Circuit board polishing device and production line

Abstract

The utility model discloses a circuit board polishing device and a production line, and belongs to the technical field of circuit board production equipment.The circuit board polishing device comprises a surface polishing mechanism, a clamping mechanism, an edge polishing mechanism and a conveying mechanism, the surface polishing mechanism comprises a first rotating driver, a polishing belt and a plurality of belt wheels, the polishing belt is wound among the belt wheels, and the edge polishing mechanism is arranged between the belt wheels; the first rotary driver is used for driving the plurality of belt wheels to rotate; the clamping mechanism comprises a first clamping assembly and a second clamping assembly, the first clamping assembly is configured to clamp two side edges of the circuit board, and the second clamping assembly is configured to clamp the other two side edges of the circuit board; the edge grinding mechanism comprises a first edge grinding assembly and a second edge grinding assembly, the first edge grinding assembly is configured to grind two side edges of the circuit board, and the second edge grinding assembly is configured to grind the other two side edges of the circuit board; and the conveying mechanism is used for driving the clamping mechanism to pass through the surface grinding mechanism and the edge grinding mechanism to grind the surface and the side edges of the circuit board.

Description

Technical Field

[0001] This utility model relates to the field of circuit board production equipment technology, and in particular to circuit board grinding device and production line. Background Technology

[0002] Circuit board polishing equipment is commonly used to polish the surface or edges of circuit boards to remove surface oxide layers, cut burrs, etc.

[0003] In related technologies, surface grinding and side grinding of circuit boards usually require multiple sets of equipment to complete. The circuit boards are transferred between different equipment, resulting in low grinding efficiency, which is not conducive to improving the production efficiency of circuit boards. Utility Model Content

[0004] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a circuit board polishing device capable of polishing the surface and sides of circuit boards, which helps to improve polishing efficiency and circuit board production efficiency.

[0005] This utility model also proposes a production line.

[0006] According to a first aspect of the present invention, a circuit board polishing apparatus includes: a surface polishing mechanism, comprising a first rotary driver, a polishing belt, and a plurality of pulleys, the polishing belt being wound around the plurality of pulleys and the lower end of the polishing belt being horizontally arranged, the first rotary driver being configured to drive the plurality of pulleys to rotate; a clamping mechanism, comprising a first clamping component and a second clamping component, the first clamping component being configured to clamp two of the back sides of the circuit board, and the second clamping component being configured to clamp the other two back sides of the circuit board; an edge grinding mechanism, comprising a first edge grinding component and a second edge grinding component, the first edge grinding component being configured to grind two of the back sides of the circuit board, and the second edge grinding component being configured to grind the other two back sides of the circuit board; and a conveying mechanism configured to drive the clamping mechanism to pass sequentially through the surface polishing mechanism and the edge grinding mechanism.

[0007] The circuit board polishing device according to the embodiment of this utility model has at least the following beneficial effects: the clamping mechanism includes a first clamping component and a second clamping component, which can clamp the circuit board; the conveying mechanism is configured to drive the clamping mechanism to pass sequentially through the surface polishing mechanism and the edge polishing mechanism; when the clamping mechanism moves to the surface polishing mechanism, the first rotary driver can drive one of the pulleys to rotate; since the polishing belt is wound between multiple pulleys to drive the polishing belt to rotate, the lower end of the polishing belt is horizontally arranged so that the polishing belt can abut against the surface of the circuit board; and through the polishing belt... The device rotates to achieve large-area grinding of the circuit board surface. When the clamping mechanism moves to the edge grinding mechanism, the first clamping component and the second clamping component alternately clamp the circuit board. The first edge grinding component and the second edge grinding component alternately grind the sides of the circuit board, thereby achieving grinding of all four sides of the circuit board without having to disassemble the clamping mechanism and the circuit board multiple times, thus improving grinding efficiency. This circuit board grinding device can sequentially grind the surface and sides of the circuit board without changing multiple sets of equipment or disassembling the circuit board and the clamping mechanism multiple times, which helps to improve the grinding efficiency and production efficiency of the circuit board.

[0008] According to some embodiments of the present invention, the surface polishing mechanism further includes a reciprocating drive, wherein two pulleys are lower wheels, the polishing belt passes over the lower ends of the two lower wheels, and the reciprocating drive is connected to the two lower wheels to drive the lower wheels to rise and fall.

