Novel surface-mounted multi-layer PCB (printed circuit board)

Abstract

The utility model relates to the technical field of PCBs (printed circuit boards), in particular to a novel surface-mounted multilayer PCB, which comprises a bonding pad substrate, the bonding pad substrate comprises an upper substrate and a lower substrate, an insulating medium layer is arranged between the upper substrate and the lower substrate, a heat dissipation bin is arranged in the middle of the insulating medium layer, a heat dissipation mechanism is fixedly arranged in the heat dissipation bin, and the heat dissipation mechanism is fixedly connected with the bonding pad substrate. And semiconductor chilling plates are arranged at the two ports of the heat dissipation bin and abut against the upper side face and the lower side face of the heat dissipation mechanism. According to the utility model, the heat dissipation mechanism is fixedly arranged in the middle of the insulating medium layer, heat generated by the upper substrate or the lower substrate is transmitted to the heat dissipation frame through the cylindrical heat dissipation rods or the square heat dissipation rods, and then the heat is transmitted to the outside of the bonding pad substrate, so that the purpose of heat dissipation of the upper substrate or the lower substrate is achieved; and the service life of the upper-layer substrate or the lower-layer substrate is greatly prolonged.

Description

TECHNICAL FIELD

[0001] The utility model relates to a kind of multilayer PCB, in particular to a kind of novel patch multilayer PCB, belong to PCB plate technical field. BACKGROUND

[0002] Novel patch multilayer PCB is a kind of printed circuit board using multilayer structure design, complex circuit connection and layout are realized by layering multilayer conductive layer (usually copper layer) and insulating layer (such as epoxy resin), each layer of conductive layer can be independently designed circuit, and interlayer electrical connection is realized by interlayer interconnection structure (such as via, blind hole, buried hole etc.).

[0003] PCB will generate certain heat in the process of use, once heat gathers, the data handled will be affected, leading to efficiency reduction, and once temperature is too high, PCB service life will be inevitably affected, especially multilayer PCB, only by adhesive layer, PCB is fixed together, seriously affect the efficiency of heat dissipation.

[0004] Therefore, novel patch multilayer PCB needs to be improved to solve the above problems. UTILITY MODEL CONTENT

[0005] The utility model aims at providing a kind of novel patch multilayer PCB, in the middle part of insulating dielectric layer, fixedly set in heat dissipation mechanism, the heat generated by upper substrate or lower substrate is transferred to heat dissipation frame by cylindrical heat dissipation rod or square heat dissipation rod, and then heat is transferred to the outside of pad substrate, to the purpose of heat dissipation of upper substrate or lower substrate, substantially improve the service life of upper substrate or lower substrate.

[0006] To achieve the above purpose, the main technical scheme adopted by the utility model includes:

[0007] A kind of novel patch multilayer PCB, including pad substrate, the pad substrate includes upper substrate and lower substrate, insulating dielectric layer is fixedly arranged between the upper substrate and the lower substrate, the middle part of the insulating dielectric layer is provided with heat dissipation bin, heat dissipation mechanism is fixedly arranged in the inside of heat dissipation bin, cylindrical heat dissipation rod and square heat dissipation rod are fixedly arranged on the outside of heat dissipation mechanism, the square heat dissipation rod and the cylindrical heat dissipation rod are all extended to the inside of the insulating dielectric layer and are connected with heat dissipation frame;

[0008] Semiconductor refrigerating sheet is fixedly arranged at the both ends of heat dissipation bin, and the semiconductor refrigerating sheet is in contact with the upper and lower sides of heat dissipation mechanism.

[0009] Preferably, the interior of the insulating medium layer is provided with square through holes and circular through holes, the square heat dissipation rods are arranged in the square through holes, and the columnar heat dissipation rods are arranged in the circular through holes.

[0010] Preferably, the heat dissipation mechanism, the columnar heat dissipation rods, the square heat dissipation rods and the heat dissipation frame are fixedly connected through welding.

[0011] Preferably, the upper substrate and the lower substrate are provided with heat dissipation frame grooves on the corresponding side surfaces, and the heat dissipation frame is fixedly arranged in the heat dissipation frame grooves.

[0012] Preferably, the semiconductor refrigeration piece comprises a refrigeration piece heat absorbing surface and a refrigeration piece heat radiating surface, and the refrigeration piece heat radiating surface is in abutment with the upper side surface or the lower side surface of the heat dissipation mechanism.

