Efficient heat dissipation type circuit board

Abstract

The utility model discloses an efficient heat dissipation type circuit board which comprises a circuit board body, a surrounding cylinder is detachably installed on the upper surface of the circuit board body, a lying type heat dissipation mechanism is rotatably installed in the surrounding cylinder, and the air blowing end of the lying type heat dissipation mechanism is attached to the upper surface of the circuit board body in a sliding mode. And a wind direction guide mechanism is fixedly mounted on the upper surface of the lying type heat dissipation mechanism and can drive the lying type heat dissipation mechanism to rotate in the surrounding cylinder. Through the design of the wind direction diversion mechanism and the lying type heat dissipation mechanism, a worker can turn an air port according to a part with high heat productivity, and the effect of fixed-point heat dissipation can be achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board technical field, concretely is a kind of high-efficiency heat dissipation type circuit board. BACKGROUND

[0002] Due to the volume of electronic products is increasingly reduced and chip frequency is constantly rising, the assembly density of circuit board is constantly rising, so the heat dissipation problem is more and more serious, and good heat dissipation measure can effectively improve the heat dissipation efficiency of circuit board and improve the service life of components.

[0003] The utility model discloses a high-efficiency heat dissipation type circuit board discloses a kind of high-efficiency heat dissipation type circuit board, including board body, the top of the board body is equipped with installation through-hole, the bottom of board body is inserted with the installation block that extends to the board body above and passes through installation through-hole.The high-efficiency heat dissipation type circuit board, by the rotation of heat dissipation fan power-on, so that the hot air under the board body is inhaled into the inside of hollow cavity, and the hot air inhaled into the inside of hollow cavity is discharged through the upper air hole, so that the hot air under the board body can play excellent heat dissipation effect after being discharged, the mobile block and the top rod are pushed by pressure spring between the board body, the board body is fixed stable under the joint action of threaded sleeve and top rod, the mobile block is more smooth when being pushed by the board body and moving by rotating groove and rotating block, the device is connected between the board body and the installation block by a series of mechanical structures, and the heat dissipation effect is better after being connected.

[0004] However, the above-mentioned high-efficiency heat dissipation type circuit board, the heat dissipation mechanism occupies a large space after installation, and the height is higher, which will affect the layout and design of the whole equipment, especially for some small size equipment or densely arranged occasions, the excessive space occupation will lead to unreasonable layout of other components, affecting the overall performance, and the high heat output electrical components cannot be cooled by the device. UTILITY MODEL CONTENTS

[0005] The utility model discloses a high-efficiency heat dissipation type circuit board to solve the problem of not having the function of cooling high heat output electrical components in the process of cooling circuit board in the background art.

[0006] To achieve the above object, the utility model provides the following technical scheme:

[0007] A high-efficiency heat dissipation type circuit board, comprising: a circuit board body, a surrounding cylinder detachably mounted on the upper surface of the circuit board body, a prone heat dissipation mechanism rotatably installed in the surrounding cylinder, a blowing end of the prone heat dissipation mechanism slidingly attached to the upper surface of the circuit board body, a wind direction guiding mechanism fixedly installed on the upper surface of the prone heat dissipation mechanism, and the wind direction guiding mechanism capable of driving the prone heat dissipation mechanism to rotate in the surrounding cylinder.

[0008] Preferably, the prone heat dissipation mechanism comprises a connecting disc, the connecting disc is rotatably installed in the surrounding cylinder, a motor is fixedly installed on the upper surface of the connecting disc, a fan blade is fixedly installed at one end of the output shaft of the motor, and a wind guide cylinder is in communication with the upper surface of the connecting disc and slides on the upper surface of the circuit board body.

[0009] Preferably, the fan blade at the outer surface of the motor output shaft rotates in the surrounding cylinder.

[0010] Preferably, a connecting ring is fixedly installed on the lower surface of the connecting disc, a limiting ring is fixedly installed on the outer surface of the connecting ring, the connecting disc is rotatably installed in the ring groove through the limiting ring, and the ring groove is arranged on the inner ring wall of the surrounding cylinder.

[0011] Preferably, the air inlet and the air outlet of the wind guide cylinder are wide at one end and narrow at the other end, so that a Venturi effect is formed.

[0012] Preferably, the upper surface of the connecting disc is provided with an air outlet hole.

[0013] Preferably, the wind direction guide mechanism comprises a connecting rod, the connecting rod is fixedly installed on the upper surface of the connecting disc, and an arc-shaped baffle plate is fixedly installed on the upper surface of the connecting rod.

[0014] Preferably, a conical cylinder is fixedly installed on the inner lower surface of the arc-shaped baffle plate.