[0009] Specifically, the surface polishing mechanism also includes a reciprocating drive, wherein two pulleys are lower pulleys, and the polishing belt passes over the lower ends of the two lower pulleys so that the lower end of the polishing belt is horizontally positioned. The reciprocating drive is connected to the two lower pulleys to drive the lower pulleys to rise and fall, thereby causing the lower end of the polishing belt to tilt upwards or downwards. When the reciprocating drive drives one of the lower pulleys to move upwards, the side of the polishing belt closest to that lower pulley tilts upwards. With the conveying action of the conveying mechanism, the circuit board can be inserted under the polishing belt from the side of the polishing belt that is tilted upwards. When the reciprocating drive drives the lower pulley that has moved upwards to return to its original position, the lower end of the polishing belt is horizontally positioned, and the lower end of the polishing belt abuts against the circuit board. Next, in conjunction with the first rotary driver, the pulley is driven to rotate, causing the polishing belt to rotate relative to the circuit board, thereby polishing the surface of the circuit board. After the surface of the circuit board is polished, the reciprocating driver can drive another lower wheel to move upward, causing the side of the polishing belt near the lower wheel to tilt upward. With the conveying action of the conveying mechanism, the circuit board can pass through the underside of the polishing belt from the side that tilts upward. That is, the circuit board polishing device, through the cooperation of the reciprocating driver and the lower wheel, facilitates the contact or separation of the circuit board and the polishing belt, which helps to avoid the problem of the circuit board colliding with the lower wheel during transport and ensures the polishing effect of the polishing belt and the circuit board.

[0010] According to some embodiments of the present invention, the surface polishing mechanism further includes a stand, and the reciprocating drive includes two cylinders. The pulley and the cylinders are both connected to the stand, and the cylinders are connected to the lower wheel for transmission to drive the lower wheel to rise and fall.

[0011] Specifically, the surface polishing mechanism also includes a stand, and the reciprocating drive includes two cylinders. The cylinders and multiple pulleys are all connected to the stand. The cylinders are connected to the lower wheel drive, and the cylinders and the lower wheel are set one-to-one to drive the lower wheel to rise and fall. With the polishing belt passing around the lower wheel, the two sides of the lower end of the polishing belt can be tilted upward or downward. With the conveying action of the conveying mechanism, the circuit board can be connected or separated from the polishing belt.

[0012] According to some embodiments of the present invention, the surface polishing mechanism further includes a multi-directional drive, which is connected to at least one pulley to drive the pulley to move along multiple mutually perpendicular axes.

[0013] Considering the potential for belt misalignment, the surface polishing mechanism also includes a multi-directional drive connected to at least one pulley to drive the pulley to move along multiple mutually perpendicular axes. By moving the pulley, the rotation path of the polishing belt is adjusted so that the misaligned polishing belt is adjusted to the preset path, thereby achieving the function of correcting the belt misalignment.

[0014] According to some embodiments of the present invention, the circuit board polishing device further includes a lifting mechanism, the upper end and the lower end of which are connected to the clamping mechanism and the conveying mechanism, respectively, and the lifting mechanism is used to drive the clamping mechanism to move up and down.

[0015] Optionally, the circuit board polishing device also includes a lifting mechanism. The lower end of the lifting mechanism is connected to a conveying mechanism, which provides support for the lifting mechanism. The upper end of the lifting mechanism is connected to a clamping mechanism to drive the lifting mechanism to move up and down. When the conveying mechanism drives the clamping mechanism to move to the lower end of the polishing belt, the lifting mechanism can drive the clamping mechanism to move upward so that the circuit board clamped in the clamping mechanism is connected to the lower end of the polishing belt. With the rotation of the polishing belt, the polishing belt polishes the surface of the circuit board. After the surface of the circuit board is polished, the lifting mechanism can drive the clamping mechanism to move downward so that the circuit board clamped in the clamping mechanism is separated from the lower end of the polishing belt. With the conveying action of the conveying mechanism, the circuit board after surface polishing is moved to the edge grinding mechanism.

[0016] According to some embodiments of the present invention, both the first clamping assembly and the second clamping assembly include a jaw and an opening / closing driver, wherein the opening / closing driver is connected to the jaw to drive the jaw to open and close.

[0017] Optionally, both the first clamping assembly and the second clamping assembly include a jaw and an opening / closing driver. The opening / closing driver is connected to the jaw to drive the jaw to open and close. When the opening / closing driver drives the jaw to open, the circuit board can be placed at the opening of the jaw. The opening / closing driver can also drive the jaw to close, so that the jaw abuts against two of the back sides of the circuit board, thereby clamping the circuit board.

