Expanding hole ACF adhesive film with adjustable air permeability
By designing adjustment holes and connection holes in the ACF film, combined with insulation and elastic layers, the problem of resin adhesive deformation caused by hot air extrusion is solved, achieving adjustable air permeability and good heat dissipation of the ACF film.
Patent Information
- Application Number
- CN202422996877.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-05
- Publication Date
- 2025-11-07
- Estimated Expiration
- 2034-12-05
AI Technical Summary
When existing ACF adhesive films generate heat during the operation of electronic devices, the hot air compresses and expands the pores, causing the resin adhesive to deform and affecting the normal electrical conduction of the conductive particles.
The resin adhesive is designed with equidistant adjustment holes and connection holes along the X and Y axes. The inner diameter of the adjustment holes is smaller than that of the connection holes. The conductive particles penetrate along the Z axis. Combined with the insulating layer and the elastic layer, the inner diameter of the holes is automatically adjusted by thermal expansion and contraction to avoid affecting the movement of the conductive particles.
By automatically adjusting the inner diameter of the pores based on the principle of thermal expansion and contraction, the conductive particles can operate normally, thus improving the air permeability and heat dissipation of the ACF film.
Smart Images
Figure CN223522461U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of ACF adhesive film, specifically relates to the expansion hole ACF adhesive film of adjustable control ventilation performance. BACKGROUND
[0002] ACF adhesive film, full name is anisotropic conductive adhesive film, is a special adhesive film, is mainly used in the connection and packaging in electronic equipment, its feature lies in Z axis electrical conductivity direction and XY insulating plane resistance characteristic has obvious difference, that is, vertical direction conduction and horizontal direction insulation.
[0003] In prior art, ACF adhesive film is usually composed of resin adhesive and conductive particles dispersed therein, these conductive particles are usually tiny particles made of gold, silver, carbon or other conductive materials, ACF adhesive film is provided with a plurality of expansion holes for realizing the effect of ventilation.
[0004] However, when electronic equipment runs, heat is generated, the heat causes thermal expansion of air, when hot air passes through the expansion hole, the expansion hole is extruded by hot air and becomes larger, which causes the resin adhesive to deform, the deformed resin adhesive extrudes the conductive particles, thereby affecting the normal current passing effect of ACF adhesive film. UTILITY MODEL CONTENTS
[0005] The utility model aims at providing expansion hole ACF adhesive film of adjustable control ventilation performance, to solve the technical problem that when electronic equipment runs, heat is generated in prior art, the heat causes thermal expansion of air, when hot air passes through the expansion hole, the expansion hole is extruded by hot air and becomes larger, which causes the resin adhesive to deform, the deformed resin adhesive extrudes the conductive particles, thereby affecting the normal current passing effect of ACF adhesive film.
[0006] The technical problem solved by the utility model can be realized by the following technical scheme:
[0007] Expansion hole ACF adhesive film of adjustable control ventilation performance, comprising:
[0008] Resin adhesive, a plurality of adjusting holes and connecting holes are equidistantly arranged in the resin adhesive along the X axis direction and the Y axis direction, the adjusting holes and the connecting holes are communicated with each other, the adjusting hole is a trapezoidal cross section, the adjusting hole inner diameter is smaller than the connecting hole inner diameter, and the adjusting hole is located at the bottom of the connecting hole in the Z axis direction.
[0009] Conductive particles, a plurality of groups of conductive particles are equidistantly arranged along the X axis direction and the Y axis direction, the conductive particles are arranged in the resin adhesive and fixedly connected with the resin adhesive, the conductive particles are arranged through the resin adhesive along the Z axis direction, and the conductive particles are not in contact with the adjusting holes and the connecting holes.
[0010] As a further scheme of the present utility model: the inner wall of the connecting hole and the adjusting hole is fixedly connected with an insulating layer respectively.
[0011] As a further scheme of the present utility model: the two ends of the adjusting hole are respectively provided with an elastic layer, the elastic layer has elasticity, and the elastic layer is arranged in the resin adhesive and fixedly connected with the resin adhesive.
