Continuous cleaning laser splicing device

Abstract

The utility model discloses a continuous cleaning laser splicing device, and relates to the field of electrode slice making. The continuous cleaning laser splicing device comprises a first laser system, a second laser system, a control system and a machining platform. The control system is electrically connected with the first laser system and the second laser system at the same time; the first laser system and the second laser system are horizontally arranged above the processing platform; the first laser system comprises a first laser, and a first collimator, a first galvanometer and a first field lens which are sequentially arranged along the light path direction of the first laser; the second laser system comprises a second collimator, a second galvanometer and a second field lens which are sequentially arranged along the light path direction of the second laser; and the first field lens and the second field lens are arranged above the processing platform. The laser cleaning quality, precision and production efficiency can be improved, and the comprehensive cost can be reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of battery sheet making, and particularly relates to a continuous cleaning laser splicing device. BACKGROUND

[0002] In the production process of new energy lithium batteries, the positive and negative electrode sheet rolls need to be subjected to surface treatment and processing such as laser cleaning, punching, and scribing. Due to the limitations of device hardware efficiency and field lens processing width, the continuous flight cleaning efficiency is very low. Therefore, the commonly used processing method on the market is the start-stop type laser cleaning of the electrode sheet belt. When customers need to improve the production efficiency, the multi-station start-stop type laser cleaning is used. Due to the frequent start-stop of the electrode sheet belt, the motor acceleration and deceleration occupies part of the time, and the positioning accuracy is poor due to factors such as material belt shaking, slipping, and multi-station positioning error during the start-stop process. In addition, when the same electrode sheet processing area is subjected to laser cleaning by using a laser, the laser cleaning splicing part is prone to excessive cleaning or the problem of residual material due to the inaccurate positioning of the two adjacent lasers.

[0003] Therefore, it is necessary to provide a laser cleaning device with high cleaning efficiency, high precision, and low cost. SUMMARY

[0004] In order to solve the problems existing in the prior art, a continuous cleaning laser splicing device is provided, which uses two sets of lasers to continuously fly laser cleaning on the same electrode sheet processing area, instead of the traditional start-stop cleaning of one set or multiple sets of lasers, thereby improving the cleaning quality precision and production efficiency, and reducing the comprehensive cost of customers.

[0005] The utility model provides the following technical scheme:

[0006] The utility model provides a continuous cleaning laser splicing device, which comprises a first laser system, a second laser system, a control system, and a processing platform. The control system is electrically connected with the first laser system and the second laser system. The first laser system and the second laser system are horizontally arranged above the processing platform. The first laser system comprises a first laser, a first collimator, a first galvanometer, and a first field lens arranged in sequence along the light path direction of the first laser. The second laser system comprises a second collimator, a second galvanometer, and a second field lens arranged in sequence along the light path direction of the second laser. The first field lens and the second field lens are arranged above the processing platform. The first laser and the second laser are electrically connected with the control system and controlled by the same control system.

[0007] Further, an overlapping area is arranged between the processing width of the first laser system on the processing platform and the processing width of the second laser system on the processing platform.

[0008] Further, the first field lens and the second field lens are horizontally arranged above the processing platform.

[0009] Further, the first laser system further comprises a first focusing assembly, and the second laser system further comprises a second focusing assembly, and the first focusing assembly and the second focusing assembly are electrically connected with the first field lens and the second field lens respectively.

[0010] Further, the processing platform is an adsorption platform.

[0011] Further, the continuous cleaning laser splicing device further comprises a material belt, the material belt is arranged above the adsorption platform, and a line connecting the first field lens and the second field lens is perpendicular or parallel to a belt running direction of the material belt.

[0012] Further, the continuous cleaning laser splicing device further comprises an edge searching sensor, and the edge searching sensor is arranged on a side of the adsorption platform.

[0013] Further, the continuous cleaning laser splicing device further comprises a dust removal assembly, and the dust removal assembly is arranged below the adsorption platform.