[0018] According to some embodiments of the present invention, both the first edge grinding assembly and the second edge grinding assembly include a lifting component, a transverse component, a rotating component, and two edge grinding wheels. The lifting component is used to drive the transverse component to rise and fall, the transverse component is used to drive the two edge grinding wheels to move closer or further apart, and the rotating component is used to drive the edge grinding wheels to rotate.

[0019] Both the first and second edge-grinding assemblies include a lifting component, a traversing component, a rotating component, and two edge-grinding wheels. The lifting component is connected to the traversing component, which drives the traversing component to rise and fall, so that the edge-grinding wheels are at the same height as the side of the circuit board. The traversing component drives the two edge-grinding wheels to move closer together, so that the two edge-grinding wheels abut against two of the opposite sides of the circuit board. The rotating component drives the edge-grinding wheels to rotate, so that the edge-grinding wheels grind the side of the circuit board. After the side of the circuit board is ground, the traversing component drives the two edge-grinding wheels to move away from each other, so that the edge-grinding wheels separate from the side of the circuit board. The lifting component drives the traversing component to move upward, so as to avoid the edge-grinding wheels obstructing the transfer of the circuit board. Through the alternating cooperation of the first and second edge-grinding assemblies, and the alternating cooperation of the first and second clamping components, the four sides of the circuit board can be ground without changing multiple sets of equipment or repeatedly disassembling the circuit board and clamping mechanism, which helps to improve the grinding efficiency and production efficiency of the circuit board.

[0020] According to some embodiments of the present invention, the circumferential surface of the grinding wheel is provided with an annular groove.

[0021] Considering that the side of the circuit board may bend under pressure when the grinding wheel grinds the side of the circuit board, which is not conducive to improving the production quality of the circuit board, the grinding wheel has an annular groove on its circumference. Under the driving action of the transverse component, the side of the circuit board is embedded in the annular groove for grinding. The contact between the annular groove and the side plate of the circuit board restricts the bending of the side of the circuit board, which is beneficial to improving the production quality of the circuit board.

[0022] According to some embodiments of the present invention, the circuit board polishing device further includes a cleaning roller and a second rotary driver. The second rotary driver is connected to the cleaning roller to drive the cleaning roller to rotate. The conveying mechanism can sequentially convey the clamping mechanism to the surface polishing mechanism and the cleaning roller.

[0023] Considering that the surface of the circuit board will have debris after polishing, which will affect the subsequent etching process, the circuit board polishing device also includes a cleaning roller and a second rotary driver. The conveying mechanism can sequentially move the clamping mechanism to the surface polishing mechanism and the cleaning roller. That is, after the surface of the circuit board is polished, it can be moved to the cleaning roller. The cleaning roller can come into contact with the surface of the circuit board. The second rotary driver is connected to the cleaning roller to drive the cleaning roller to rotate, thereby cleaning the surface of the circuit board and making the surface of the circuit board cleaner.

[0024] The production line according to a second aspect of the present invention includes the circuit board polishing apparatus shown in the first aspect.

[0025] The production line according to the embodiments of the present invention has at least the following beneficial effects: the production line includes the circuit board polishing device shown in the first aspect, the clamping mechanism includes a first clamping component and a second clamping component, the first clamping component or the second clamping component can clamp the circuit board, the conveying mechanism is configured to drive the clamping mechanism to pass sequentially through the surface polishing mechanism and the edge polishing mechanism, when the clamping mechanism moves to the surface polishing mechanism, the first rotary driver can drive one of the pulleys to rotate, since the polishing belt is wound between multiple pulleys to drive the polishing belt to rotate, the lower end of the polishing belt is horizontally arranged so that the polishing belt can abut against the surface of the circuit board. Next, the rotating grinding belt enables large-area grinding of the circuit board surface. When the clamping mechanism moves to the edge grinding mechanism, the first clamping component and the second clamping component alternately clamp the circuit board, and the first edge grinding component and the second edge grinding component alternately grind the sides of the circuit board, thereby achieving grinding of all four sides of the circuit board without having to disassemble the clamping mechanism and the circuit board multiple times, thus improving grinding efficiency. This circuit board grinding device can sequentially grind the surface and sides of the circuit board without changing multiple sets of equipment or disassembling the circuit board and the clamping mechanism multiple times, which is beneficial to improving the grinding efficiency and production efficiency of the circuit board.

