Radiator and electronic equipment

Abstract

The utility model belongs to the field of electronic equipment, and discloses a radiator and electronic equipment, the radiator comprises a radiating frame and a plurality of radiating fins, the radiating frame comprises a first supporting piece and a second supporting piece, and the first supporting piece and the second supporting piece are arranged in parallel; the multiple cooling fins are perpendicular to the first supporting piece and the second supporting piece and connected with the first supporting piece and the second supporting piece. Radiation layers are arranged on the two sides of each cooling fin in the thickness direction, and the radiation layers are further filled with a plurality of cooling particles. In this way, the heat dissipation efficiency of the radiator is improved, and heat dissipation weakness of the radiator is delayed.

Description

Technical Field

[0001] This application relates to the field of electronic devices, and more particularly to a heat sink and an electronic device. Background Technology

[0002] When electronic devices are working, they convert some electrical energy into heat energy, causing electrical components to operate in a high-temperature environment, which reduces the efficiency of the electrical components and shortens their service life.

[0003] Traditional heat dissipation methods involve connecting a heat sink to electrical components and using the heat sink fins to conduct and dissipate heat, carrying it into the environment through the air. This passive heat dissipation method relies primarily on the performance of the heat sink fins for its efficiency. However, heat sink fins made of specific materials often have limited heat dissipation performance, are ineffective at dissipating heat under sustained high temperatures, and their performance may weaken during use, leading to a decrease in the overall heat dissipation effect of the heat sink.

[0004] Therefore, how to improve the heat dissipation efficiency of radiators and delay the weakening of heat dissipation has become an urgent problem to be solved in this field. Utility Model Content

[0005] This application discloses a heat sink and electronic equipment, with the aim of improving the heat dissipation efficiency of the heat sink and delaying the weakening of the heat dissipation of the heat sink.

[0006] This application discloses a heat sink, which includes a heat sink frame and a plurality of heat sinks. The heat sink frame includes a first support member and a second support member, which are arranged in parallel. The plurality of heat sinks are perpendicular to the first support member and the second support member and are connected to the first support member and the second support member. Each heat sink has a radiation layer on both sides in the thickness direction, and the radiation layer is filled with a plurality of heat dissipation particles.

[0007] Optionally, the radiating layer is made of any one of ceramic oxide, silicon carbide, or nano-carbon; the heat dissipation particles are made of graphene.

[0008] Optionally, the spacing between two adjacent heat sinks is between 4 mm and 6 mm; the thickness of the heat sink is between 0.3 mm and 0.5 mm.

[0009] Optionally, both the first support member and the second support member have openings at the gaps between two adjacent heat sinks.

[0010] Optionally, the first support member has multiple first protruding ridges spaced apart on the side away from the heat sink. The multiple first protruding ridges are arranged along the length direction of the first support member and protrude a predetermined height away from the heat sink. The second support member has multiple second protruding ridges spaced apart on the side away from the heat sink. The multiple second protruding ridges are arranged along the length direction of the second support member and protrude a predetermined height away from the heat sink. The length extension direction of the first and second protruding ridges is the same as the length extension direction of the heat sink. The gap between two adjacent first protruding ridges corresponds to the gap between two adjacent second protruding ridges.

[0011] Optionally, the height of the plurality of first protruding ridges gradually increases from the edge of the first support member toward the center of the first support member; the height of the plurality of second protruding ridges gradually increases from the edge of the second support member toward the center of the second support member.

[0012] Optionally, the heat sink further includes a heat pipe, each heat sink fin has a through hole, and the through holes on the multiple heat sink fins are arranged opposite each other. The heat pipe passes through the multiple through holes arranged opposite each other on the multiple heat sink fins in sequence and is connected to the multiple heat sink fins.

[0013] This application also discloses an electronic device including electrical components, the electronic device further including the aforementioned heat sink, the heat sink being connected to the electrical components.

