Electronic equipment radiator

Abstract

The utility model relates to the technical field of heat dissipation equipment, in particular to an electronic equipment radiator which comprises a shell, a heat dissipation assembly and a water absorption assembly. The heat dissipation assembly is arranged in the shell and comprises a heat dissipation sheet, and the heat dissipation sheet is arranged on the binding face and can be attached to the electronic equipment; and the water absorbing assembly is used for absorbing water condensed by the cooling fins. When the radiator is used, one side of the radiating fin is attached to the electronic equipment, and the radiating fin generates cold energy and transmits the cold energy to the electronic equipment to cool the electronic equipment. After the radiator is used for a period of time, because the temperature difference between the electronic equipment and the radiating fins is large, the electronic equipment and the radiating fins are fogged and condensed to form condensed water. The water absorption assemblies are arranged around the cooling fins, condensate water can flow to the water absorption assemblies on the peripheries of the cooling fins to be absorbed, and finally the absorbed condensate water is treated in a unified mode. Through the absorption effect of the water absorption assembly, the condensed water is prevented from directly entering the electronic equipment or the radiator to cause damage.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of heat dissipation equipment, specifically relates to an electronic equipment radiator. BACKGROUND

[0002] With the development of science and technology, electronic equipment has become an indispensable tool in people's daily life, such as mobile phones, cameras and tablets, etc. And electronic equipment will generate a lot of heat under the condition of long time use, which will cause the electronic equipment to be stuck.

[0003] The semiconductor radiator is a better radiator in the electronic equipment radiator, which uses the refrigeration fin attached to the back of the electronic equipment to cool and dissipate heat. However, due to the large temperature difference between the electronic equipment and the refrigeration fin, they will form condensation water. The existing radiator does not consider the problem of condensation water treatment. After long-term use of the radiator, the condensation water will seep into the electronic equipment or the radiator, affecting its service life, and in serious cases, it may also cause electric shock danger. SUMMARY

[0004] The purpose of the utility model is to provide an electronic equipment radiator, which can timely treat liquefied condensation water to solve the problems in the above background technology.

[0005] To achieve the above purpose, the utility model adopts the technical scheme of providing an electronic equipment radiator, which comprises a shell, a heat dissipation assembly and a water absorption assembly, one side of the shell is a bonding surface; the heat dissipation assembly is placed in the shell and comprises a heat dissipation fin, the heat dissipation fin is arranged on the bonding surface, and the heat dissipation fin can be bonded with the electronic equipment; the water absorption assembly is arranged around the heat dissipation fin, and the water absorption assembly can absorb the water condensed on the heat dissipation fin.

[0006] Further, the bonding surface is provided with a mounting groove, the mounting groove is arranged around the heat dissipation fin, and the water absorption assembly is arranged in the mounting groove.

[0007] Further, the heat dissipation assembly comprises a semiconductor heat conducting part, a heat dissipation module and a heat dissipation fan, the semiconductor heat conducting part, the heat dissipation module and the heat dissipation fan are all arranged in the shell, the semiconductor heat conducting part is connected with the heat dissipation fin and the heat dissipation module, and the heat dissipation fan faces the heat dissipation module.

[0008] Further, the shell comprises a front shell and a rear shell connected by buckling, the rear shell is hollow, the heat dissipation module adopts a heat dissipation fin, an installation cavity is formed between the heat dissipation module and the rear shell, and the heat dissipation fan is arranged in the installation cavity.

[0009] Further, the end face of the front shell is a fitting face, the front shell is provided with the mounting groove, the bottom of the mounting groove is provided with a through hole, and at least one of the semiconductor heat-conducting element, the heat dissipation module or the heat dissipation fan is communicated with the through hole.

[0010] Further, the shell further comprises a support frame arranged in the front shell, and the support frame supports the heat dissipation fins.

[0011] Further, the contact face of the heat dissipation fin is provided with a fitting layer.

[0012] Further, the electronic equipment heat dissipator further comprises a clamping assembly, the clamping assembly comprises a fixed clamping arm and a movable clamping arm, the fixed clamping arm and the movable clamping arm are arranged on opposite sides of the shell respectively, the fixed clamping arm and the movable clamping arm are oppositely arranged, and the movable clamping arm can be close to or away from the fixed clamping arm.

[0013] Further, the movable clamping arm comprises a clamping plate, a connecting piece and a spring piece, the clamping plate is arranged on one side of the shell, the clamping plate is connected with the connecting piece, the connecting piece is slidingly connected with the shell, and the spring piece is located in the shell and drives the connecting piece to reset.