[0026] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0027] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0028] Figure 1 This is a schematic diagram of the structure of a circuit board polishing device according to an embodiment of the present invention;

[0029] Figure 2 This is a frontal structural diagram of a circuit board polishing device according to an embodiment of the present invention;

[0030] Figure 3This is a side view of the circuit board polishing device according to an embodiment of the present invention.

[0031] Figure 4 This is a partial structural schematic diagram of the clamping mechanism of a circuit board polishing device according to an embodiment of the present invention.

[0032] Icon labels:

[0033] 100. Surface polishing mechanism; 110. Pulley; 120. Polishing belt; 130. Lower wheel; 140. Reciprocating drive; 150. Frame;

[0034] 200, clamping mechanism; 210, first clamping assembly; 220, second clamping assembly; 230, gripper; 231, first clamping block; 232, second clamping block; 240, opening and closing actuator;

[0035] 300. Edge grinding mechanism; 310. First edge grinding assembly; 320. Second edge grinding assembly; 330. Lifting component; 340. Lateral movement component; 350. Rotating component; 360. Edge grinding wheel;

[0036] 400. Conveying mechanism. Detailed Implementation

[0037] The embodiments of this utility model are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0038] In the description of this utility model, it should be understood that the orientation descriptions, such as up, down, etc., are based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0039] In the description of this utility model, "multiple" refers to two or more. The use of "first" and "second" is for distinguishing technical features only and should not be construed as indicating or implying relative importance, or implicitly indicating the number of technical features or their sequential relationship.

[0040] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0041] Reference Figures 1 to 4 As shown, a circuit board polishing device according to an embodiment of the present invention includes: a surface polishing mechanism 100, a clamping mechanism 200, an edge polishing mechanism 300, and a conveying mechanism 400.

[0042] Reference Figure 1 , Figure 2 and Figure 3 As shown, the surface polishing mechanism 100 includes a first rotary driver, a stand 150, a polishing belt 120, and four pulleys 110. All four pulleys 110 are rotatably connected to the stand 150. The polishing belt 120 is wound around the four pulleys 110. The first rotary driver is drively connected to at least one of the pulleys 110 to rotate the polishing belt 120. The lower end of the polishing belt 120 is horizontally positioned to polish the surface of the circuit board.

[0043] Reference Figure 1 , Figure 2 and Figure 4 As shown, the clamping mechanism 200 includes a first clamping component 210 and a second clamping component 220. The first clamping component 210 is configured to clamp two of the back sides of the circuit board, and the second clamping component 220 is configured to clamp the other two back sides of the circuit board, so as to realize the clamping of the circuit board with the clamping mechanism 200.

[0044] Reference Figure 1 , Figure 2 and Figure 3 As shown, the edge grinding mechanism 300 includes a first edge grinding component 310 and a second edge grinding component 320. The first edge grinding component 310 is configured to grind two of the back sides of the circuit board, and the second edge grinding component 320 is configured to grind the other two back sides of the circuit board.

[0045] Reference Figure 1 , Figure 2 and Figure 3 As shown, the conveying mechanism 400 is configured to drive the clamping mechanism 200 to pass sequentially through the surface polishing mechanism 100 and the edge grinding mechanism 300. When the clamping mechanism 200 moves to the surface polishing mechanism 100, the first rotary driver can drive one of the pulleys 110 to rotate. Since the polishing belt 120 is wound between multiple pulleys 110, the polishing belt 120 is driven to rotate. The lower end of the polishing belt 120 is set horizontally so that the polishing belt 120 can abut against the surface of the circuit board. Through the rotation of the polishing belt 120, a large area of ​​polishing of the surface of the circuit board can be achieved.

[0046] Reference Figure 1 , Figure 2 and Figure 3As shown, when the clamping mechanism 200 moves to the edge grinding mechanism 300, the first clamping component 210 and the second clamping component 220 alternately clamp the circuit board, and the first edge grinding component 310 and the second edge grinding component 320 alternately grind the sides of the circuit board, thereby achieving grinding of all four sides of the circuit board without having to disassemble the clamping mechanism 200 and the circuit board multiple times, thus improving grinding efficiency. This circuit board grinding device can sequentially grind the surface and sides of the circuit board without changing multiple sets of equipment or disassembling the circuit board and the clamping mechanism 200 multiple times, which is beneficial to improving the grinding efficiency and production efficiency of the circuit board.