[0014] Optionally, the electronic device further includes a housing and a rear cover, wherein the heat sink and the electrical components are mounted inside the housing, and the rear cover covers the heat sink and the electrical components and is connected to the housing; the distance between the heat sink and the rear cover is between 2 mm and 3 mm.

[0015] Optionally, the back cover is provided with a plurality of protruding ridges corresponding to the position of the heat sink. The protruding ridges protrude to a predetermined height on the side of the back cover away from the heat sink, and there is a gap between two adjacent protruding ridges. The protruding ridge includes a first side and a second side arranged opposite to each other. The first side is provided with a heat dissipation hole, and the second side is arc-shaped and bends toward the heat dissipation hole.

[0016] This application incorporates a radiating layer on a heat sink, which radiates the heat absorbed by the heat sink to the external environment, expanding the heat dissipation range of the heat sink. Furthermore, heat dissipation particles are added within the radiating layer. When the heat sink receives heat from electrical components, it first dissipates the heat through its own structure, and then further conducts the heat to the heat dissipation particles within the radiating layer. These particles alleviate the heat dissipation pressure on the heat sink and further enhance the heat dissipation efficiency of the entire heat sink structure, radiating the heat to the external environment through the radiating layer. This design effectively improves the inherent heat dissipation capacity of the heat sink, further enhancing its heat dissipation effect, thereby increasing the heat dissipation efficiency of the radiator and delaying its heat dissipation degradation. Attached Figure Description

[0017] The accompanying drawings are provided to further illustrate the embodiments of this application and form part of the specification. They serve to demonstrate implementation methods of this application and, together with the textual description, explain the principles of this application. Obviously, the drawings described below are merely some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort. In the drawings:

[0018] Figure 1 This is a schematic diagram of the first embodiment of the heat sink of this application;

[0019] Figure 2 This is a schematic diagram of the heat sink in the first embodiment of the heat sink of this application;

[0020] Figure 3 This is a schematic diagram of a second embodiment of the heat sink of this application;

[0021] Figure 4 This is a schematic diagram of the third embodiment of the heat sink of this application;

[0022] Figure 5 This is a schematic diagram of the first support member in the fourth embodiment of the heat sink of this application;

[0023] Figure 6 This is a schematic diagram of the second support member in the fourth embodiment of the heat sink of this application.

[0024] Figure 7 This is a schematic diagram of the fifth embodiment of the heat sink of this application;

[0025] Figure 8 This is a schematic diagram showing the connection between the heat sink and electrical components in one embodiment of the electronic device of this application;

[0026] Figure 9 This is a schematic diagram of a second embodiment of the electronic device of this application;

[0027] Figure 10 This is a schematic diagram of a third embodiment of the electronic device of this application;

[0028] Figure 11 This is a schematic diagram of the protruding ridge in the third embodiment of the electronic device of this application.

[0029] Among them, 10 is an electronic device; 100 is a heat sink; 110 is a heat sink frame; 111 is a first support member; 112 is a first protruding ridge; 113 is a second support member; 114 is a second protruding ridge; 115 is an opening; 120 is a heat sink; 121 is a radiation layer; 122 is a heat dissipation particle; 130 is a heat pipe; 140 is a through hole; 200 is an electrical component; 300 is a housing; 400 is a back cover; 410 is a protruding ridge; 411 is a first side surface; 412 is a heat dissipation hole; 413 is a second side surface; and 414 is a second heat dissipation hole. Detailed Implementation

[0030] The present application will now be described in detail with reference to the accompanying drawings and optional embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0031] Figure 1 This is a schematic diagram of the first embodiment of the heat sink of this application. Figure 2 This is a schematic diagram of the heat sink in the first embodiment of the heat sink of this application, as shown below. Figure 1 and Figure 2 As shown, this application discloses a heat sink 100, which includes a heat sink frame 110 and a plurality of heat sinks 120. The heat sink frame 110 includes a first support member 111 and a second support member 113, which are arranged in parallel. The plurality of heat sinks 120 are perpendicular to the first support member 111 and the second support member 113 and are connected to the first support member 111 and the second support member 113. Each heat sink 120 has a radiation layer 121 on both sides in the thickness direction, and the radiation layer 121 is filled with a plurality of heat dissipation particles 122.