[0014] Further, a sliding cavity is arranged in the shell, the connecting piece is a connecting rod, the connecting rod is slidingly connected with the sliding cavity, one end of the connecting rod is provided with a stop head, the spring piece is a spring, the spring is sleeved on the connecting rod and abuts against the stop head at one end and abuts against the side wall of the mounting cavity at the other end.

[0015] The electronic equipment heat dissipator has the advantages that:

[0016] 1. When the heat dissipator is used, one side of the heat dissipation fin is attached to the electronic equipment, the heat dissipation fin generates cold energy, and the cold energy is transmitted to the electronic equipment to cool the electronic equipment. After the heat dissipator is used for a period of time, due to the large temperature difference between the electronic equipment and the heat dissipation fin, mist condensation is formed between the two, and condensate water is formed. The water absorption assembly is arranged around the heat dissipation fin, and the condensate water flows to the water absorption assembly around the heat dissipation fin for absorption, and finally the absorbed condensate water is uniformly treated. Through the absorption effect of the water absorption assembly, the condensate water is prevented from directly entering the electronic equipment or the heat dissipator and causing damage.

[0017] 2. The shell comprises a front shell and a rear shell which are connected by buckling, the rear shell is hollow, the heat dissipation module adopts heat dissipation fins, the heat dissipation fins guide the generated heat to the rear shell and dissipate the heat to the outside through the hollow structure. The mounting cavity is formed between the heat dissipation module and the rear shell, and the heat dissipation fan is arranged in the mounting cavity. The heat dissipation fan blows out the heat from the hollow structure, accelerates the heat dissipation rate of the heat dissipation module, and improves the heat dissipation performance.

[0018] 3. The bottom of the mounting groove is provided with a through hole, and at least one of the semiconductor heat conduction element, the heat dissipation module or the heat dissipation fan is communicated with the through hole. Through the heat radiation of the semiconductor heat conduction element or the heat dissipation module, the condensed water absorbed by the water absorption assembly can be heated to evaporate in time. Or through the disturbance of the heat dissipation fan, the condensed water absorbed by the water absorption assembly can be evaporated faster.

[0019] 4. The electronic equipment radiator further comprises a clamping assembly, the clamping assembly comprises a fixed clamping arm and a movable clamping arm, the fixed clamping arm and the movable clamping arm are respectively arranged on opposite sides of the shell, the fixed clamping arm and the movable clamping arm are oppositely arranged, and the movable clamping arm can be close to or away from the fixed clamping arm, so that the radiator can be adapted to electronic equipment of different sizes. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings needed to be used in the specific embodiments or the prior art description. Obviously, the drawings described below are some embodiments of the present application, and those skilled in the art can also obtain other drawings according to these drawings without creative labor.

[0021] Figure 1 A perspective structural schematic view of the electronic equipment radiator provided by the embodiment of the present application is shown in the figure.

[0022] Figure 2 Another perspective structural schematic view of the electronic equipment radiator provided by the embodiment of the present application is shown in the figure.

[0023] Figure 3 A partial structural schematic view of the electronic equipment radiator provided by the embodiment of the present application is shown in the figure, wherein the front shell is not shown.

[0024] Figure 4 An overall structural sectional view of the electronic equipment radiator provided by the embodiment of the present application is shown in the figure.

[0025] Figure 5 An installation position schematic view of the water absorption assembly used by the electronic equipment radiator provided by the embodiment of the present application is shown in the figure.

[0026] Explanation of reference signs:

[0027] 1, shell; 11, bonding surface; 12, mounting groove; 121, through hole; 13, front shell; 14, rear shell; 15, mounting chamber; 16, support frame; 17, sliding cavity; 2, heat dissipation assembly; 21, heat dissipation fin; 22, semiconductor heat conduction element; 23, heat dissipation module; 24, heat dissipation fan; 3, water absorption assembly; 4, clamping assembly; 41, fixed clamping arm; 42, movable clamping arm; 421, clamping plate; 422, connecting rod; 423, stop head; 424, spring. DETAILED DESCRIPTION

[0028] The technical solutions of the present application will be described clearly and completely below in conjunction with the drawings. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative efforts fall within the scope of the present application.

[0029] In the description of the present application, it should be noted that the orientations or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0030] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connection" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or the communication inside two elements. For those skilled in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0031] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as there is no conflict.

