Heat dissipation structure of hair removal instrument and hair removal instrument

Abstract

The utility model relates to a hair removal instrument heat dissipation structure and a hair removal instrument. The hair removal instrument heat dissipation structure comprises a heat conduction substrate and a heat dissipation fin assembly. A heat transfer layer is arranged on the surface of one side of the heat conduction substrate, and an attaching heat dissipation area attached to a heat source for heat dissipation and an attaching installation area attached to the heat dissipation fin assembly for installation are arranged on the heat transfer layer; the heat conduction substrate provides heat conduction and serves as an installation substrate, the heat transfer layer is arranged on one side face of the heat conduction substrate to enhance the heat conduction performance, meanwhile, the structure is simplified, the size is reduced, and finally the attached heat dissipation area and the attached installation area are arranged on the heat transfer layer and correspond to an attached heat source for heat dissipation and an attached heat dissipation fin assembly respectively. The heat dissipation fin assembly can rapidly take away heat of a heat source through the heat transfer layer, and the heat dissipation performance is guaranteed. The whole structure is very simple, disassembly and assembly are convenient, the size is smaller, the heat transfer layer can be made of the following graphene layer or other existing heat conduction materials, and the manufacturing process is simpler.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for hair removal devices, and more specifically, to a heat dissipation structure and a hair removal device. Background Technology

[0002] A hair removal device is a small electrical appliance that generates powerful energy instantaneously to stimulate the hair follicles, gradually damaging them and preventing them from regenerating hair, thus achieving a relatively long-term hair removal effect. During operation, the hair removal device often generates a lot of heat, requiring a heat dissipation structure. Existing heat dissipation structures typically only dissipate heat from the working heat source and the lamp tube. However, the design of the heat-conducting components in the heat dissipation structure is relatively complex, bulky, and inconvenient to assemble.

[0003] For example, Chinese patent application number 202223077024.6 provides a heat dissipation mechanism for a hair removal device and a laser hair removal device. Its heat-conducting components use a first heat-conducting pipe and a second heat-conducting pipe. The structure is complex and the volume is relatively large. Moreover, the efficiency of the heat-conducting pipe is greatly affected by the material. Improving the heat conduction efficiency often means bearing higher costs. Therefore, a heat dissipation structure and hair removal device that can improve these defects are needed. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide a heat dissipation structure and a hair removal device in view of the above-mentioned defects of the prior art.

[0005] The technical solution adopted by this utility model to solve its technical problem is:

[0006] A heat dissipation structure for a hair removal device is constructed, comprising a heat-conducting substrate and a heat dissipation fin assembly; a heat transfer layer is disposed on one side surface of the heat-conducting substrate, and the heat transfer layer is provided with a heat dissipation area for heat source heat dissipation and a mounting area for mounting the heat dissipation fin assembly.

[0007] The heat dissipation structure of the hair removal device of this utility model includes a housing, a first air duct on the housing, and a first heat dissipation fin inside the first air duct.

[0008] In the heat dissipation structure of the hair removal device described in this utility model, the orientation of the air inlet of the first air duct is perpendicular to the orientation of the air outlet.

[0009] The heat dissipation structure of the hair removal device of this utility model is wherein the housing is square, and the air inlet and air outlet of the first air duct are disposed on two adjacent side surfaces of the housing.

[0010] The heat dissipation structure of the hair removal device described in this utility model includes a first heat dissipation fin composed of multiple L-shaped heat dissipation fins stacked together, with a gap between adjacent heat dissipation fins.

[0011] The heat dissipation structure of the hair removal device of this utility model includes a second heat dissipation fin on one side surface of the housing, a second air duct on the second heat dissipation fin, an air inlet of the second air duct being adjacent to and facing the same direction as the air inlet of the first air duct, and an air outlet of the second air duct being used to blow air to cool the lamp tube of the hair removal device.

[0012] The heat dissipation structure of the hair removal device described in this utility model further includes a fan assembly for introducing air into the air inlet of the first air duct and the air inlet of the second air duct.

[0013] The heat dissipation structure of the hair removal device described in this utility model, wherein the heat transfer layer is a graphene layer.