[0014] Further, the continuous cleaning laser splicing device further comprises a positioning optical fiber, and the positioning optical fiber is arranged above the material belt.

[0015] Further, the continuous cleaning laser splicing device further comprises a main driving mechanism, and the main driving mechanism is connected with the material belt and drives the material belt to move.

[0016] Preferably, the continuous cleaning laser splicing device can further comprise a plurality of laser systems, and the plurality of laser systems are electrically connected with a same control system.

[0017] Preferably, the adsorption platform is selected from one of a platform type, a roller type, a suspension type, a steel belt type and a belt type.

[0018] Preferably, the first laser system and the second laser system can be arranged above the processing platform in a cantilever type, a two-end support type, an inverted type or a platform type.

[0019] Further, the continuous cleaning laser splicing device can be applied to layered continuous cleaning, left-right splicing type cleaning, front-back splicing type cleaning and front-back tracking splicing type cleaning.

[0020] Further, the continuous cleaning laser splicing device is suitable for intermittent slot position / continuous slot position cleaning of continuous / starting and stopping laser cleaning.

[0021] The continuous cleaning laser splicing device has the following beneficial technical effects:

[0022] The utility model discloses simple structure is applicable to multiple cleaning mode, and the same area is cleaned continuously by flying through using two sets of laser systems simultaneously, thereby improving the production efficiency of equipment, and the same control system is used to control two sets of laser systems, and positioning accuracy and control accuracy error are reduced, and the cleaning quality of laser is improved obviously. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the utility model embodiment technical scheme, below will to the drawing needed to use in the embodiment description is briefly introduced, obviously, below description in the drawing is some embodiments of the utility model, for the ordinary skilled person in the art comes, under the premise of not paying creative labor, can also obtain other drawings according to these drawings.

[0024] Figure 1 The utility model provides a continuous cleaning laser splicing device structure schematic view.

[0025] Figure 2 The utility model provides a continuous cleaning laser splicing device structure installation schematic view.

[0026] Figure 3 The utility model provides a continuous cleaning laser splicing device main view of embodiment 1.

[0027] Figure 4 The utility model provides a continuous cleaning laser splicing device left view of embodiment 2.

[0028] Figure 5 The utility model provides a field mirror splicing type processing schematic view of embodiment 1.

[0029] Figure 6 The utility model provides a pole piece processing schematic view of embodiment 1.

[0030] Figure 7 The utility model provides a field mirror overlap area processing schematic view of embodiment 2.

[0031] Figure 8 The utility model provides a left and right splicing type cleaning schematic view of embodiment 2.

[0032] Figure 9 The utility model provides a front and rear splicing type cleaning schematic view of embodiment 2.

[0033] Figure 10 The utility model provides a front and rear tracking splicing type cleaning schematic view of embodiment 2.

[0034] Figure 11 The utility model provides a pole piece processing schematic view of embodiment 3.

[0035] Explanation of the figure:

[0036] 1 - first laser; 2 - second laser; 3 - first collimator; 4 - second collimator; 5 - first galvanometer; 6 - second galvanometer; 7 - first field lens; 8 - second field lens; 9 - first processing slot; 10 - second processing slot; 11 - third processing slot; 12 - first laser system processing point; 13 - second laser system processing point; 14 - material belt; 15 - main drive mechanism; 16 - dust removal assembly; 17 - edge finding sensor; 18 - positioning optical fiber; 19 - adsorption platform; 20 - first focusing assembly; 21 - second focusing assembly; W1 - first laser system processing width; W2 - second laser system processing width; W3 - overlapping area. DETAILED DESCRIPTION

[0037] The technical solutions of the present application will be described clearly and completely below in conjunction with the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts fall within the scope of protection of the present application.