[0013] Preferably, the pad substrate is fixedly provided with a metal pipe, and the metal pipe penetrates the insulating medium layer and the heat dissipation mechanism in sequence.

[0014] Preferably, the upper side surface of the upper substrate and the lower side surface of the lower substrate are fixedly provided with welding lines.

[0015] Preferably, the heat dissipation frame is fixedly provided with a plurality of mounting blocks on the circumferential side surface, and the mounting blocks are provided with mounting holes.

[0016] The utility model at least has the following beneficial effects:

[0017] 1, the middle part of the insulating medium layer is fixedly provided with the heat dissipation mechanism, the heat generated by the upper substrate or the lower substrate is transmitted to the heat dissipation frame through the columnar heat dissipation rod or the square heat dissipation rod, and then the heat is transmitted to the outside of the pad substrate, so that the purpose of dissipating heat of the upper substrate or the lower substrate is achieved, and the service life of the upper substrate or the lower substrate is greatly improved.

[0018] 2, after the heat is transmitted to the insulating medium layer through the heat transfer mode of the upper substrate or the lower substrate, the heat on the insulating medium layer is reduced through the columnar heat dissipation rod and the square heat dissipation rod on the heat dissipation mechanism, and the heat on the upper substrate or the lower substrate can be actively absorbed through the refrigeration piece heat absorbing surface on the semiconductor refrigeration piece, and the heat is transmitted to the heat dissipation mechanism through the refrigeration piece heat radiating surface, so that the heat on the pad substrate can be greatly reduced, and the service efficiency and the service life of the pad substrate are improved. BRIEF DESCRIPTION OF DRAWINGS

[0019] The drawings described herein are used to provide further understanding of the present application, and form a part of the present application. The schematic embodiments of the present application and the description thereof are used to explain the present application, and do not constitute improper limitation on the present application. In the drawings:

[0020] Figure 1 is a structure diagram of the heat dissipation mechanism of the utility model;

[0021] Figure 2 is a perspective view of the utility model;

[0022] Figure 3 is a partial structure of the utility model Figure 1 ;

[0023] Figure 4 is a partial structure of the utility model Figure 2 ;

[0024] Figure 5 is a partial structure of the utility model Figure 3 .

[0025] In the figure, 1, pad substrate;101, upper substrate;102, lower substrate;103, heat dissipation frame slot;2, insulating medium layer;201, square through hole;202, circular through hole;203, heat dissipation compartment;3, heat dissipation mechanism;301, cylindrical heat dissipation rod;302, square heat dissipation rod;303, heat dissipation frame;4, semiconductor refrigeration piece;401, refrigeration piece heat absorption surface;402, refrigeration piece heat dissipation surface;5, welding circuit;6, metal pipe;7, mounting block;701, mounting hole. Specific implementation

[0026] The embodiment of the application will be described in detail below with the help of drawings and examples, so that the realization process of how to apply technical means to solve technical problems and achieve technical effects of the application can be fully understood and implemented.

[0027] As Figures 1-5 shown, the novel patch type multilayer PCB provided by the embodiment includes a pad substrate 1, the pad substrate 1 includes an upper substrate 101 and a lower substrate 102, an insulating medium layer 2 is fixedly arranged between the upper substrate 101 and the lower substrate 102, a heat dissipation compartment 203 is formed in the middle of the insulating medium layer 2, a heat dissipation mechanism 3 is fixedly arranged in the heat dissipation compartment 203, cylindrical heat dissipation rods 301 and square heat dissipation rods 302 are fixedly arranged on the outer side of the heat dissipation mechanism 3, the square heat dissipation rods 302 and the cylindrical heat dissipation rods 301 both extend into the insulating medium layer 2 and are connected with a heat dissipation frame 303, and the insulating medium layer 2 is fixedly arranged in the middle of the pad substrate 1, that is, the insulating medium layer 2 is fixed between the upper substrate 101 and the lower substrate 102, which can play the role of insulating support, improve the overall insulating performance, and also improve the overall structural strength;

[0028] The heat generated by the upper substrate 101 or the lower substrate 102 can be transmitted to the heat dissipation frame 303 through the columnar heat dissipation rod 301 or the square heat dissipation rod 302, and then transmitted to the outside of the pad substrate 1, so as to achieve the purpose of dissipating heat of the upper substrate 101 or the lower substrate 102, and the structure is simple, and the service life of the upper substrate 101 or the lower substrate 102 is greatly improved.