[0032] This application provides a radiation layer 121 on the heat sink 120, which radiates the heat absorbed by the heat sink 120 to the external environment, thereby expanding the heat dissipation range of the heat sink 120. Heat dissipation particles 122 are added within the radiation layer 121. When the heat sink 120 receives heat from the electrical component 200, it first dissipates the heat through its own structure, and then further conducts the heat to the heat dissipation particles 122 within the radiation layer 121. The heat dissipation particles 122 share the heat dissipation burden on the heat sink 120 and further enhance the heat dissipation efficiency of the entire heat sink 120 structure, radiating the heat to the external environment through the radiation layer 121. This design effectively improves the inherent heat dissipation capacity of the heat sink 120, further enhancing its heat dissipation effect, thereby improving the heat dissipation efficiency of the radiator 100 and delaying the weakening of the radiator 100's heat dissipation.

[0033] Specifically, the radiating layer 121 is made of any one of ceramic oxide, silicon carbide, or nano-carbon; the heat dissipation particles 122 are made of graphene.

[0034] Since the heat dissipation particles 122 need to further absorb and transfer the heat from the heat sink 120, they need to have good heat dissipation performance. Therefore, graphene material is used to make the heat dissipation particles 122. Graphene is a single-layer two-dimensional honeycomb lattice structure in which carbon atoms are tightly packed, and it has very good thermal conductivity. The heat dissipation particles 122 made of graphene material can quickly transfer the heat from the heat sink 120 to the radiation layer 121. The radiation layer 121 needs to dissipate the heat to the external environment through radiation. Therefore, it can be made of any material with good radiation performance, such as ceramic oxide, silicon carbide, or nano-carbon. For example, when the radiation layer 121 is made of nano-carbon, it can effectively convert thermal energy into infrared short waves and emit them into the outside air.

[0035] This application utilizes a radiating layer 121 with added heat dissipation particles 122 on the heat sink 120, so that heat is transferred twice on the heat sink 120 through the heat dissipation particles 122. The heat dissipation particles 122 share the heat dissipation pressure of the heat sink 120, and finally the heat dissipation particles 122 transfer the heat to the radiating layer 121, so that the radiating layer 121 radiates the heat to the external environment. That is, through the two heat dissipation methods of heat transfer and heat radiation, the inherent heat dissipation capacity of the heat sink 120 is effectively improved, the heat dissipation effect of the heat sink 120 is further improved, and the heat dissipation efficiency of the radiator 100 is improved, thus delaying the heat dissipation decay of the radiator 100.

[0036] To ensure smooth airflow between adjacent heat sinks 120 in the radiator 100 and to effectively increase the airflow velocity between them, enabling air to quickly transfer heat from between the heat sinks 120 to the external environment, the dimensions of the heat sink 120 in this application are designed as follows:

[0037] The spacing between two adjacent heat sinks 120 ranges from 4 mm to 6 mm; the thickness of the heat sink 120 ranges from 0.3 mm to 0.5 mm.

[0038] When the distance between two adjacent heat sinks 120 is less than 4 mm, the two heat sinks 120 are too close together, compressing the space between them. It is difficult for air to circulate in the narrow gap formed between the two heat sinks 120, and the airflow is difficult to carry away the heat. When the distance between two adjacent heat sinks 120 is greater than 6 mm, the space between the two heat sinks 120 is larger, the airflow speed is slower, and the rate at which the airflow carries away the heat will decrease.

