Photoresist baking oven
By employing non-contact double-sided radiative heating and temperature monitoring in the photoresist baking apparatus, the problem of uneven heating on the wafer surface was solved, achieving better heating uniformity and temperature control, and improving the quality of photoresist baking.
Patent Information
- Application Number
- CN202423222585.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-25
- Publication Date
- 2025-11-04
- Estimated Expiration
- 2034-12-25
AI Technical Summary
Existing photoresist baking equipment uses contact heating, which leads to uneven heating on the wafer surface, affecting subsequent processes, and the heating unevenness and temperature control are poor.
A non-contact heating method is adopted, which uses heating devices on the top and bottom sides to radiate heat to the wafer. Double-sided heating is achieved by utilizing the heat-conducting openings of the wafer carrier disk, and the heating temperature is adjusted by monitoring the temperature with sensing components.
This technology achieves uniform heating of wafers and improves the heating effect, thereby enhancing heating uniformity and temperature control accuracy and improving the quality of photoresist baking.
Smart Images
Figure CN223513437U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to wafer baking technical field, specifically, relate to a photoresist baking oven. BACKGROUND
[0002] With the rapid development of semiconductor industry, photoetching process becomes an important process means, and photoresist spin coating is an important link in photoetching process, usually adopts the mode of rotary coating to carry out. Its coating process utilizes the centrifugal force during rotation, and finally forms a layer of photoresist with uniform thickness on the wafer. Usually, the wafer surface coated with photoresist is directly placed on the heated hot plate for baking, which adopts a heating plate contact type baking method. There is a problem that the thermal conductivity of the structural material formed between the wafer and the hot plate is poor, resulting in uneven heating of the wafer surface photoetching baking, which affects the subsequent process. And in the conventional technology, the side of the wafer coated with photoresist is usually heated on one side, which also causes uneven heating of the wafer. SUMMARY
[0003] The purpose of the utility model includes providing a photoresist baking oven, which can adopt a non-contact heating means and can realize double-sided heating, uniform heating and better wafer heating effect.
[0004] Embodiments of the utility model can be implemented as follows:
[0005] In a first aspect, the utility model provides a photoresist baking oven, which comprises a baking oven body, a wafer carrier disc, a first heating device and a second heating device. The wafer carrier disc is fixedly installed in the baking oven body and is used to carry a wafer coated with photoresist. The first heating device and the second heating device are both arranged in the baking oven body, the first heating device is arranged above the wafer carrier disc, and is used to radiate and heat the upper surface of the wafer. The second heating device is arranged below the wafer carrier disc and is used to radiate and heat the lower surface of the wafer. The middle part of the wafer carrier disc is provided with a heat conduction opening, and the second heating device corresponds to the heat conduction opening.
[0006] In an optional embodiment, the wafer carrier disc comprises a mounting part and a carrying part. The mounting part is arranged at one side edge of the carrying part and is fixedly installed on the inner wall of the baking oven body. The carrying part is annular and forms the heat conduction opening in the middle part, and is used to carry the edge area of the wafer.
[0007] In an optional embodiment, a plurality of first sensing components are arranged on the carrying part, and the plurality of first sensing components are used to detect the position of the wafer and the surface temperature of the wafer.
[0008] In an optional embodiment, the plurality of accommodating grooves are evenly formed on the bearing part, and the plurality of first sensing components are correspondingly installed in the plurality of accommodating grooves and used to contact the bottom surface of the wafer.
[0009] In an optional embodiment, the bearing part is in a circular ring shape, the outer diameter of the bearing part is adapted to the outer diameter of the wafer, and the inner diameter of the bearing part is 1 / 2-5 / 7 of the outer diameter of the bearing part.
[0010] In an optional embodiment, the photoresist baking oven further comprises a mechanical arm, which is arranged in the baking oven body and on one side of the wafer loading plate and used to grab the wafer and transfer the wafer to the wafer loading plate.
[0011] In an optional embodiment, the wafer loading plate is fixedly arranged on the side wall of the baking oven body, and the baking oven body is further provided with an inlet on the side wall away from the wafer loading plate, the inlet is provided with an inlet door for loading the wafer, and the mechanical arm is further used to transfer the wafer sent into the inlet to the wafer loading plate.
