Optical chip verification device
The optical chip verification device, consisting of a PCB board, a support base, and a camera, simplifies the assembly process and simulates the finished product environment for verification. This solves the problem of complex and time-consuming optical chip verification, enabling rapid and accurate finished product verification and improving R&D and production efficiency.
Patent Information
- Application Number
- CN202423197448.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-24
- Publication Date
- 2025-11-04
- Estimated Expiration
- 2034-12-24
AI Technical Summary
Existing optical chip verification methods are complex and time-consuming, and cannot ensure that the finished product is consistent with the verification environment, which affects R&D and production efficiency.
The installation space consists of a PCB board, a support base, and a base. The camera and optical chip fit together closely, simulating the finished product environment for verification. This simplifies the assembly process and ensures accurate acquisition of optical information.
It enables rapid and accurate verification of finished optical chips, improves R&D and production efficiency, ensures performance consistency, and is easy to operate.
Smart Images
Figure CN223512903U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of optical chip verification technology, and in particular to an optical chip verification device. Background Technology
[0002] Currently, there are two methods for verifying optical chips. One method involves assembling the optical chip into a finished product. This method requires the use of microscopes, vacuum pumps, vacuum workbenches, dispensing machines, UV curing adhesives, UV lamps, tweezers, and other equipment to pre-assemble the optical chip with other components. This pre-assembly process is complex and time-consuming, hindering rapid performance verification and thus impacting the R&D and production efficiency of optical chips.
[0003] Another method is to simply assemble the optical chip and then use a lens to verify it. However, the verification environment of the optical chip in this method is quite different from the actual working environment of the optical chip, and it cannot be guaranteed that the performance of the optical chip after assembly into a finished product is the same as the performance after verification. Utility Model Content
[0004] To solve at least one of the above-mentioned technical problems, this application provides an optical chip verification device, the technical solution of which is as follows.
[0005] The optical chip verification device provided in this application includes:
[0006] PCB board, used for electrical connection of optical chips;
[0007] The mounting assembly includes a support base and a base that cooperate with each other, forming a mounting space between the support base and the base. The support base is provided with a first through hole and a first mounting slot for mounting an optical chip. The first through hole connects the mounting space and the first mounting slot.
[0008] The camera is electrically connected to the PCB board and is located in the mounting space. One end of the camera is mounted on the base, and the other end passes through the first through hole and abuts against the optical chip.
[0009] The optical chip verification apparatus according to the embodiments of this application has at least the following beneficial effects:
[0010] The mounting space between the support and the base of the optical chip verification device is used to accommodate the optical chip. During optical chip verification, the optical chip is simply placed on the first mounting slot without complex assembly procedures. At this time, the camera passes through the first through-hole and abuts against the optical chip without damaging it. The first through-hole ensures that the optical chip can receive light during the verification process. During operation, light shines on the optical chip through the first through-hole, electrically connecting the PCB board to the optical chip. The PCB board can apply voltage to the optical chip to simulate the operating conditions. The camera, by shooting in close contact with the optical chip, can more realistically simulate the operating state of the optical chip, thus restoring the working environment in which the optical chip is assembled into a finished product. Under the condition that the camera and the optical chip are in close contact, the focal length and optical parameters of the camera are matched with the optical performance of the optical chip to ensure that the optical information of the optical chip can be accurately acquired during the finished product verification process, and to perform finished product verification of the optical chip. The camera is electrically connected to the PCB board to transmit the image information of the optical chip acquired by the camera to the PCB board. This optical chip verification device can ensure that the camera can be in close contact with the optical chip to simulate the working environment of assembling the optical chip into a finished product, ensuring accurate verification results, and enabling rapid disassembly and assembly of the optical chip for rapid finished product verification. It is convenient to use and simple to operate, ensuring the performance consistency from optical chip to finished product, and improving the R&D and production efficiency of optical chips.
[0011] According to some embodiments of this application, the support base is provided with a cover adapted to the first mounting groove, and an optical chip mounting space is formed between the support base and the cover. The cover is provided with a second through hole communicating with the first through hole.
[0012] According to some embodiments of this application, a first slot is provided on the side of the cover away from the support base. The first slot is connected to the first through hole and is used to install a filter.
[0013] According to some embodiments of this application, the mounting component has a socket for inserting an optical chip on its side, and the socket is connected to the first mounting slot.
