Clamping tool for semiconductor material processing

Abstract

The utility model relates to the technical field of semiconductor material processing, and discloses a clamping tool for semiconductor material processing, which comprises a mounting plate, a fixing mechanism is arranged at the top of the mounting plate, a rotating mechanism is arranged on the surface of the fixing mechanism, the fixing mechanism comprises a rotating rod, and the rotating rod is rotatably connected to the top of the mounting plate. According to the clamping tool for processing the semiconductor material, through the arranged fixing mechanism, in the rotating process of the screw rod, the positioning plate can be driven to move towards the side close to the semiconductor material, the semiconductor material can be clamped and fixed, the phenomenon that the semiconductor material deviates in the processing process of the semiconductor material is avoided, and the processing efficiency of the semiconductor material is improved. The rotating mechanism is arranged to play a good role in fixing the semiconductor material, and through the arranged rotating mechanism, the purpose of rotating the rotating disc can be achieved, so that the angle of the semiconductor material is adjusted, and later processing of the semiconductor material is facilitated.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor material processing, specifically to a kind of clamping tool for semiconductor material processing. BACKGROUND

[0002] Semiconductor material is a kind of electronic material with electric conductivity between conductor and insulator, which can be used to make semiconductor devices and integrated circuits, and is widely used in lighting, power electronic devices, new energy, mobile communication and military and other fields.

[0003] In the processing link of semiconductor material, fixation is a crucial step, however, in the current situation, the existing clamping tool for semiconductor material processing has obvious shortcomings, and the effect of the tool in fixing semiconductor material is far from ideal state;

[0004] In actual processing operation, semiconductor material needs to be kept absolutely stable, and any slight looseness can lead to serious consequences, but the existing clamping tool often cannot meet this requirement, due to the limitation of design or structure, when fixing semiconductor material, it often cannot provide enough clamping force, and this deficiency is particularly prominent in the processing process, when processing equipment starts to work, vibration and impact force are easy to make semiconductor material loose. SUMMARY

[0005] The utility model aims at providing a kind of clamping tool for semiconductor material processing to solve the problems raised in the above background.

[0006] To achieve the above object, the utility model provides the following technical scheme: a kind of clamping tool for semiconductor material processing, including mounting plate, the mounting plate top is provided with fixed mechanism, the fixed mechanism surface is provided with rotating mechanism.

[0007] The fixed mechanism includes rotating rod, the rotating rod is rotatably connected to the top of mounting plate, the rotating rod top is fixedly connected with rotating disc, the rotating disc is internally provided with rectangular slot, the rectangular slot is rotatably connected with screw rod, the screw rod one side is fixedly connected with rotating piece, the screw rod surface is screw-connected with sliding piece, the sliding piece top is fixedly connected with positioning plate, the positioning plate surface is fixedly connected with rubber pad.

[0008] Preferably, the number of positioning plates is three, and the three positioning plates are distributed in a ring shape at equal intervals, and the positioning plates can be used to clamp and fix semiconductor material.

[0009] Preferably, the screw surface is rotatably connected with a support frame, the support frame is fixedly connected to the surface of the rotating disc, and the screw can be supported through the arranged support frame, so that the inclination of the screw during rotation is avoided.

[0010] Preferably, the rotating disc top is fixedly connected with a connecting block, and the connecting block surface is fixedly connected with a lamp, so that the surrounding of the semiconductor material is full of light, and the later processing is facilitated.

[0011] Preferably, the rotating mechanism comprises a first support piece, the first support piece is fixedly connected to the top of the mounting plate on both sides, a worm is rotatably connected in the first support piece, the worm surface is engaged with a worm wheel, the worm wheel is fixedly connected to the surface of the rotating rod, the worm surface is rotatably connected to a second support piece in the middle, and the second support piece is fixedly connected to the top of the mounting plate in the middle. Under the cooperation of the worm and the worm wheel, the rotating rod and the rotating disc can be driven to rotate synchronously.

[0012] Preferably, the worm surface right side is fixedly connected with a second flat gear, the second flat gear surface is engaged with a first flat gear, and the diameter of the first flat gear is smaller than that of the second flat gear. Under the cooperation of the first flat gear and the second flat gear, the worm and the worm wheel can be driven to rotate synchronously.