[0012] In an optional embodiment, the bottom wall of the baking oven body is provided with a sliding rail, the mechanical arm is slidingly arranged on the sliding rail, the sliding rail extends from below the inlet to the wafer loading plate, and the mechanical arm can slide along the sliding rail.
[0013] In an optional embodiment, the baking oven body is provided with a mounting table, the mounting table is located below the wafer loading plate, the second heating device is embeddedly arranged on the mounting table, and the sliding rail extends to the bottom of the mounting table.
[0014] In an optional embodiment, the inner wall of the baking oven body is provided with a second sensing component, the second sensing component is located above the inlet, used to detect the position of the inlet door, and used to detect the internal temperature of the baking oven body.
[0015] The photoresist baking oven provided by the embodiment of the utility model has the beneficial effects that:
[0016] The photoresist baking oven is characterized in that the wafer carrier plate is fixedly installed in the box body, is used for carrying the wafer coated with the photoresist, the first heating device and the second heating device are both arranged in the baking box body, the first heating device is arranged above the wafer carrier plate in a spaced mode and is used for radiating and heating the upper surface of the wafer, the second heating device is arranged below the wafer carrier plate in a spaced mode and is used for radiating and heating the lower surface of the wafer, the middle part of the wafer carrier plate is provided with a heat conduction opening in a penetrating mode, and the second heating device corresponds to the heat conduction opening. BRIEF DESCRIPTION OF DRAWINGS
[0017] In order to more clearly illustrate the technical scheme in the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly introduced as follows, and it should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation to the scope, and for those skilled in the art, other related drawings can also be obtained without creative labor on the basis of the drawings.
[0018] Figure 1 The structural schematic diagram of the photoresist baking oven provided in the present embodiment is shown in the figure.
[0019] Figure 2 The structural schematic diagram of the wafer carrier plate in the first view is shown in the figure. Figure 1
[0020] The structural schematic diagram of the wafer carrier plate in the second view is shown in the figure. Figure 3 Figure 1
[0021] The photoresist baking oven is characterized in that the wafer carrier plate is fixedly installed in the box body, is used for carrying the wafer coated with the photoresist, the first heating device and the second heating device are both arranged in the baking box body, the first heating device is arranged above the wafer carrier plate in a spaced mode and is used for radiating and heating the upper surface of the wafer, the second heating device is arranged below the wafer carrier plate in a spaced mode and is used for radiating and heating the lower surface of the wafer, the middle part of the wafer carrier plate is provided with a heat conduction opening in a penetrating mode, and the second heating device corresponds to the heat conduction opening. DETAILED DESCRIPTION
[0022] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.
[0023] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of the present application.
[0024] It should be noted that: similar reference numbers and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.
[0025] In the description of the present application, it should be noted that if the terms "upper", "lower", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly placed when the product of the present application is used, only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.
[0026] In addition, if the terms "first", "second" and the like appear, they are only used for differentiation in description, and cannot be understood as indicating or implying relative importance.
[0027] As disclosed in the background art, the existing photoresist baking device usually adopts a single-sided contact hot plate for heating, and the contact between the hot plate and the wafer cannot be completely matched, thus causing the problem of uneven heating of the photoresist baking on the surface of the hot plate and the wafer, affecting the subsequent process. At the same time, due to the large depth of the existing oven, it is very inconvenient to place the wafer on the carrier plate, and it is also impossible to know whether the wafer is placed in place. Moreover, the temperature control effect of the oven is poor, and it is difficult to achieve precise heating.
[0028] In order to solve the above problems, the embodiments of the present application provide a novel photoresist baking oven, and the basic structure and working principle of the photoresist baking oven will be further introduced below. It should be noted that the features in the embodiments of the present application can be combined with each other without conflict.
[0029] Referring to Figures 1 to 3The utility model embodiment provides a photoresist baking oven 100, it can adopt non -contact heating means, and can realize double -sided heating, heating is even and wafer 200 is heated effect is better. Simultaneous wafer 200 is convenient to place, and temperature control effect is better.