[0014] The heat dissipation structure of the hair removal device described in this utility model further includes a semiconductor cooling unit, wherein the heating surface of the semiconductor cooling chip of the semiconductor cooling unit is attached to the heat dissipation area of ​​the heat transfer layer.

[0015] A hair removal device, wherein the hair removal device is provided with a heat dissipation structure as described above.

[0016] The beneficial effects of this utility model are as follows: Using the improved structure of this application, the thermally conductive substrate provides heat conduction while also serving as a mounting substrate. A heat transfer layer is arranged on one side of the thermally conductive substrate to enhance thermal conductivity, while simplifying the structure and reducing volume. Finally, a heat dissipation bonding area and a mounting bonding area are arranged on the heat transfer layer to correspond to heat source heat dissipation and heat dissipation fin assembly, respectively. During cooling, the heat dissipation fin assembly can quickly remove heat from the heat source through the heat transfer layer, ensuring heat dissipation performance. The overall structure is very simple, easy to assemble and disassemble, and smaller in size. The heat transfer layer can be made of graphene as described below or other existing thermally conductive materials, and the manufacturing process is also simpler. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the present invention will be further described below in conjunction with the accompanying drawings and embodiments. The drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a front view of the heat dissipation structure of the hair removal device according to a preferred embodiment of the present invention;

[0019] Figure 2This is a bottom view of the heat dissipation structure of the hair removal device according to a preferred embodiment of the present invention;

[0020] Figure 3 This is an exploded view of the heat dissipation structure of the hair removal device according to a preferred embodiment of this utility model;

[0021] Figure 4 This is an overall diagram of the heat dissipation structure of the hair removal device according to a preferred embodiment of the present invention;

[0022] Figure 5 This is a front sectional view of the heat dissipation structure of the hair removal device according to a preferred embodiment of the present invention. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, a clear and complete description will be provided below in conjunction with the technical solutions in the embodiments of this utility model. Obviously, the described embodiments are some, but not all, of the embodiments of this utility model. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0024] The preferred embodiment of the hair removal device of this utility model has a heat dissipation structure, such as... Figure 1 As shown, it includes a thermally conductive substrate 1 and a heat dissipation fin assembly 3; a heat transfer layer 2 is provided on one side surface of the thermally conductive substrate 1, and the heat transfer layer 2 is provided with a heat dissipation area for heat source heat dissipation and a heat dissipation mounting area for heat dissipation fin assembly mounting.

[0025] With the improved structure of this application, the thermally conductive substrate 1 provides heat conduction and also serves as a mounting substrate. The thermally conductive substrate can be made of a metal material with good thermal conductivity, such as copper, or a non-metal material with good thermal conductivity. The shape of the thermally conductive substrate can be set as needed.

[0026] A heat transfer layer 2 is arranged on one side of the thermally conductive substrate 1 to quickly collect heat and enhance thermal conductivity, while also simplifying the structure and reducing the volume. The heat transfer layer can be made of graphene layer as described below or other existing thermally conductive materials, and the manufacturing process is also simpler.

[0027] Finally, a heat dissipation area and a mounting area are arranged on the heat transfer layer 2 to correspond to heat source heat dissipation and heat dissipation fin assembly respectively. During cooling, the heat dissipation fin assembly 3 can quickly remove the heat from the heat source through the heat transfer layer 2 to ensure heat dissipation performance.

[0028] The overall structure is very simple, easy to assemble and disassemble, and smaller in size.

[0029] Preferably, the heat dissipation fin assembly 3 includes a housing 30, a first air duct 31 is provided on the housing 30, and a first heat dissipation fin 32 is provided inside the first air duct 31; this design makes it easy to quickly remove the heat from the housing by relying on a fan.

[0030] Preferably, the air inlet of the first air duct 31 is perpendicular to the air outlet. Of course, it can also be at a near-vertical angle. This angle arrangement is designed according to the actual air intake and exhaust requirements of the hair removal device. It is understandable that when the structure of the hair removal device changes, it can also be changed accordingly. The solution obtained by simply changing the orientation of the air inlet and air outlet also falls within the scope of protection of this application.

[0031] Preferably, the housing 30 is square, and the air inlet and air outlet of the first air duct 31 are located on two adjacent side surfaces of the housing; similarly, the shape of the housing 30 is not limited to square, and can be improved as needed. The solution obtained by simply changing the orientation based on the shape of the housing 30 is also within the scope of protection of this application.