[0012] As a further scheme of the present utility model: the elastic layer is provided with a fillet around the adjusting hole axis in the bottom end inner wall, and the cross section of the fillet is arc-shaped.
[0013] As a further scheme of the present utility model: a plurality of limiting layers are fixedly connected in the resin adhesive, and the limiting layers are located between the two groups of adjusting holes in the Y-axis direction.
[0014] As a further scheme of the present utility model: the limiting layer has insulation and hardness.
[0015] The present utility model has the advantages of:
[0016] 1, the resin adhesive is fixed on the electronic equipment along the Z-axis direction of the bottom end, at this time, the adjusting hole is first contacted with the electronic equipment, when the electronic equipment runs and generates heat, the heat makes the air expand, the expansion promotes the adjusting hole to start deforming to the surrounding, the adjusting hole is in the shape of an inverted circular table, the air in the adjusting hole closer to the electronic equipment expands more, therefore, when the hot air flows along the inner wall of the adjusting hole, the inner diameter of the expanded adjusting hole is leveled with the inner diameter of the connecting hole, the hot air flows out through the connecting hole, so that the ACF film automatically adjusts the inner diameter of the adjusting hole according to the thermal expansion and contraction principle of the air, and finally realizes the adjustable air permeability of the ACF film to make the ACF film better dissipate heat.
[0017] 2, when the heat generated by the electronic equipment is dissipated through the adjusting hole, the adjusting hole is expanded under the influence of the hot air, and the inner diameter of the expanded adjusting hole will not exceed the inner diameter of the connecting hole, so as to avoid the influence of the expansion of the adjusting hole on the normal operation of the conductive particles. BRIEF DESCRIPTION OF DRAWINGS
[0018] The present utility model will be further described below in combination with the drawings.
[0019] Fig. 1 It is a general structure schematic view of the present utility model;
[0020] Fig. 2 It is a general structure A-A sectional view of the present utility model.
[0021] In the drawing: 1, resin adhesive; 2, conductive particles; 3, adjusting hole; 4, limiting layer; 5, connecting hole; 6, insulating layer; 7, fillet; 8, elastic layer. Detailed Implementation
[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.
[0023] like Figs. 1-2 As shown, the expandable pore ACF membrane with adjustable breathability includes:
[0024] The resin adhesive 1 has several adjusting holes 3 and connecting holes 5 equidistantly spaced along the X-axis and Y-axis directions, respectively. The adjusting holes 3 and connecting holes 5 are interconnected. The cross-section of the adjusting hole 3 is trapezoidal, and the inner diameter of the adjusting hole 3 is smaller than the inner diameter of the connecting hole 5. The adjusting hole 3 is located at the bottom of the connecting hole 5 in the Z-axis direction. When the resin adhesive 1 is installed on the electronic device, the bottom end of the resin adhesive 1 along the Z-axis direction is fixed to the electronic device. At this time, the adjusting hole 3 first contacts the electronic device. When the electronic device generates heat during operation, the heat causes the air to expand. The expansion causes the adjusting hole 3 to start deforming in all directions, and the adjusting hole 3 takes the shape of an inverted frustum. The air in the adjusting hole 3 expands more as it gets closer to the electronic device. Therefore, when the hot air flows along the inner wall of the adjusting hole 3, the inner diameter of the expanded adjusting hole 3 is level with the inner diameter of the connecting hole 5. The hot air flows out through the connecting hole 5, thereby realizing that the ACF film automatically adjusts the inner diameter of the adjusting hole 3 according to the principle of thermal expansion and contraction of air. Finally, the ACF film can adjust its own air permeability so that the ACF film can better dissipate heat.