[0030] The photoresist baking oven 100 provided by the utility model embodiment includes a baking oven body 110, a wafer carrier plate 130, a first heating device 150 and a second heating device 170, the wafer carrier plate 130 is fixedly installed in the baking oven body 110 and is used for carrying the wafer 200 coated with photoresist, the first heating device 150 and the second heating device 170 are both arranged in the baking oven body 110, and the first heating device 150 is arranged above the wafer carrier plate 130 at intervals and is used for radiating and heating the upper surface of the wafer 200, and the second heating device 170 is arranged below the wafer carrier plate 130 at intervals and is used for radiating and heating the lower surface of the wafer 200, wherein a heat conduction opening 131 is arranged in the middle of the wafer carrier plate 130, and the second heating device 170 corresponds to the heat conduction opening 131.
[0031] The photoresist baking device provided by the utility model embodiment utilizes the first heating device 150 and the second heating device 170 to radiate and heat the two side surfaces of the wafer 200 on the wafer carrier plate 130 from the upper side and the lower side respectively in an interval mode, can avoid the problem of uneven heating caused by direct contact, improves the uniformity of heating, and the wafer carrier plate 130 is provided with the heat conduction opening 131, so that the wafer 200 can be directly radiated and heated from the upper side and the lower side, and the heating effect of the wafer 200 can be improved by the combined heating of the two sides, and the uniformity of heating of the wafer 200 is further improved, so that the wafer 200 can be evenly heated and has a better heating effect.
[0032] In some embodiments, the wafer carrier plate 130 includes a mounting portion 133 and a carrying portion 135, the mounting portion 133 is arranged at one side edge of the carrying portion 135 and is fixedly installed on the inner wall of the baking oven body 110, the carrying portion 135 is annular and forms the heat conduction opening 131 in the middle and is used for carrying the edge region of the wafer 200. Specifically, the mounting portion 133 and the carrying portion 135 are integrally formed, and the mounting portion 133 is fixedly installed on the inner wall of the baking oven body 110, so as to realize the fixed support of the wafer carrier plate 130. The middle of the carrying portion 135 is formed with the heat conduction opening 131, so that the bottom side of the wafer 200 can be exposed on the lower side, and the edge region of the wafer 200 can be supported, so as to guarantee the carrying effect and the radiating and heating effect on the lower side.
[0033] It should be noted that the first heating device 150 and the second heating device 170 in the embodiment are common heating devices, for example, in the form of resistance wire heating or in the form of graphite sheet hot plate heating, and the specific type of the first heating device 150 and the second heating device 170 is not limited herein.
[0034] In some embodiments, the plurality of first sensing components 137 are arranged on the bearing portion 135 and are used to detect the position of the wafer 200 and the surface temperature of the wafer 200. Specifically, the first sensing component 137 includes a first photoelectric sensor and a first temperature sensor, which are integrated in the same housing. The first photoelectric sensor can sense the position of the wafer 200, so as to know in real time whether the wafer 200 is placed in place. The first temperature sensor can monitor the lower surface temperature of the wafer 200, so as to monitor the heating temperature of the wafer 200 in real time, and regulate the heating temperature of the first heating device 150 and the second heating device 170 based thereon.
[0035] Further, the second heating device 170 can preheat the wafer 200 and the photoresist layer covering the surface of the wafer 200, perform gelation reaction on the photoresist polymer material, and perform thermal curing on the photoresist (the photoresist layer is a semi-cured film, the heating temperature is 0-150°C, and the heating time is 10-15 minutes). Then, the first heating device 150 is used for heating (the heating temperature is 150-350°C, and the heating time is 20-30 minutes), so that the photoresist layer reaches a completely cured state.
[0036] In some embodiments, a plurality of accommodating grooves 139 are uniformly arranged on the bearing portion 135, and the plurality of first sensing components 137 are correspondingly arranged in the plurality of accommodating grooves 139 and are used to contact the bottom surface of the wafer 200. By arranging the accommodating grooves 139, the first sensing components 137 can be accommodated on the bearing portion 135, so as to avoid interference with the placement of the wafer 200 and ensure that the wafer 200 can be smoothly placed on the wafer carrier disk 130.
[0037] Further, the bearing portion 135 is in the form of a circular ring, the outer diameter of the bearing portion 135 is adapted to the outer diameter of the wafer 200, and the inner diameter of the bearing portion 135 is 1 / 2-5 / 7 of the outer diameter of the bearing portion 135. Preferably, the inner diameter of the bearing portion 135 is 4 / 5 of the outer diameter, so as to uniformly radiate and conduct heat to most of the area of the wafer 200 while ensuring the supporting effect.