[0039] Furthermore, the thickness of the heat sink 120 itself also affects its heat dissipation performance. If the thickness of the heat sink 120 is less than 0.3 mm, the heat dissipation effect of the heat sink 120 will be poor. If the thickness of the heat sink 120 is greater than 0.5 mm, when two adjacent heat sinks 120 leave the same gap, the overall size of the heat sink 100 will increase. Therefore, the thickness of the heat sink 120 in this application is between 0.3 mm and 0.5 mm. For example, when the thickness of the heat sink 120 is 0.4 mm, it can ensure that the heat sink 120 itself has good heat dissipation performance, and the overall size of the heat sink 100 can be effectively controlled without occupying too much space.

[0040] The heat sink 120 in this application can be made of aluminum or other metals with good thermal conductivity, such as copper. This application only uses aluminum as an example and does not impose specific limitations on the material of the heat sink 120. Each heat sink 120 is vertically connected to the first support member 111 and the second support member 113, which can ensure the vertical convection of air. Each heat sink 120 is straight and without deformation, and does not obstruct the airflow.

[0041] Therefore, this application sets the spacing between two adjacent heat sinks 120 in the range of 4 mm to 6 mm. For example, when the spacing between two adjacent heat sinks 120 is 5 mm, an airflow channel is formed between the two adjacent heat sinks 120. The temperature inside the airflow channel is lower than the temperature of the heat sink 120, which leads to an increase in the air pressure difference due to the temperature difference inside the airflow channel. This increases the air velocity inside the airflow channel and accelerates the heat dissipation rate, thereby increasing the pathway for heat convection. This allows the heat flow in the environment to flow more quickly under the impetus of air pressure without being obstructed. At the same time, the spacing setting, in conjunction with the radiation shielding layer, can effectively improve the inherent heat dissipation capacity of the heat sink 120, further enhance the heat dissipation effect of the heat sink 120, and thus improve the heat dissipation efficiency of the radiator 100, delaying the weakening of the heat dissipation of the radiator 100.

[0042] Figure 3 This is a schematic diagram of the second embodiment of the heat sink of this application. Figure 3 The illustrated embodiment is based on Figure 1 Improvements, such as Figure 3 As shown, the first support member 111 and the second support member 113 are provided with openings 115 at the gaps between two adjacent heat sinks 120.

[0043] The difference between this embodiment and the previous embodiment is that an opening 115 is provided on the first support member 111 and the second support member 113 at the position corresponding to the gap between the two heat sinks 120. The opening 115 is used to open up the airflow channel formed between the gap between the two heat sinks 120, so that air can circulate through the opening 115 and the airflow channel formed between the two heat sinks 120.

[0044] The air below the first support 111 and the second support 113 can convect with the air above the first support 111 and the second support 113 through the opening 115, which further increases the air velocity near the heat sink 120. This can further accelerate the air velocity in the airflow channel formed between two adjacent heat sinks 120, quickly carry the heat of the heat sink 120 to the external environment, and effectively improve the heat dissipation efficiency of the heat sink 100.

[0045] Figure 4 This is a schematic diagram of the third embodiment of the heat sink of this application. Figure 4 The illustrated embodiment is based on Figure 1 Improvements, such as Figure 4As shown, the first support member 111 has multiple first protruding ridges 112 spaced apart on the side away from the heat sink 120. The multiple first protruding ridges 112 are arranged along the length direction of the first support member 111, and the multiple first protruding ridges 112 protrude at a predetermined height in the direction away from the heat sink 120. The second support member 113 has multiple second protruding ridges 114 spaced apart on the side away from the heat sink 120. The multiple second protruding ridges 114 are arranged along the length direction of the second support member 113, and the multiple second protruding ridges 114 protrude at a predetermined height in the direction away from the heat sink 120. The length extension direction of the first protruding ridges 112 and the second protruding ridges 114 is the same as the length extension direction of the heat sink 120. The gap between two adjacent first protruding ridges 112 corresponds to the gap between two adjacent second protruding ridges 114.