[0015] Preferably, the conical cylinder can guide the wind blown out of the air outlet hole to four directions, and the arc surface in the arc-shaped baffle plate can guide the wind to the upper surface of the circuit board body.

[0016] Preferably, a knob rod is fixedly installed on the upper surface of the arc-shaped baffle plate.

[0017] Compared with the prior art, the utility model has the advantages of:

[0018] 1. Through the design of the circuit board body, the wind direction guide mechanism, the prone heat dissipation mechanism and the surrounding cylinder, during the heat dissipation process of the circuit board body, the staff can drive the prone heat dissipation mechanism to rotate on the upper surface of the circuit board body by twisting the wind direction guide mechanism, so that the prone heat dissipation mechanism can be aligned with the high-heat electric components, the wind direction guide mechanism can guide the remaining wind flow to the upper surface of the circuit board body in all directions, and the prone heat dissipation mechanism and the wind direction guide mechanism realize the heat dissipation effect of omnidirectional blowing, so that the air can flow through the heat dissipation area more orderly, the heat dissipation efficiency is improved, the prone heat dissipation mechanism occupies less space in the vertical direction, which is beneficial to realizing efficient heat dissipation in limited space and conducive to the compact design of the overall equipment.

[0019] 2、By the design of arc baffle, knob rod, cone, connecting disc, air duct, motor, fan blade and limit ring, when the heat dissipation of the electrical elements on the surface of the circuit board body is carried out, the motor can be started to drive the fan blade to rotate in the surrounding cylinder, and the fan blade can blow the wind into the air duct, and through the "venturi effect" of the air duct, the wind speed of the wind flow flowing out of the air outlet of the air duct can be improved, the principle is that when the air passes through the narrow channel, the air flow rate increases due to the reduction of the channel cross-sectional area, and with the increase of the kinetic energy of the airflow, the pressure is reduced, according to Bernoulli's theorem, the reduction of the pressure can reduce the temperature of the surrounding air, because the kinetic energy of the fluid (air) increases in the process of acceleration, which reduces the internal energy, thereby reducing the temperature, and then the low-temperature high-speed wind flow can be blown on the surface of the electrical elements to realize the purpose of efficient heat dissipation, and in the process of heat dissipation, the worker can also twist the knob rod to drive the connecting disc to rotate in the ring groove of the surrounding cylinder through the limit ring, thereby driving the air duct connected with the upper surface of the connecting disc to rotate on the upper surface of the circuit board body, thereby enabling the worker to adjust the air outlet according to the parts with large heat generation to realize the function of point heat dissipation, and the arc baffle on the lower surface of the knob rod can also guide the remaining wind flow to the upper surface of the circuit board body in all directions, and the blowing of the air duct can realize the heat dissipation effect of the electrical elements on the upper surface of the circuit board body in all directions, so that the air can flow through the heat dissipation area more orderly, improve the heat dissipation efficiency, and the air duct in the prone position occupies less space in the vertical direction, which is beneficial to realize efficient heat dissipation in limited space and conducive to the compact design of the whole equipment. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is the whole structure schematic diagram of the efficient heat dissipation type circuit board of the utility model;

[0021] Figure 2 It is the arc baffle structure schematic diagram of the utility model;

[0022] Figure 3 It is the wind direction guiding mechanism structure schematic diagram of the utility model;

[0023] Figure 4 It is the prone heat dissipation mechanism structure schematic diagram of the utility model.

[0024] In the drawing: 1, circuit board body; 2, wind direction guiding mechanism; 201, arc baffle; 202, knob rod; 203, connecting rod; 204, cone; 3, prone heat dissipation mechanism; 301, connecting disc; 302, air duct; 303, motor; 304, fan blade; 305, connecting ring; 306, limit ring; 4, surrounding cylinder; 401, ring groove. DETAILED DESCRIPTION

[0025] Clearly, the described embodiments are merely a part of the embodiments of the present application, but not all the embodiments. Based on the embodiments of the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0026] Please refer to Figures 1-4 The embodiment provides the following technical scheme:

[0027] As Figures 1-2 Indicated, an efficient heat dissipation type circuit board, comprising: circuit board body 1, the upper surface of the circuit board body 1 is detachably mounted with a cylinder 4, the cylinder 4 is rotatably mounted with a prone heat dissipation mechanism 3, the blowing end of the prone heat dissipation mechanism 3 is slidably attached to the upper surface of the circuit board body 1, the upper surface of the prone heat dissipation mechanism 3 is fixedly installed with a wind direction guiding mechanism 2, and the wind direction guiding mechanism 2 can drive the prone heat dissipation mechanism 3 to rotate in the cylinder 4.