[0038] In some embodiments, the photoresist baking oven 100 further comprises a mechanical arm 190 arranged in the baking oven body 110 and arranged on one side of the wafer loading plate 130, used to grab the wafer 200 and transfer the wafer 200 to the wafer loading plate 130. By arranging the mechanical arm 190 in the baking oven body 110, the wafer 200 is placed from the outside, and the mechanical arm 190 can quickly and smoothly place the wafer 200 on the wafer loading plate 130.
[0039] In some embodiments, the wafer loading plate 130 is fixedly arranged on the side wall of the baking oven body 110, and the baking oven body 110 is further provided with an inlet 111 on the side wall away from the wafer loading plate 130, and the inlet 111 is provided with an inlet door 113 for loading the wafer 200, and the mechanical arm 190 is further used to transfer the wafer 200 sent to the inlet 111 to the wafer loading plate 130. Specifically, the inlet door 113 can be an electrically controlled door, and the inlet 111 and the wafer loading plate 130 are arranged on the left and right sides of the baking oven body 110 respectively, so that the heating position is located in the deep part of the baking oven body 110, and the heating effect is better. The mechanical arm 190 can realize the transfer of the wafer 200 between the inlet 111 and the wafer loading plate 130, which is very convenient.
[0040] Further, the bottom wall of the baking oven body 110 is provided with a sliding rail 115, and the mechanical arm 190 is slidingly arranged on the sliding rail 115, the sliding rail 115 extends from below the inlet 111 to the wafer loading plate 130, and the mechanical arm 190 can slide along the sliding rail 115. Specifically, the mechanical arm 190 is provided with a sliding block on the bottom side, and cooperates with a driving motor to realize sliding of the mechanical arm 190 on the sliding rail 115, so as to realize transfer of the mechanical arm 190 between the inlet 111 and the wafer loading plate 130.
[0041] It should be noted that the basic structure and working principle of the mechanical arm 190 here can refer to the wafer 200 transfer mechanical arm in the prior art, for example, the wafer 200 can be grabbed and placed by the suction cup, which will not be introduced here.
[0042] In some embodiments, the baking oven body 110 is provided with a mounting table 117, the mounting table 117 is located below the wafer loading plate 130, and the second heating device 170 is embedded and mounted on the mounting table 117, and the sliding rail 115 extends to the bottom of the mounting table 117. Specifically, the first heating device 150 is fixedly arranged on the top wall of the baking oven body 110, and the second heating device 170 can be embedded on the mounting table 117, and the design of the mounting table 117 can shorten the distance between the second heating device 170 and the wafer loading plate 130, and improve the heat radiation effect.
[0043] In some embodiments, the inner wall of the baking chamber 110 is provided with a second induction assembly 119 for detecting the position of the material inlet door 113 and detecting the internal temperature of the baking chamber 110. Specifically, the second induction assembly 119 includes a second photoelectric sensor located above the material inlet 111 and a second temperature sensor located on the side wall near the wafer carrier disc 130, which can monitor the position of the material inlet door 113 to monitor whether the baking chamber 110 is sealed in place, and the second temperature sensor can detect the internal temperature of the baking chamber 110, and adjust the heating temperature of the first heating device 150 and the second heating device 170 accordingly, to avoid the baking chamber 110 being heated to a too high temperature.
[0044] The working principle of the photoresist baking oven 100 provided by the embodiment of the utility model is as follows: the wafer 200 is loaded by the material inlet 111, the wafer 200 to be baked is grabbed by the mechanical arm 190 and enters the baking chamber 110, the mechanical arm 190 moves through the slide rail 115 and places the wafer 200 on the wafer carrier disc 130, the wafer carrier disc 130 is designed with a heat conduction opening 131 and a first induction assembly 137, after the wafer 200 is placed on the wafer carrier disc 130 and sensed by the first induction assembly 137, the second heating device 170 and the first heating device 150 heat the wafer 200 respectively, the second heating device 170 is preheated first, the polymer material in the photoresist is crosslinked, the photoresist is heat cured (the photoresist is a semi-cured film, the heating temperature is 0-150 degrees, and the heating time is 10-15 minutes), then the wafer 200 is heated again by the first heating device 150 (150-350 degrees, 20-30 minutes), so that the photoresist is completely cured and the baking is completed. The second induction assembly 119 senses the internal temperature of the baking chamber 110, so as to calculate the actual baking temperature in the oven, and the first induction assembly 137 senses the temperature of the wafer carrier disc 130, and the temperature adjustment of the first heating device 150 and the second heating device 170 can be adjusted by the detection temperature of the first induction assembly 137 and the second induction assembly 119.