[0025] Conductive particles 2 are arranged in several groups at equal intervals along the X-axis and Y-axis directions. The conductive particles 2 are disposed inside the resin adhesive 1 and are fixedly connected to the resin adhesive 1. The conductive particles 2 are disposed through the resin adhesive 1 along the Z-axis direction. The conductive particles 2 do not contact the adjustment hole 3 and the connection hole 5. When the heat generated by the electronic device is dissipated through the adjustment hole 3, the adjustment hole 3 expands due to the influence of hot air. The inner diameter of the expanded adjustment hole 3 will not exceed the inner diameter of the connection hole 5, thereby avoiding the expansion of the adjustment hole 3 from affecting the normal operation of the conductive particles 2.
[0026] In some specific implementations, insulating layers 6 are fixedly connected to the inner walls of the connecting hole 5 and the adjusting hole 3 respectively. When air flows along the inner walls of the adjusting hole 3 and the connecting hole 5, the air contains dust, and the dust carries electrons that flow along the inner walls of the adjusting hole 3 and the connecting hole 5. In order to prevent these electrons from affecting the resin adhesive 1, the insulating layers 6 fixed to the inner walls of the adjusting hole 3 and the connecting hole 5 can insulate against the electrons.
[0027] In some specific embodiments, the adjusting hole 3 is provided with an elastic layer 8 at both ends, the elastic layer 8 has elasticity, the elastic layer 8 is arranged in the resin adhesive 1 and fixedly connected with the resin adhesive 1, when the adjusting hole 3 is expanded by hot air, the adjusting hole 3 transmits the expansion force of the hot air to the surrounding, at this time, the elastic layer 8 is deformed to the surrounding by the expansion force of the air, the deformation of the elastic layer 8 does not affect the deformation of the resin adhesive 1, when the air heat in the adjusting hole 3 decreases, the expansion force on the elastic layer 8 decreases, the elastic layer 8 starts to automatically recover, so that the inner diameter of the adjusting hole 3 starts to decrease, the elastic layer 8 achieves the effect of buffering the expansion force of the air, avoiding the direct effect of the expansion force of the air on the resin adhesive 1, thereby affecting the service life of the resin adhesive 1, thereby achieving the effect of protecting the resin adhesive 1.
[0028] In some specific embodiments, the elastic layer 8 is provided with a fillet 7 around the adjusting hole 3 in the bottom end inner wall, the fillet 7 is in circular arc shape in cross section, in order to better enter the hot air into the adjusting hole 3, when the hot air flows along the inner wall of the adjusting hole 3, the fillet 7 can better enter the hot air into the inner wall of the adjusting hole 3, the fillet 7 is closer to the electronic equipment, so that the fillet 7 is first contacted with the hot air, the expansion of the hot air first acts on the fillet 7, and the shape of the fillet 7 can better cope with the expansion of the hot air.
[0029] In some specific embodiments, the resin adhesive 1 is fixedly connected with a plurality of limiting layers 4 inside, the limiting layer 4 is located between the two groups of adjusting holes 3 in the Y-axis direction, the limiting layer 4 has insulation and hardness, when the adjusting hole 3 is expanded by the hot air, the elastic layer 8 is deformed, in order to avoid the deformation of the elastic layer 8 causing the position of the adjusting hole 3 to deviate on the resin adhesive 1, the limiting layer 4 can limit the elastic layer 8, avoiding the deformation of the elastic layer 8 causing the position of the adjusting hole 3 to deviate, thereby affecting the normal operation of the conductive particles 2.
