Lead alloy plate forming die with leveling function

By introducing a buffer spring and guide post structure into the lead alloy plate forming mold, the problem of hard contact damage during the leveling process of the mold is solved, realizing the buffer leveling and dustproof and anti-collision protection of the mold, and improving production efficiency and mold life.

CN223505957UActive Publication Date: 2025-11-04YUNNAN DAZE ELECTRODE TECH
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Patent Information

Application Number
CN202423078850.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-13
Publication Date
2025-11-04
Estimated Expiration
2034-12-13

AI Technical Summary

Technical Problem

Existing lead alloy sheet forming molds are prone to damage from hard contact during the mold closing and leveling process, and are not easy to level with internal buffers, resulting in mold deformation and increased labor costs.

Method used

A lead alloy plate forming mold with a leveling function was designed. It adopts a structure including a connecting seat, a lower pressure mold, an upper pressure mold, a leveling plate, a buffer spring, and a guide post. The elastic force of the buffer spring assists in leveling and mold separation, reducing hard contact damage. The corrugated sleeve and fixed cover provide dustproof and impact protection.

Benefits of technology

It achieves internal buffering and leveling of the mold, reducing mold deformation and labor costs, while improving the mold's service life and production efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of dies, and discloses a lead alloy plate forming die with a leveling function, which comprises a connecting seat, a lower pressing die is arranged at the top end of the connecting seat, an upper pressing die is arranged at the top end of the lower pressing die, and guide columns are vertically fixed on two sides of two ends of the bottom of the upper pressing die respectively. And a leveling structure for leveling the die is arranged between the upper pressing die and the lower pressing die. When the lead alloy plate forming mold with the leveling function is used, the leveling plate is arranged between the lower pressing mold and the upper pressing mold, in the mold pressing process between the lower pressing mold and the upper pressing mold, auxiliary leveling can be conducted on the contact face through the leveling plate, and meanwhile second buffer springs are arranged on the two sides and the two ends of the top of the leveling plate correspondingly; and through leveling treatment, the deformation condition occurring in the pressure forming machining process can be reduced, and the problem that the interior of the mold is inconvenient to buffer and level is solved.
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Description

Technical Field

[0001] This utility model relates to the field of mold technology, specifically to a lead alloy plate forming mold with a leveling function. Background Technology

[0002] Lead alloy sheet is an alloy sheet composed of lead and other metallic elements. It has high density and good corrosion resistance and is often used in applications such as radiation protection, sound insulation, and acid and alkali resistance. In the production and processing of lead alloy sheet, in order to ensure the uniformity of the processed shape and size of the lead alloy sheet, guarantee product quality, improve production efficiency, and reduce costs, lead alloy sheet forming molds are required to form and process the lead alloy sheet.

[0003] According to the heat leveling mold disclosed in patent number CN201721286694.5, by setting a first rectangular groove and a second rectangular groove and a protruding rectangular block, the contact area between the load-bearing part and the counterweight part is effectively reduced, thereby improving the flatness of the contact surface and improving the flatness of the thin plate to be leveled.

[0004] In actual operation, the mold can improve the flatness of the contact molding surface by setting concave and convex structures, which can play a leveling role. However, during the leveling process of the upper and lower molds closing, the hard contact between the upper and lower molds can easily cause certain impact damage to the mold, which is a shortcoming and makes it inconvenient to perform buffering and leveling inside the mold.

[0005] Now, a novel lead alloy plate forming mold with a leveling function is proposed to address the above-mentioned shortcomings. Utility Model Content

[0006] The purpose of this invention is to provide a lead alloy plate forming mold with a leveling function to solve the problem mentioned in the background art of inconvenience in buffering and leveling the inside of the mold.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a lead alloy plate forming mold with a leveling function, comprising a connecting seat, a lower pressing mold provided at the top of the connecting seat, and an upper pressing mold provided at the top of the lower pressing mold, guide columns being vertically fixed on both sides of the bottom of the upper pressing mold, and a leveling structure for leveling the mold being provided between the upper pressing mold and the lower pressing mold.

[0008] The leveling structure includes a leveling plate, guide rods, buffer spring one, buffer spring two, sliding sleeves, and guide holes. A leveling plate is provided between the lower and upper pressure molds, and sliding sleeves are fixed to both sides of the top of the leveling plate. Buffer spring one is fixed to both sides of the top of the leveling plate, and buffer spring two is fixed to both sides of the top of the leveling plate. Guide rods are fixed to the four corners of the top of the leveling plate, and guide holes are opened inside the four corners of the bottom of the upper pressure mold.