[0046] This embodiment and Figure 1 Unlike the illustrated embodiment, in this embodiment, the first support 111 and the second support 113 have protrusions of a certain height on the side away from the heat sink 120, forming multiple first protrusions 112 and second protrusions 114. Airflow channels are formed between adjacent first protrusions 112 and adjacent second protrusions 114, allowing air to circulate within these channels. The first protrusions 112 and second protrusions 114 are heated by the heat sink 120, resulting in a certain temperature. The temperature within the airflow channel formed between the two first protrusions 112 and the two adjacent second protrusions 114 is lower than that of the first protrusions 112 and the second protrusions 114. This results in an increased air pressure difference within the airflow channel due to the temperature difference, which in turn increases the airflow velocity and heat dissipation rate. When the air below the heat sink 120 passes through the gap between the two adjacent first protrusions 112 or the two adjacent second protrusions 114, it quickly carries the heat below the heat sink 100 to the external environment, thereby improving the heat dissipation efficiency of the heat sink 100 and delaying the weakening of the heat dissipation of the heat sink 100.

[0047] Furthermore, the gap between two adjacent first protrusions 112 corresponds to the gap between two adjacent second protrusions 114, which can align the airflow channel formed between the two adjacent first protrusions 112 with the airflow channel formed between the two adjacent second protrusions 114, allowing the air in the two channels to further form convection, accelerating the airflow speed in the airflow channels, and further improving the heat dissipation effect of the radiator 100.

[0048] Figure 5 This is a schematic diagram of the first support member in the fourth embodiment of the heat sink of this application. Figure 6 This is a schematic diagram of the second support member in the fourth embodiment of the heat sink of this application, as shown below. Figure 5 and Figure 6As shown, the height of the plurality of first protrusions 112 gradually increases from the edge of the first support member 111 toward the center of the first support member 111; the height of the plurality of second protrusions 114 gradually increases from the edge of the second support member 113 toward the center of the second support member 113.

[0049] Since the heat sink 120 located in the middle of the multiple vertically installed heat sinks 120 is affected by the heat of the surrounding heat sinks 120, the heat sink 120 in the middle often has a higher temperature and generates more heat, while the heat sinks 120 located at the edge of the heat sink 100 have a relatively lower temperature than the middle part, in this embodiment, in order to enable the first protruding ridge 112 and the second protruding ridge 114 to form targeted heat dissipation for different parts of the heat sink 100, the structure of the first protruding ridge 112 and the second protruding ridge 114 has been improved.

[0050] The height of multiple first protruding ridges 112 gradually increases from the edge of the first support member 111 towards the center of the first support member 111, thereby gradually increasing the heat dissipation area of ​​the first protruding ridges 112 from the edge of the first support member 111 towards the center of the first support member 111. Therefore, the heat dissipation effect of the first protruding ridges 112 closer to the center of the first support member 111 is better. Similarly, the height of multiple second protruding ridges 114 gradually increases from the edge of the second support member 113 towards the center of the second support member 113, thereby gradually increasing the heat dissipation area of ​​the second protruding ridges 114 from the edge of the second support member 113 towards the center of the second support member 113. Since the heat dissipation area is larger, the heat dissipation effect of the second protruding ridges 114 closer to the center of the second support member 113 is better. This forms a targeted stepped heat dissipation for different parts of the radiator 100, making the overall heat of the heat sinks 120 with higher and lower temperatures tend to be balanced, further improving the heat dissipation uniformity of the radiator 100.

[0051] Figure 7 This is a schematic diagram of the fifth embodiment of the heat sink of this application. Figure 7 The illustrated embodiment is based on Figure 1 Improvements, such as Figure 7 As shown, the heat sink 100 also includes a heat pipe 130. Each heat sink 120 is provided with a through hole 140. The through holes 140 on the multiple heat sinks 120 are arranged facing each other. The heat pipe 130 passes through the through holes 140 arranged facing each other on the multiple heat sinks 120 in sequence and is connected to the multiple heat sinks 120.