[0013] Preferably, the first flat gear inner ring is fixedly connected with an output shaft, the output shaft left side is fixedly connected with a motor, and the motor is fixedly connected to the top of the mounting plate.

[0014] Compared with the prior art, the utility model provides a clamping tool for semiconductor material processing has the following beneficial effects:

[0015] 1、 the clamping tool for semiconductor material processing, through the setting fixed mechanism, in the process that the screw rotates, can drive the positioning plate to the side that is close to semiconductor material moves, can clamping fixed semiconductor material, avoids in the process that semiconductor material is processed, semiconductor material appears the phenomenon that deviates, to semiconductor material has played good fixed role.

[0016] 2、 the clamping tool for semiconductor material processing, through the setting rotating mechanism, can realize the purpose of rotating the rotating disc, so that it adjusts the angle of semiconductor material, is favorable to the processing of semiconductor material later. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical scheme in the embodiments of the present application, the drawings needed to be used in the embodiment description will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0018] Figure 1 It is a whole structure schematic view of the present application.

[0019] Figure 2 It is a fixed mechanism schematic view of the present application.

[0020] Figure 3 It is a fixed mechanism cross section schematic view of the present application.

[0021] Figure 4 It is a rotating mechanism schematic view of the present application.

[0022] In the figure: 1, mounting plate; 2, fixed mechanism; 21, connecting block; 22, rubber pad; 23, screw rod; 24, lamp; 25, sliding piece; 26, rotating disc; 27, support frame; 28, positioning plate; 29, rotating rod; 3, rotating mechanism; 31, first support; 32, worm; 33, second support; 34, motor; 35, first flat gear; 36, second flat gear; 37, worm wheel. DETAILED DESCRIPTION

[0023] The technical scheme in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the present application.

[0024] The present application provides a technical scheme:

[0025] Embodiment one:

[0026] In combination with Figures 1 to 2 -3, a clamping tool for semiconductor material processing, comprising a mounting plate 1, the mounting plate 1 is provided with a fixed mechanism 2 on the top, and the fixed mechanism 2 is provided with a rotating mechanism 3 on the surface.

[0027] The fixing mechanism 2 comprises a rotating rod 29 rotatably connected to the top of the mounting plate 1, a rotating disc 26 fixedly connected to the top of the rotating rod 29, a rectangular groove formed in the rotating disc 26, a screw rod 23 rotatably connected in the rectangular groove, a rotating piece fixedly connected to one side of the screw rod 23, a sliding piece 25 threadedly connected to the surface of the screw rod 23, a positioning plate 28 fixedly connected to the top of the sliding piece 25, and a rubber pad 22 fixedly connected to the surface of the positioning plate 28.

[0028] Further, the three positioning plates 28 are annularly and equidistantly distributed, and the semiconductor material can be clamped and fixed through the positioning plates 28.

[0029] Further, the screw rod 23 is rotatably connected with a support frame 27 fixedly connected to the surface of the rotating disc 26, and the screw rod 23 can be supported through the support frame 27, so as to avoid tilting of the screw rod 23 during rotation.

[0030] Further, the top of the rotating disc 26 is fixedly connected with a connecting block 21, and the surface of the connecting block 21 is fixedly connected with a lamp 24, so that the surrounding of the semiconductor material is full of light, which is convenient for later processing.

[0031] Embodiment Two:

[0032] Referring to Figure 4 On the basis of Embodiment One, the rotating mechanism 3 further comprises a first support piece 31 fixedly connected to the top of the mounting plate 1 on both sides, a worm 32 rotatably connected in the first support piece 31, a worm wheel 37 meshed with the surface of the worm 32, the worm wheel 37 being fixedly connected to the surface of the rotating rod 29, a second support piece 33 rotatably connected to the surface of the worm 32 in the middle, the second support piece 33 being fixedly connected to the top of the mounting plate 1 in the middle, and the rotating rod 29 and the rotating disc 26 can be driven to synchronously rotate under the cooperation of the worm 32 and the worm wheel 37.

