PCB assembly and electronic product

Abstract

The utility model discloses a PCB assembly and an electronic product, the PCB assembly comprises a PCB unit and an HSP isolation layer, and the HSP isolation layer covers the PCB unit. According to the scheme, the HSP isolation layer with a certain thickness covers the upper surface of the wiring or the copper foil layer on the PCB unit, the electronic component is isolated from the non-welding area at the bottom, the problem of isolation between the electronic component and the wiring of the PCB can be solved, meanwhile, due to the characteristics of the HSP isolation layer, the problem of insulation in the design process of the PCB can be solved, and the reliability of the PCB is improved. And the safety and the reliability of the PCB during application are ensured.

Description

Technical Field

[0001] This utility model relates to the field of PCB manufacturing technology, specifically to a PCB component and electronic product. Background Technology

[0002] In the current PCB design process of electronic products, if space is insufficient, the space of the non-soldering area at the bottom of electronic components needs to be utilized. This requires routing traces or laying copper foil layers to make full use of the PCB unit's space and reduce the size of the PCB unit.

[0003] The bottom of the electronic component is covered with a copper foil layer, which can serve as an electrical connection carrier for various components and circuits, and is used for conduction or soldering. The spacing between the heat dissipation pad 11 on the top of the electronic component 1 and the traces or copper foil on the bottom PCB unit 12 must meet the safety requirements to ensure the safety of the PCB unit 2 during use. The creepage distance requirement is 3.2mm and the electrical clearance requirement is 2.4mm.

[0004] However, the trace spacing between the top heat dissipation pad 11 and the bottom PCB unit 12 of some existing electronic components 1 does not meet safety regulations. For example, see [link to example]. Figures 1-2 The distance from the four protruding corners of the Infineon MOSFET's heat sink to the bottom is only 1.4mm, which cannot meet safety requirements.

[0005] See Figure 3 If the above-mentioned electronic component 1 needs to meet safety requirements, the copper foil on the PCB unit position 13 corresponding to the four protruding corners 12 of the electronic component 1 needs to be hollowed out. However, if the copper foil part at the bottom of the electronic component 1 is hollowed out, it will result in insufficient current carrying capacity.

[0006] If the traces are not routed at the bottom of the MOSFET, then traces need to be routed around the perimeter of PCB unit 2, which would increase the design area and cost of PCB unit 2.

[0007] Secondly, if the area of ​​PCB unit 2 cannot be increased, the traces can be placed on the inner layer using blind vias, but this will significantly increase the cost of PCB unit 2.

[0008] Therefore, it is evident that solving the isolation problem between electronic components and PCB traces with a low-cost solution is a problem that needs to be addressed in this field. Utility Model Content

[0009] In view of the above-mentioned technical problems in the design of existing PCBs, the purpose of this utility model is to provide a PCB assembly that can solve the isolation problem between electronic components and PCB traces with a low-cost solution, effectively overcoming the problems existing in the prior art. On this basis, electronic products using this PCB assembly are also formed.

[0010] To achieve the above objectives, this utility model provides a PCB assembly, including a PCB unit and an HSP isolation layer, wherein the HSP isolation layer covers the PCB unit.

[0011] Furthermore, the HSP isolation layer covers the entire area of ​​the PCB unit.

[0012] Furthermore, the HSP isolation layer covers a portion of the PCB unit.

[0013] Furthermore, the thickness of the HSP isolation layer is less than or equal to 100 μm.

[0014] Furthermore, the HSP isolation layer has a uniform thickness structure.

[0015] Furthermore, the HSP isolation layer has a non-uniform thickness structure.

[0016] Furthermore, the HSP isolation layer covers an area on the PCB unit that corresponds to a portion of the PCB unit.

[0017] Furthermore, the HSP isolation layer covers a larger area than a portion of the PCB unit.

[0018] Furthermore, the PCB unit has a copper foil layer or traces laid in the unsoldered areas.

[0019] To achieve the above objectives, this utility model provides an electronic product, including the aforementioned PCB assembly.

[0020] The PCB assembly and electronic products provided by this utility model solve the problem of isolation between electronic components and PCB traces by covering the upper surface of the traces or copper foil layer with an isolation layer.