[0028] Through the design of the circuit board body 1, the wind direction guiding mechanism 2, the prone heat dissipation mechanism 3 and the cylinder 4, during the heat dissipation process of the circuit board body 1, the staff can drive the prone heat dissipation mechanism 3 to rotate on the upper surface of the circuit board body 1 by twisting the wind direction guiding mechanism 2, so that the prone heat dissipation mechanism 3 can be aligned with the high-heat electric components, so that the effect of point heat dissipation can be realized, and the wind direction guiding mechanism 2 can also guide the remaining air flow to each direction of the upper surface of the circuit board body 1, and the prone heat dissipation mechanism 3 realizes the heat dissipation effect of omnidirectional blowing, so that the air can flow through the heat dissipation area more orderly, the heat dissipation efficiency is improved, and the prone heat dissipation mechanism 3 occupies less space in the vertical direction, which is beneficial to realizing efficient heat dissipation in limited space and conducive to the compact design of the overall equipment.

[0029] As Figures 3-4 Indicated, the prone heat dissipation mechanism 3 comprises a connecting disc 301, the connecting disc 301 is rotatably installed in the cylinder 4, the upper surface of the connecting disc 301 is fixedly installed with a motor 303, one end of the output shaft of the motor 303 is fixedly installed with a fan blade 304, the upper surface of the connecting disc 301 is communicated with an air duct 302, and the air duct 302 is slidably attached to the upper surface of the circuit board body 1.

[0030] The fan blade 304 on the outer surface of the output shaft of the motor 303 rotates in the cylinder 4.

[0031] The lower surface of the connecting disc 301 is fixedly installed with a connecting ring 305, the outer surface of the connecting ring 305 is fixedly installed with a limiting ring 306, the connecting disc 301 is rotatably installed in a ring groove 401 through the limiting ring 306, and the ring groove 401 is formed in the inner ring wall of the cylinder 4.

[0032] The air inlet and air outlet of the air duct 302 are wide to narrow, so that a "Venturi effect" is formed.

[0033] The upper surface of the connecting disc 301 is provided with an air outlet hole.

[0034] The air direction guiding mechanism 2 comprises a connecting rod 203 fixedly installed on the upper surface of the connecting disc 301, and an arc-shaped baffle disc 201 fixedly installed on the upper surface of the connecting rod 203.

[0035] The inner lower surface of the arc-shaped baffle disc 201 is fixedly installed with a conical cylinder 204.

[0036] The conical cylinder 204 can guide the air blown out of the air outlet hole to four directions, and through the arc surface in the arc-shaped baffle disc 201, the air can be guided to the upper surface of the circuit board body 1.

[0037] The upper surface of the arc-shaped baffle disc 201 is fixedly installed with a knob rod 202.

[0038] By the design of the arc-shaped baffle 201, the knob rod 202, the conical cylinder 204, the connecting disc 301, the air duct 302, the motor 303, the fan blade 304 and the limiting ring 306, when the electrical elements on the surface of the circuit board body 1 are cooled, the motor 303 can be started to drive the fan blade 304 to rotate in the surrounding cylinder 4, and the fan blade 304 will blow air into the air duct 302, and through the "Venturi effect" of the air duct 302, the wind speed of the air flow out of the air outlet of the air duct 302 can be improved. The principle is that when air passes through a narrow channel, the air flow rate increases due to the decrease in the cross-sectional area of the channel, and with the increase in the kinetic energy of the airflow, the pressure decreases. According to Bernoulli's theorem, the decrease in pressure will cause the temperature of the surrounding air to drop. This is because the kinetic energy of the fluid (air) increases during acceleration, resulting in a decrease in internal energy, thereby reducing the temperature. In turn, it can make the low-temperature high-speed airflow blow on the surface of the electrical elements to achieve the purpose of efficient heat dissipation. During the heat dissipation process, the worker can also twist the knob rod 202 to drive the connecting disc 301 to rotate in the ring groove 401 of the surrounding cylinder 4 through the limiting ring 306, thereby driving the air duct 302 connected to the upper surface of the connecting disc 301 to rotate on the upper surface of the circuit board body 1. In turn, it can make the worker adjust the air outlet according to the position with high heat dissipation, so as to realize the function of point heat dissipation. The arc-shaped baffle 201 on the lower surface of the knob rod 202 can also guide the remaining airflow to the upper surface of the circuit board body 1 in all directions, and cooperate with the blowing of the air duct 302 to realize the heat dissipation effect of blowing and sweeping the electrical elements on the upper surface of the circuit board body 1 in all directions. Make the air flow through the heat dissipation area more orderly, improve the heat dissipation efficiency, and the air duct 302 in the prone position occupies less space in the vertical direction, which is conducive to realizing efficient heat dissipation in limited space and conducive to the compact design of the overall equipment.