[0032] Reference Figures 1 to 5 As an electronic equipment radiator provided by an embodiment of the present application, it comprises a shell 1, a heat dissipation assembly 2 and a water absorption assembly 3, one side of the shell 1 is a bonding surface 11; the heat dissipation assembly 2 is arranged in the shell 1 and comprises a heat dissipation fin 21, the heat dissipation fin 21 is arranged on the bonding surface 11 and can be bonded with the electronic equipment; the water absorption assembly 3 is arranged around the heat dissipation fin 21 and absorbs the condensed water of the heat dissipation fin 21.

[0033] When the heat sink is used, one side of the heat dissipation fin 21 is attached to the electronic device, the heat dissipation fin 21 generates cold and transmits the cold to the electronic device to cool the electronic device. After the heat sink is used for a period of time, due to the large temperature difference between the electronic device and the heat dissipation fin 21, fog condensation is formed between the two, and condensate water is formed. The water absorption assembly 3 is arranged around the heat dissipation fin 21. The condensate water will flow to the water absorption assembly 3 around the heat dissipation fin 21 for absorption, and finally the absorbed condensate water is uniformly treated. Through the absorption effect of the water absorption assembly 3, the damage caused by the direct entry of the condensate water into the electronic device or the heat sink is avoided.

[0034] Specifically, the water absorption assembly 3 is made of flexible fiber fabric material or solid material with micro gaps, and has good water absorption effect. For example: cotton, sponge or diatom mud, etc. In order to facilitate the fixation of the water absorption assembly 3, the mounting groove 12 is arranged on the fitting surface 11, the mounting groove 12 is arranged around the heat dissipation fin 21, and the water absorption assembly 3 is arranged in the mounting groove 12. The water absorption assembly 3 can be compacted in a compacted manner to make the water absorption assembly 3 full of the entire mounting groove 12. The heat dissipation assembly 2 further includes a semiconductor heat conducting member 22, a heat dissipation module 23 and a heat dissipation fan 24. The semiconductor heat conducting member 22, the heat dissipation module 23 and the heat dissipation fan 24 are arranged in the shell 1. The semiconductor heat conducting member 22 connects the heat dissipation fin 21 and the heat dissipation module 23. The heat dissipation fan 24 faces the heat dissipation module 23 and cools the heat dissipation module 23.

[0035] In this embodiment, the shell 1 includes a front shell 13 and a rear shell 14 connected by buckling. The rear shell 14 is hollow. The heat dissipation module 23 is made of heat dissipation fins. The heat dissipation fins guide the generated heat to the rear shell 14 and dissipate the heat to the outside through the hollow structure. An installation cavity 15 is formed between the heat dissipation module 23 and the rear shell 14. The heat dissipation fan 24 is arranged in the installation cavity 15. The heat dissipation fan 24 blows the heat out of the hollow structure, accelerates the heat dissipation rate of the heat dissipation module 23, and improves the heat dissipation performance.

[0036] Further, the end surface of the front shell 13 is the fitting surface 11. The front shell 13 is provided with the mounting groove 12. The bottom of the mounting groove 12 is provided with a through hole 121. At least one of the semiconductor heat conducting member 22, the heat dissipation module 23 or the heat dissipation fan 24 communicates with the through hole 121. Through the heat radiation effect of the semiconductor heat conducting member 22 or the heat dissipation module 23, the condensate water absorbed by the water absorption assembly 3 can be heated, so that the condensate water evaporates in time. Or through the disturbance effect of the heat dissipation fan 24, the condensate water absorbed by the water absorption assembly 3 evaporates faster.

[0037] In the embodiment, the shell 1 further comprises a support frame 16 arranged in the front shell 13, and the support frame 16 supports the heat dissipation fins 21. The support frame 16 is fixed on the heat dissipation module 23, is hollow, and has an installation cavity 15 formed in the middle portion, and the semiconductor heat conduction member 22 is installed in the installation cavity 15. The top of the support frame 16 is fixed with the heat dissipation fins 21, and the support frame 16 supports the heat dissipation fins 21. One surface of the semiconductor heat conduction member 22 is attached to the heat dissipation fins 21, and the other surface is attached to the heat dissipation module 23.

[0038] Further, the contact surface of the heat dissipation fins 21 is provided with an adhesive layer, which can be used to adhere and fix the heat dissipation fins 21 to the surface of the electronic device. In order to realize heat conduction, the adhesive layer can be made of a heat-conducting adhesive material.

