power to achieve a good cleaning effect on the solder tip 610.

[0065] In this embodiment, the diameter of the receiving groove 631 is set to 32mm, allowing it to hold a sufficiently large area of ​​cleaning cotton, thus improving the continuous cleaning ability of the cleaning cotton and reducing the need for frequent replacement, resulting in a longer maintenance cycle. Of course, in other embodiments, the diameter of the receiving groove 631 can also be set to 25mm, 26mm, 27mm, 28mm, 29mm, 30mm, 31mm, 33mm, 34mm, 35mm, 36mm, 37mm, 38mm, 39mm, 40mm, etc., to meet different cleaning needs.

[0066] As a preferred embodiment, the depth of the receiving groove 631 is set to 8.5mm. This ensures that the cleaning cotton within the receiving groove 631 has sufficient depth for the solder tip 610 to be inserted and cleaned, guaranteeing a large cleaning range and good cleaning effect for the solder tip 610. Simultaneously, it prevents the solder tip 610 from hitting the bottom of the receiving groove 631 and causing damage, thus affecting the soldering effect. Of course, in other embodiments, the depth of the receiving groove 631 can also be set to 5.0mm, 6.0mm, 7.0mm, 8.0mm, 9.0mm, 10.0mm, etc., according to actual needs to achieve a good cleaning effect. In this embodiment, the cleaning cotton is a TPE sponge, enabling it to achieve a good cleaning effect on the solder tip 610. Of course, in other embodiments, the cleaning cotton can be made of other materials that can effectively clean the solder tip 610.

[0067] As a preferred embodiment, the cleaning tray 630 is positioned on the side of the rework station 200. This allows the soldering tip 610 to be quickly inserted into the cleaning cotton on the cleaning tray 630 after completing the soldering operation on the defective pads of the rework product on the rework station 200. This enables rapid cleaning of the soldering tip 610, improving cleaning efficiency and preventing solder from solidifying on the soldering tip 610 or falling onto the equipment or rework product, which would be difficult to clean and affect product quality. In this embodiment, the cleaning drive module includes a soldering lifting component 620 and a rework drive component 210. Through the cooperation of the soldering lifting component 620 and the rework drive component 210, the soldering tip 610 can be smoothly inserted into the cleaning cotton to achieve cleaning and maintain good soldering performance.

[0068] As a preferred solution, the position of the cleaning cotton on the solder tip 610 is changed each time by the cleaning drive module and the rotary drive component 942, so that the solder tip 610 is cleaned by different parts of the cleaning cotton each time. This ensures that the cleaning cotton always maintains a good cleaning effect on the solder tip 610, makes full use of the cleaning cotton, achieves greater usage efficiency, and extends the service life of a single piece of cleaning cotton. It also eliminates the need for frequent replacement of the cleaning cotton and reduces the maintenance cost of the equipment.

[0069] After the defective pads have been soldered, the reworked product is moved below the placement module under the drive of the rework driver 210. The placement module is used to place the new chip onto the soldered pads, realizing the replacement of the defective chip. The placement module includes a material carrier 800 and a pick-up and placement component 900; the material carrier 800 is used to hold the new chip to be replaced, while the pick-up and placement component 900 picks the required new chip from the material carrier 800 according to the defect information, and transfers and places the new chip onto the soldered pads.

[0070] In this embodiment, the material carrier assembly 800 includes: a material carrier turntable 810, a turntable driving assembly, a plurality of wafer disks 820, and a chip recognition camera 830; wherein, the plurality of wafer disks 820 are arranged circumferentially along the material carrier turntable 810; the turntable driving assembly includes: a turntable rotation drive 840 for driving the material carrier turntable 810 to rotate and select different wafer disks 820 on the material carrier turntable 810 for material picking; and a turntable movement drive 850 for driving the material carrier turntable 810 to move in the X-axis and Y-axis directions and select chips at different positions on the wafer disks 820 for material picking; the chip recognition camera 830 is located above the material carrier turntable 810 and can be used to identify chips on the material carrier turntable 810. The chip recognition camera 830 selects chips on the material carrier turntable 810 that meet the requirements for defect rework based on the defect information, and cooperates with the turntable driving assembly to move the required new chips directly below the chip recognition camera 830 for material picking. Of course, in other embodiments, the material carrier 800 can also be configured in other structural forms to meet the new chip requirements of the repair equipment.

