Positive and negative rotation grinding machine for wafer processing

Abstract

The utility model relates to the technical field of wafer grinding, and discloses a forward and reverse rotation grinding machine for wafer processing, which comprises a processing support table, bottom support legs are uniformly arranged on the periphery of the bottom end of the processing support table, and a reverse rotation clamping assembly for forward rotation clamping of a wafer is arranged on the processing support table. According to the wafer grinding device, the reverse rotation clamping assembly is arranged on the machining supporting table, the forward rotation grinding assembly is arranged above the reverse rotation clamping assembly, the height of the grinding disc can be adjusted downwards through the lifting air cylinder, and therefore the grinding disc can be ground in a reverse rotation mode. The grinding disc can be attached to the upper surface of the wafer, the wafer to be ground can be ground in a forward and reverse rotation mode, the grinding efficiency of the wafer is greatly improved, under high-speed forward and reverse rotation driving, the surface grinding flatness and parallelism of the wafer can be higher, and the overall grinding quality of the wafer is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer grinding technical field, concretely is a kind of positive and negative rotation grinder for wafer processing. BACKGROUND

[0002] Wafer is one of the most important raw materials of LED, is the light-emitting component of LED, the most core part of LED, and the quality of wafer will directly determine the performance of LED, wafer is by III and V group compound semiconductor material, when LED is packaged, wafer incoming material is in neat arrangement on wafer film.

[0003] Through the search, a quartz wafer shape grinder is authorized in China Patent Announcement No. CN 208663326 U, including conveying belt, mounting frame, fixed block one, air cylinder one, air rod one, movable block one, air cylinder two, air rod two, rotating shaft, grinding rod, motor, characterized in that: the conveying belt is below the mounting frame, the fixed block one is installed on one side of the mounting frame, one end of the air cylinder one is connected with the air rod one, the other end of the air cylinder one is connected with the fixed block one, the air rod one is connected with the movable block one, the air cylinder two is installed below the movable block one, one end of the air rod two is connected with the air cylinder two, the other end of the air rod two is installed with suction nozzle, the movable block one is installed on guide rail one, the movable block two is installed on guide rail one, one end of the air cylinder three is connected with the fixed block two. The utility model discloses a quartz wafer shape grinder, which realizes the grinding of circular quartz wafer, improves the production efficiency, and reduces the cost.

[0004] The grinder in the above patent still has some deficiencies, the existing wafer processing grinder, when grinding wafer, can only make wafer fixed, adjust the grinding head on the grinder to grind the surface of wafer, turn over after one side is ground, grind the other side, this grinding method is low in efficiency, and the parallelism and flatness of wafer grinding are also not high, and the grinding quality of wafer is poor. UTILITY MODEL CONTENTS

[0005] In view of the deficiencies of the prior art, the utility model provides a positive and negative rotation grinder for wafer processing, solves the problem that the existing wafer processing grinder can only make wafer fixed when grinding wafer, adjust the grinding head on the grinder to grind the surface of wafer, turn over after one side is ground, grind the other side, this grinding method is low in efficiency, and the parallelism and flatness of wafer grinding are also not high, and the grinding quality of wafer is poor.

[0006] The utility model provides following technical scheme: a kind of positive and negative rotation grinding machine for wafer processing, including processing support platform, the bottom support leg of the four around of the bottom end of processing support platform is evenly provided, the reverse clamping assembly for wafer positive rotation clamping is provided on the processing support platform, the upper portion of the reverse clamping assembly is provided with the positive rotation grinding assembly for wafer grinding reverse rotation;

[0007] The reverse clamping assembly includes a limiting fixed seat arranged in the middle part of the top end of the processing support platform. A drive motor is arranged in the middle part of the bottom end of the processing support platform. A motor fixing shell is sleeved on the drive motor. The motor fixing shell is fixedly connected with the bottom of the processing support platform. A bottom transmission rod is connected with the drive end of the drive motor. The top end of the bottom transmission rod penetrates through the processing support platform and extends into the limiting fixed seat. A wafer clamping disc is slidingly inserted into the middle part of the limiting fixed seat. The top end of the wafer clamping disc is fixedly connected with the bottom end of the wafer clamping disc. A wafer placing groove is formed in the middle part of the top end of the wafer clamping disc. Driving screw holes are evenly formed in the inner wall of the wafer placing groove. A resisting screw is threadedly inserted into each driving screw hole. Wafer clamping plates are evenly arranged around the inner wall of the wafer placing groove. The end of the resisting screw penetrates through the driving screw hole and is rotatably connected with the side surface of the wafer clamping plate.