[0014] According to some embodiments of this application, the support base has a protrusion on the side away from the base, the protrusion is arranged along the outer periphery of the first mounting groove, the insertion port is formed on the side of the protrusion, the cover has a second slot that mates with the protrusion, and the cover has a clearance groove that communicates with the insertion port.
[0015] According to some embodiments of this application, the support base and the base are detachably connected, the base is mounted on the PCB board, and the support base is disposed between the base and the PCB board.
[0016] According to some embodiments of this application, the support base has a third slot on one side near the base that cooperates with the camera.
[0017] According to some embodiments of this application, there are upper and lower housings that cooperate with each other, the PCB board is mounted on the lower housing, the mounting assembly is disposed between the upper housing and the PCB board, and the upper housing is provided with a third through hole communicating with the first through hole.
[0018] According to some embodiments of this application, the upper housing is provided with a second mounting groove for mounting a dustproof lens, and the third through hole is formed in the second mounting groove.
[0019] According to some embodiments of this application, the lower housing includes a side plate, and the side plate is provided with a connector, which is connected to the PCB board.
[0020] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description
[0021] The present application will be further illustrated below with reference to the accompanying drawings and embodiments. It should be noted that the embodiments illustrated in the following drawings are exemplary and are only used to explain the present application, and should not be construed as limiting the present application.
[0022] Figure 1 This is a perspective view of one embodiment of the optical chip verification device in this application;
[0023] Figure 2 This is one of the exploded views of an embodiment of the optical chip verification apparatus in this application;
[0024] Figure 3 This is a second exploded view of one embodiment of the optical chip verification device in this application.
[0025] Figure label:
[0026] Support base 100, first through hole 110, first mounting groove 120, cover 130, second through hole 131, first slot 132, filter 133, clearance groove 134, protrusion 140;
[0027] Base 200;
[0028] PCB board 300;
[0029] Camera 400.
[0030] Upper housing 500, second mounting groove 510, third through hole 511, dustproof lens 520;
[0031] Lower housing 600, side plate 610, connector 611;
[0032] Optical chip 700, connecting cable 710. Detailed Implementation
[0033] The following is combined Figures 1 to 3 The embodiments of this application are described in detail below, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.
[0034] In the description of this application, it should be understood that the terms "center", "middle", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0035] In the description of this application, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.
[0036] In the description of this application, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0037] In the description of this application, the use of terms such as "one embodiment," "some embodiments," "an example," "some instances," "some embodiments," "illustrative embodiment," "example," "specific example," and "some examples" indicates that the specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0038] The working environment, other components, and operation of existing optical chips are already described in the relevant technologies for those skilled in the art, and will not be described in detail here. The structure of the optical chip verification device in this application will be described below.
[0039] Reference Figures 1 to 3 An optical chip verification apparatus according to a first aspect embodiment of this application includes:
[0040] PCB board 300 is used for electrical connection of optical chips;
[0041] The mounting assembly includes a support base 100 and a base 200 that cooperate with each other, forming an mounting space between the support base 100 and the base 200. The support base 100 is provided with a first through hole 110 and a first mounting groove 120 for mounting an optical chip. The first through hole 110 connects the mounting space and the first mounting groove 120.
[0042] Camera 400 is electrically connected to PCB board 300. Camera 400 is located in the installation space. One end of camera 400 is mounted on base 200, and the other end passes through the first through hole 110 and abuts against optical chip 700.
[0043] The mounting space between the support 100 and the base 200 of the optical chip verification device is used to accommodate the optical chip. During optical chip verification, the optical chip 700 is simply placed on the first mounting slot 120 without complex assembly procedures. At this time, the camera 400 passes through the first through hole 110 and abuts against the optical chip 700 without damaging the optical chip. The first through hole 110 ensures that the optical chip can receive light during the verification process. During operation, light shines on the optical chip 700 through the first through hole 110, electrically connecting the PCB board 300 to the optical chip 700. The PCB board 300 can apply voltage to the optical chip 700 to simulate the working conditions. The camera 400 takes pictures while in close contact with the optical chip 700, which can more realistically simulate the working state of the optical chip and restore the optical chip's true state. In the working environment where the optical chip is assembled into a finished product, the camera 400 is in close contact with the optical chip. The focal length and optical parameters of the camera are matched with the optical performance of the optical chip to ensure accurate acquisition of optical information during the finished product verification process. The camera 400 is electrically connected to the PCB board 300 to transmit the image information of the optical chip acquired by the camera 400 to the PCB board 300. This optical chip verification device can ensure that the camera 400 is in close contact with the optical chip to simulate the working environment of assembling the optical chip into a finished product, ensuring accurate verification results. It can also achieve rapid assembly and disassembly of the optical chip and rapid finished product verification of the optical chip. It is convenient to use and simple to operate, ensuring the performance consistency from optical chip to finished product and improving the R&D and production efficiency of optical chips.