[0009] As a further technical solution of this utility model, the sliding sleeve penetrates the interior of the calibration plate, and the guide post penetrates the interior of the sliding sleeve.

[0010] As a further technical solution of this utility model, the top ends of the first buffer spring and the second buffer spring are fixedly connected to the bottom end of the upper pressure mold, and the second buffer spring is provided in three sets at equal intervals at both ends of the top of the calibration plate.

[0011] As a further technical solution of this utility model, through holes are respectively opened on both sides of the bottom end of the lower die, the bottom end of the guide post penetrates the interior of the through holes, mounting grooves are respectively provided on both sides of the top end of the lower die, a corrugated sleeve is sleeved on the outer side of the guide post, and a fixing ring is fixed at the bottom end of the corrugated sleeve. Inner holes are respectively opened on both sides and both ends of the top of the fixing ring, and mounting bolts are provided inside the inner holes. Threaded holes are respectively opened on both sides and both ends of the bottom of the mounting groove, and the guide post penetrates the interior of the fixing ring.

[0012] As a further technical solution of this utility model, the bottom end of the mounting bolt penetrates the interior of the inner hole and is threadedly connected to the threaded hole.

[0013] As a further technical solution of this utility model, a fixing cover is provided at the bottom of the upper mold, and an insertion hole is opened in the interior of the four corners of the top of the fixing cover, and a fixing bolt is provided in the interior of the insertion hole. A screw hole is opened in the interior of the four corners of the top of the upper mold.

[0014] As a further technical solution of this utility model, the bottom end of the fixing bolt passes through the interior of the insertion hole and is threadedly connected to the screw hole.

[0015] As a further technical solution of this utility model, the bottom end of the guide post is fixedly connected to the top end of the connecting seat, and a base plate is fixed to the bottom end of the connecting seat.

[0016] Compared with the prior art, the beneficial effects of this utility model are: the lead alloy plate forming mold with leveling function not only facilitates the buffering and leveling of the mold interior, facilitates dust prevention on the outside of the internal guide components of the forming mold, but also facilitates auxiliary protection on the outside of the forming mold.

[0017] By using a forming mold with a connecting seat, lower die, leveling plate, guide rod, buffer spring one, upper die, buffer spring two, guide post, sliding sleeve, and guide hole, a leveling plate is set between the lower die and the upper die during the forming process of lead alloy plate. During the pressing process between the lower die and the upper die, the leveling plate can be used to assist in leveling the contact surface. At the same time, buffer spring two is set on both sides and both ends of the top of the leveling plate, which can play a role in buffering and leveling. The leveling process can reduce the deformation that occurs during the pressure forming process and assist in leveling the stamping surface of the die plate. Through the downward tension of buffer spring one and buffer spring two, the die plate is pressed. During the demolding process, it can greatly avoid the deformation of the plate surface caused by the stamping pin pulling the plate surface when the upper and lower dies are separated in traditional stamping, which causes secondary shaping labor costs. At the same time, the elasticity of buffer spring one and buffer spring two can help the upper and lower dies separate.

[0018] The forming mold is equipped with guide posts, corrugated sleeves, mounting grooves, retaining rings, threaded holes, mounting bolts, and inner holes. When the mold is in use, a corrugated sleeve is set on the outside of the inner guide post. The corrugated sleeve can be used to provide an auxiliary outer cover to seal the outside of the guide post, reducing the adhesion of dust on the outside of the guide post and preventing external obstruction during the guiding process.

[0019] With an upper mold, a fixing cover, fixing bolts, insertion holes, and screw holes, the molding die is installed and used with a fixing cover fixed at the top of the upper mold using fixing bolts. The fixing cover can protect the outside of the molding die assembly from impact and reduce structural damage to the outside of the molding die. Attached Figure Description

[0020] Figure 1 This is a frontal cross-sectional view of the present invention.

[0021] Figure 2 This is a top view schematic diagram of the alignment plate structure of this utility model;

[0022] Figure 3 This is a partial sectional view of the side of the calibration plate of this utility model;

[0023] Figure 4 This is a front view structural diagram of the corrugated sleeve of this utility model;

[0024] Figure 5 This is a top view of the fixing ring structure of this utility model;

[0025] Figure 6 This utility model Figure 1 A magnified structural diagram at point A in the diagram.

