Multilayer circuit board pulse electroplating device

Abstract

The utility model relates to the technical field of electroplating devices, in particular to a multilayer circuit board pulse electroplating device. According to the technical scheme, the electroplating device comprises an electroplating tank, a guide frame, a motor, a storage frame, a bottom plate and first guide rods, the storage frame is arranged in the electroplating tank, guide plates are arranged at the two ends of the storage frame, springs are arranged at the upper end of a base, first sliding sleeves are installed in the electroplating tank, the first guide rods are arranged at the two ends of the bottom plate, and rotating seats are arranged at the upper ends of the first guide rods; a rotating wheel is arranged at the lower end of the motor; a cam is arranged at the lower end of the rotating wheel; a guide frame sleeves the outer side of the cam; a sliding seat is arranged on one side of the guide frame; through the storage frame capable of transversely moving in the electroplating bath, a plurality of layers of circuit boards are impacted with an electroplating solution, so that uniform electroplating processing is carried out.

Description

TECHNICAL FIELD

[0001] The utility model relates to electroplating device technical field especially relates to a multilayer circuit board pulse electroplating device. BACKGROUND

[0002] In the manufacture of multilayer circuit board, multilayer circuit board usually needs to cover certain thickness of metal on its surface to provide conductivity and protection function, and pulse electroplating device is widely used in multilayer circuit board manufacturing to ensure that the metal coating has consistent uniformity, fully guarantees the quality and reliability of circuit board.

[0003] Because the thickness of multilayer circuit board is large, directly immersed in liquid in the process of pulse electroplating processing, it will cause the problem of uneven coverage of electroplating solution, which affects the electroplating effect of multilayer circuit board, therefore, we propose a multilayer circuit board pulse electroplating device to solve the existing problems. UTILITY MODEL CONTENT

[0004] The utility model aims at the problems existing in the background art, and provides a multilayer circuit board pulse electroplating device.

[0005] To achieve the above object, the utility model provides the following technical scheme: a multilayer circuit board pulse electroplating device, including electroplating tank, guide frame, motor, storage frame, bottom plate and guide rod one, the inside of electroplating tank is provided with storage frame, both ends of storage frame are provided with guide plate, the upper end of bottom plate is provided with the spring connected with guide plate, the inside of both ends of electroplating tank is embedded and installed with sliding sleeve one, both ends of bottom plate are provided with guide rod one slidingly installed in the inside of sliding sleeve one, the upper end of guide rod one is provided with rotating seat on one side, the rotating seat is rotatably installed with connecting rod on the upper end, one side of electroplating tank is provided with motor, the lower end of motor is provided with rotating wheel, the lower end of rotating wheel is provided with cam, the outer side of cam is sleeved with guide frame, one side of guide frame is provided with sliding seat, the upper end of connecting rod is rotatably installed with sliding block slidingly installed in the inside of sliding seat.

[0006] When the multilayer circuit board pulse electroplating device in the scheme is used, the multilayer circuit board is placed in the storage frame, then the hydraulic rod two drives the lifting plate to descend, the spring pulls the guide plate to descend, and the storage frame enters the electroplating tank, the hydraulic rod one drives the support to move backward, drives the lifting plate to move out of the lower end of the guide plate, and is dislocated with the guide plate to carry out electroplating processing. In this process, the motor drives the rotating wheel to rotate, because the guide frame slides in the sleeve two through the guide rod two, drives the guide frame to move transversely, the guide frame moving transversely drives the sliding block to move, because the connecting rod is rotatably installed with the sliding block, is slidably installed with the sliding block, the lower end is rotatably installed with the rotating seat, the transverse force is applied to the guide rod two, after the rotating wheel rotates one round, the pushing base repeatedly moves transversely, and then the multilayer circuit board impacts the electroplating liquid, the multilayer circuit board is fully contacted with the electroplating solution, and efficient and uniform electroplating processing is carried out. After processing, the hydraulic rod one drives the support to reset, so that the lifting plate is located at the lower end of the guide plate, the hydraulic rod two drives the lifting plate to exert a lifting force on the guide plate, and the spring is pulled. The storage frame moves out of the electroplating tank, and the multilayer circuit board is stored and taken out.

[0007] Preferably, the bottom end of the electroplating tank is provided with a base, and the base comprises a support plate and a support column connected with the four corners of the bottom end of the electroplating tank. The electroplating tank is supported at the four corners of the bottom by the support column, and the base supports the bottom of the electroplating tank.

[0008] Preferably, the inside of the rear side of the electroplating tank is provided with a support, and the top of the electroplating tank is fixedly installed with a hydraulic rod one connected with the support through a telescopic end. When the hydraulic rod one operates, the support reciprocatingly moves.