[0038] It should be understood that when used in the specification and the appended claims, the terms "comprise" and "include" indicate the presence of described features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0039] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly used when the product of the present application is used, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0040] In the description of the present application, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set", "mount", "connected", "connected" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be directly connected, or indirectly connected through an intermediate medium, or it can be connected inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0041] Embodiment 1

[0042] Referring to Figures 1-2 The continuous cleaning laser splicing device is shown in the figure, which comprises a first laser system, a second laser system, a control system and an adsorption platform 19; the control system is electrically connected with the first laser system and the second laser system; the first laser system and the second laser system are horizontally arranged above the adsorption platform 19; the first laser system comprises a first laser 1, a first collimator 3, a first galvanometer 5 and a first field lens 7 which are arranged in sequence along the light path direction of the first laser 1; the second laser system comprises a second collimator 4, a second galvanometer 6 and a second field lens 8 which are arranged in sequence along the light path direction of the second laser 2; the first field lens 7 and the second field lens 8 are horizontally arranged above the adsorption platform 19.

[0043] Specifically, in the embodiment, an overlapping area W3 is arranged between the processing width W1 of the first laser system and the processing width W2 of the second laser system.

[0044] Specifically, the first laser system further comprises a first focusing assembly 20; the second laser system further comprises a second focusing assembly 21; the first focusing assembly 20 and the second focusing assembly 21 are respectively electrically connected with the first field lens 7 and the second field lens 8.

[0045] Specifically, the continuous cleaning laser splicing device further comprises a material belt 14, which is arranged above the adsorption platform 19.

[0046] Specifically, in the embodiment, as Figure 3 shown, the connecting line between the first field lens 7 and the second field lens 8 is parallel to the running direction of the material belt 14.

[0047] Specifically, the continuous cleaning laser splicing device further comprises an edge searching sensor 17, which is arranged on the side of the adsorption platform 19.

[0048] Specifically, the continuous cleaning laser splicing device further comprises a dust removal assembly 16, which is arranged below the adsorption platform 19.

[0049] Specifically, the continuous cleaning laser splicing device further comprises a positioning optical fiber 18, which is arranged above the material belt 14.

[0050] Specifically, the continuous cleaning laser splicing device further comprises a main driving mechanism 15, which is connected with the material belt 14.

[0051] The embodiment can adopt field lens splicing type processing to perform layered continuous cleaning on the pole piece, specifically as Figure 5 、 Figure 6As shown. During equipment operation, the main drive mechanism 15 pulls the electrode material belt 14 forward at a uniform speed. At this time, the adsorption platform 19 supports or adsorbs the electrode. When the positioning fiber optic cable 18 senses that the area to be cleaned has reached the cleaning position, the edge-finding sensor 17 detects the reference edge of the electrode in the Y direction (width direction) in real time. The first laser 1 starts emitting light and flies continuously along the X direction (length direction) of the electrode to clean the first layer of the electrode. When the belt of the first processing slot 9 reaches the position of the second processing slot 10, the cleaning of the first layer is completed, and the first laser 1 stops emitting light. At the same time, the second laser 2 starts emitting light and flies continuously along the X direction to clean the second layer of the slot. After the cleaning of the second layer is completed, the second laser 2 stops emitting light. At this time, the cleaning slot has moved from the position of the second processing slot 10 to the position of the third processing slot 11. If the electrode process requires cleaning more layers, the first laser 1 and the second laser 2 need to complete the multi-layer cleaning process within the cleaning area of ​​the corresponding field lens.

[0052] Example 2

[0053] The only difference between this embodiment and Embodiment 1 is that in this embodiment, the line connecting the first field mirror 7 and the second field mirror 8 is perpendicular to the belt travel direction of the material belt 14. For details, please refer to [link / reference needed]. Figure 4 .