[0047] It should be noted that the conveying mechanism 400 can be a belt conveyor mechanism, and the clamping mechanism 200 can be fixedly connected to the upper belt of the belt conveyor mechanism.

[0048] Reference Figure 1 , Figure 2 and Figure 4 As shown, it can be understood that both the first clamping assembly 210 and the second clamping assembly 220 include grippers 230 and an opening / closing driver 240. The opening / closing driver 240 is connected to the grippers 230 to drive the grippers 230 to open and close. When the opening / closing driver 240 drives the grippers 230 to open, the circuit board can be placed in the opening of the grippers 230. The opening / closing driver 240 can also drive the grippers 230 to close, so that the grippers 230 abut against two of the back sides of the circuit board, thereby clamping the circuit board.

[0049] Reference Figure 1 , Figure 2 and Figure 4 As shown, the four sides of the circuit board are named the first side, the second side, the third side, and the fourth side, respectively. The first clamping component 210 is used to clamp the first side and the third side, and the second clamping component 220 is used to clamp the second side and the fourth side.

[0050] Reference Figure 1 , Figure 2 and Figure 4 As shown, when the first clamping component 210 clamps the first and third sides, the second clamping component 220 separates from the second and fourth sides, exposing the second and fourth sides. At this time, the second edge-grinding component 320 can then grind the second and fourth sides of the circuit board. Similarly, when the second clamping component 220 clamps the second and fourth sides, the first clamping component 210 separates from the first and third sides, exposing the first and third sides. At this time, the first edge-grinding component 310 can then grind the first and third sides of the circuit board.

[0051] Reference Figure 1 , Figure 2 and Figure 4As shown, the circuit board polishing device alternately clamps the circuit board with the first clamping component 210 and the second clamping component 220, and alternately polishes the sides of the circuit board with the first edge polishing component 310 and the second edge polishing component 320, thereby enabling polishing of all four sides of the circuit board without having to disassemble the clamping mechanism 200 and the circuit board multiple times, thus improving polishing efficiency.

[0052] Reference Figure 1 , Figure 2 and Figure 4 As shown, it should be noted that the gripper 230 includes a first gripper 231 and a second gripper 232 that can slide relative to each other. The opening and closing actuator 240 can be an electric push rod, a pneumatic push rod, an electric push rod, etc. The opening and closing actuator 240 can move closer to or further away from the first gripper 231 or the second gripper 232 to drive the first gripper 231 and the second gripper 232 to close or open with each other.

[0053] It should be understood that in some other embodiments, the first clamping assembly 210 and the second clamping assembly 220 both include two clamping members disposed opposite to each other. The clamping member includes a clamping block, a lead screw and a fixing block. The fixing block is provided with a screw hole, the lead screw is threadedly connected to the screw hole and connected to the clamping block. By screwing the lead screw into the screw hole, the clamping block can be driven to move closer or further away from the other clamping block, so as to clamp the circuit board placed between the two clamping blocks.

[0054] Reference Figure 1 , Figure 2 and Figure 3 As shown, it can be understood that in this embodiment, both the first edge grinding assembly 310 and the second edge grinding assembly 320 include a lifting member 330, a transverse member 340, a rotating member 350, and two edge grinding wheels 360. The lifting member 330 is used to drive the transverse member 340 to rise and fall, the transverse member 340 is used to drive the two edge grinding wheels 360 to move closer or further apart, and the rotating member 350 is used to drive the edge grinding wheels 360 to rotate.

[0055] Reference Figure 1 , Figure 2 and Figure 3 As shown, the lifting member 330 is connected to the transverse member 340. The lifting member 330 can drive the transverse member 340 to rise and fall, so that the grinding wheel 360 and the side of the circuit board are at the same height. The transverse member 340 is used to drive the two grinding wheels 360 to move closer to each other, so that the two grinding wheels 360 abut against two of the opposite sides of the circuit board. The rotating member 350 is used to drive the grinding wheel 360 to rotate, so as to achieve the grinding of the side of the circuit board by the grinding wheel 360.

[0056] Reference Figure 1 , Figure 2 and Figure 3As shown, after the side of the circuit board is polished, the transverse component 340 can drive the two grinding wheels 360 to move away from each other, so that the grinding wheels 360 are separated from the side of the circuit board. The lifting component 330 can drive the transverse component 340 to move upward, so as to avoid the problem of the grinding wheels 360 obstructing the transfer of the circuit board. Through the alternating cooperation of the first grinding component 310 and the second grinding component 320, and the alternating cooperation of the first clamping component 210 and the second clamping component 220, the four sides of the circuit board can be polished without changing multiple sets of equipment or repeatedly disassembling the circuit board and the clamping mechanism 200, which is conducive to improving the polishing efficiency and production efficiency of the circuit board.

