Electronic package
By defining thermal interface material regions of different materials on the non-functional surfaces of electronic components and combining them with heat dissipation structures, the delamination problem between the thermal interface material and the heat sink was solved, resulting in better heat dissipation and structural stability.
Patent Information
- Application Number
- CN202422842483.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-11-13
- Filing Date
- 2024-11-21
- Publication Date
- 2025-11-04
- Estimated Expiration
- 2034-11-21
AI Technical Summary
The existing thermal interface material does not adhere tightly enough to the heat sink, resulting in delamination and affecting the heat dissipation effect.
A first region and a second region are defined on the non-functional surface of the electronic component. Different thermally conductive interface materials (silicone substrate and epoxy resin substrate) are used respectively, and a heat dissipation structure is formed by dispensing to enhance adhesion and flatness.
It improves the adhesion of the heat dissipation structure and the flatness of the overall structure, effectively dissipates heat, reduces stress and warping, and enhances the heat dissipation effect.
Smart Images
Figure CN223513958U_ABST
Abstract
Description
Technical Field
[0001] This application relates to a semiconductor package, and more particularly to an electronic package with a heat dissipation structure. Background Technology
[0002] With the rise and rapid development of various applications and technologies requiring high-speed computing, such as e-sports games, high-resolution audio-visual multimedia and autonomous driving, as well as the requirement for miniaturization of related devices, the number of components contained in semiconductor chips (ICs) with packaging structures such as Flip-Chip Ball Grid Array (FCBGA) is increasing day by day, and the processing and instruction cycles are getting faster and faster, resulting in more and more heat generated, and the requirements for heat dissipation structures are also getting higher and higher.
[0003] Figure 1 This is a cross-sectional schematic diagram of an existing semiconductor package 1. Figure 1 As shown, the semiconductor package 1 includes a packaging substrate 10, a semiconductor chip 11 mounted on the upper side of the packaging substrate 10 in a flip-chip manner, and a heat sink 12. The heat sink 12 is disposed on the upper surface of the semiconductor chip 11 through a thermal interface material (TIM) 13.
[0004] However, considering the electrical insulation, thermal conductivity and flexibility properties of the aforementioned thermal interface material 13, manufacturers generally use a silicone-based thermal interface material 13. However, the tightness of the fit between the thermal interface material 13 and the heat sink 12 is insufficient (especially at the corners), which makes it easy for the thermal interface material 13 and the heat sink 12 to delaminate.
[0005] Therefore, overcoming the problems of the existing technology has become an urgent issue that needs to be addressed. Utility Model Content
[0006] In view of the various deficiencies of the prior art, this application provides an electronic package, including: a carrier structure having opposing first surfaces and second surfaces; an electronic component having opposing active surfaces and non-active surfaces, with the active surface disposed on the first surface of the carrier structure and electrically connected to the carrier structure, wherein the non-active surface defines a first region and a second region; a first thermally conductive interface material disposed on the first region; a second thermally conductive interface material disposed on the second region; and a heat dissipation structure disposed on the first thermally conductive interface material and the second thermally conductive interface material.
[0007] This application also provides a method for manufacturing an electronic package, comprising: disposing an electronic component on a carrier structure, wherein the carrier structure has opposing first surfaces and second surfaces, the electronic component has opposing active surfaces and non-active surfaces, the electronic component is disposed on the first surface with the active surface and electrically connected to the carrier structure, and the non-active surface defines a first region and a second region; disposing a first thermally conductive interface material on the first region; disposing a second thermally conductive interface material on the second region; and disposing a heat dissipation structure on the first thermally conductive interface material and the second thermally conductive interface material.
[0008] In the aforementioned electronic package and its manufacturing method, the material of the first thermal interface material is different from the material of the second thermal interface material.
[0009] In the aforementioned electronic package and its manufacturing method, the first region is located in the central region of the non-functional surface, and the second region is located in the peripheral region of the non-functional surface.
[0010] In the aforementioned electronic package and its manufacturing method, the central region is located at the center of the non-functional surface and may be polygonal or cross-shaped, while the peripheral region is located at the corner of the non-functional surface and may be L-shaped or rectangular.