[0071] The pick-and-place assembly 900 includes: an adsorption head 910 located directly below the chip recognition camera 830 and below the material carrier turntable 810; an adsorption lifting member 920 for driving the adsorption head 910 to move along the Z-axis; an ejector pin 911 disposed inside the adsorption head 910 and protruding upward; a pick-and-place head disposed on the upper side of the material carrier turntable 810; a transfer drive member for driving the pick-and-place head to move closer to or away from the material carrier assembly 800; and a lifting drive member for driving the pick-and-place head to move along the Z-axis. After the turntable drive assembly moves the material carrier platform to directly below the chip recognition camera 830, the adsorption lifting component 920 drives the adsorption head 910 to rise and contact the wafer disk 820. The adsorption head 910 then adsorbs and fixes the wafer disk 820. At this time, the ejector pin 911 protrudes upwards and engages with the adsorption head 910, lifting the new chip upwards. Since the wafer disk 820 is firmly held by the adsorption head 910, the new chip separates from the wafer disk 820 under the action of the ejector pin 911. The transfer drive assembly and the lifting drive assembly drive the pick-up and placement head to move onto the material carrier turntable 810 to pick up the lifted chip. The pick-up and placement head then places the new chip picked up by the transfer drive assembly and the lifting drive assembly onto the pre-soldered pads, completing the chip placement process and achieving a good placement effect. In this embodiment, the ejector pin 911 is located in the middle of the adsorption head 910, and multiple adsorption holes 912 are provided around the ejector pin 911 on the adsorption head 910. The multiple adsorption holes 912 not only enhance the adsorption and fixation force on the wafer disk 820, but also adsorb and fix the wafer disk 820 around the new chip. This allows the new chip to be more easily separated from the wafer disk 820 when the ejector pin 911 lifts it, facilitating subsequent chip removal. Of course, in other embodiments, the adsorption holes 912 and ejector pin 911 can also be arranged in other ways to accommodate different types of wafer disks 820 for chip lifting.

[0072] In this embodiment, the rework equipment also includes a chip detection module 930 for detecting the quality of new chips. This avoids replacing defective new chips with new ones that could prevent the rework from failing and improves the rework success rate. Specifically, the chip detection module 930 is located on the path of the transfer drive unit that drives the pick-up and placement head. This allows for direct chip detection and transfer via the pick-up and placement module, eliminating the need for an additional chip transfer device. This improves the efficiency and reduces the cost of the rework equipment.

[0073] The chip inspection module 930 includes: a transfer station 931, a first inspection camera 932 positioned directly above the transfer station 931, a second inspection camera 933 positioned to the side of the transfer station 931 and below the pick-up and placement head to inspect the bottom of new chips, and a waste bin 934 positioned to the side of the transfer station 931. After the pick-up and placement head picks up a chip from the carrier assembly 800, it transfers the new chip onto the transfer station 931. The first inspection camera 932 above the transfer station 931 identifies and inspects the new chip. If the chip is qualified, the pick-up and placement head moves the chip to directly above the second inspection camera 933. The second inspection camera 933 inspects the bottom of the chip, especially the electrodes on the bottom of the chip. Only chips that pass both inspections are placed onto the pads of defective chips by the pick-up and placement module, ensuring that the replaced chip is a normal and qualified chip and improving the success rate of rework. The waste bin 934 is located between the transfer station 931 and the second inspection camera 933. Chips that fail to pass inspection by the first inspection camera 932 or the second inspection camera 933 will be discarded into the waste bin 934 by the pick-up and placement head. The pick-up and placement head will then return to the material carrier assembly 800 to obtain new chips.

[0074] In this embodiment, the pick-up and placement head includes: a pick-up head 950 for transferring chips from the carrier assembly 800 to the transfer station 931, and a placement head 940 for placing chips from the transfer station 931 onto the rework products; the lifting drive includes: a pick-up lifting drive 951 for driving the pick-up head 950 to move along the Z-axis and a placement lifting drive 941 for driving the placement head 940 to move along the Z-axis; and the transfer drive can drive the pick-up head 950 and the placement head 940 to move respectively, so that the pick-up head 950 and the placement head 940 can work independently. When the placement head 940 is placing chips, the pick-up head 950 can go to the carrier assembly 800 to pick up the chips required for the next defective product, thereby improving the rework efficiency of the equipment. As a preferred embodiment, the pick-and-place assembly 900 further includes a rotary drive 942 for driving the placement head 940 to rotate. When the placement head 940 moves the chip above the second inspection camera 933 to inspect the bottom of the chip, the second inspection camera 933 also identifies the chip's angle. The rotary drive 942 rotates the placement head 940 according to the chip angle information required for the defective chip, cooperating with the second inspection camera 933 to match the chip angle on the placement head 940 with the required chip angle. This allows the placement head 940 to properly place the new chip onto the defective pad, achieving a good placement effect. Both the placement head 940 and the pick-and-place head 950 fix the chip using negative pressure adsorption. Of course, in other embodiments, the placement head 940 and the pick-and-place head 950 can also fix the chip using other methods to achieve chip pick-up, transfer, and placement.