[0057] Reference Figure 1 , Figure 2 and Figure 3 As shown, it should be noted that the lifting component 330 and the lateral movement component 340 can be linear drive mechanisms such as pneumatic push rods, hydraulic push rods, electric push rods, and lead screw slider mechanisms. The rotating component 350 can be a rotary motor.

[0058] Reference Figure 1 , Figure 2 and Figure 3 As shown, it is understandable that, considering that the side of the circuit board may be bent after being pressed when the grinding wheel 360 grinds the side of the circuit board, which is not conducive to improving the production quality of the circuit board, the grinding wheel 360 is provided with an annular groove on its circumferential surface. Under the driving action of the transverse member 340, the side of the circuit board is embedded in the annular groove for grinding. The contact between the annular groove and the side plate of the circuit board restricts the bending of the side of the circuit board, which is conducive to improving the production quality of the circuit board.

[0059] Reference Figure 1 , Figure 2 and Figure 3 As shown, specifically, the annular groove includes a first guide section, a grinding section, and a second guide section arranged from top to bottom. The lower end of the first guide section is connected to the grinding section, and the outer diameter of the first guide section gradually increases from bottom to top. The upper end of the second guide section is connected to the grinding section, and the outer diameter of the second guide section gradually increases from top to bottom.

[0060] Reference Figure 1 , Figure 2 and Figure 3 As shown, the first guide section and the second guide section can guide the circuit board, so that the circuit board passes into the grinding section along the slope of the first guide section and the second guide section to achieve the contact between the side and the grinding section. With the rotation of the grinding wheel 360 degrees, the side of the circuit board is ground.

[0061] Reference Figure 1 , Figure 2 and Figure 3As shown, it can be understood that, specifically, the surface polishing mechanism 100 also includes a reciprocating drive 140, wherein the two pulleys 110 are lower pulleys 130, and the polishing belt 120 passes over the lower ends of the two lower pulleys 130 so that the lower ends of the polishing belt 120 are horizontally positioned. The reciprocating drive 140 is connected to the two lower pulleys 130 to drive the lower pulleys 130 to rise and fall, thereby causing the lower ends of the polishing belt 120 to tilt upward or downward.

[0062] Reference Figure 1 , Figure 2 and Figure 3 As shown, when the reciprocating drive 140 drives one of the lower wheels 130 to move upward, the side of the polishing belt near the lower wheel 130 can tilt upward. With the conveying action of the conveying mechanism 400, the circuit board can be inserted from the side of the polishing belt 120 tilting upward and under the polishing belt 120. When the reciprocating drive 140 drives the lower wheel 130 to return to its original position, the lower end of the polishing belt 120 can be set horizontally and the lower end of the polishing belt 120 can abut against the circuit board. With the first rotary drive driving the pulley 110 to rotate, the polishing belt 120 can rotate relative to the circuit board, thereby polishing the surface of the circuit board.

[0063] Reference Figure 1 , Figure 2 and Figure 3 As shown, after the surface of the circuit board is polished, the reciprocating driver 140 can drive another lower wheel 130 to move upward, thereby causing the polishing belt 120 to tilt upward on the side close to the lower wheel 130. With the conveying action of the conveying mechanism 400, the circuit board can pass through the underside of the polishing belt 120 from the side tilted upward. That is, the circuit board polishing device, through the cooperation of the reciprocating driver 140 and the lower wheel 130, facilitates the contact or separation of the circuit board and the polishing belt 120, which helps to avoid the problem of the circuit board colliding with the lower wheel 130 during the transfer, and can ensure the polishing effect of the polishing belt 120 and the circuit board.

[0064] Reference Figure 1 , Figure 2 and Figure 3 As shown, specifically, the reciprocating drive 140 includes two cylinders, and the cylinders and multiple pulleys 110 are all connected to the upright frame 150. The cylinders are connected to the lower wheel 130 in a transmission manner, and the cylinders and the lower wheel 130 are arranged in a one-to-one correspondence to drive the lower wheel 130 to rise and fall. With the grinding belt 120 passing around the lower wheel 130, the two sides of the lower end of the grinding belt 120 are tilted upward or downward. With the conveying action of the conveying mechanism 400, the circuit board can be connected or separated from the grinding belt 120.