[0011] In the aforementioned electronic package and its manufacturing method, the central region is located at the center of the non-functional surface and may be rectangular, while the peripheral region is located at the opposite two edges of the non-functional surface and may be elongated.
[0012] In the aforementioned electronic package and its manufacturing method, the first thermal interface material is a thermal interface material based on silicone, and the second thermal interface material is a thermal interface material based on epoxy resin.
[0013] In the aforementioned electronic package and its manufacturing method, the first thermally conductive interface material and the second thermally conductive interface material are formed on the non-functional surface of the electronic component by dispensing.
[0014] In the aforementioned electronic package and its manufacturing method, the heat dissipation structure has a top plate and a support foot extending from the top plate.
[0015] In the aforementioned electronic package and its manufacturing method, the support foot is bonded to the first surface of the support structure surrounding the electronic component by an adhesive layer.
[0016] In the aforementioned electronic package and its manufacturing method, the top sheet is combined with the first thermally conductive interface material and the second thermally conductive interface material.
[0017] Therefore, the electronic package of this application mainly defines a first region (e.g., a central region) and a second region (e.g., a peripheral region) on the non-functional surface of the electronic component. The first thermally conductive interface material (e.g., a thermally conductive interface material with better elasticity based on silicone) is disposed in the first region to reduce stress and warping. The second thermally conductive interface material (e.g., a thermally conductive interface material with high adhesion based on epoxy resin) is disposed in the second region to strengthen the adhesion with the heat dissipation structure and improve the overall structural flatness. This allows the heat generated during the operation of the electronic component to be effectively dissipated to the outside through the first thermally conductive interface material, the second thermally conductive interface material, and the heat dissipation structure. Attached Figure Description
[0018] Figure 1 This is a cross-sectional schematic diagram of an existing semiconductor package.
[0019] Figures 2A to 2C This is a cross-sectional schematic diagram illustrating the manufacturing method of the electronic package of this application.
[0020] Figures 3A to 3C This is a partial top view of the electronic package of this application.
[0021] Explanation of reference numerals in the attached figures
[0022] 1 Semiconductor package
[0023] 10 Packaging substrate
[0024] 11 Semiconductor chips
[0025] 12 Heat sinks
[0026] 13 Thermal interface materials
[0027] 2 Electronic Packages
[0028] 21 Load-bearing structure
[0029] 211 First Surface
[0030] 212 Second Surface
[0031] 213 Adhesive layer
[0032] 22 Electronic Components
[0033] 22a Working surface
[0034] 22b Non-operating surface
[0035] 220 conductive bump
[0036] 221 base rubber
[0037] 23 First thermal interface material
[0038] 24 Second thermal interface material
[0039] 25 Heat dissipation structure
[0040] 251 Top Film
[0041] 252 Supporting feet
[0042] X First Region
[0043] Y Second region. Detailed Implementation
[0044] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.
[0045] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this application, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.
[0046] Please see Figures 2A to 2C This is a cross-sectional schematic diagram of the electronic package and its manufacturing method according to this application.
[0047] like Figure 2A As shown, at least one electronic component 22 is disposed on a support structure 21 and the electronic component 22 is electrically connected to the support structure 21.
[0048] The carrier structure 21 is, for example, a packaged substrate with a circuit layer, a silicon interposer (TSI) with through-siliconvia (TSV), or other plate types, and has opposing first surfaces 211 and second surfaces 212. The circuit layer is, for example, a redistribution layer (RDL).
[0049] It should be understood that the load-bearing structure 21 may also be the substrate, component or structure of other load-bearing components, such as lead frames or other boards with metal wiring, and is not limited to the above.
[0050] Electronic component 22 may be an active component, a passive component, a package module, or a combination thereof. An active component may be, for example, a semiconductor chip, and a passive component may be, for example, a resistor, a capacitor, or an inductor.