[0075] As a preferred embodiment, chip waste components for cleaning defective chips are provided on both sides of the transfer station 931, including: a transfer air blowing component 935 and a transfer suction component 936 located on the opposite side of the transfer air blowing component 935. When the first inspection camera 932 detects that the camera on the transfer station 931 is defective or does not meet the rework requirements for defects, the transfer air blowing component 935 will blow air, generating negative pressure to suck away and remove the defective chips on the transfer station 931, quickly processing the defective chips and improving efficiency. This prevents the pick-up and placement head from continuing to place defective chips onto rework products. In this embodiment, a cleaning brush 937 is vertically arranged upwards in the waste bin 934. The cleaning brush 937 can move within the waste bin 934, and the placement head 940 can extend into the waste bin 934. The movement of the cleaning brush 937 cleans the placement head 940, ensuring good working performance of the placement head 940.

[0076] The reworked product with the new chip mounted will move under the soldering module 700 under the drive of the rework driver 210. The soldering module 700 is used to solder the mounted new chip onto the pads, ensuring that the new chip achieves good connection and fixation on the reworked product.

[0077] In this embodiment, the welding module 700 includes a welding head 710 and a welding lifting component 720. The welding lifting component 720 drives the welding head 710 to move along the Z-axis, allowing the welding head 710 to approach or move away from the rework station 200 to achieve a good welding effect on the reworked products. As a preferred embodiment, the welding head 710 is configured as an optical welding head 710. Driven by the welding lifting component 720, the welding head 710 can approach or move away from the rework station 200, and the optical range of the welding head 710 can be adjusted to match the size and type of the defect to be processed, achieving a good welding effect.

[0078] As a preferred embodiment, the positioning module 300, pad cleaning module 500, soldering module 600, mounting module, soldering module 700, and chip detection module 930 are arranged along the Y-axis in a straight line. This makes it easier and faster for the rework drive 210 to move the rework station 200 between these modules, thus realizing the product rework process and effectively improving the efficiency of product rework. Of course, in other embodiments, these modules can also be arranged along the X-axis in a straight line to achieve good rework results.

[0079] In this embodiment, the pad cleaning module 500, the soldering module 600, and the pick-and-place assembly 900 are movably mounted on the first linear module 110. The first linear module 110 can independently drive the pad cleaning module 500, the soldering module 600, and the pick-and-place assembly 900 to move on the first linear module 110, facilitating rework of each part. The first linear module 110 acts as a transfer drive to move the pick-and-place head closer to or away from the material carrier assembly 800. The positioning module 300 and the soldering module 700 are movably mounted on the second linear module 120, which is located in the upper middle part of the first linear module 110. The second linear module 120 can independently drive the pad cleaning module 500, the soldering module 600, and the pick-and-place assembly 900 to move on the second linear module 120, facilitating rework of each part. When one module is undergoing repair work, other unused modules can be moved to one side under the drive of the first linear module 110 or the second linear module 120, avoiding interference with the working module and affecting the repair effect. This reduces the space reserved in the equipment body to avoid mutual interference between modules, allowing the equipment to be designed to be smaller.

[0080] The above is only used to illustrate the technical solution of this utility model and not to limit it. Any other modifications or equivalent substitutions made by those skilled in the art to the technical solution of this utility model, as long as they do not depart from the spirit and scope of the technical solution of this utility model, should be covered within the scope of the claims of this utility model.

Claims

1. A Mini LED finished product rework equipment, comprising a frame (100), characterized in that, The frame (100) is equipped with: A rework station (200) is used to place rework products. A rework drive unit (210) is provided below the rework station (200) for driving the rework station (200) to move in the X-axis and Y-axis directions. The positioning module (300) is used to identify defects in the products being repaired on the rework station (200); The adhesive removal module (400) is used to remove glue, adhesive film, or adhesive layer from defective parts of returned products; The pad cleaning module (500) is used to clean the pads on defective parts of reworked products; Soldering module (600) is used to apply solder to the cleaned pads; The soldering module (600) includes: a soldering head (610) and a soldering lifting component (620) for driving the soldering head (610) to move along the Z-axis direction and moving the soldering head (610) closer to or away from the reworked product; The mounting module includes: a carrier assembly (800) for holding new chips, and a pick-and-place assembly (900) for picking up the new chips from the carrier assembly (800) and mounting them onto the solder pads after soldering; and A soldering module (700) is used to solder the mounted new chip onto the pads; It also includes: a cleaning disk (630) and a cleaning drive module; A cleaning tray (630) is positioned below the solder tip (610). A receiving groove (631) is provided on the cleaning tray (630), and a cleaning cotton is placed in the receiving groove (631). The cleaning drive module is used to drive the solder tip (610) and / or the cleaning tray (630) so that the solder tip (610) is inserted into the cleaning cotton to clean the solder tip (610).