[0032] Correspondingly, in order to correspond to the air inlet and outlet layout design of the first air duct 31, the first heat dissipation fin 32 is composed of multiple L-shaped heat dissipation fins stacked together, with a gap between adjacent heat dissipation fins; similarly, the shape of the first heat dissipation fin is not limited to the above method, and can be improved as needed. The solution obtained by simply changing the orientation based on the shape of the first heat dissipation fin is also within the scope of protection of this application.

[0033] Preferably, a second heat dissipation fin 33 is provided on one side surface of the housing 30, and a second air duct is provided on the second heat dissipation fin 33. The air inlet of the second air duct is adjacent to the air inlet of the first air duct 31 and faces the same direction. The air outlet of the second air duct is used to blow air to cool the lamp tube 4 of the hair removal device.

[0034] This structural design allows the fan assembly to blow air onto both air ducts simultaneously. Part of the air from the second air duct blows onto the lamp tube 4, providing direct heat dissipation for the lamp tube. Compared to existing structures that simultaneously dissipate heat from both the heat source and the lamp tube, the structure of this application is simpler, easier to assemble, and smaller in size.

[0035] Preferably, the heat dissipation structure of the hair removal device also includes a fan assembly 5 for drawing air into the air inlet of the first air duct 31 and the air inlet of the second air duct; the fan assembly 5 can adopt the existing design and no modification is required.

[0036] Preferably, the heat dissipation structure of the hair removal device also includes a semiconductor cooling unit 6, wherein the heating surface of the semiconductor cooling chip of the semiconductor cooling unit 6 is attached to the heat dissipation area of ​​the heat transfer layer; the semiconductor cooling unit 6 can adopt the existing design and no improvement is required.

[0037] A hair removal device, wherein the hair removal device is provided with a heat dissipation structure as described above.

[0038] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A heat dissipation structure for a hair removal device, characterized in that, It includes a thermally conductive substrate and a heat dissipation fin assembly; a heat transfer layer is provided on one side surface of the thermally conductive substrate, and the heat transfer layer is provided with a heat dissipation bonding area for heat source heat dissipation and a mounting bonding area for mounting the heat dissipation fin assembly.

2. The heat dissipation structure of the hair removal device according to claim 1, characterized in that, The heat dissipation fin assembly includes a housing, on which a first air duct is provided, and within the first air duct are first heat dissipation fins.

3. The heat dissipation structure of the hair removal device according to claim 2, characterized in that, The air inlet of the first air duct is oriented perpendicularly to the air outlet.

4. The heat dissipation structure of the hair removal device according to claim 3, characterized in that, The housing is square, and the air inlet and outlet of the first air duct are located on two adjacent side surfaces of the housing; the top surface of the housing is mounted on the bonding area of ​​the heat transfer layer.

5. The heat dissipation structure of the hair removal device according to claim 2, characterized in that, The first heat dissipation fin is composed of multiple L-shaped heat dissipation fins stacked together, with a gap between adjacent heat dissipation fins.

6. The heat dissipation structure of the hair removal device according to claim 2, characterized in that, A second heat dissipation fin is provided on one side surface of the housing. A second air duct is provided on the second heat dissipation fin. The air inlet of the second air duct is adjacent to the air inlet of the first air duct and faces the same direction. The air outlet of the second air duct is used to blow air to cool the lamp tube of the hair removal device.

7. The heat dissipation structure of the hair removal device according to claim 6, characterized in that, The heat dissipation structure of the hair removal device also includes a fan assembly that allows air to enter through the air inlet of the first air duct and the air inlet of the second air duct.

8. The heat dissipation structure of the hair removal device according to any one of claims 1-7, characterized in that, The heat transfer layer is a graphene layer.

9. The heat dissipation structure of the hair removal device according to any one of claims 1-7, characterized in that, The heat dissipation structure of the hair removal device also includes a semiconductor cooling unit, wherein the heating surface of the semiconductor cooling chip of the semiconductor cooling unit is attached to the heat dissipation area of ​​the heat transfer layer.

10. A hair removal device, characterized in that, The hair removal device is provided with a heat dissipation structure as described in any one of claims 1-9.

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