[0052] In this embodiment, the heat pipe 130 passes through the through holes 140 on multiple heat sinks 120 in sequence, so that the heat pipe 130 is connected to the multiple heat sinks 120 and directly contacts the heat sinks 120 in the radiator 100 that mainly perform heat dissipation. When the heat pipe 130 conducts heat from the electrical component 200 to the radiator 100, the heat from the heat pipe 130 is directly conducted to the heat sinks 120 and dissipated through the heat sinks 120, further improving the heat dissipation effect.

[0053] Figure 8 This is a schematic diagram of the first embodiment of the electronic device of this application, as shown below. Figure 8 As shown, this application also discloses an electronic device 10, which includes an electrical component 200. The electronic device 10 also includes the aforementioned heat sink 100, which is connected to the electrical component 200.

[0054] In this application, the heat sink 100 can be connected to the electrical component 200 through the heat pipe 130. The heat pipe 130 conducts the heat generated by the electrical component 200 to the heat sink 100. The heat sink 100 dissipates the heat generated by the electrical component 200 into the environment through the heat sink 120, effectively reducing the temperature of the electrical component 200 itself, ensuring the normal use of the electrical component 200, and extending the service life of the electrical component 200.

[0055] However, since the heat sink 120 has an upper limit to its heat dissipation efficiency, and its heat dissipation efficiency decreases with prolonged use, it often cannot achieve a good heat dissipation effect when continuously dissipating heat from the electrical component 200, or when the electrical component 200 suddenly generates significantly high heat in a short period of time.

[0056] To address the aforementioned issues, this application improves the heat sink 100 in the electronic device 10 by providing a radiation layer 121 on the heat sink 120. This radiation layer 121 radiates the heat absorbed by the heat sink 120 to the external environment, expanding the heat dissipation range of the heat sink 120. Furthermore, heat dissipation particles 122 are added within the radiation layer 121. When the heat sink 120 receives heat from the electrical component 200, it first dissipates the heat through its own structure, and then further conducts the heat to the heat dissipation particles 122 within the radiation layer 121. The heat dissipation particles 122 share the heat dissipation burden on the heat sink 120 and further enhance the heat dissipation efficiency of the entire heat sink 120 structure, radiating the heat to the external environment through the radiation layer 121. This design effectively improves the inherent heat dissipation capacity of the heat sink 120, enhances its heat dissipation effect, thereby improving the heat dissipation efficiency of the heat sink 100, delaying the weakening of the heat dissipation of the heat sink 100, and further extending the service life of the electronic device 10.

[0057] Figure 9 This is a schematic diagram of a second embodiment of the electronic device of this application. Figure 9 The illustrated embodiment is based on Figure 8 Improvements, such as Figure 9 As shown, the electronic device 10 also includes a housing 300 and a rear cover 400. The heat sink 100 and the electrical components 200 are installed inside the housing 300. The rear cover 400 covers the heat sink 100 and is connected to the housing 300. The distance between the heat sink 100 and the rear cover 400 is between 2 mm and 3 mm.

[0058] It should be noted that the electronic device 10 in this application is mainly a display device with display function. The electronic device 10 has a display panel, such as a television or computer. This application does not impose specific restrictions on the type of electronic device 10.

[0059] Because air circulation is required between the radiator 100 and the back cover 400 in order to more easily carry the heat radiated by the radiator 100 to the external environment, the distance between the radiator 100 and the back cover 400 will directly affect the speed of air circulation between the radiator 100 and the back cover 400. If the distance between the radiator 100 and the back cover 400 is too large or too small, the air circulation rate will decrease.