[0044] The contents of this application are described in detail below with reference to specific embodiments. It should be noted that the following description is merely illustrative and not a specific limitation of this application.
[0045] Reference Figures 1 to 3 In some embodiments, the support base 100 is provided with a cover 130 adapted to the first mounting groove 120, and an optical chip mounting space is formed between the support base 100 and the cover 130. The cover 130 is provided with a second through hole 131 communicating with the first through hole 110, thereby confining the optical chip within the optical chip mounting space. The first mounting groove 120 can limit the movement space of the cover 130 and ensure the stability of the optical chip verification.
[0046] Reference Figures 1 to 3In some embodiments, a first slot 132 is provided on the side of the cover 130 away from the support base 100. The first slot 132 is connected to the first through hole 110. The first slot 132 is used to install a filter 133. The filter 133 is used to limit the wavelength of the light passing through in order to obtain more accurate optical information. It is understood that in the complex environment of daily use, the filter 133 needs to be selected according to the specific usage scenario to avoid interference of complex light on the optical chip 700. In industrial scenarios without interference, the filter 133 may not be used depending on the conditions.
[0047] Reference Figures 1 to 3 In some embodiments, the mounting assembly has a socket on its side for inserting the optical chip 700, which is connected to the first mounting slot 120.
[0048] Reference Figures 1 to 3 In some embodiments, the support base has a protrusion 140 on the side away from the base 200. The protrusion 140 is arranged along the outer periphery of the first mounting groove 120, and an insertion port is formed on the side of the protrusion 140. The cover 130 has a second slot that mates with the protrusion 140, and an avoidance groove 134 that communicates with the insertion port. In other words, the first mounting groove 120 is formed between the surrounding protrusions 140. The shape and size of the first mounting groove 120 are adapted to the optical chip to be verified to ensure that the optical chip can be stably placed in the optical chip mounting space. The protrusion 140 has a guide surface at the end that forms the avoidance groove 134 to facilitate the smooth insertion of the optical chip into the first mounting groove 120.
[0049] Reference Figures 1 to 3 In some embodiments, the optical chip 700 is provided with a connecting line 710, which is connected to the PCB board 300. The connecting line facilitates the PCB board 300 to read the resistors and capacitors from the optical chip 700 and apply voltage to the optical chip 700.
[0050] Reference Figures 1 to 3 In some embodiments, the support base 100 has a third slot on the side near the base 200 that cooperates with the camera 400, so that the support base 100 and the camera 400 can be stably cooperated, and the camera 400 is aligned with the first through hole 110 and the optical chip 700, so that the focal length and optical parameters of the camera 400 are matched with the optical performance of the optical chip 700, so as to ensure that the optical information of the optical chip can be accurately obtained during the finished product verification process, and to ensure the accuracy of the optical chip verification. The camera 400 will specifically shoot light of a certain wavelength, and the working status of the optical chip 700 can be known by looking at the transmittance.
[0051] Reference Figures 1 to 3In some embodiments, the support base 100 and the base 200 are detachably connected. The base 200 is mounted on the PCB board 300, and the support base 100 is located between the base 200 and the PCB board 300. Specifically, a locking block can be provided on the support base 100, and a locking groove that cooperates with the locking block can be provided on the base 200 to achieve a detachable connection between the support base 100 and the base 200.
[0052] Reference Figures 1 to 3 In some embodiments, the optical chip verification device includes an upper housing 500 and a lower housing 600 that cooperate with each other. A PCB board 300 is mounted on the lower housing 600. A mounting assembly is located between the upper housing 500 and the PCB board 300. The upper housing 500 is provided with a third through hole 511 that communicates with the first through hole 110, so that external light can irradiate the optical chip 700. Specifically, the PCB board 300 and the lower housing 600 are connected by screws. The lower housing 600 serves as the support structure for the entire optical chip verification device, ensuring the overall stability of the optical chip verification device.