[0009] Preferably, the inside of the support is provided with symmetrically distributed hydraulic rod two, and the lower end of the hydraulic rod two is provided with a lifting plate located below the guide plate. The reciprocatingly moving support drives the hydraulic rod two to move synchronously, and drives the lifting plate to move synchronously.

[0010] Preferably, the upper end of the bottom plate is provided with guide rods three symmetrically distributed and located in the spring and slidably inserted into the guide plate. The bottom plate is connected with the guide plate through the spring, realizes the elastic connection with the storage frame, the guide rod three moves longitudinally in the spring when the spring expands and contracts, and the guide rod three is slidably supported by the guide plate, thereby limiting the spring and avoiding the outward deviation of the spring.

[0011] Preferably, the cam is rotatably installed with the rotating wheel through a bearing, and the cam is located at the lower end side of the rotating wheel. The cam rotates with the rotating wheel, and drives the guide frame to move transversely.

[0012] Preferably, the guide frame is provided with symmetrically distributed guide rods two at one end, the electroplating tank is internally embedded with symmetrically distributed sliding sleeves two at one side, and the guide rods two are slidingly installed in the sliding sleeves two.

[0013] Compared with the prior art, the utility model has the advantages that:

[0014] 1、The utility model discloses a storage frame moves longitudinally in the electroplating tank, and multiple layer circuit boards are stored, when the multiple layer circuit boards are electroplated, the base moves repeatedly in the electroplating tank horizontally, so that the electroplating solution impacts the multiple layer circuit boards, the multiple layer circuit boards fully contact the electroplating solution, and the multiple layer circuit boards are uniformly electroplated. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is the front view three -dimensional structure schematic diagram of the utility model;

[0016] Figure 2 It is the top view three -dimensional structure schematic diagram of the utility model;

[0017] Figure 3 It is the motor side view three -dimensional structure schematic diagram of the utility model;

[0018] Figure 4 It is the sliding seat bottom view three -dimensional structure schematic diagram of the utility model;

[0019] Figure 5 It is the storage frame top view three -dimensional structure schematic diagram of the utility model.

[0020] Fig. 1, electroplating tank;2, guide rod one;3, base;4, guide frame;5, runner;6, motor;7, hydraulic rod one;8, hydraulic rod two;9, storage frame;10, bottom plate;11, sliding sleeve one;12, guide rod two;13, cam;14, sliding sleeve two;15, rotating seat;16, connecting rod;17, sliding seat;18, sliding block;19, support;20, guide rod three;21, guide plate;22, lifting plate;23, spring. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0022] As Figures 1-5As shown, the present invention proposes a multilayer circuit board pulse electroplating device, including an electroplating tank 1, a base 3, a guide frame 4, a motor 6, a storage frame 9, a bottom plate 10, and a guide rod 2. The electroplating tank 1 is provided with a storage frame 9, and both ends of the storage frame 9 are provided with guide plates 21. The bottom plate 10 is provided with a spring 23 connected to the guide plate 21. Both ends of the electroplating tank 1 are embedded with sliding sleeves 11. Both ends of the bottom plate 10 are provided with guide rods 2 that are slidably installed inside the sliding sleeves 11. A rotating seat 15 is provided on one side of the upper end of the guide rod 2, and a connecting rod 16 is rotatably installed on the upper end of the rotating seat 15.

[0023] A base 3 is provided at the lower end of the electroplating tank 1. The base 3 includes a support plate and support columns connected to the four corners of the lower end of the electroplating tank 1.

[0024] A bracket 19 is provided inside the rear side of the electroplating tank 1, and a hydraulic rod 7 with a telescopic end connected to the bracket 19 is fixedly installed above the electroplating tank 1.

[0025] The bracket 19 is equipped with symmetrically distributed hydraulic rods 28, and the lower end of the hydraulic rods 28 is equipped with a lifting plate 22 located below the guide plate 21;

[0026] The base plate 10 has symmetrically distributed guide rods 20 located inside the spring 23 and slidably inserted into the guide plate 21 at its upper end;

[0027] Based on the implementation steps of Embodiment 1: The storage frame 9 has multiple slots on all four sides and inside the lower end, and the top of the storage frame 9 is open. Multiple inclined partitions are set inside, and multi-layer electroplating plates are stored between the partitions. While the multi-layer electroplating plates are supported, the multi-layer circuit boards that enter the electroplating tank 1 effectively contact the liquid material through the slots. When the storage frame 9 is above the electroplating tank 1, the lifting plate 22 is below the guide plate 21, and the spring 23 is in a stretched state. When operating with the hydraulic rod 8, after the lifting plate 22 descends, the spring 23 is pulled into the electroplating tank 1 by its own elastic force. At the same time, the hydraulic rod 7 drives the bracket 19 to move backward, ensuring that the storage frame 9 is not affected by the lifting plate 22 when moving laterally, and the multi-layer circuit boards undergo pulse electroplating processing.