[0060] If the distance d between the radiator 100 and the back cover 400 is less than 2 mm, the radiator 100 and the back cover 400 will be too close together, resulting in insufficient space between them, obstructed airflow, and inability to effectively remove heat. If the distance d between the radiator 100 and the back cover 400 is greater than 3 mm, the airflow speed between the radiator 100 and the back cover 400 will be slower, which is also not conducive to the rapid removal of heat by the air.

[0061] Therefore, this application designs the distance d between the heat sink 100 and the rear cover 400, setting the distance d between the heat sink 100 and the rear cover 400 to between 2 mm and 3 mm. For example, when the distance d between the heat sink 100 and the rear cover 400 is 2.5 mm, air can effectively circulate between the heat sink 100 and the rear cover 400, and can quickly carry the heat radiated by the heat sink 100 to the external environment, effectively improving the air circulation rate between the heat sink 100 and the rear cover 400, and further improving the heat dissipation performance of the electronic device 10.

[0062] Figure 10 This is a schematic diagram of a third embodiment of the electronic device of this application. Figure 11 This is a schematic diagram of the protruding ridge in the third embodiment of the electronic device of this application. Figure 10 The illustrated embodiment is based on Figure 8 Improvements, such as Figure 10 and Figure 11As shown, the back cover 400 is provided with a plurality of protruding ridges 410 at the position corresponding to the heat sink 100. The protruding ridges 410 protrude a preset height toward the side of the back cover 400 away from the heat sink 100, and there is a gap between two adjacent protruding ridges 410. The protruding ridges 410 include a first side surface 411 and a second side surface 413 arranged opposite to each other. The first side surface 411 is provided with a heat dissipation hole 412, and the second side surface 413 is arc-shaped and bends toward the heat dissipation hole 412.

[0063] The difference between this embodiment and the previous embodiment is that, in order to ensure that the rear cover 400 does not affect the heat dissipation effect of the heat sink 100 after it is closed on the housing 300, this embodiment has made improvements to the rear cover 400 of the electronic device 10. The specific improvements are as follows:

[0064] In this embodiment, multiple heat dissipation holes 412 are provided on the back cover 400 at the position corresponding to the heat sink 100, so that when the heat sink 100 transfers heat through the air, it can be directly discharged to the external environment through the heat dissipation holes 412 on the back cover 400. In addition, multiple protrusions 410 are provided on the back cover 400, which locally raises the surface of the back cover 400 away from the heat sink 100. A slit is formed between the multiple spaced protrusions 410. The air flow speed in the slit is faster than the air flow speed in other positions. Therefore, when the air flows through the slit between the multiple protrusions 410, it will quickly carry away the heat from the heat dissipation holes 412, effectively improving the heat dissipation rate and preventing heat from accumulating at the heat dissipation holes 412. This can effectively reduce the temperature at the heat dissipation holes 412 and prevent the heat dissipation holes 412 exposed to the outside of the device from getting too hot to the touch.

[0065] Furthermore, since the protrusion 410 has a heat dissipation hole 412 formed on the first side 411, and the first side 411 opposite to the second side 413 is an arc surface, an L-shaped air channel is formed between the radiator 100 and the protrusion 410 on the rear cover 400. That is, when the air flows through the position of the protrusion 410, a corner is formed. When the radiator 100 radiates heat towards the rear cover 400 through the radiation layer 121 of the heat sink 120, as the air is carried towards the protrusion 410, the protrusion 410 will transfer the heat from the radiator 100 towards the rear cover 400 to the side, avoiding excessive heat concentration and causing local overheating of the rear cover 400. In addition, the heat dissipation hole 412 is not directly opposite the rear cover 400, which helps to prevent dust from entering the housing 300.

[0066] In this application, the heat dissipation holes 412 of multiple adjacent protrusions 410 can be on the same side or on different sides. For example, when the heat dissipation holes 412 of two adjacent protrusions 410 are on different sides, the heat can be discharged from different directions. This effectively avoids the heat from being too concentrated in the same direction and causing local overheating, effectively reducing the temperature of the back cover 400 and preventing the back cover 400 from getting too hot to the touch.