[0029] In addition, the semiconductor refrigeration sheet 4 is fixedly arranged at the two ports of the heat dissipation bin 203, the semiconductor refrigeration sheet 4 abuts against the upper and lower sides of the heat dissipation mechanism 3, the semiconductor refrigeration sheet 4 includes a refrigeration sheet heat absorption surface 401 and a refrigeration sheet heat dissipation surface 402, the refrigeration sheet heat dissipation surface 402 abuts against the upper side or the lower side of the heat dissipation mechanism 3, after the heat is transmitted to the insulating medium layer 2 by the upper substrate 101 or the lower substrate 102 in a heat transfer manner, the heat on the insulating medium layer 2 is reduced through the columnar heat dissipation rod 301 and the square heat dissipation rod 302 on the heat dissipation mechanism 3, and the heat on the upper substrate 101 or the lower substrate 102 can be actively absorbed through the refrigeration sheet heat absorption surface 401 on the semiconductor refrigeration sheet 4, and the heat is transmitted to the heat dissipation mechanism 3 through the refrigeration sheet heat dissipation surface 402, so that the heat on the pad substrate 1 can be greatly reduced, and the use efficiency and the service life of the pad substrate 1 are improved.

[0030] Further, as shown in Figure 2 and Figure 4 , the square heat dissipation rod 302 is arranged in the square through hole 201, and the columnar heat dissipation rod 301 is arranged in the circular through hole 202, the columnar heat dissipation rod 301 and the square heat dissipation rod 302 on the heat dissipation mechanism 3 can support the insulating medium layer 2 to some extent, and improve the overall structural strength, the heat dissipation mechanism 3, the columnar heat dissipation rod 301, the square heat dissipation rod 302 and the heat dissipation frame 303 are fixedly connected by welding, and the overall structural strength of the heat dissipation mechanism 3 is improved;

[0031] At the same time, as shown in Figure 3 , the upper substrate 101 and the lower substrate 102 correspondingly have a side surface provided with a heat dissipation frame groove 103, and the heat dissipation frame 303 is fixedly arranged in the heat dissipation frame groove 103, so that the heat dissipation frame 303 can dissipate heat and support the pad substrate 1.

[0032] Further, as shown in Figure 2 and Figure 5As shown, the pad substrate 1 is fixedly provided with a metal pipe 6, the metal pipe 6 penetrates the insulating medium layer 2 and the heat dissipation mechanism 3 in sequence, the pad substrate 1 is fixed through the metal pipe 6, and the heat dissipation mechanism 3 can also play a heat dissipation purpose, and the heat dissipation efficiency is improved. The upper side of the upper substrate 101 and the lower side of the lower substrate 102 are fixedly provided with welding lines 5, and the peripheral side of the heat dissipation frame 303 is fixedly provided with a plurality of mounting blocks 7. The mounting holes 701 are formed in the mounting blocks 7, and the mounting blocks 7 are fixed through the mounting holes 701, so that the stability of the mounting blocks 7 is improved.

[0033] As shown in the Figures 1-5 The principle of the novel patch type multilayer PCB provided by the embodiment is as follows:

[0034] The insulating medium layer 2 is fixedly arranged in the middle of the pad substrate 1, that is, the insulating medium layer 2 is fixed between the upper substrate 101 and the lower substrate 102, which can play a role of insulating support, improve the overall insulating performance, and also improve the overall structural strength.

[0035] The heat dissipation mechanism 3 is fixedly arranged in the middle of the insulating medium layer 2, and the heat generated by the upper substrate 101 or the lower substrate 102 can be transmitted to the heat dissipation frame 303 through the cylindrical heat dissipation rod 301 or the square heat dissipation rod 302, and then transmitted to the outside of the pad substrate 1, so as to achieve the purpose of dissipating heat of the upper substrate 101 or the lower substrate 102, and the structure is simple, and the service life of the upper substrate 101 or the lower substrate 102 is greatly improved.