[0039] The electronic device heat dissipator further comprises a control device and a power supply device. The control device is arranged on a circuit board in the shell 1. The power supply device is arranged in the shell 1 and comprises a battery and a charging interface. The charging interface is exposed to the shell 1, and the battery and the charging interface are electrically connected to the control device. The control device is a controller. The heat dissipation assembly 2 further comprises a temperature sensor and a display screen. The temperature sensor and the display screen are connected to the control device. The temperature sensor sends the sensed temperature to the control device through an electrical signal. The control device feeds back the temperature sensed by the temperature sensor to the user in real time through the display screen. In the embodiment, the display screen is a digital tube display screen. It can be understood that in other specific embodiments, the display screen can also be an LED display screen.

[0040] The control device is built-in with an intelligent chip, and a switch is arranged on the control device. The switch is a three-position switch, which is a closed position, a manual control position and an automatic control position. The user can select manual control cooling according to the temperature displayed on the display screen, or switch to the automatic control position. The electronic device heat dissipator can automatically control the temperature of the electronic device to about 16℃, so that the electronic device runs more smoothly.

[0041] Further, the electronic device heat dissipator further comprises a clamping assembly 4, which comprises a fixed clamping arm 41 and a movable clamping arm 42. The fixed clamping arm 41 and the movable clamping arm 42 are arranged on opposite sides of the shell 1, respectively. The fixed clamping arm 41 and the movable clamping arm 42 are arranged opposite to each other, and the movable clamping arm 42 can be close to or away from the fixed clamping arm 41.

[0042] Specifically, the movable clamping arm 42 comprises a clamping plate 421, a connecting member and an elastic member. The clamping plate 421 is arranged on one side of the housing 1, the connecting member is connected to the clamping plate 421 and is slidingly connected to the housing 1, and the elastic member is arranged in the housing 1 and drives the connecting member to reset. In this embodiment, the housing 1 is provided with a sliding cavity 17, the connecting member is a connecting rod 422, the connecting rod 422 is slidingly connected to the sliding cavity 17, one end of the connecting rod 422 is provided with a stopper 423, the elastic member is a spring 424, the spring 424 is sleeved on the connecting rod 422 and abuts against the stopper 423 at one end and abuts against the side wall of the mounting cavity 15 at the other end. When the clamping plate 421 is pulled to move away from the fixed clamping arm 41, the connecting rod 422 slides out of the sliding cavity 17, at this time, the spring 424 is compressed and has elastic force under the extrusion of the stopper 423, the clamping plate 421 has a clamping tendency with the fixed clamping arm 41, at this time, the electronic device can be placed between the fixed clamping arm 41 and the clamping plate 421, and the clamping plate 421 and the fixed clamping arm 41 can clamp the electronic device on both sides after the clamping plate 421 is released. In order to avoid leaving marks when clamping, rubber pads are pasted on the contact surfaces of the fixed clamping arm 41 and the clamping plate 421, which play a certain protection role.

[0043] In other embodiments, the connecting member can be a sliding rod, and the elastic member can be a tension spring. The sliding rod is slidingly connected to the sliding cavity 17, one end of the tension spring is fixed to the end of the sliding rod, and the other end of the tension spring is fixed to the bottom wall of the sliding cavity 17. When the clamping plate 421 is pulled to move away from the fixed clamping arm 41, the sliding rod slides out of the sliding cavity 17, at this time, the sliding rod deforms to pull the tension spring, so that the tension spring has elastic force, and the clamping plate 421 has a clamping tendency with the fixed clamping arm 41, at this time, the electronic device can be placed between the fixed clamping arm 41 and the clamping plate 421 for clamping and fixing.

[0044] In other specific embodiments, the elastic member can also be an elastic rubber band or rubber; and the clamping plate 421 can move relative to the fixed clamping arm 41 along a plane parallel to the heat dissipation fins 21. The electronic device heat spreader can be adapted to electronic devices with a length or width of 67-88 mm, such as mobile phones. It can be understood that the electronic device can also be products such as tablets, handheld game consoles, notebook computers, etc.