[0067] In addition, multiple circular second heat dissipation holes 414 can be provided on the ground side of the back cover 400. By cooperating with the heat dissipation holes 412, heat can be discharged from different directions, while enhancing the air circulation inside and outside the housing 300, and further improving the heat dissipation effect of the electronic device 10.

[0068] It should be noted that the inventive concept of this application can form many embodiments, but due to the limited space of the application documents, they cannot all be listed. Therefore, without conflict, the embodiments described above or the technical features can be arbitrarily combined to form new embodiments. After the embodiments or technical features are combined, the original technical effect will be enhanced.

[0069] The above description, in conjunction with specific optional embodiments, provides a further detailed explanation of this application and should not be construed as limiting the specific implementation of this application to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of this application, and all such modifications or substitutions should be considered within the scope of protection of this application.

Claims

1. A radiator, characterized in that, The radiator includes a heat sink frame and multiple heat sinks. The heat sink frame includes a first support member and a second support member. The first support member and the second support member are arranged in parallel. The multiple heat sinks are perpendicular to the first support member and the second support member and are connected to the first support member and the second support member. Each heat sink has a radiation layer on both sides in the thickness direction, and the radiation layer is filled with multiple heat dissipation particles.

2. The radiator as described in claim 1, characterized in that, The radiating layer is made of any one of ceramic oxide, silicon carbide, or nano-carbon; the heat dissipation particles are made of graphene.

3. The radiator as described in claim 2, characterized in that, The spacing between two adjacent heat sinks ranges from 4 mm to 6 mm; the thickness of the heat sink ranges from 0.3 mm to 0.5 mm.

4. The radiator as described in claim 1, characterized in that, Both the first support member and the second support member have openings at the gaps between two adjacent heat sinks.

5. The radiator as described in claim 4, characterized in that, The first support member has multiple first protruding ridges spaced apart on the side away from the heat sink. The multiple first protruding ridges are arranged along the length direction of the first support member and protrude a predetermined height in the direction away from the heat sink. The second support member has multiple second protruding ridges spaced apart on the side away from the heat sink. The multiple second protruding ridges are arranged along the length direction of the second support member and protrude a predetermined height in the direction away from the heat sink. The length extension direction of the first protrusion and the second protrusion is the same as the length extension direction of the heat sink; and the gap between two adjacent first protrusions corresponds to the gap between two adjacent second protrusions.

6. The radiator as described in claim 5, characterized in that, The height of the plurality of first protruding ridges gradually increases from the edge of the first support member toward the center of the first support member; the height of the plurality of second protruding ridges gradually increases from the edge of the second support member toward the center of the second support member.

7. The radiator as claimed in claim 1, characterized in that, The heat sink also includes a heat pipe. Each heat sink fin has a through hole. The through holes on the multiple heat sink fins are arranged opposite each other. The heat pipe passes through the through holes arranged opposite each other on the multiple heat sink fins in sequence and is connected to the multiple heat sink fins.

8. An electronic device comprising electrical components, characterized in that, The electronic device further includes a heat sink as described in any one of claims 1 to 7, the heat sink being connected to the electrical component.

9. The electronic device as claimed in claim 8, characterized in that, The electronic device further includes a housing and a rear cover. The heat sink and the electrical components are installed inside the housing. The rear cover covers the heat sink and the electrical components and is connected to the housing. The distance between the heat sink and the rear cover is between 2 mm and 3 mm.

10. The electronic device as claimed in claim 9, characterized in that, The rear cover has multiple protruding ridges corresponding to the position of the heat sink. The protruding ridges protrude a predetermined height toward the side of the rear cover away from the heat sink, and there is a gap between two adjacent protruding ridges. The protruding ridge includes a first side and a second side disposed opposite to each other. The first side is provided with a heat dissipation hole, and the second side is arc-shaped and bends toward the heat dissipation hole.

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