[0036] After the heat is transmitted to the insulating medium layer 2 through the upper substrate 101 or the lower substrate 102 by heat transmission, the heat on the insulating medium layer 2 is reduced through the cylindrical heat dissipation rod 301 and the square heat dissipation rod 302 on the heat dissipation mechanism 3, and the heat on the upper substrate 101 or the lower substrate 102 can be actively absorbed through the refrigeration piece heat absorption surface 401 on the semiconductor refrigeration piece 4, and the heat is transmitted to the heat dissipation mechanism 3 through the refrigeration piece heat dissipation surface 402, so that the heat on the pad substrate 1 can be greatly reduced, and the service efficiency and service life of the pad substrate 1 are improved.

[0037] Some terms are used in the description and claims to refer to certain components. As one skilled in the art will appreciate, hardware manufacturers can refer to a component using different names. This description and claims should not be controlled by the difference in name, but by the difference in function of the component. As mentioned throughout the description and claims, "comprising" is an open term, which should be interpreted as "comprising but not limited to". "Approximately" means within an acceptable error range, and those skilled in the art can solve technical problems within a certain error range, and basically achieve the technical effect.

[0038] It is to be understood that the terms "including", "comprising", or any other variation thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0039] The above description shows and describes several preferred embodiments of the present application, but it is to be understood that the present application is not limited to the above-described and illustrated forms, and should not be considered as excluding other embodiments, but can be used in various other combinations, modifications and environments, and can be modified within the scope of the present application concept described herein, by the above teachings or related technical or knowledge. Any modification and change made by those skilled in the art without departing from the spirit and scope of the present application shall be within the protection scope of the claims of the present application.

Claims

1. A novel patch multi-layer PCB board comprising a pad substrate (1), characterized in that, The pad substrate (1) comprises an upper substrate (101) and a lower substrate (102), an insulating medium layer (2) is fixedly arranged between the upper substrate (101) and the lower substrate (102), a heat dissipation bin (203) is arranged in the middle part of the insulating medium layer (2), a heat dissipation mechanism (3) is fixedly arranged in the inside of the heat dissipation bin (203), cylindrical heat dissipation rods (301) and square heat dissipation rods (302) are fixedly arranged on the outer side of the heat dissipation mechanism (3), and the square heat dissipation rods (302) and the cylindrical heat dissipation rods (301) extend into the inside of the insulating medium layer (2) and are connected with a heat dissipation frame (303). Semiconductor refrigerating sheets (4) are fixedly arranged at the two ports of the heat dissipation bin (203), and the semiconductor refrigerating sheets (4) abut against the upper and lower sides of the heat dissipation mechanism (3).

2. A novel patch multi-layer PCB board according to claim 1, characterized by: Square through holes (201) and circular through holes (202) are arranged in the inside of the insulating medium layer (2), the square heat dissipation rods (302) are arranged in the inside of the square through holes (201), and the cylindrical heat dissipation rods (301) are arranged in the inside of the circular through holes (202).

3. A novel patch multi-layer PCB board according to claim 1, characterized in that: The heat dissipation mechanism (3), the cylindrical heat dissipation rods (301), the square heat dissipation rods (302) and the heat dissipation frame (303) are fixedly connected by welding.

4. A novel patch multi-layer PCB board according to claim 1, characterized in that: Corresponding sides of the upper substrate (101) and the lower substrate (102) are provided with heat dissipation frame grooves (103), and the heat dissipation frame (303) is fixedly arranged in the inside of the heat dissipation frame grooves (103).

5. A novel patch multi-layer PCB board according to claim 1, characterized in that: The semiconductor refrigerating sheets (4) comprise refrigerating sheet heat absorbing surfaces (401) and refrigerating sheet heat dissipation surfaces (402), and the refrigerating sheet heat dissipation surfaces (402) abut against the upper side or the lower side of the heat dissipation mechanism (3).

6. A novel patch multi-layer PCB board according to claim 1, characterized by: Metal pipes (6) are fixedly arranged on the pad substrate (1) and sequentially penetrate the insulating medium layer (2) and the heat dissipation mechanism (3).

7. A novel patch multi-layer PCB board according to claim 1, characterized in that: Welding lines (5) are fixedly arranged on the upper side of the upper substrate (101) and the lower side of the lower substrate (102).

8. A novel patch multi-layer PCB board according to claim 1, characterized by: A plurality of mounting blocks (7) are fixedly arranged on the circumferential side of the heat dissipation frame (303), and mounting holes (701) are arranged in the mounting blocks (7).

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