[0021] Meanwhile, the isolation layer itself has pressure resistance characteristics, which can solve the insulation problem in the design process and ensure the safety and reliability of PCB components in application. Attached Figure Description

[0022] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0023] Figure 1 Here is an example diagram of the overall structure of an existing MOSFET;

[0024] Figure 2 This is an example diagram of the assembly structure of an existing MOSFET on a PCB unit;

[0025] Figure 3 Here is an example diagram of an existing structure where the trace is not routed at the bottom of the MOSFET;

[0026] Figure 4 This is a cross-sectional view of the structure of this PCB assembly;

[0027] Figure 5 This is a schematic diagram showing the width structure of the HSP isolation layer in this PCB assembly;

[0028] Figure 6 This is a schematic diagram of the thickness structure of the HSP isolation layer in this PCB assembly. Detailed Implementation

[0029] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the following description, in conjunction with specific illustrations, further elaborates on this utility model.

[0030] In existing PCB design, traces or copper foil layers need to be laid on the PCB board as electrical connection carriers for various components and circuits, used for conduction or soldering. The spacing between the pins of electronic components on the PCB board and the corresponding traces and copper foil layers on the bottom PCB board often fails to meet safety regulations, posing a safety hazard. Therefore, based on this technical problem, this utility model provides a PCB assembly that solves the isolation problem between electronic components and the corresponding traces or copper foil layers on the bottom PCB board by covering the traces or copper foil layers with an isolation layer.

[0031] Meanwhile, the isolation layer has pressure resistance, which can solve the insulation problem of the PCB unit during the design process and ensure the safety and reliability of the PCB unit during application.

[0032] Furthermore, the PCB assembly 100 provided by this utility model, see [link to previous document]. Figure 3 It includes a PCB unit 120, an unsoldered area 130, electronic components 110, and an isolation layer 140.

[0033] The PCB unit 120 can be used for wiring or to lay copper foil layers. Electronic components 110 are disposed on the PCB unit 120. The bottom of the electronic components 110 and the PCB unit 120 form an unsoldered area 130. This unsoldered area 130 can be used for wiring or to lay copper foil layers. It can serve as an electrical connection carrier for various components and circuits, and can be used for conduction or soldering.

[0034] The isolation layer 140 covers the unsoldered area 130, and its top and bottom are respectively connected to the electronic component 110 and the PCB unit 120. By setting the isolation layer 140, the electronic component can be isolated from the unsoldered area at the bottom, so that the electronic component 110 can meet the electrical clearance requirements of the traces or copper foil layers of the unsoldered area 130, ensuring the safety of the PCB assembly 100 during application.

[0035] Here, the isolation layer 140 is preferably an HSP insulating layer 140, which has a voltage-resistant structure. Therefore, it can solve the insulation problem of the PCB unit in the design process and improve the reliability of the PCB assembly 100.

[0036] Furthermore, the HSP isolation layer 140 with a thickness of 1mm can withstand a voltage of 40kV, while this solution only needs to withstand 2.5kw. Therefore, in this solution, the HSP isolation layer 140 with a thickness not exceeding 100um is printed. For example, it can be 10um, 30um, 40um, 55um, 70um, 80um, or 90um, etc. This solution preferably uses 80um. Thus, the safety issues between the copper foil layer and the top heat dissipation pad can be solved without affecting the normal conduction of the PCB assembly 100.

[0037] In some preferred embodiments, see Figure 5 The HSP isolation layer 140 is disposed on the unsoldered area 130 of the PCB unit, and the coverage area formed by the HSP isolation layer 140 on the PCB unit corresponds to the unsoldered area 130 on the PCB unit.

[0038] Specifically, the HSP isolation layer 140 covers the unsoldered area 130 on the PCB unit with the same width as the unsoldered area 130 of the PCB unit. By setting the HSP isolation layer 140 on the unsoldered area 130 of the PCB unit, the electronic components 110 can be isolated from the unsoldered area 130 at the bottom, solving the isolation problem between the electronic components 110 and the PCB board 120 traces, as well as the insulation problem in the design process, ensuring the safety and reliability of the PCB assembly 100 in application.

[0039] In some preferred embodiments, the HSP isolation layer 140 covers a larger area than the unsoldered area 130 on the PCB unit.

[0040] Specifically, the HSP isolation layer 140 is disposed on the unsoldered area 130 of the PCB unit, such as... Figure 4 Its width is greater than the width of the unsoldered area 130 of the PCB unit, so that the HSP isolation layer 140 can cover the unsoldered area 130 of the PCB unit, preventing the electronic components 110 above from contacting and conducting with the copper foil layer at the bottom, thus avoiding short circuits and other faults.