[0028] like Figures 1-5 As shown, compared with Embodiment 1, the multilayer circuit board pulse electroplating device proposed in this utility model further includes: a motor 6 is provided on one side of the electroplating tank 1, a rotating wheel 5 is provided at the lower end of the motor 6, a cam 13 is provided at the lower end of the rotating wheel 5, a guide frame 4 is sleeved on the outside of the cam 13, a slide block 17 is provided on one side of the guide frame 4, and a slider 18 is rotatably mounted on the upper end of the connecting rod 16 and slidably mounted inside the slide block 17.

[0029] Cam 13 is rotatably mounted to the rotating wheel 5 via a bearing, and cam 13 is located on the lower side of the rotating wheel 5.

[0030] The guiding frame 4 is provided with symmetrically distributed guide rods 12 at one end, and the electroplating tank 1 is internally embedded with symmetrically distributed sliding sleeves 14 at one side, and the guide rods 12 are slidingly installed in the sliding sleeves 14;

[0031] In the embodiment, the motor 6 drives the rotating wheel 5 and the continuous horizontal moving mechanism to realize efficient electroplating of the multilayer circuit board during the pulse electroplating process of the multilayer circuit board, and the horizontal moving operation can ensure that the electroplating solution fully covers the surface of the multilayer circuit board, avoids the problem of uneven coverage of the electroplating solution, and helps to improve the electroplating effect.

[0032] The above specific embodiments are only several preferred embodiments of the present application, and based on the technical scheme of the present application and the related inspiration of the above embodiments, those skilled in the art can make various alternative improvements and combinations on the above specific embodiments.

[0033] It is obvious for those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, and the present application can be realized in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-limiting, and the scope of the present application is defined by the appended claims rather than the above description, and therefore all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application. Any reference signs in the claims should not be regarded as limiting the involved claims.

Claims

1. A multilayer circuit board pulse electroplating device, comprising an electroplating tank (1), a guide frame (4), a motor (6), a storage frame (9), a base plate (10), and a guide rod (2), characterized in that: The electroplating tank (1) is equipped with a storage frame (9) inside. Both ends of the storage frame (9) are equipped with guide plates (21). The upper end of the bottom plate (10) is equipped with a spring (23) connected to the guide plates (21). Both ends of the electroplating tank (1) are equipped with a sliding sleeve (11). Both ends of the bottom plate (10) are equipped with a guide rod (2) that is slidably installed inside the sliding sleeve (11). A rotating seat (15) is provided on one side of the upper end of the guide rod (2). A connecting rod (16) is rotatably mounted on the upper end of the rotating seat (15). A motor (6) is provided on one side of the electroplating tank (1). A rotating wheel (5) is provided on the lower end of the motor (6). A cam (13) is provided on the lower end of the rotating wheel (5). A guide frame (4) is sleeved on the outside of the cam (13). A slide block (17) is provided on one side of the guide frame (4). A slider (18) is rotatably mounted on the upper end of the connecting rod (16) and slidably mounted inside the slide block (17).

2. The multilayer circuit board pulse electroplating apparatus according to claim 1, characterized in that: The electroplating tank (1) is provided with a base (3) at its lower end. The base (3) includes a support plate and support columns connected to the four corners of the lower end of the electroplating tank (1).

3. The multilayer circuit board pulse electroplating apparatus according to claim 1, characterized in that: A bracket (19) is provided inside the rear side of the electroplating tank (1), and a hydraulic rod (7) with its telescopic end connected to the bracket (19) is fixedly installed above the electroplating tank (1).

4. The multilayer circuit board pulse electroplating apparatus according to claim 3, characterized in that: The bracket (19) is provided with symmetrically distributed hydraulic rods (8), and the lower end of the hydraulic rods (8) is provided with a lifting plate (22) located below the guide plate (21).

5. The multilayer circuit board pulse electroplating apparatus according to claim 1, characterized in that: The base plate (10) is provided with three guide rods (20) that are symmetrically distributed and located inside the spring (23) and whose upper ends are slidably inserted into the guide plate (21).

6. The multilayer circuit board pulse electroplating apparatus according to claim 1, characterized in that: The cam (13) is rotatably mounted to the rotating wheel (5) via a bearing, and the cam (13) is located on the lower side of the rotating wheel (5).

7. The multilayer circuit board pulse electroplating apparatus according to claim 1, characterized in that: One end of the guide frame (4) is provided with symmetrically distributed guide rods (12), and a symmetrically distributed sliding sleeve (14) is embedded inside one side of the electroplating tank (1). The guide rods (12) are slidably installed inside the sliding sleeves (14).

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