[0033] Further, the second spur gear 36 is fixedly connected to the right side of the surface of the worm 32, the first spur gear 35 is meshed with the surface of the second spur gear 36, the diameter of the first spur gear 35 is smaller than that of the second spur gear 36, and the worm 32 and the worm wheel 37 can be driven to synchronously rotate under the cooperation of the first spur gear 35 and the second spur gear 36.

[0034] Further, the output shaft is fixedly connected to the inner ring of the first spur gear 35, the motor 34 is fixedly connected to the left side of the output shaft, and the motor 34 is fixedly connected to the top of the mounting plate 1.

[0035] In actual operation, when the device is used, first, the semiconductor material is placed between the positioning plates 28, and the rotating member is rotated in sequence, the rotating member can drive the screw rod 23 to rotate, and in the process of rotating the screw rod 23, the positioning plate 28 can be driven to move to the side close to the semiconductor material, the semiconductor material can be clamped and fixed, the phenomenon of deviation of the semiconductor material in the process of processing the semiconductor material is avoided, and the semiconductor material is well fixed. When it is necessary to adjust the angle of the semiconductor material, the motor 34 can be started, the motor 34 can drive the first and second bevel gears 35 and 36 to rotate synchronously, and drive the worm 32 and the worm wheel 37 to rotate, so that the rotating disc 26 rotates, so that the angle of the semiconductor material is adjusted, and the semiconductor material is beneficial to the processing of the semiconductor material in the later period.

[0036] It should be noted that, in this document, the terms such as first and second are used merely to distinguish one entity or operation from another, and do not necessarily require or imply that these entities or operations exist in any actual relationship or order. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment. Without more limitations, the element defined by the statement "including a" does not exclude the existence of other identical elements in the process, method, article or equipment including the element.

Claims

1. A clamping tool for processing of semiconductor material, comprising a mounting plate (1), characterized in that: The mounting plate (1) top is provided with a fixing mechanism (2), the fixing mechanism (2) surface is provided with rotating mechanism (3); The fixing mechanism (2) includes a rotating rod (29), the rotating rod (29) is rotatably connected to the top of the mounting plate (1), the rotating rod (29) top fixedly connected with rotating disc (26), the rotating disc (26) is internally provided with a rectangular slot, the rectangular slot is rotatably connected with screw rod (23), one side of the screw rod (23) is fixedly connected with a rotating part, the screw rod (23) surface is screw connected with sliding piece (25), the sliding piece (25) top is fixedly connected with positioning plate (28), the positioning plate (28) surface is fixedly connected with rubber pad (22).

2. The clamping tool for processing of semiconductor material according to claim 1, characterized in that: The positioning plate (28) is provided in three, three positioning plates (28) are annularly and equally spaced.

3. The holding tool for processing of semiconductor material according to claim 1, characterized in that: The screw rod (23) surface is rotatably connected with support frame (27), the support frame (27) is fixedly connected to the surface of the rotating disc (26).

4. The holding tool for processing of semiconductor material according to claim 1, characterized in that: The rotating disc (26) top is fixedly connected with connecting block (21), the connecting block (21) surface is fixedly connected with lamp (24).

5. The holding tool for processing of semiconductor material according to claim 1, characterized in that: The rotating mechanism (3) includes a first support (31), the first support (31) is fixedly connected to both sides of the top of the mounting plate (1), the first support (31) is rotatably connected with a worm (32), the worm (32) surface is engaged with a worm wheel (37), the worm wheel (37) is fixedly connected to the surface of the rotating rod (29), the worm (32) surface is rotatably connected to the second support (33), the second support (33) is fixedly connected to the top of the mounting plate (1) middle.

6. The holding tool for processing of semiconductor material according to claim 5, characterized in that: The worm (32) surface right side is fixedly connected with the second spur gear (36), the second spur gear (36) surface is engaged with the first spur gear (35), the first spur gear (35) diameter is less than the second spur gear (36).

7. The holding tool for processing of semiconductor material according to claim 6, characterized in that: The first spur gear (35) inner ring is fixedly connected with an output shaft, the output shaft left side is fixedly connected with motor (34), the motor (34) is fixedly connected to the top of the mounting plate (1).

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