Thickness adjustment control structure for chip packaging
By combining the drive components and the scale lines, precise control of the distance between the chip and the circuit board is achieved, solving the problem of difficult adjustment of the packaging thickness in the existing technology and improving the packaging accuracy and reliability.
Patent Information
- Application Number
- CN202422950122.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-02
- Publication Date
- 2025-11-04
- Estimated Expiration
- 2034-12-02
AI Technical Summary
In existing technologies, it is difficult to precisely control the packaging thickness between the chip and the circuit board, mainly because the adhesive dots are liquid, making distance adjustment difficult.
The structure design employs a combination of drive components and scale lines. Through the combination of rotating rods, bevel gears, and screws, the precise movement of the carrier plate is achieved. Combined with pointer readings, this ensures accurate adjustment of the distance between the chip and the circuit board.
It enables precise control of the distance between the chip and the circuit board, improving the accuracy and reliability of packaging and preventing the chip from falling off.
Smart Images
Figure CN223513937U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip packaging technology, and in particular to a thickness adjustment control structure for chip packaging. Background Technology
[0002] Chip packaging is an important step in the semiconductor manufacturing process. It involves encapsulating bare chips (die) by injecting encapsulating adhesive between the chip and the circuit board after the chip is mounted on the circuit board.
[0003] During the packaging process, the distance between the chip and the circuit board needs to be adjusted. Currently, the technology involves applying adhesive to four points on the circuit board first, and then placing the four corners of the chip on the four adhesive points. Since the adhesive points are liquid, it is difficult to control the thickness of the adhesive points, making it difficult to control the thickness of the package. Utility Model Content
[0004] To address the shortcomings of existing technologies, this invention provides a thickness adjustment control structure for chip packaging, which solves the problems mentioned in the background section.
[0005] To achieve the above objectives, the present invention adopts the following technical solution:
[0006] A thickness adjustment control structure for chip packaging includes a circuit board and a chip. A first double-sided adhesive is bonded to the top of the circuit board, and a mounting bracket is bonded to the first double-sided adhesive. A driving component is disposed inside the mounting bracket, and a connecting plate is disposed inside the mounting bracket through the driving component. A carrier plate is fixedly mounted on the top of the connecting plate, and a second double-sided adhesive is bonded to the top of the carrier plate. The chip is bonded to the second double-sided adhesive.
[0007] Preferably, the drive assembly includes a rotating rod rotatably connected inside the mounting bracket, a first bevel gear fixedly mounted on the surface of the rotating rod, a second bevel gear meshing with the surface of the first bevel gear, a screw fixedly mounted inside the second bevel gear, a fixed block rotatably connected to the surface of the screw, the fixed block being fixedly connected to the mounting bracket, a movable block threadedly connected to the surface of the screw, the movable block being fixedly connected to a connecting plate, a guide rod slidably connected inside the movable block, and the guide rod being fixedly connected to the fixed block.
[0008] Preferably, a knob is fixedly installed on the front side of the rotating rod, and the surface of the knob is provided with anti-slip texture.
[0009] Preferably, a mounting post is fixedly installed at the bottom of the chip, and an anti-detachment plate is fixedly installed at the bottom of the mounting post.
[0010] Preferably, the top of the circuit board is injected with encapsulating adhesive, which is located between the chip and the circuit board.
[0011] Preferably, the mounting bracket has scale lines on its surface, and the connecting plate has a pointer fixedly mounted on its surface.
[0012] Preferably, there are multiple anti-detachment plates, and the multiple anti-detachment plates are distributed in an array.
[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: The chip packaging thickness adjustment control structure attaches the first double-sided adhesive at the bottom of the mounting bracket to a suitable position on the circuit board. Rotating the drive assembly allows the connecting plate to move up and down, which in turn moves the carrier plate up and down. The height of the carrier plate is determined by the change in the pointer reading on the scale line until the carrier plate moves to the appropriate height. Then, the chip is attached to the second double-sided adhesive on the top of the carrier plate. Subsequently, encapsulation glue is injected between the circuit board and the chip for encapsulation. This achieves the goal of precisely controlling the distance between the chip and the circuit board. Furthermore, the encapsulation is performed after adjusting the distance between the chip and the circuit board, thus enabling better encapsulation. Attached Figure Description
[0014] Figure 1 This is a three-dimensional perspective view of the present invention;
[0015] Figure 2 This is a left view of a partial structure of this utility model;
[0016] Figure 3 This utility model Figure 2 Enlarged view of point A in the middle;
[0017] Figure 4 This is a left sectional view of a partial structure of the present invention;
[0018] Figure 5 This utility model Figure 4 Enlarged view of point B in the middle.
