Test board for integrated circuit
By designing a heat dissipation mechanism consisting of a U-shaped limiting seat, a telescopic rod, and a spring on the integrated circuit test board, the problem of poor adaptability of the heat dissipation structure was solved, achieving good adaptation and convenient assembly for chips of different heights.
Patent Information
- Application Number
- CN202422977035.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-04
- Publication Date
- 2025-11-04
- Estimated Expiration
- 2034-12-04
AI Technical Summary
Existing test boards for integrated circuits have problems with heat dissipation structure adaptability and cannot be adapted to test chips of different heights.
A heat dissipation mechanism including a U-shaped limiting seat, a telescopic rod, a heat-conducting copper plate, and a spring was designed. The elastic pressing design adapts to test chips of different heights, and the combination of card slots and handles facilitates disassembly and assembly, thus achieving flexible adaptation of the heat dissipation structure.
It achieves good heat dissipation adaptability for test chips of different heights, facilitates chip assembly and disassembly, and improves the versatility and efficiency of the test board.
Smart Images
Figure CN223513308U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of circuit board, concretely to a test board for integrated circuit. BACKGROUND
[0002] The integrated circuit test board is a specially designed circuit board for functional test, performance test and fault diagnosis of integrated circuits (IC). It can provide the required power supply and input signal for IC, and can monitor the output signal of IC to verify whether the IC meets the design specifications.
[0003] The existing test board for integrated circuits has the following problems when in use: it is usually based on different integrated circuit test requirements to assemble test chips matching its test requirements on the test board, in order to ensure the stable work of the test chips, a fixed heat dissipation structure is usually installed outside the test chips, but due to the different heights of different test chips, the adaptability of the heat dissipation structure is poor, and it cannot adapt to test chips of different heights. SUMMARY
[0004] The utility model aims at providing a test board for integrated circuit, which solves the problems in the background art.
[0005] The technical scheme of the utility model is: a test board for integrated circuit, including test board main body, the test board main body includes a test main substrate, the test main substrate top one side rear is provided with the power supply interface seat, the test main substrate top one side front is provided with the voltage stabilizing mainboard, the test main substrate top other side middle part is provided with test interface seat,
[0006] The test main substrate top middle part is provided with a chip mainboard, the chip mainboard outer side is provided with heat conduction heat dissipation mechanism, and the heat conduction heat dissipation mechanism includes a U-shaped limiting seat installed outside the chip mainboard.
[0007] The U-shaped limiting seat top four corners are all fixedly connected with telescopic rods and springs, the telescopic rods
[0008] The upper movable end and the upper end of the spring are fixedly connected with the same heat conduction copper plate, and the heat conduction copper plate is fixedly connected with a heat conduction pad at the center of the bottom wall.
[0009] As a preferred technical scheme, a chip assembly groove is formed in the middle position of the chip mainboard, and a plurality of chip pin grooves are formed at the front and rear ends of the chip mainboard.
[0010] As a preferred technical scheme, two clamping grooves are symmetrically formed at the top rear side of the test main substrate.
[0011] As a preferred technical scheme, the clamping grooves are slidably clamped with clamping strips, and the top ends of the two clamping strips are fixedly connected with U-shaped limiting seats.
[0012] As a preferred technical scheme, the inner side walls of the U-shaped limiting seats are slidably connected with the chip mainboards, the bottom ends of the U-shaped limiting seats are slidably connected with the test main baseboards, and the rear ends of the U-shaped limiting seats are fixedly connected with handles.
[0013] As a preferred technical scheme, the through holes are arranged between the upper and lower side walls at the four corners of the test main baseboard, the mounting sleeves are fixedly installed in the through holes, and the mounting sleeves are provided with threads.
[0014] As a preferred technical scheme, the spring sliding sleeves are slidably connected with the outer sides of the corresponding telescopic rods, and the top ends of the heat-conducting copper plates are fixedly connected with a plurality of heat-dissipating fins in a horizontal equidistant mode.
[0015] Compared with the prior art, the utility model has the advantages that:
[0016] 1、 the utility model discloses a heat-conducting heat-dissipating mechanism is provided with the elasticity of pressing down, it includes the U-shaped limiting seat of installing in the outer side of chip mainboard, and the heat-conducting copper plate of its U-shaped limiting seat top is connected through telescopic rod, and the spring is fixedly connected between the bottom of its heat-conducting copper plate and U-shaped limiting seat, can pull the heat-conducting pad of heat-conducting copper plate bottom and press down and fit in the test chip of chip mainboard assembly, and the adaptability of its heat-dissipating structure is good to different height test chip.