[0054] Specifically, in this embodiment, during equipment operation, the main drive mechanism 15 pulls the electrode strip 14 forward at a constant speed. At this time, the adsorption platform 19 supports or adsorbs the electrode. When the positioning optical fiber 18 senses that the area to be cleaned has reached the cleaning position of the overlapping area W3, the edge-finding sensor 17 detects the reference edge of the electrode in the Y direction in real time. The first laser 1 and the second laser 2 simultaneously start emitting light and fly continuously along the X direction to clean the electrode slot. After cleaning, the first laser 1 and the second laser 2 simultaneously turn off their light emission. If the electrode process requires cleaning more layers, the first laser 1 and the second laser 2 need to complete multi-layer cleaning within the cleaning area of ​​the corresponding field lens.

[0055] To achieve efficient and continuous flight splicing cleaning of the overlapping area W3 of the two field lenses, left-right splicing cleaning, front-back splicing cleaning, and front-back tracking splicing cleaning can be adopted.

[0056] Please see as follows Figure 8 The left-right splicing cleaning method shown has the first laser system processing point 12 located on the left side of the tank and the second laser system processing point 13 located on the right side of the tank.

[0057] Please see Figure 9 The front-to-back splicing cleaning method shown has the first laser system processing point 12 located at the front end of the tank and the second laser system processing point 13 located at the rear end of the tank.

[0058] Please see Figure 10The front and rear tracking splicing cleaning mode shown, the first laser system processing point 12 and the second laser system processing point 13 are arranged at intervals, and when processing, the first laser system and the second laser system perform cleaning in a short time in sequence.

[0059] Embodiment 3

[0060] The difference between the embodiment and the embodiment 1 is that no overlapping area W3 is arranged between the first laser system processing width W1 and the second laser system processing width W2, that is, the laser processing width in the embodiment is equal to W1+W2, and the specific is as shown in Figure 11

[0061] The continuous cleaning laser splicing device of the embodiment can use the field lens splicing processing mode to perform continuous layer-by-layer cleaning.

[0062] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited to this, and any skilled person in the art can easily think of various equivalent modifications or replacements within the technical range disclosed by the present application, and these modifications or replacements should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.​

Claims

1. A continuous cleaning laser splicing apparatus, comprising: The application relates to a laser processing system, which comprises a first laser system, a second laser system, a control system and a processing platform; the control system is electrically connected with the first laser system and the second laser system; the first laser system and the second laser system are horizontally arranged above the processing platform; the first laser system comprises a first laser, a first collimator, a first galvanometer and a first field lens which are sequentially arranged along the light path direction of the first laser; the second laser system comprises a second collimator, a second galvanometer and a second field lens which are sequentially arranged along the light path direction of the second laser; and the first field lens and the second field lens are arranged above the processing platform.

2. The continuous washing laser splicing apparatus of claim 1, wherein, An overlapping area is arranged between the processing area of the first laser system on the processing platform and the processing area of the second laser system on the processing platform.

3. The continuous washing laser splicing apparatus of claim 1, wherein, The first field lens and the second field lens are horizontally arranged above the processing platform.

4. The continuous washing laser splicing apparatus of claim 3, wherein, The first laser system further comprises a first focusing assembly; the second laser system further comprises a second focusing assembly; and the first focusing assembly and the second focusing assembly are respectively electrically connected with the first field lens and the second field lens.

5. The continuous washing laser splicing apparatus according to any one of claims 1 to 4, wherein The processing platform is an adsorption platform.

6. The continuous washing laser splicing apparatus of claim 5, wherein, A material belt is further arranged above the adsorption platform; and the connecting line between the first field lens and the second field lens is perpendicular to or parallel to the running direction of the material belt.

7. The continuous washing laser splicing apparatus of claim 6, wherein, An edge searching sensor is further arranged on the side of the adsorption platform.

8. The continuous washing laser splicing apparatus of claim 7, wherein, A dust removing assembly is further arranged below the adsorption platform.

9. The continuous washing laser splicing apparatus of claim 8, wherein, A positioning optical fiber is further arranged above the material belt.

10. The continuous washing laser splicing apparatus of claim 9, wherein, A main driving mechanism is further arranged and connected with the material belt.

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