[0045] In summary, the photoresist baking oven 100 provided by the embodiment has the wafer carrier plate 130 fixedly installed in the oven body for carrying the wafer 200 coated with photoresist, the first heating device 150 and the second heating device 170 are both arranged in the oven body 110, the first heating device 150 is arranged above the wafer carrier plate 130 for radiating and heating the upper surface of the wafer 200, and the second heating device 170 is arranged below the wafer carrier plate 130 for radiating and heating the lower surface of the wafer 200, wherein the middle part of the wafer carrier plate 130 is provided with the heat conduction opening 131, and the second heating device 170 corresponds to the heat conduction opening 131. Compared with the prior art, the first heating device 150 and the second heating device 170 are arranged on the upper and lower sides of the wafer carrier plate 130 respectively to radiate and heat the two side surfaces of the wafer 200 on the wafer carrier plate 130, which can avoid the uneven heating caused by direct contact, improve the uniformity of heating, and improve the heating effect of the wafer 200 and the uniformity of heating of the wafer 200.
[0046] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, any skilled person in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered within the protection scope of the present application.
Claims
1. A photoresist baking oven characterized by, The photoresist baking oven comprises a baking box body, a wafer carrier plate, a first heating device and a second heating device, the wafer carrier plate is fixedly installed in the baking box body and used for carrying a wafer coated with photoresist, the first heating device and the second heating device are both arranged in the baking box body, the first heating device is arranged above the wafer carrier plate and used for radiating and heating the upper surface of the wafer, and the second heating device is arranged below the wafer carrier plate and used for radiating and heating the lower surface of the wafer.
2. The photoresist oven of claim 1, wherein, The wafer carrier plate comprises a mounting part and a carrying part, the mounting part is arranged at one side edge of the carrying part and fixedly installed on the inner wall of the baking box body, the carrying part is annular and forms the heat conduction opening in the middle part and used for carrying the edge area of the wafer.
3. The photoresist oven of claim 2, wherein, A plurality of first sensing components are arranged on the carrying part and used for detecting the position of the wafer and the surface temperature of the wafer.
4. The photoresist oven of claim 3, wherein, A plurality of accommodating grooves are uniformly arranged on the carrying part, and the first sensing components are one-to-one correspondingly installed in the accommodating grooves and used for contacting the bottom surface of the wafer.
5. The photoresist oven of claim 2, wherein, The carrying part is annular, the outer diameter of the carrying part is adapted to the outer diameter of the wafer, and the inner diameter of the carrying part is 1 / 2-5 / 7 of the outer diameter of the carrying part.
6. The photoresist oven of claim 1, wherein, The photoresist baking oven further comprises a mechanical arm, the mechanical arm is arranged in the baking box body and at one side of the wafer carrier plate and used for grabbing the wafer and transferring the wafer to the wafer carrier plate.
7. The photoresist oven of claim 6, wherein, The wafer carrier plate is fixedly arranged on the side wall of the baking box body, and a feeding port is further arranged on the side wall of the baking box body away from the wafer carrier plate, a feeding door is arranged at the feeding port and used for loading the wafer, and the mechanical arm is further used for transferring the wafer sent into the feeding port to the wafer carrier plate.
8. The photoresist oven of claim 7, wherein, A sliding rail is arranged on the bottom wall of the baking box body, the mechanical arm is slidingly arranged on the sliding rail, the sliding rail extends from below the feeding port to the wafer carrier plate, and the mechanical arm can slide along the sliding rail.
9. The photoresist oven of claim 8, wherein, An installation table is arranged in the baking box body, the installation table is below the wafer carrier plate, the second heating device is embeddedly installed on the installation table, and the sliding rail extends to the bottom of the installation table.
10. The photoresist oven of claim 7, wherein, A second sensing component is arranged on the inner wall of the baking box body and used for detecting the position of the feeding door and the internal temperature of the baking box body.