[0051] In this embodiment, the electronic component 22 is a semiconductor chip having opposing active surfaces 22a and non-active surfaces 22b. The active surface 22a is electrically connected to the carrier structure 21 via multiple conductive bumps 220 using a flip-chip method. An adhesive base 221 is formed between the first surface 211 of the carrier structure 21 and the active surface 22a to cover each of the conductive bumps 220. However, the method of electrically connecting the electronic component 22 to the carrier structure 21 is not limited to the above.
[0052] In addition, an adhesive layer 213 is provided on the periphery of the first surface 211 of the support structure 21. The adhesive layer 213 is formed on the periphery of the first surface 211 of the support structure 21, for example, by dispensing.
[0053] like Figure 2B As shown, a first thermal interface material 23 and a second thermal interface material 24 are disposed on the non-functional surface 22b of the electronic component 22, wherein the material of the first thermal interface material 23 is different from the material of the second thermal interface material 24.
[0054] Please refer to the following at the same time. Figures 3A to 3C This is a top view of the supporting structure 21 and the electronic component 22. In this embodiment, the non-functional surface 22b of the electronic component 22 defines adjacent first region X and second region Y, such that the first thermally conductive interface material 23 is disposed in the first region X, and the second thermally conductive interface material 24 is disposed in the second region Y.
[0055] like Figure 3A and 3B As shown, the first region X of the non-functional surface 22b of the electronic component 22 is located in the central region, while the second region Y is located in the peripheral region. For example, the central region is located at the center of the non-functional surface 22b of the electronic component and may be polygonal or cross-shaped, while the peripheral region is located at the corner of the non-functional surface 22b of the electronic component and may be L-shaped or rectangular.
[0056] like Figure 3CAs shown, the first region X of the non-functional surface 22b of the electronic component 22 is located in the central region, while the second region Y is located in the peripheral region. For example, the central region is located at the center of the non-functional surface 22b of the electronic component and may be rectangular, while the peripheral region is located on the opposite two edges of the non-functional surface 22b of the electronic component (e.g., the top and bottom edges or the left and right edges) and may be elongated.
[0057] In this embodiment, the first thermally conductive interface material 23 is, for example, a silicone-based thermally conductive interface material (TIM) with better elasticity; the second thermally conductive interface material 24 is, for example, an epoxy-based thermally conductive interface material (TIM) with higher adhesion.
[0058] Furthermore, the first thermally conductive interface material 23 and the second thermally conductive interface material 24 can be formed on the non-functional surface 22b of the electronic component 22 by dispensing. The first thermally conductive interface material 23 can be laid first and then the second thermally conductive interface material 24 can be laid, or the second thermally conductive interface material 24 can be laid first and then the first thermally conductive interface material 23 can be laid, or the first thermally conductive interface material 23 and the second thermally conductive interface material 24 can be laid simultaneously.
[0059] like Figure 2C As shown, a heat dissipation structure 25 is provided on the first thermally conductive interface material 23 and the second thermally conductive interface material 24, and a thermal operation is performed to form an inter-metallic compound (IMC) layer (not shown) between the first thermally conductive interface material 23, the second thermally conductive interface material 24 and the heat dissipation structure 25. This results in a stable bond between the heat dissipation structure 25, the first thermally conductive interface material 23 and the second thermally conductive interface material 24, and the electronic component 22, thereby improving the heat dissipation effect and obtaining the electronic package 2 of this application.
[0060] The heat dissipation structure 25 may be, for example, a heat sink, a heat dissipation lid, or other components or structures with equivalent functions. In this embodiment, a heat dissipation lid is used as an example. The heat dissipation structure 25 has a top plate 251 and a support foot 252 extending from the top plate 251. The support foot 252 is bonded and fixed to the first surface 211 of the support structure 21 surrounding the electronic component 22 by an adhesive layer 213, thereby bonding the top plate 251 with the first thermally conductive interface material 23 and the second thermally conductive interface material 24.
[0061] Through the aforementioned process, this application also discloses an electronic package 2, which includes a carrier structure 21, an electronic component 22 disposed on the carrier structure 21, a first thermal interface material 23 and a second thermal interface material 24 disposed on the electronic component 22, and a heat dissipation structure 25 disposed on the first thermal interface material 23 and the second thermal interface material 24.