[0065] It should be understood that in some other embodiments, the reciprocating drive 140 includes two sets of swinging components, each including a rotary motor and a connecting rod. One end of the connecting rod is connected to the rotary motor, and the other end is connected to the pulley 110. Driven by the rotary motor, the connecting rod and the pulley 110 are driven to swing, thereby causing the grinding belt 120 to tilt upward or downward.

[0066] It should be understood that in some other embodiments, the circuit board polishing device also includes a lifting mechanism, the upper end and the lower end of which are connected to the clamping mechanism 200 and the conveying mechanism 400, respectively, and the lifting mechanism is used to drive the clamping mechanism 200 to move up and down.

[0067] When the conveying mechanism 400 drives the clamping mechanism 200 to move to the lower end of the polishing belt 120, the lifting mechanism can drive the clamping mechanism 200 to move upward so that the circuit board clamped in the clamping mechanism 200 connects with the lower end of the polishing belt 120. With the rotation of the polishing belt 120, the polishing belt 120 polishes the surface of the circuit board. After the surface of the circuit board is polished, the lifting mechanism can drive the clamping mechanism 200 to move downward so that the circuit board clamped in the clamping mechanism 200 separates from the lower end of the polishing belt 120. With the conveying action of the conveying mechanism 400, the circuit board after surface polishing is moved to the edge grinding mechanism 300.

[0068] Reference Figure 1 , Figure 2 and Figure 3 As shown, it is understood that in this embodiment, considering the possibility of misalignment of the polishing belt 120, the surface polishing mechanism 100 also includes a multi-directional driver. The multi-directional driver is connected to at least one pulley 110 to drive the pulley 110 to move along multiple mutually perpendicular axes. By moving the pulley 110, the rotation path of the polishing belt 120 is adjusted so that the misaligned polishing belt 120 is adjusted to a preset path, thereby realizing the correction function of the polishing belt 120.

[0069] Reference Figure 1 , Figure 2 and Figure 3 As shown, the multi-directional drive can be a three-axis drive motor to drive the pulley 110 to move on the X, Y and Z axes, thereby adjusting the rotation path of the grinding belt 120 to achieve the correction of the grinding belt 120.

[0070] Reference Figure 1 , Figure 2 and Figure 3As shown, it is understandable that, considering that the surface of the circuit board will have debris after polishing, which will affect the subsequent etching process, the circuit board polishing device also includes a cleaning roller and a second rotary driver. The second rotary driver is connected to the cleaning roller to drive the cleaning roller to rotate. The conveying mechanism 400 can sequentially convey the clamping mechanism 200 to the surface polishing mechanism 100 and the cleaning roller.

[0071] Reference Figure 1 , Figure 2 and Figure 3 As shown, after the surface of the circuit board is polished, it can be transferred to the cleaning roller. The cleaning roller can come into contact with the surface of the circuit board. The second rotary driver is connected to the cleaning roller to drive the cleaning roller to rotate, thereby cleaning the surface of the circuit board and making the surface of the circuit board cleaner.

[0072] Reference Figure 1 , Figure 2 and Figure 3 As shown, it is understood that the circuit board polishing device also includes a transformer and a nozzle. The nozzle is adjacent to the cleaning roller, and the opening of the nozzle is facing the surface of the circuit board. The transformer can be a pump body. The transformer is connected to the nozzle so that gas can be ejected from the nozzle to help remove debris from the surface of the circuit board.

[0073] It should be noted that the rotating component 350, the first rotary driver, and the second rotary driver can be rotary motors.

[0074] Reference Figure 1 , Figure 2 and Figure 3 As shown, a production line according to one embodiment of the present invention includes a circuit board polishing device as shown in any of the above embodiments.