[0019] In the diagram: 1. Circuit board; 2. Chip; 3. Encapsulating adhesive; 4. First double-sided adhesive; 5. Mounting bracket; 6. Rotating rod; 7. Knob; 8. First bevel gear; 9. Second bevel gear; 10. Screw; 11. Fixing block; 12. Moving block; 13. Guide rod; 14. Connecting plate; 15. Bearing plate; 16. Second double-sided adhesive; 17. Mounting post; 18. Anti-detachment plate; 19. Scale line; 20. Pointer. Detailed Implementation
[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0021] Reference Figure 1-5A thickness adjustment control structure for chip packaging includes a circuit board 1 and a chip 2. A first double-sided adhesive 4 is bonded to the top of the circuit board 1, and a mounting bracket 5 is bonded to the first double-sided adhesive 4. A driving assembly is disposed inside the mounting bracket 5, and a connecting plate 14 is disposed inside the mounting bracket 5 through the driving assembly. The driving assembly includes a rotating rod 6 rotatably connected inside the mounting bracket 5. A knob 7 is fixedly mounted on the front side of the rotating rod 6. The surface of the knob 7 is provided with anti-slip texture to facilitate the rotation of the rotating rod 6. A first bevel gear 8 is fixedly mounted on the surface of the rotating rod 6, and a second bevel gear 9 is meshed on the surface of the first bevel gear 8. A screw 10 is fixedly mounted inside the second bevel gear 9, and a fixing block 11 is rotatably connected to the surface of the screw 10. The fixing block 11 is connected to the mounting bracket. 5. Fixed connection: A movable block 12 is threaded onto the surface of the screw 10. The movable block 12 is fixedly connected to the connecting plate 14. A guide rod 13 is slidably connected inside the movable block 12. The guide rod 13 is fixedly connected to the fixed block 11. Rotating the knob 7 causes the rotating rod 6 to rotate, which in turn causes the first bevel gear 8 to rotate, the second bevel gear 9 to rotate, and the screw 10 to rotate. This causes the movable block 12 to move up and down along the guide rod 13, which in turn causes the connecting plate 14 to move up and down. This facilitates the adjustment of the height of the carrier plate 15, thereby facilitating the adjustment of the distance between the chip 2 and the circuit board 1, and thus the adjustment of the package thickness. The carrier plate 15 is fixedly mounted on the top of the connecting plate 14, and a second double-sided adhesive 16 is adhered to the top of the carrier plate 15. Chip 2 is bonded to the second double-sided adhesive 16. Encapsulating adhesive 3 is injected onto the top of circuit board 1, positioned between chip 2 and circuit board 1 for easy encapsulation of chip 2. A mounting post 17 is fixedly installed at the bottom of chip 2, and an anti-detachment plate 18 is fixedly installed at the bottom of the mounting post 17. Multiple anti-detachment plates 18 are arranged in an array. After encapsulation of chip 2, the mounting post 17 and anti-detachment plates 18 are located inside the encapsulating adhesive 3, thus preventing chip 2 from easily detaching. A scale line 19 is provided on the surface of the mounting bracket 5, and a pointer 20 is fixedly installed on the surface of the connecting plate 14. By observing the reading changes of the pointer 20 on the scale line 19, the carrier plate 15 can be precisely controlled. The chip packaging uses a thickness adjustment control structure to adjust the height. The first double-sided adhesive 4 at the bottom of the mounting bracket 5 is attached to a suitable position on the circuit board 1. Rotating the drive assembly allows the connecting plate 14 to move up and down, which in turn moves the carrier plate 15 up and down. The height adjustment of the carrier plate 15 is determined by the change in the reading of the pointer 20 on the scale line 19 until the carrier plate 15 moves to the appropriate height. Then, the chip 2 is attached to the second double-sided adhesive 16 on the top of the carrier plate 15. Subsequently, encapsulation glue 3 is injected between the circuit board 1 and the chip 2 for encapsulation. This achieves the goal of precisely controlling the distance between the chip 2 and the circuit board 1. Furthermore, the encapsulation is performed after adjusting the distance between the chip 2 and the circuit board 1, which allows for better encapsulation.