[0008] Preferred technical solution one: the positive rotation grinding assembly includes a top connecting frame arranged above the limiting fixed seat. Two lifting cylinders are symmetrically arranged on the bottom side of the two ends of the top connecting frame. The bottom end of the lifting cylinder is connected with the processing support platform. A servo motor is installed in the middle part of the top connecting frame. A grinding transmission rod is connected with the drive shaft of the servo motor.

[0009] Preferred technical solution two: the bottom end of the grinding transmission rod penetrates through the top connecting frame and extends above the limiting fixed seat. A grinding disc is arranged below the grinding transmission rod. An installation screw hole is formed in the top end of the grinding disc. An installation screw block is arranged at the bottom end of the grinding transmission rod. The installation screw block is threadedly inserted into the installation screw hole.

[0010] Preferred technical solution three: the bottom of the wafer clamping disc is inserted into the limiting fixed seat. The upper part of the wafer clamping disc extends out of the top part of the limiting fixed seat.

[0011] This scheme can prevent the rotation of the resisting screw from being limited by the limiting fixed seat.

[0012] Preferred technical solution four: the end of the resisting screw is provided with a handle for easy rotation.

[0013] This scheme can make it more convenient for the user to rotate the resisting screw.

[0014] Preferably, the diameter of the grinding disc is less than the diameter of the wafer placing groove.

[0015] The grinding disc can extend into the wafer placing groove to grind the wafer fixed inside.

[0016] Compared with the prior art, the positive and negative rotation grinding machine for wafer processing has the following beneficial effects:

[0017] (1) The reverse clamping assembly is arranged on the machining support table, the positive rotation grinding assembly is arranged above the reverse clamping assembly, the wafer to be ground can be fixed in the wafer placing groove under the pushing of the resisting screw on the wafer clamping plate, the driving motor can drive the wafer clamping disc to rotate reversely through the bottom transmission rod, the wafer fixed in the wafer placing groove rotates reversely, the grinding disc in the positive rotation grinding assembly rotates forward under the driving of the servo motor, and the lifting cylinder can adjust the height of the grinding disc downward, so that the grinding disc can be attached to the upper surface of the wafer, the wafer to be ground can be ground positively and negatively, the grinding efficiency of the wafer is greatly improved, the surface grinding flatness and parallelism of the wafer are higher under the high-speed positive and negative rotation driving, and the overall grinding quality of the wafer is improved. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is a structure perspective view of the utility model;

[0019] Figure 2 It is a structure perspective view of the utility model; Figure 1 It is an enlarged view of the structure of the grinding transmission rod;

[0020] Figure 3 It is a structure perspective view of the utility model; Figure 1 It is a structure exploded view of the reverse clamping assembly;

[0021] Figure 4 It is a structure front view of the utility model.

[0022] In the figure: 1, machining support table; 2, bottom support leg; 3, reverse clamping assembly; 4, positive rotation grinding assembly;

[0023] 301, limit fixing seat; 302, driving motor; 303, motor fixing shell; 304, bottom transmission rod; 305, wafer clamping disc; 306, wafer placing groove; 307, driving screw hole; 308, resisting screw; 309, wafer clamping plate;

[0024] 401, top connecting frame; 402, lifting cylinder; 403, servo motor; 404, grinding transmission rod; 405, grinding disc; 406, mounting screw hole; 407, mounting screw block. DETAILED DESCRIPTION

[0025] Reference should be made to Figures 1-4 ,

[0026] Embodiment One: A positive and negative rotation grinding machine for wafer processing, comprising a processing support table 1, the bottom end of the processing support table 1 is uniformly provided with a bottom support leg 2 around, the processing support table 1 is provided with a negative rotation clamping assembly 3 for wafer positive rotation clamping, the upper part of the negative rotation clamping assembly 3 is provided with a positive rotation grinding assembly 4 for wafer grinding negative rotation.