[0041] Meanwhile, in some preferred embodiments, such as Figure 4 The HSP isolation layer 140 can be printed on the unsoldered area 130 of the PCB unit with a uniform thickness structure, which can ensure that each area of ​​the electronic component 120 and the unsoldered area 130 form a stable withstand voltage, thereby improving the stability of the insulation between the electronic component 120 and the unsoldered area 130.

[0042] In some preferred embodiments, the HSP isolation layer 140 may be printed as a non-uniform thickness structure on the unsoldered area 130 of the PCB unit.

[0043] Specifically, such as Figure 6 The HSP isolation layer 140 has a greater thickness on both sides than in the middle, and a recessed area can be formed in the middle to embed the heat dissipation pad of the electronic component 120 into the recessed area, thus ensuring the soldering stability of the electronic component 120.

[0044] The configuration of the isolation layer 140 on the PCB unit 120 includes, but is not limited to, the above-mentioned structure. For example, the thickness on one side may be greater than the thickness on the other side, or the thickness may be set at intervals of different sizes. The specific configuration can be determined according to the actual situation.

[0045] It should be noted that the above describes covering the unsoldered area at the bottom of the electronic components of the PCB unit with the HSP isolation layer 140. This solution includes, but is not limited to, this covering structure. The HSP isolation layer 140 can be covered in any area of ​​the PCB unit 120, or it can be covered on the entire surface of the PCB unit 120. This can solve the isolation problem between the electronic components 110 and the traces of the PCB board 120, and ensure the safety of the PCB assembly 100 during application.

[0046] The PCB assembly 100 constructed by the above scheme is illustrated below using an Infineon MOSFET as an example to illustrate its specific assembly design process. It should be noted that the following assembly process is only an example and does not constitute a limitation on this scheme.

[0047] First, based on the requirement of a withstand voltage of 2.5kw, a 100um thick HSP isolation layer 140 is printed on the traces or copper foil layer laid in the unsoldered area 130 at the bottom of the MOSFET 100.

[0048] Then, the MOSFET 110 is placed on the HSP isolation layer 140. By printing the HSP isolation layer 140 between the MOSFET 110 and the laid traces or copper foil layer, the electronic component 110 is isolated from the unsoldered area 130 at the bottom. This solves the isolation problem between the electronic component 110 and the PCB board 120 traces and ensures the safety of the PCB assembly 100 during application.

[0049] It should be noted that when soldering MOSFETs, it is preferable to use stepped steel mesh to prevent the device from being excessively lifted by the HSP, which could lead to soldering problems.

[0050] The PCB assembly provided by this solution uses an HSP isolation layer 140 of a certain thickness to cover the upper surface of the traces or copper foil layer. The HSP isolation layer 140 can isolate the electronic components 120 from the unsoldered areas 130 of the PCB unit, so that the electronic components 110 and the traces or copper foil layer meet the electrical clearance requirements. This effectively solves the problem of isolation between electronic components and PCB traces with a low-cost solution.

[0051] Meanwhile, the HSP isolation layer has high voltage resistance, which can solve the insulation problem of PCB units in the design process and improve the reliability of PCB components.

[0052] In addition, printing the HSP isolation layer under the components can ensure that the soldering does not float.

[0053] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A PCB assembly, comprising PCB units, characterized in that, It also includes an HSP isolation layer, which covers the traces or the upper surface of the copper foil layer in the unsoldered area of ​​the PCB unit. The HSP isolation layer can cover the unsoldered area of ​​the PCB unit to prevent the electronic components above from contacting and conducting with the copper foil layer at the bottom.

2. The PCB assembly according to claim 1, characterized in that, The HSP isolation layer covers the entire area of ​​the PCB unit.

3. The PCB assembly according to claim 1, characterized in that, The HSP isolation layer covers a portion of the PCB unit.

4. The PCB assembly according to claim 1 or 2, characterized in that, The thickness of the HSP isolation layer is less than or equal to 100 μm.

5. The PCB assembly according to claim 1 or 2, characterized in that, The HSP isolation layer has a uniform thickness structure.

6. The PCB assembly according to claim 1 or 2, characterized in that, The HSP isolation layer has a non-uniform thickness structure.

7. The PCB assembly according to claim 3, characterized in that, The HSP isolation layer covers an area on the PCB unit that corresponds to a portion of the PCB unit.

8. The PCB assembly according to claim 3, characterized in that, The HSP isolation layer covers a larger area than a portion of the PCB unit.

9. An electronic product, characterized in that, Includes the PCB assembly described in any one of claims 1-8.

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