[0026] In the diagram: 1. Connecting seat; 2. Lower pressing mold; 3. Alignment plate; 4. Guide rod; 5. Buffer spring one; 6. Upper pressing mold; 7. Buffer spring two; 8. Guide post; 9. Sliding sleeve; 10. Guide hole; 11. Corrugated sleeve; 12. Through hole; 13. Base plate; 14. Mounting groove; 15. Fixing ring; 16. Threaded hole; 17. Mounting bolt; 18. Inner hole; 19. Fixing cover; 20. Fixing bolt; 21. Insertion hole; 22. Screw hole. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Please see Figure 1-6 This utility model provides an embodiment: a lead alloy plate forming mold with a leveling function, including a connecting seat 1, a lower pressing mold 2 is provided at the top of the connecting seat 1, and an upper pressing mold 6 is provided at the top of the lower pressing mold 2. Guide columns 8 are vertically fixed on both sides of the bottom ends of the upper pressing mold 6, and a leveling structure for leveling the mold is provided between the upper pressing mold 6 and the lower pressing mold 2.

[0029] The leveling structure includes a leveling plate 3, a guide rod 4, a buffer spring 5, a buffer spring 7, a sliding sleeve 9, and a guide hole 10. The leveling plate 3 is set between the lower pressure mold 2 and the upper pressure mold 6. Sliding sleeves 9 are fixed to both sides of the top of the leveling plate 3. Buffer springs 5 ​​and 7 are fixed to both sides of the top of the leveling plate 3. Guide rods 4 are fixed to the four corners of the top of the leveling plate 3. Guide holes 10 are opened in the interior of the four corners of the bottom of the upper pressure mold 6. The sliding sleeve 9 penetrates the interior of the leveling plate 3. The guide post 8 penetrates the interior of the sliding sleeve 9. The tops of the buffer springs 5 ​​and 7 are fixedly connected to the bottom of the upper pressure mold 6. Three sets of buffer springs 7 are equally spaced at both ends of the top of the leveling plate 3.

[0030] Specifically, such as Figures 1-3As shown, a leveling plate 3 is provided between the lower die 2 and the upper die 6. During the pressing process between the lower die 2 and the upper die 6, the leveling plate 3 can be used to assist in leveling the contact surface. At the same time, buffer springs 7 are provided on both sides and both ends of the top of the leveling plate 3, which can play a role in buffering and leveling, reducing collision damage. The leveling process can reduce the deformation that occurs during the pressure forming process and assist in leveling the stamping surface of the die plate. Through the downward tension of the buffer springs 5 ​​and 7, the die plate is pressed. During the demolding process, the deformation of the plate surface caused by the stamping pin pulling the plate surface during the separation of the upper and lower dies in traditional stamping can be greatly avoided, resulting in the labor cost of secondary shaping. At the same time, the elasticity of the buffer springs 5 ​​and 7 can help the upper and lower dies to separate.

[0031] The bottom of the lower die 2 has through holes 12 on both sides. The bottom end of the guide post 8 passes through the interior of the through hole 12. The top of the lower die 2 has mounting grooves 14 on both sides. The outer side of the guide post 8 is fitted with a corrugated sleeve 11, and the bottom end of the corrugated sleeve 11 is fixed with a fixing ring 15. The top sides and ends of the fixing ring 15 have inner holes 18, and the interior of the inner holes 18 is fitted with mounting bolts 17. The bottom sides and ends of the mounting groove 14 have threaded holes 16. The guide post 8 passes through the interior of the fixing ring 15, and the bottom end of the mounting bolt 17 passes through the interior of the inner hole 18 and is threadedly connected to the threaded hole 16.

[0032] Specifically, such as Figure 1 , Figure 4 and Figure 5 As shown, a corrugated sleeve 11 is provided on the outside of the inner guide post 8. The corrugated sleeve 11 can be used to provide an auxiliary outer cover to seal and prevent dust from the outside of the guide post 8, thereby reducing the adhesion of dust on the outside of the guide post 8.

[0033] A fixing cover 19 is provided at the bottom of the upper mold 6. An insertion hole 21 is provided inside the four corners of the top of the fixing cover 19. A fixing bolt 20 is provided inside the insertion hole 21. A screw hole 22 is provided inside the four corners of the top of the upper mold 6. The bottom end of the fixing bolt 20 passes through the inside of the insertion hole 21 and is threadedly connected to the screw hole 22.

[0034] Specifically, such as Figure 1 and Figure 6 As shown, a fixing cover 19 is installed and fixed at the top of the upper mold 6 using fixing bolts 20. The fixing cover 19 can provide anti-collision protection for the outside of the molding module assembly.

[0035] The bottom end of the guide post 8 is fixedly connected to the top end of the connecting seat 1, and the bottom end of the connecting seat 1 is fixed with a base plate 13.