[0027] The negative rotation clamping assembly 3 comprises a limiting fixed seat 301 arranged at the middle part of the top end of the processing support table 1, a driving motor 302 arranged at the middle part of the bottom end of the processing support table 1, a motor fixed shell 303 sleeved on the driving motor 302, the motor fixed shell 303 is fixedly connected with the bottom of the processing support table 1, a bottom transmission rod 304 connected with the driving end of the driving motor 302, the top end of the bottom transmission rod 304 is rotatably penetrated through the processing support table 1 and extends into the limiting fixed seat 301, and a wafer clamping disc 305 is slidingly inserted into the middle part of the limiting fixed seat 301.

[0028] The top end of the bottom transmission rod 304 is fixedly connected with the bottom end of the wafer clamping disc 305, a wafer placing groove 306 is formed in the middle part of the top end of the wafer clamping disc 305, driving screw holes 307 are uniformly formed around the inner wall of the wafer placing groove 306, resisting screw rods 308 are threadedly inserted into the driving screw holes 307, wafer clamping plates 309 are uniformly arranged around the inner wall of the wafer placing groove 306, and the end portions of the resisting screw rods 308 are rotatably connected with the side surface of the wafer clamping plate 309.

[0029] The positive rotation grinding assembly 4 comprises a top connecting frame 401 arranged above the limiting fixed seat 301, two lifting cylinders 402 symmetrically arranged at the bottom side of both ends of the top connecting frame 401, the bottom end of the lifting cylinder 402 is connected with the processing support table 1, a servo motor 403 is installed at the middle part of the top connecting frame 401, a grinding transmission rod 404 connected with the driving shaft of the servo motor 403, the bottom end of the grinding transmission rod 404 is rotatably penetrated through the top connecting frame 401 and extends above the limiting fixed seat 301, a grinding disc 405 is arranged below the grinding transmission rod 404, an installation screw hole 406 is formed at the top end of the grinding disc 405, an installation screw block 407 is arranged at the bottom end of the grinding transmission rod 404, and the installation screw block 407 is threadedly inserted into the installation screw hole 406.

[0030] Embodiment Two: The difference between this embodiment and Embodiment One is that the bottom of the wafer clamping disc 305 is inserted into the limiting fixed seat 301, and the upper part of the wafer clamping disc 305 extends out of the top part of the limiting fixed seat 301.

[0031] So that the user for the rotation of the resistance screw 308 will not be limited by the limiting fixed seat 301.

[0032] Embodiment three: the difference between this embodiment and embodiment one is that the end of the resistance screw 308 is provided with a handle for easy rotation.

[0033] So that the user for the rotation of the resistance screw 308 is more convenient.

[0034] Embodiment four: the difference between this embodiment and embodiment one is that the diameter of the grinding disc 405 is smaller than the diameter of the wafer placing groove 306.

[0035] So that the grinding disc 405 extends into the wafer placing groove 306 to grind the wafer fixed inside.

[0036] In this embodiment, since the existing wafer processing grinder, when grinding the wafer, only the wafer can be fixed, the grinding head on the grinder is adjusted to grind the surface of the wafer, and after one side is ground, the wafer is turned over to grind the other side. This grinding method is low in efficiency, and the parallelism and flatness of the wafer grinding are not high, and the grinding quality of the wafer is poor.

[0037] In summary, when the user needs to grind the wafer, the user first needs to place the wafer in the wafer placing groove 306 in the reverse clamping assembly 3, and then rotate the resistance screw 308 to move the resistance screw 308 in the drive screw hole 307, and then push the wafer clamping plate 309 in the wafer placing groove 306, so that the wafer clamping plate 309 can clamp the wafer to be ground placed in the wafer placing groove 306.