2. The Mini LED finished product repair equipment according to claim 1, characterized in that, The positioning module (300) includes: an identification and positioning camera (310) and a height measurement component; The identification and positioning camera (310) is used to identify and locate defects in the rework products on the rework station (200); the height measuring component includes: a height measuring probe (320), and a height measuring lifting component (330) for driving the height measuring probe (320) to move on the Z-axis so that the height measuring probe (320) can touch the rework products on the rework station (200) to measure the height of defects.

3. The Mini LED finished product repair equipment according to claim 1, characterized in that, The adhesive removal module (400) includes: an adhesive removal head (410), an adhesive removal lifting component (420) for driving the adhesive removal head (410) to move along the Z-axis direction, and an adhesive removal blowing component (430) disposed on the side of the adhesive removal head (410) facing the rework product for cleaning adhesive removal residue. The pad cleaning module (500) includes: a pad cleaning head (510), a cleaning lifting component (550) for driving the pad cleaning head (510) to move along the Z-axis direction so that the pad cleaning head (510) can contact the reworked product to achieve cleaning, and a pad blowing component disposed on the side of the pad cleaning head (510) to clean the residue on the pad.

4. The Mini LED finished product repair equipment according to claim 1, characterized in that, The welding module (700) includes a welding head (710) and a welding lifting component (720) for driving the welding head (710) to move along the Z-axis direction and moving the welding head (710) closer to or away from the product to be repaired.

5. The Mini LED finished product repair equipment according to claim 1, characterized in that, The loading assembly (800) includes: a loading turntable (810), a turntable drive assembly, a plurality of wafer disks (820), and a chip recognition camera (830); each wafer disk (820) is arranged circumferentially along the loading turntable (810); the chip recognition camera (830) is located above the loading turntable (810); the turntable drive assembly includes: a turntable rotation drive (840) for driving the loading turntable (810) to rotate, and a turntable movement drive (850) for driving the loading turntable (810) to move in the X-axis and Y-axis directions; the chip recognition camera (830) cooperates with the turntable drive assembly to move a new chip required from one of the wafer disks (820) directly below the chip recognition camera (830); The pick-and-place assembly (900) includes: an adsorption head (910) located directly below the chip recognition camera (830) and below the material carrier turntable (810) for adsorbing the wafer disk (820); an adsorption lifting member (920) for driving the adsorption head (910) to move along the Z-axis and bring the adsorption head (910) closer to the wafer disk (820); a ejector pin (911) disposed inside the adsorption head (910) and protruding upward to lift the new chip on the wafer disk (820); a pick-and-place head disposed on the upper side of the material carrier turntable (810); a transfer drive member for driving the pick-and-place head closer to or away from the material carrier assembly (800); and a lifting drive member for driving the pick-and-place head to move along the Z-axis and bring the pick-and-place head closer to or away from the rework station (200) or the wafer disk (820).

6. The Mini LED finished product repair equipment according to claim 5, characterized in that, It also includes: a chip detection module (930) located on the path of the transfer drive unit driving the pick-up and placement head to move, for detecting the quality of new chips; The chip detection module (930) includes: a transfer station (931), a first detection camera (932) disposed directly above the transfer station (931), a second detection camera (933) disposed beside the transfer station (931) and below the pick-up and placement head to detect the bottom of the new chip, and a waste bin (934) disposed beside the transfer station (931).

7. The Mini LED finished product repair equipment according to claim 6, characterized in that, The pick-up and placement head includes: a pick-up head (950) for transferring new chips from the carrier assembly (800) to the transfer station (931) and a placement head (940) for placing new chips from the transfer station (931) onto rework products; the lifting drive includes: a pick-up lifting drive (951) for driving the pick-up head (950) to move along the Z-axis and a placement lifting drive (941) for driving the placement head (940) to move along the Z-axis; the pick-up and placement assembly (900) further includes: a rotation drive (942) for driving the placement head (940) to rotate to correct the angle of the new chips.

8. The Mini LED finished product repair equipment according to claim 7, characterized in that, The transfer station (931) is equipped with chip cleaning modules on both sides for cleaning up defective chips. It includes a transfer blowing component (935) and a transfer suction component (936) disposed on the opposite side of the transfer blowing component (935) to suck away and remove defective chips on the transfer table (931); A cleaning brush (937) is vertically installed inside the waste bin (934). The cleaning brush (937) can move inside the waste bin (934) to clean the mounting head (940) back and forth.

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