[0045] The electronic device heat spreader in this embodiment has the following advantages:

[0046] When the heat sink is used, the heat dissipation fins 21 are attached to the electronic device, the heat dissipation fins 21 generate cold energy, and the cold energy is transmitted to the electronic device to cool the electronic device. After the heat sink is used for a period of time, due to the large temperature difference between the electronic device and the heat dissipation fins 21, fog condensation is formed between the two, and condensate water is formed. The water absorption assembly 3 is arranged around the heat dissipation fins 21. The condensate water will flow to the water absorption assembly 3 around the heat dissipation fins 21 for absorption, and finally the absorbed condensate water is uniformly treated. Through the absorption effect of the water absorption assembly 3, the damage caused by the direct entry of the condensate water into the electronic device or the heat sink is avoided.

[0047] The embodiments of the specific embodiment are the preferred embodiments of the utility model, not limited to the protection scope of the utility model, so: all equivalent changes made according to the structure, shape and principle of the utility model should be covered in the protection scope of the utility model.

Claims

1. An electronic device heat sink characterized in that: a housing (1) has a fitting surface (11); a heat dissipation assembly (2) is arranged in the housing (1) and comprises a heat dissipation fin (21), the heat dissipation fin (21) is arranged on the fitting surface (11), and the heat dissipation fin (21) is capable of being fitted with an electronic device; and a water absorption assembly (3) is arranged around the heat dissipation fin (21), and the water absorption assembly (3) is capable of absorbing water condensed on the heat dissipation fin (21). The fitting surface (11) is provided with a mounting groove (12), the mounting groove (12) is arranged around the heat dissipation fin (21), and the water absorption assembly (3) is arranged in the mounting groove (12). The heat dissipation assembly (2) further comprises a semiconductor heat conduction member (22), a heat dissipation module (23) and a heat dissipation fan (24), the semiconductor heat conduction member (22), the heat dissipation module (23) and the heat dissipation fan (24) are all arranged in the housing (1), the semiconductor heat conduction member (22) is connected with the heat dissipation fin (21) and the heat dissipation module (23), and the heat dissipation fan (24) faces the heat dissipation module (23). The housing (1) comprises a front housing (13) and a rear housing (14) which are connected by buckling, the rear housing (14) is hollow, the heat dissipation module (23) adopts a heat dissipation fin, an installation cavity (15) is formed between the heat dissipation module (23) and the rear housing (14), and the heat dissipation fan (24) is arranged in the installation cavity (15).

2. The electronic device heat spreader of claim 1, wherein, An end surface of the front housing (13) is the fitting surface (11), the front housing (13) is provided with the mounting groove (12), a through hole (121) is arranged at the bottom of the mounting groove (12), and at least one of the semiconductor heat conduction member (22), the heat dissipation module (23) or the heat dissipation fan (24) is communicated with the through hole (121).

3. The electronic device heat spreader of claim 2, wherein, The housing (1) further comprises a support frame (16), the support frame (16) is arranged in the front housing (13), and the support frame (16) supports the heat dissipation fin (21).

4. The electronic device heat spreader of claim 3, wherein, An adhesive layer is arranged on a contact surface of the heat dissipation fin (21).

5. The electronic device heat spreader of claim 4, wherein, Further comprising a clamping assembly (4), the clamping assembly (4) comprises a fixed clamping arm (41) and a movable clamping arm (42), the fixed clamping arm (41) and the movable clamping arm (42) are arranged on opposite sides of the housing (1) respectively, the fixed clamping arm (41) and the movable clamping arm (42) are arranged oppositely, and the movable clamping arm (42) is capable of moving close to or away from the fixed clamping arm (41).

6. The electronic device heat spreader of claim 5, wherein, The movable clamping arm (42) comprises a clamping plate (421), a connecting member and an elastic member, the clamping plate (421) is arranged on one side of the housing (1), the clamping plate (421) is connected with the connecting member, the connecting member is slidingly connected to the housing (1), and the elastic member is located in the housing (1) and drives the connecting member to reset.

7. The electronic device heat spreader of claim 1, wherein, ​ 8. The electronic device heat spreader of claim 4, wherein, ​ 9. The electronic device heat spreader of claim 8, wherein, ​ 10. The electronic device heat spreader of claim 9, wherein, The shell (1) is internally provided with a sliding cavity (17), the connecting piece is a connecting rod (422), the connecting rod (422) is slidingly connected to the sliding cavity (17), one end of the connecting rod (422) is provided with a stop head (423), the elastic piece is a spring (424), the spring (424) is sleeved on the connecting rod (422) and one end of the spring (424) abuts against the stop head (423), and the other end of the spring (424) abuts against the side wall of the mounting cavity (15).

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