[0017] 2、 the utility model discloses that the heat-conducting heat-dissipating mechanism adopts the structure design of being beneficial to dismounting, and the clamping strip is fixedly connected on both sides of the bottom of its U-shaped limiting seat, and the clamping groove for clamping strip clamping is seted up on the top of test main baseboard, when the chip assembly in its chip mainboard is carried out, for facilitating the chip assembly work, can hold the handle of heat-conducting heat-dissipating mechanism and draw out the heat-conducting heat-dissipating mechanism of test main baseboard assembly. ACCURACY OF DRAWINGS
[0018] Figure 1 It is the overall perspective drawing of the utility model;
[0019] Figure 2 It is the test board main body perspective of the utility model Figure One ;
[0020] Figure 3 It is the test board main body perspective of the utility model Figure Two ;
[0021] Figure 4 It is the heat-conducting heat-dissipating mechanism perspective of the utility model.
[0022] In the figure: 1, test board main body; 2, heat dissipation mechanism; 11, test main substrate; 12, chip main board; 13, chip assembly groove; 14, chip pin groove; 15, clamping groove; 16, power supply interface seat; 17, voltage stabilizing main board; 18, test interface seat; 19, through hole; 110, mounting sleeve; 21, U-shaped limiting seat; 22, handle; 23, clamping strip; 24, telescopic rod; 25, heat-conducting copper plate; 26, heat-conducting pad; 27, heat dissipation fin; 28, spring. DETAILED DESCRIPTION
[0023] The embodiments of the present application will be further described in detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate the present application, but cannot be used to limit the scope of the present application.
[0024] In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more; the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" and the like are only for the purpose of description, and cannot be understood as indicating or implying relative importance.
[0025] In the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "connected", "connected" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0026] As Figures 1 to 4As shown, a test board for integrated circuits includes a test board body 1, the test board body 1 includes a test main substrate 11, the test main substrate 11 is provided with a power supply interface seat 16 at the top side of the rear, is provided with a voltage stabilizing main plate 17 at the top side of the front, is provided with a test interface seat 18 at the top side of the other side of the middle, is provided with a chip main plate 12 at the top side of the middle, the chip main plate 12 is provided with a chip assembly groove 13 at the middle position, and a plurality of chip pin grooves 14 are provided at the front and rear ends of the chip main plate 12. The test chip can be installed and arranged in the chip main plate 12, the power supply interface seat 16 can be connected with a power supply line, and the test interface seat 18 can be connected with a component to be tested. The integrated circuit, that is, the IC, can be functionally tested, performance tested and fault diagnosed. The IC can be provided with the required power supply and input signal, and the output signal of the IC can be monitored to verify whether the IC meets the design specifications.
[0027] The chip main plate 12 is provided with a heat-conducting heat dissipation mechanism 2, the heat-conducting heat dissipation mechanism 2 includes a U-shaped limiting seat 21 installed on the outer side of the chip main plate 12, the four corners of the top end of the U-shaped limiting seat 21 are fixedly connected with a telescopic rod 24 and a spring 28, the upper end of the telescopic rod 24 is fixedly connected with the upper end of the spring 28, the same heat-conducting copper plate 25 is fixedly connected with the heat-conducting pad 26 at the bottom wall center position of the heat-conducting copper plate 25, the spring 28 is slidably sleeved on the outer side of the corresponding telescopic rod 24, and a plurality of heat dissipation fins 27 are fixedly connected with the top end of the heat-conducting copper plate 25 in a horizontal and equidistant manner. The heat-conducting heat dissipation mechanism 2 is provided with an elastic downward pressing type, which includes a U-shaped limiting seat 21 installed on the outer side of the chip main plate 12, the heat-conducting copper plate 25 is connected with the U-shaped limiting seat 21 at the top end through the telescopic rod 24, and the spring 28 is fixedly connected between the bottom end of the heat-conducting copper plate 25 and the U-shaped limiting seat 21. The bottom heat-conducting pad 26 of the heat-conducting copper plate 25 can be pressed and fitted on the test chip assembled in the chip main plate 12. The adaptability of the heat dissipation structure is good for different heights of test chips.