[0038] Then, start the servo motor 403, and the servo motor 403 drives the grinding disc 405 to rotate through the grinding transmission rod 404, and the distance between the grinding disc 405 and the wafer is adjusted, and then the lifting cylinder 402 is started to drive the servo motor 403 and the grinding disc 405 to move downward at the same time, and then the bottom surface of the grinding disc 405 is attached to the upper surface of the wafer.

[0039] At the same time, the drive motor 302 is started to drive the wafer clamping disc 305 inserted into the limiting fixed seat 301 to rotate through the bottom transmission rod 304, so that the wafer fixed in the wafer placing groove 306 can rotate in the opposite direction, and the grinding disc 405 rotates in the positive direction under the drive of the servo motor 403, so that the wafer fixed in the wafer placing groove 306 can be positively ground, which greatly improves the grinding efficiency of the wafer. Under the high-speed positive and negative rotation drive, the surface grinding flatness and parallelism of the wafer are higher, and the overall grinding quality of the wafer is improved.

Claims

1. A double-side polishing machine for wafer processing, comprising a processing support table (1), characterized in that: The bottom support leg (2) is uniformly arranged around the bottom end of the processing support table (1), the processing support table (1) is provided with a reverse clamping assembly (3) for clamping the wafer in forward rotation, and the upper portion of the reverse clamping assembly (3) is provided with a forward rotation grinding assembly (4) for wafer grinding reverse rotation. The reverse clamping assembly (3) comprises a limiting fixed seat (301) arranged in the middle of the top end of the processing support table (1), a driving motor (302) arranged at the middle of the bottom end of the processing support table (1), a motor fixed shell (303) sleeved on the driving motor (302), the motor fixed shell (303) is fixedly connected with the bottom of the processing support table (1), a bottom transmission rod (304) connected with the driving end of the driving motor (302), the top end of the bottom transmission rod (304) rotates through the processing support table (1) and extends into the limiting fixed seat (301), a wafer clamping disc (305) slidably inserted into the middle of the limiting fixed seat (301), the top end of the bottom transmission rod (304) is fixedly connected with the bottom end of the wafer clamping disc (305), a wafer placing groove (306) is formed in the middle of the top end of the wafer clamping disc (305), a plurality of driving screw holes (307) are uniformly formed around the inner wall of the wafer placing groove (306), a resisting screw rod (308) is threadedly inserted into each driving screw hole (307), and a wafer clamping plate (309) is uniformly arranged around the inner wall of the wafer placing groove (306).

2. A reverse-rotation polishing machine for wafer processing according to claim 1, characterized by: The forward rotation grinding assembly (4) comprises a top connecting frame (401) arranged above the limiting fixed seat (301), two lifting cylinders (402) symmetrically arranged at the bottom sides of the two ends of the top connecting frame (401), the bottom end of the lifting cylinder (402) being connected with the processing support table (1), a servo motor (403) mounted on the middle of the top connecting frame (401), and a grinding transmission rod (404) connected with the driving shaft of the servo motor (403).

3. A reverse-rotation polisher for wafer processing according to claim 2, wherein: The bottom end of the grinding transmission rod (404) rotates through the top connecting frame (401) and extends above the limiting fixed seat (301), a grinding disc (405) is arranged below the grinding transmission rod (404), an installation screw hole (406) is formed in the top end of the grinding disc (405), and an installation screw block (407) is arranged at the bottom end of the grinding transmission rod (404) and threadedly inserted into the installation screw hole (406).

4. A reverse-rotation polisher for wafer processing according to claim 3, wherein: The bottom of the wafer clamping disc (305) is inserted into the limiting fixed seat (301), and the upper portion of the wafer clamping disc (305) extends out of the top of the limiting fixed seat (301).

5. A flipper polisher for wafer processing as defined in claim 4 wherein: The end of the resisting screw rod (308) is provided with a handle for easy rotation.

6. A reverse-rotation polisher for wafer processing according to claim 5, wherein: The diameter of the grinding disc (405) is smaller than the diameter of the wafer placing groove (306).

Images