[0062] The carrier structure 21 is, for example, a package substrate with a circuit layer, and has a first surface 211 and a second surface 212 opposite to each other.
[0063] The electronic component 22 is a semiconductor chip with an active surface 22a and a non-active surface 22b. The active surface 22a is electrically connected to the support structure 21 by a flip-chip method through a plurality of conductive bumps 220. An adhesive 221 is formed between the first surface 211 of the support structure 21 and the active surface 22a to cover each of the conductive bumps 220.
[0064] The non-functional surface 22b of the electronic component 22 defines a first region X (e.g., a central region) and a second region Y (e.g., a peripheral region), such that the first thermally conductive interface material 23 is disposed in the first region X, and the second thermally conductive interface material 24 is disposed in the second region Y. The first thermally conductive interface material 23 is, for example, a silicone-based thermally conductive interface material with good elasticity, and the second thermally conductive interface material 24 is, for example, an epoxy resin-based thermally conductive interface material with high adhesion.
[0065] The heat dissipation structure 25 has a top plate 251 and a support foot 252 extending from the top plate 251. The support foot 252 is bonded and fixed to the first surface 211 of the support structure 21 around the electronic component 22 by an adhesive layer 213. The top plate 251 is bonded to the first thermal interface material 23 and the second thermal interface material 24.
[0066] In summary, the electronic package of this application mainly defines a first region (e.g., a central region) and a second region (e.g., a peripheral region) on the non-functional surface of the electronic component. The first thermally conductive interface material (e.g., a thermally conductive interface material with better elasticity based on silicone) is disposed in the first region to reduce stress and warping. The second thermally conductive interface material (e.g., a thermally conductive interface material with high adhesion based on epoxy resin) is disposed in the second region to strengthen the adhesion with the heat dissipation structure and improve the overall structural flatness. This allows the heat generated during the operation of the electronic component to be effectively dissipated to the outside through the first thermally conductive interface material, the second thermally conductive interface material, and the heat dissipation structure.
[0067] The above embodiments are used to illustrate the principles and effects of this application, and are not intended to limit this application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application should be as set forth in the claims.
Claims
1. An electronic package, characterized in that, include: The load-bearing structure has a first surface and a second surface that are opposite to each other; An electronic component has a working surface and a non-working surface, and the working surface is disposed on a first surface of the support structure and electrically connected to the support structure, wherein the non-working surface defines a first region and a second region. The first thermally conductive interface material is disposed on the first region; A second thermally conductive interface material is disposed on the second region; and A heat dissipation structure is disposed on the first thermal interface material and the second thermal interface material.
2. The electronic package as described in claim 1, characterized in that, The material of the first thermal interface is different from that of the second thermal interface.
3. The electronic package as described in claim 1, characterized in that, The first region is located in the central region of the non-functional surface, and the second region is located in the peripheral region of the non-functional surface.
4. The electronic package as described in claim 3, characterized in that, The central region is located at the center of the non-functional surface and can be polygonal or cross-shaped, while the outer region is located at the corner of the non-functional surface and can be L-shaped or rectangular.
5. The electronic package as described in claim 3, characterized in that, The central region is located at the center of the non-functional surface and can be rectangular, while the outer region is located at the opposite two edges of the non-functional surface and can be elongated.
6. The electronic package as claimed in claim 1, characterized in that, The first thermal interface material is a thermal interface material with silicone as the base material, and the second thermal interface material is a thermal interface material with epoxy resin as the base material.
7. The electronic package as claimed in claim 1, characterized in that, The first thermally conductive interface material and the second thermally conductive interface material are formed on the non-functional surface of the electronic component by dispensing.
8. The electronic package as claimed in claim 1, characterized in that, The heat dissipation structure has a top plate and support feet extending from the top plate.
9. The electronic package as claimed in claim 8, characterized in that, The support foot is bonded to the first surface of the support structure surrounding the electronic component via an adhesive layer.
10. The electronic package as claimed in claim 8, characterized in that, The top plate combines the first thermal interface material and the second thermal interface material.