[0030] In order to facilitate the personnel in the art to understand the embodiment of the scheme, the working principle of the scheme will be briefly described in combination with specific application scenarios:
[0031] When the resin adhesive 1 is installed on the electronic device, the bottom end of the resin adhesive 1 along the Z-axis direction is fixed on the electronic device, at this time, the adjusting hole 3 is first in contact with the electronic device, when the electronic device operates to generate heat, the heat will make the air expand, the expansion will make the adjusting hole 3 begin to deform to the four directions, the adjusting hole 3 is in the shape of an inverted truncated cone, the air inside the adjusting hole 3 closer to the electronic device expands more, therefore, when the hot air flows along the inner wall of the adjusting hole 3, the inner diameter of the expanded adjusting hole 3 is flat with the inner diameter of the connecting hole 5, the hot air flows out through the connecting hole 5, the adjusting hole 3 is affected by the expansion force of the hot air and expands, the inner diameter of the expanded adjusting hole 3 will not exceed the inner diameter of the connecting hole 5, the adjusting hole 3 transmits the expansion force of the hot air to the four directions, at this time, the elastic layer 8 is deformed to the four directions under the expansion force of the air, the deformation of the elastic layer 8 will not affect the deformation of the resin adhesive 1, when the air in the adjusting hole 3 reduces in heat, the expansion force on the elastic layer 8 decreases, the elastic layer 8 begins to automatically recover, so that the inner diameter of the adjusting hole 3 begins to decrease, when the elastic layer 8 deforms, the limiting layer 4 can limit the elastic layer 8, avoiding the deformation of the elastic layer 8 causing the position of the adjusting hole 3 to deviate.
[0032] When the hot air flows along the inner wall of the adjusting hole 3, the inner diameter of the expanded adjusting hole 3 is flat with the inner diameter of the connecting hole 5, the hot air flows out through the connecting hole 5, so as to realize that the ACF film automatically adjusts the inner diameter of the adjusting hole 3 according to the thermal expansion and contraction principle of the air, and finally realizes that the ACF film can adjust its own air permeability to better dissipate heat, the inner diameter of the expanded adjusting hole 3 will not exceed the inner diameter of the connecting hole 5, so as to avoid that the expansion of the adjusting hole 3 affects the normal operation of the conductive particles 2.
[0033] The above describes several embodiments of the present application in detail, but the embodiments of the present application are not limited to this, and cannot be considered to limit the scope of the present application. Any equivalent changes and improvements made within the scope of the present application should still belong to the patent coverage of the present application.
Claims
1. An expanded hole ACF film having a controllable air permeability, characterized by, Include: Resin adhesive (1), a plurality of adjusting holes (3) and connecting holes (5) are equidistantly opened along the X axis direction and the Y axis direction respectively, the adjusting holes (3) and the connecting holes (5) are communicated with each other, the adjusting hole (3) is trapezoidal in cross section, the inner diameter of the adjusting hole (3) is smaller than the inner diameter of the connecting hole (5), and the adjusting hole (3) is located at the bottom of the connecting hole (5) in the Z axis direction; Conductive particles (2), a plurality of groups of conductive particles (2) are equidistantly arranged along the X axis direction and the Y axis direction respectively, the conductive particles (2) are arranged inside the resin adhesive (1) and are fixedly connected with the resin adhesive (1), the conductive particles (2) are arranged along the Z axis direction and penetrate through the resin adhesive (1), and the conductive particles (2) are not in contact with the adjusting hole (3) and the connecting hole (5).
2. The adjustable air permeability of the expanded hole ACF adhesive film according to claim 1, characterized by, The inner walls of the connecting hole (5) and the adjusting hole (3) are fixedly connected with an insulating layer (6) respectively.
3. The adjustable air permeability of the expanded hole ACF adhesive film according to claim 1, characterized by, Both ends of the adjusting hole (3) are respectively provided with an elastic layer (8), the elastic layer (8) has elasticity, the elastic layer (8) is arranged in the resin adhesive (1) and is fixedly connected with the resin adhesive (1).
4. The adjustable air permeability of the expansion hole ACF adhesive film according to claim 3, characterized by, The elastic layer (8) is provided with a fillet (7) around the axis of the adjusting hole (3) on the inner wall of the bottom end, and the cross section of the fillet (7) is arc-shaped.
5. The adjustable air permeability of the expanded hole ACF adhesive film according to claim 1, characterized by, A plurality of limiting layers (4) are fixedly connected inside the resin adhesive (1), and the limiting layer (4) is located between the two groups of adjusting holes (3) in the Y axis direction.
6. The adjustable air permeability of the expansion hole ACF adhesive film according to claim 5, characterized by, The limiting layer (4) has insulation and hardness.