[0039] According to the above technical scheme, the working steps of the present scheme are summarized and combed: when the electrical elements on the surface of the circuit board body 1 are cooled, the fan blade 304 can be driven to rotate in the surrounding cylinder 4 by starting the motor 303, and the fan blade 304 will blow air into the air duct 302, and through the "Venturi effect" of the air duct 302, the air flow speed out of the air outlet of the air duct 302 can be improved. The principle is that when air passes through a narrow channel, the air flow rate increases due to the decrease of the channel cross-sectional area, and with the increase of the kinetic energy of the airflow, the pressure decreases. According to Bernoulli's theorem, the decrease of pressure will cause the temperature of the surrounding air to drop. This is because the kinetic energy of the fluid (air) increases during acceleration, resulting in a decrease in internal energy, thereby reducing the temperature. In turn, it can make the low-temperature high-speed airflow blow on the surface of the electrical elements to achieve the purpose of efficient heat dissipation. During the heat dissipation process, the worker can also rotate the connecting disc 301 in the ring groove 401 of the surrounding cylinder 4 by twisting the knob rod 202, thereby driving the air duct 302 connected to the upper surface of the connecting disc 301 to rotate on the upper surface of the circuit board body 1, thereby enabling the worker to adjust the air outlet according to the position of the heat generating part, so as to achieve the effect of point cooling. The arc-shaped baffle 201 on the lower surface of the knob rod 202 can also guide the remaining airflow to the upper surface of the circuit board body 1 in all directions, and in combination with the blowing of the air duct 302, it can achieve the effect of omnidirectional blowing and cooling of the electrical elements on the upper surface of the circuit board body 1.

[0040] In summary: it can enable the worker to adjust the air outlet according to the position of the heat generating part, so as to achieve the effect of point cooling.

[0041] The parts not involved in the present application are the same as or can be realized by the prior art. Although embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A high-efficiency heat dissipation circuit board, characterized in that, include: The circuit board body (1) has a surrounding cylinder (4) detachably installed on its upper surface. A horizontal heat dissipation mechanism (3) is rotatably installed inside the surrounding cylinder (4). The air blowing end of the horizontal heat dissipation mechanism (3) is slidably attached to the upper surface of the circuit board body (1). A wind guide mechanism (2) is fixedly installed on the upper surface of the horizontal heat dissipation mechanism (3). The wind guide mechanism (2) can drive the horizontal heat dissipation mechanism (3) to rotate inside the surrounding cylinder (4).

2. The high-efficiency heat dissipation circuit board according to claim 1, characterized in that: The horizontal heat dissipation mechanism (3) includes a connecting plate (301), which is rotatably installed inside the casing (4). A motor (303) is fixedly installed on the upper surface of the connecting plate (301), and a fan blade (304) is fixedly installed at one end of the output shaft of the motor (303). An air guide tube (302) is connected to the upper surface of the connecting plate (301), and the air guide tube (302) is slidably attached to the upper surface of the circuit board body (1).

3. The high-efficiency heat dissipation circuit board according to claim 2, characterized in that: The fan blades (304) on the outer surface of the output shaft of the motor (303) rotate within the casing (4).

4. The high-efficiency heat dissipation circuit board according to claim 2, characterized in that: A connecting ring (305) is fixedly installed on the lower surface of the connecting disc (301), and a limiting ring (306) is fixedly installed on the outer surface of the connecting ring (305). The connecting disc (301) is rotatably installed in the annular groove (401) through the limiting ring (306). The annular groove (401) is opened on the inner annular wall of the surrounding cylinder (4).

5. The high-efficiency heat dissipation circuit board according to claim 2, characterized in that: The air inlet and outlet of the air duct (302) are wide to narrow, thus creating a "Venturi effect".

6. The high-efficiency heat dissipation circuit board according to claim 2, characterized in that: The upper surface of the connecting plate (301) is provided with an air outlet.

7. The high-efficiency heat dissipation circuit board according to claim 1, characterized in that: The wind guide mechanism (2) includes a connecting rod (203), which is fixedly installed on the upper surface of the connecting plate (301), and an arc-shaped baffle (201) is fixedly installed on the upper surface of the connecting rod (203).

8. The high-efficiency heat dissipation circuit board according to claim 7, characterized in that: A conical cylinder (204) is fixedly installed on the lower inner surface of the arc-shaped baffle (201).

9. A high-efficiency heat dissipation circuit board according to claim 8, characterized in that: The conical tube (204) can guide the air blown out of the air outlet in all directions, and the arc surface in the arc-shaped baffle (201) can guide the air to the upper surface of the circuit board body (1).

10. A high-efficiency heat dissipation circuit board according to claim 8, characterized in that: A toggle rod (202) is fixedly installed on the upper surface of the arc-shaped baffle (201).

Images