[0036] Working Principle: In the use of this lead alloy plate forming mold with a leveling function, a leveling plate 3 is provided between the lower die 2 and the upper die 6. During the pressing process between the lower die 2 and the upper die 6, the leveling plate 3 assists in leveling the contact surface. Simultaneously, buffer springs 7 are provided on both sides and at both ends of the top of the leveling plate 3, which can buffer and level the surface of the mold plate. Through the downward tension of the buffer springs 5 ​​and 7, the mold plate surface is pressed down. During demolding, this greatly avoids the separation of the upper and lower dies in traditional stamping processes. When the stamping pin pulls on the plate surface, causing deformation, it results in the labor cost of secondary reshaping. At the same time, the elasticity of buffer spring 5 and buffer spring 7 can help the upper and lower dies separate. When the forming die is in use, a corrugated sleeve 11 is provided on the outside of the internal guide post 8. The corrugated sleeve 11 can be used to provide auxiliary outer cover sealing and dust prevention for the outside of the guide post 8. When the forming die is installed and used, a fixing cover 19 is installed and fixed on the top of the upper die 6 using fixing bolts 20. The fixing cover 19 can provide anti-collision protection for the outside of the forming die assembly.

[0037] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A lead alloy plate forming mold with a leveling function, comprising a connecting seat (1), characterized in that: The top of the connecting seat (1) is provided with a lower pressing mold (2), and the top of the lower pressing mold (2) is provided with an upper pressing mold (6). Guide columns (8) are vertically fixed on both sides of the bottom ends of the upper pressing mold (6). A leveling structure for leveling the mold is provided between the upper pressing mold (6) and the lower pressing mold (2). The leveling structure includes a leveling plate (3), a guide rod (4), a buffer spring one (5), a buffer spring two (7), a sliding sleeve (9), and a guide hole (10). The leveling plate (3) is provided between the lower pressing mold (2) and the upper pressing mold (6). Sliding sleeves (9) are fixed on both sides of the top of the leveling plate (3). Buffer spring one (5) is fixed on both sides of the top of the leveling plate (3). Buffer spring two (7) is fixed on both sides of the top of the leveling plate (3). Guide rods (4) are fixed at the four corners of the top of the leveling plate (3). Guide holes (10) are opened inside the four corners of the bottom of the upper pressing mold (6).

2. The lead alloy plate forming mold with leveling function according to claim 1, characterized in that: The sliding sleeve (9) penetrates the interior of the calibration plate (3), and the guide post (8) penetrates the interior of the sliding sleeve (9).

3. The lead alloy plate forming mold with leveling function according to claim 1, characterized in that: The top ends of the first buffer spring (5) and the second buffer spring (7) are fixedly connected to the bottom end of the upper pressure mold (6), and the second buffer spring (7) is provided in three sets at equal intervals at both ends of the top of the calibration plate (3).

4. The lead alloy plate forming mold with leveling function according to claim 1, characterized in that: The bottom of the lower die (2) has through holes (12) on both sides. The bottom end of the guide post (8) passes through the inside of the through hole (12). The top of the lower die (2) has mounting grooves (14) on both sides. The outer side of the guide post (8) is fitted with a corrugated sleeve (11), and the bottom end of the corrugated sleeve (11) is fixed with a fixing ring (15). The top of the fixing ring (15) has inner holes (18) on both sides and both ends, and mounting bolts (17) are installed inside the inner holes (18). The bottom of the mounting groove (14) has threaded holes (16) on both sides and both ends. The guide post (8) passes through the inside of the fixing ring (15).

5. A lead alloy plate forming mold with a leveling function according to claim 4, characterized in that: The bottom end of the mounting bolt (17) passes through the interior of the inner hole (18) and is threadedly connected to the threaded hole (16).

6. A lead alloy plate forming mold with a leveling function according to claim 1, characterized in that: The upper mold (6) is provided with a fixed cover (19) at the bottom of the outside, and the fixed cover (19) has four corners at the top of the top of the four corners with insertion holes (21) respectively, and the insertion holes (21) are provided with fixing bolts (20), and the upper mold (6) has four corners at the top of the four corners with screw holes (22) respectively.

7. A lead alloy plate forming mold with a leveling function according to claim 6, characterized in that: The bottom end of the fixing bolt (20) passes through the interior of the insertion hole (21) and is threadedly connected to the screw hole (22).

8. A lead alloy plate forming mold with a leveling function according to claim 1, characterized in that: The bottom end of the guide post (8) is fixedly connected to the top end of the connecting seat (1), and the bottom end of the connecting seat (1) is fixed with a base plate (13).

Citation Information

Patent Citations

  • Heat levelling mould

    CN207414061U