[0053] Reference Figures 1 to 3 In some embodiments, the upper housing 500 is provided with a second mounting groove 510 for mounting a dustproof lens 520, and a third through hole 511 is formed in the second mounting groove 510.
[0054] Reference Figures 1 to 3 In some embodiments, the lower housing 600 includes a side plate 610, on which a connector 611 is provided. The connector 611 is connected to the PCB board 300 to provide power and transmit data to the PCB board 300 from the outside through the connector 611. The PCB board can transmit the optical chip data it has obtained, the optical chip image captured by the camera, and the temperature of the PCB itself to external components through the connector 611. Specifically, the connector 611 is a type-c connector.
[0055] The method of using this optical chip verification device is as follows:
[0056] 1. Preparation stage
[0057] 1.1 Select an optical chip to be verified, whose size and optical performance meet the design requirements.
[0058] 1.2 Prepare the finished product verification device involved in this application, ensuring that all components are intact and correctly connected.
[0059] 2. Verification Phase
[0060] S1: Place the optical chip in the optical chip mounting space formed by the first mounting slot 120, and cover it with the cover 130 so that the optical chip is confined within the optical chip mounting space.
[0061] S2: Install the upper housing 500 onto the lower housing 600, so that the third through hole 511 corresponds to the first slot 132;
[0062] S3: Place the optical chip verification device into the verification optical path. In other words, connect the optical chip verification device to the spectrometer. The PCB board 300 provides power and transmits data to the optical chip 700. At the same time, the light generated by the spectrometer illuminates the optical chip 700. The optical chip 700 transmits a portion of the light. The camera 400 takes a picture of the optical chip 700 to obtain the optical information of the optical chip and perform finished product verification.
[0063] 3. Conclusion
[0064] 3.1 After the finished product verification is completed, the upper housing 500 and cover 130 can be quickly removed to take out the optical chip for the next verification.
[0065] 3.2 Record and analyze the verification results. If the optical chip does not meet the requirements, record the problems with the optical chip and carry out further research and development and improvement.
[0066] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application. Furthermore, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.
Claims
1. An optical chip verification device, characterized in that, include: PCB board, used for electrical connection of optical chips; The mounting assembly includes a support base and a base that cooperate with each other, forming a mounting space between the support base and the base. The support base is provided with a first through hole and a first mounting slot for mounting an optical chip. The first through hole connects the mounting space and the first mounting slot. The camera is electrically connected to the PCB board and is located in the mounting space. One end of the camera is mounted on the base, and the other end passes through the first through hole and abuts against the optical chip.
2. The optical chip verification device according to claim 1, characterized in that, The support base is provided with a cover that is adapted to the first mounting groove, and an optical chip mounting space is formed between the support base and the cover. The cover is provided with a second through hole that communicates with the first through hole.
3. The optical chip verification device according to claim 2, characterized in that, A first slot is provided on the side of the cover away from the support base. The first slot is connected to the first through hole and is used to install a filter.
4. The optical chip verification device according to claim 2, characterized in that, The mounting assembly has a socket for inserting an optical chip on its side, and the socket is connected to the first mounting slot.
5. The optical chip verification device according to claim 4, characterized in that, The support base has a protrusion on the side away from the base. The protrusion is arranged along the outer periphery of the first mounting groove. The insertion port is formed on the side of the protrusion. The cover has a second slot that mates with the protrusion. The cover has a clearance groove that communicates with the insertion port.
6. The optical chip verification device according to claim 1, characterized in that, The support base and the base are detachably connected. The base is mounted on the PCB board, and the support base is located between the base and the PCB board.
7. The optical chip verification device according to claim 6, characterized in that, The support base has a third slot on one side near the base that cooperates with the camera.
8. The optical chip verification device according to claim 1, characterized in that, The device includes an upper housing and a lower housing that cooperate with each other. The PCB board is mounted on the lower housing. The mounting assembly is located between the upper housing and the PCB board. The upper housing is provided with a third through hole that communicates with the first through hole.
9. The optical chip verification device according to claim 8, characterized in that, The upper housing is provided with a second mounting groove for installing a dustproof lens, and the third through hole is formed in the second mounting groove.
10. The optical chip verification device according to claim 8, characterized in that, The lower housing includes a side plate, and the side plate is provided with a connector, which is connected to the PCB board.