[0028] The top rear side of the test main substrate 11 is symmetrically provided with two clamping grooves 15, the clamping grooves 15 are slidably clamped with clamping strips 23, the top ends of the two clamping strips 23 are fixedly connected with the U-shaped limiting seat 21, the inner side wall of the U-shaped limiting seat 21 is slidably connected with the chip main plate 12, the bottom end of the U-shaped limiting seat 21 is slidably connected with the test main substrate 11, and the rear end of the U-shaped limiting seat 21 is fixedly connected with a handle 22. The heat-conducting heat dissipation mechanism 2 adopts a structure design convenient for disassembly and assembly, the two sides of the bottom end of the U-shaped limiting seat 21 are fixedly connected with the clamping strips 23, and the top end of the test main substrate 11 is provided with the clamping grooves 15 for clamping the clamping strips 23. When the chip assembly in the chip main plate 12 is carried out, in order to facilitate the chip assembly work, the handle 22 of the heat-conducting heat dissipation mechanism 2 can be held to pull out the heat-conducting heat dissipation mechanism 2 assembled on the test main substrate 11.
[0029] The through holes 19 between the upper and lower sidewalls at the four corners of the test main substrate 11 are provided with mounting sleeves 110, the mounting sleeves 110 are provided with threads, and the integrated circuit test board can be fixed and mounted on the corresponding mounting station through the four mounting sleeves 110 and screws.
[0030] The working principle of the utility model is: test chips can be installed and arranged in the chip main board 12, the power supply interface seat 16 can be connected with a power supply line, the test interface seat 18 can be connected with a component to be tested, the integrated circuit (IC) can be functionally tested, performance tested and fault diagnosed, the IC can be provided with required power supply and input signal, and the output signal of the IC can be monitored to verify whether the IC meets the design specification, the heat dissipation mechanism 2 including the U-shaped limiting seat 21 mounted on the outer side of the chip main board 12, the heat conduction copper plate 25 connected with the U-shaped limiting seat 21 through the telescopic rod 24 and the spring 28 fixedly connected between the bottom end of the heat conduction copper plate 25 and the U-shaped limiting seat 21 can be used to pull the heat conduction pad 26 at the bottom of the heat conduction copper plate 25 to press and fit the test chip assembled in the chip main board 12, and the heat dissipation mechanism is suitable for test chips with different heights.
[0031] The above is only the preferred embodiment of the utility model, but the protection scope of the utility model is not limited to this, any skilled person in the art can make equivalent replacement or change according to the technical scheme and the utility model concept of the utility model within the technical range disclosed by the utility model, which should be covered in the protection scope of the utility model.
Claims
1. A test board for integrated circuits, comprising a test board body (1), the test board body (1) including a test main substrate (11); characterized in that: A power supply interface socket (16) is provided at the rear of one side of the top of the test main board (11), a voltage regulator motherboard (17) is provided at the front of one side of the top of the test main board (11), and a test interface socket (18) is provided at the middle of the other side of the top of the test main board (11). A chip motherboard (12) is provided at the top center of the test main substrate (11), and a heat dissipation mechanism (2) is provided on the outside of the chip motherboard (12). The heat dissipation mechanism (2) includes a U-shaped limiting seat (21) installed on the outside of the chip motherboard (12). The U-shaped limiting seat (21) has a telescopic rod (24) and a spring (28) fixedly connected at the four corners of its top. The movable end of the telescopic rod (24) and the upper end of the spring (28) are fixedly connected to the same heat-conducting copper plate (25). A heat-conducting pad (26) is fixedly connected to the center of the bottom wall of the heat-conducting copper plate (25).
2. A test board for integrated circuits according to claim 1, characterized in that: The chip motherboard (12) has a chip assembly slot (13) in the middle, and multiple chip pin slots (14) are provided at both the front and rear ends of the chip motherboard (12).
3. A test board for integrated circuits according to claim 1, characterized in that: The test main substrate (11) has two symmetrical slots (15) on the rear side of its top.
4. A test board for integrated circuits according to claim 3, characterized in that: The card slot (15) is slidably engaged with a card strip (23), and the top ends of the two card strips (23) are fixedly connected to a U-shaped limiting seat (21).
5. A test board for integrated circuits according to claim 1, characterized in that: The inner wall of the U-shaped limiting seat (21) is slidably connected to the chip motherboard (12), the bottom end of the U-shaped limiting seat (21) is slidably connected to the test main substrate (11), and a handle (22) is fixedly connected to the middle of the rear end of the U-shaped limiting seat (21).
6. A test board for integrated circuits according to claim 1, characterized in that: The test main substrate (11) has through holes (19) between the upper and lower side walls at the four corners. An installation sleeve (110) is fixedly installed in the through hole (19), and the installation sleeve (110) is provided with threads.
7. A test board for integrated circuits according to claim 1, characterized in that: The spring (28) is slidably sleeved on the outside of the telescopic rod (24) on its corresponding side, and the top of the heat-conducting copper plate (25) is fixedly connected with multiple heat dissipation fins (27) at equal intervals in a horizontal manner.