[0075] Reference Figure 1 , Figure 2 and Figure 3As shown, the production line includes a circuit board polishing device as described in any of the above embodiments. The clamping mechanism 200 includes a first clamping component 210 and a second clamping component 220. The first clamping component 210 or the second clamping component 220 can clamp the circuit board. The conveying mechanism 400 is configured to drive the clamping mechanism 200 sequentially through the surface polishing mechanism 100 and the edge grinding mechanism 300. When the clamping mechanism 200 moves to the surface polishing mechanism 100, the first rotary driver can drive one of the pulleys 110 to rotate. Since the polishing belt 120 is wound between the multiple pulleys 110, the lower end of the polishing belt 120 is horizontally arranged so that the polishing belt 120 can be aligned with the circuit board. The surface abuts against the surface, and the rotation of the grinding belt 120 enables large-area grinding of the circuit board surface. When the clamping mechanism 200 moves to the edge grinding mechanism 300, the first clamping component 210 and the second clamping component 220 alternately clamp the circuit board, and the first edge grinding component 310 and the second edge grinding component 320 alternately grind the sides of the circuit board, thereby enabling grinding of all four sides of the circuit board without having to repeatedly separate the clamping mechanism 200 from the circuit board, thus improving grinding efficiency. This circuit board grinding device can sequentially grind the surface and sides of the circuit board without changing multiple sets of equipment or repeatedly separating the circuit board from the clamping mechanism 200, which is beneficial to improving the grinding efficiency and production efficiency of the circuit board.

[0076] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A circuit board polishing device, characterized in that, include: A surface polishing mechanism (100) includes a first rotary driver, a polishing belt (120) and a plurality of pulleys (110), wherein the polishing belt (120) is wound around the plurality of pulleys (110) and the lower end of the polishing belt (120) is horizontally arranged, and the first rotary driver is configured to drive the plurality of pulleys (110) to rotate. The clamping mechanism (200) includes a first clamping assembly (210) and a second clamping assembly (220), wherein the first clamping assembly (210) is configured to clamp two of the opposite sides of the circuit board, and the second clamping assembly (220) is configured to clamp the other two opposite sides of the circuit board. The edge grinding mechanism (300) includes a first edge grinding assembly (310) and a second edge grinding assembly (320), wherein the first edge grinding assembly (310) is configured to grind two of the back sides of the circuit board, and the second edge grinding assembly (320) is configured to grind the other two back sides of the circuit board. The conveying mechanism (400) is configured to drive the clamping mechanism (200) sequentially through the surface polishing mechanism (100) and the edge grinding mechanism (300).

2. The circuit board polishing device according to claim 1, characterized in that: The surface polishing mechanism (100) further includes a reciprocating drive (140), wherein the two pulleys (110) are lower wheels (130), the polishing belt (120) passes over the lower ends of the two lower wheels (130), and the reciprocating drive (140) is connected to the two lower wheels (130) to drive the lower wheels (130) to rise and fall.

3. The circuit board polishing device according to claim 2, characterized in that: The surface polishing mechanism (100) also includes a stand (150), and the reciprocating drive (140) includes two cylinders. The pulley (110) and the cylinders are both connected to the stand (150). The cylinders are connected to the lower wheel (130) for transmission to drive the lower wheel (130) to rise and fall.

4. The circuit board polishing device according to claim 2, characterized in that: The surface polishing mechanism (100) further includes a multi-directional drive connected to at least one of the pulleys (110) to drive the pulleys (110) to move along a plurality of mutually perpendicular axes.

5. The circuit board polishing device according to claim 1, characterized in that: It also includes a lifting mechanism, the upper and lower ends of which are connected to the clamping mechanism (200) and the conveying mechanism (400) respectively. The lifting mechanism is used to drive the clamping mechanism (200) to move up and down.

6. The circuit board polishing device according to claim 1, characterized in that: The first clamping assembly (210) and the second clamping assembly (220) both include a jaw (230) and an opening and closing driver (240), the opening and closing driver (240) being connected to the jaw (230) to drive the jaw (230) to open and close.

7. The circuit board polishing device according to claim 1, characterized in that: Both the first edge grinding assembly (310) and the second edge grinding assembly (320) include a lifting member (330), a transverse member (340), a rotating member (350), and two edge grinding wheels (360). The lifting member (330) is used to drive the transverse member (340) to move up and down. The transverse member (340) is used to drive the two edge grinding wheels (360) to move closer to or further away from each other. The rotating member (350) is used to drive the edge grinding wheels (360) to rotate.

8. The circuit board polishing apparatus according to claim 7, characterized in that: The circumferential surface of the grinding wheel (360) is provided with an annular groove.

9. The circuit board polishing device according to claim 1, characterized in that: It also includes a cleaning roller and a second rotary driver, the second rotary driver being connected to the cleaning roller to drive the cleaning roller to rotate, and the conveying mechanism (400) being able to convey the clamping mechanism (200) sequentially to the surface polishing mechanism (100) and the cleaning roller.

10. A production line, characterized in that: Includes the circuit board polishing apparatus as described in any one of claims 1 to 9.

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