[0022] In use: Attach the first double-sided adhesive 4 at the bottom of the mounting bracket 5 to a suitable position on the circuit board 1. Rotate the knob 7 to rotate the rotating rod 6, causing the first bevel gear 8 to rotate, the second bevel gear 9 to rotate, and the screw 10 to rotate. This causes the moving block 12 to move up and down along the guide rod 13, driving the connecting plate 14 to move up and down, and driving the carrier plate 15 to move up and down. The height of the carrier plate 15 is determined by the change in the reading of the pointer 20 on the scale line 19 until the carrier plate 15 moves to a suitable height. Then, attach the chip 2 to the second double-sided adhesive 16 on the top of the carrier plate 15. Then, inject encapsulating glue 3 between the circuit board 1 and the chip 2 for encapsulation. The injected encapsulating glue 3 will flow into the connection between the rotating rod 6 and the mounting bracket 5. After the glue dries, it can play a fixing role.
[0023] In summary, this chip packaging thickness adjustment control structure attaches the first double-sided adhesive 4 at the bottom of the mounting bracket 5 to a suitable position on the circuit board 1. Rotating the drive assembly allows the connecting plate 14 to move up and down, which in turn moves the carrier plate 15 up and down. The height of the carrier plate 15 is determined by the change in the reading of the pointer 20 on the scale line 19 until the carrier plate 15 moves to the appropriate height. Then, the chip 2 is attached to the second double-sided adhesive 16 on the top of the carrier plate 15. Subsequently, encapsulation adhesive 3 is injected between the circuit board 1 and the chip 2 for encapsulation. This achieves the goal of precisely controlling the distance between the chip 2 and the circuit board 1. Furthermore, adjusting the distance between the chip 2 and the circuit board 1 before encapsulation allows for better encapsulation and solves the problems mentioned in the background art.
[0024] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.
[0025] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A thickness adjustment control structure for chip packaging, comprising a circuit board (1) and a chip (2), characterized in that, The circuit board (1) has a first double-sided adhesive (4) attached to its top. The first double-sided adhesive (4) has a mounting bracket (5) attached to it. The mounting bracket (5) has a drive assembly inside it. The mounting bracket (5) has a connecting plate (14) attached to it through the drive assembly. The connecting plate (14) has a carrier plate (15) fixedly mounted on its top. The carrier plate (15) has a second double-sided adhesive (16) attached to its top. The chip (2) is attached to the second double-sided adhesive (16).
2. The thickness adjustment control structure for chip packaging according to claim 1, characterized in that, The drive assembly includes a rotating rod (6) rotatably connected inside the mounting bracket (5). A first bevel gear (8) is fixedly mounted on the surface of the rotating rod (6). A second bevel gear (9) is meshed on the surface of the first bevel gear (8). A screw (10) is fixedly mounted inside the second bevel gear (9). A fixing block (11) is rotatably connected to the surface of the screw (10). The fixing block (11) is fixedly connected to the mounting bracket (5). A moving block (12) is threadedly connected to the surface of the screw (10). The moving block (12) is fixedly connected to the connecting plate (14). A guide rod (13) is slidably connected inside the moving block (12). The guide rod (13) is fixedly connected to the fixing block (11).
3. The thickness adjustment control structure for chip packaging according to claim 2, characterized in that, A knob (7) is fixedly installed on the front side of the rotating rod (6), and the surface of the knob (7) is provided with anti-slip texture.
4. The thickness adjustment control structure for chip packaging according to claim 1, characterized in that, The chip (2) is fixedly mounted with a mounting post (17) at the bottom, and an anti-detachment plate (18) is fixedly mounted at the bottom of the mounting post (17).
5. The thickness adjustment control structure for chip packaging according to claim 1, characterized in that, The top of the circuit board (1) is injected with encapsulating adhesive (3), which is located between the chip (2) and the circuit board (1).
6. The thickness adjustment control structure for chip packaging according to claim 1, characterized in that, The mounting bracket (5) has scale lines (19) on its surface, and the connecting plate (14) has a pointer (20) fixedly mounted on its surface.
7. The thickness adjustment control structure for chip packaging according to claim 4, characterized in that, The number of anti-detachment plates (18) is multiple, and the multiple anti-detachment plates (18) are distributed in an array.