Film forming device
By employing layered insulation materials and insulating sheets in the film-forming apparatus, the eddy current problem caused by the conductivity of the carbon fiber layer was solved, improving heating efficiency and temperature uniformity, and ensuring the stability of the substrate reaction.
Patent Information
- Application Number
- CN202422938210.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-29
- Publication Date
- 2025-11-07
- Estimated Expiration
- 2034-11-29
AI Technical Summary
In existing film-forming devices, the conductivity of the carbon fiber layer of the insulation layer causes eddy currents to be generated in the induction coil, resulting in power loss and affecting the heating efficiency of the heated components.
The design employs layered insulation materials, including a first insulation board made of carbon fiber cloth, adjacent insulation blocks with gap fit, and an insulating sheet placed between adjacent blocks to reduce the generation of eddy currents and reduce the power loss of the induction coil.
This effectively reduces the power loss of the induction coil, improves the heating efficiency of the heated components, and ensures the temperature uniformity and heating efficiency of the substrate reaction environment.
Smart Images
Figure CN223522666U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application belongs to the technical field of film forming equipment, and particularly relates to a film forming device. BACKGROUND
[0002] At present, in the field of film forming devices, an induction coil is used to apply an induction magnetic field to a heated part (graphite) to provide a temperature field necessary for substrate reaction. Generally, a heat preservation layer needs to be arranged in a reaction chamber. The existing heat preservation layer is obtained by sintering multiple carbon fiber layers and other ceramic layers. The carbon fiber layer has good electrical conductivity. When the magnetic field of the induction coil passes through the heat preservation layer, eddy current is generated in the internal carbon fiber layer, thereby causing power loss of the induction coil and affecting the heating efficiency of the heated part (graphite). CONTENT OF THE UTILITY MODEL
[0003] The utility model aims to overcome the technical problem that eddy current is easily generated in the internal heat preservation layer, which causes power loss of the induction coil.
[0004] TECHNICAL SCHEME The utility model provides a film forming device, which comprises:
[0005] A shell has a containing cavity;
[0006] A heated part is arranged in the containing cavity and has a plate shape. The heated part comprises a bearing surface for bearing a substrate.
[0007] An induction coil is arranged on the outside of the shell.
[0008] A heat preservation part is arranged in the containing cavity and located between the heated part and the shell. The heat preservation part is stacked by multiple layer-shaped heat preservation materials. The layer-shaped heat preservation material comprises a carbon fiber cloth. The heat preservation part comprises a first heat preservation plate. The first heat preservation plate is located on at least one side of the heated part away from the bearing surface. The first heat preservation plate comprises multiple heat preservation blocks. Adjacent two heat preservation blocks are spliced with each other and form a plate shape matched with the shape of the heated part. Adjacent heat preservation blocks are spaced from each other.
[0009] In some embodiments, the film forming device further comprises an insulating sheet arranged between adjacent two heat preservation blocks along the arrangement direction of the heat preservation blocks. The insulating sheet is made of an insulating and heat insulation material.
[0010] In some embodiments, along the arrangement direction of the heat preservation blocks, the opposite sides of adjacent two heat preservation blocks are respectively provided with a first protruding part and a second protruding part. The first protruding part is connected with one of the heat preservation blocks and forms a first stepped surface facing the heated part. The second protruding part is connected with the other heat preservation block and forms a second stepped surface away from the heated part. The first stepped surface corresponds to the second stepped surface.
[0011] In some embodiments, the induction coil is in a disc shape and is arranged in correspondence with the heated member in the up-down direction, and a plurality of the heat preservation blocks are arranged around the disc center of the induction coil, and the heat preservation blocks are fan-shaped blocks.
[0012] In some embodiments, the induction coil is arranged in a row shape and at least partially corresponds to the heated member in the up-down direction, and a plurality of the heat preservation blocks are arranged side by side, and the heat preservation blocks are strip-shaped blocks.
[0013] In some embodiments, the layered heat preservation material has a stacking direction, and the stacking direction is parallel to the bearing surface of the heated member or forms an included angle, and the included angle is not greater than 45°.
[0014] In some embodiments, in the up-down direction, the first heat preservation plate has a first projection on the bearing surface, and the substrate has a second projection on the bearing surface, and the first projection covers at least the second projection.
[0015] In some embodiments, the film forming device further comprises a rotating assembly, the rotating assembly is arranged through the bottom wall of the shell, a plurality of the heat preservation blocks are arranged around the rotating assembly, and the heat preservation blocks are gap-fitted with the rotating assembly.
[0016] In some embodiments, the heat preservation member further comprises a second heat preservation plate, the second heat preservation plate is located on the side of the first heat preservation plate facing the heated member, at least partially surrounds the first heat preservation plate, and forms a receiving space together with the first heat preservation plate for receiving the heated member.
[0017] In some embodiments, the heated member comprises a first heated body and a second heated body, the first heated body and the second heated body are arranged opposite to each other in the up-down direction and are spaced apart to form a reaction chamber, the bearing surface is located on the side of the first heated body away from the bottom wall, and the first heat preservation plate is located on at least the side of the first heated body away from the bearing surface.
[0018] The heat preservation member further comprises a third heat preservation plate, the third heat preservation plate is located on at least the side of the second heated body away from the bearing surface, the first heated body and the first heat preservation plate are correspondingly connected in the up-down direction, the second heated body and the third heat preservation plate are connected, and the projection of the third heat preservation plate on the shell in the up-down direction covers at least the second heated body.
[0019] Beneficial effects: The film forming device in the embodiment of the application comprises a shell, a heated part, an induction coil and a heat preservation part; the shell has a containing cavity; the heated part is plate-shaped and is arranged in the containing cavity, and the heated part comprises a bearing surface for bearing a substrate; the induction coil is arranged outside the shell; the heat preservation part is arranged in the containing cavity and is located between the heated part and the shell, the heat preservation part is stacked by a plurality of layered heat preservation materials, the layered heat preservation material comprises a carbon fiber cloth, and the heat preservation part comprises a first heat preservation plate, the first heat preservation plate is located at least on a side of the heated part away from the bearing surface, and the first heat preservation plate comprises a plurality of heat preservation blocks, and adjacent two heat preservation blocks are spliced with each other and form a plate-shaped part matched with the shape of the heated part. By arranging the first heat preservation plate in a split manner and gap fitting between adjacent heat preservation blocks, the eddy current generated when the induction coil passes through the heat preservation layer is reduced, the power loss of the induction coil is reduced, and the heating efficiency of the heated part is ensured. BRIEF DESCRIPTION OF DRAWINGS
[0020] In order to more clearly illustrate the technical solutions in the embodiments of the application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative effort.
[0021] Figure 1 FIG. 1 is a structural schematic diagram of a film forming device according to an embodiment of the application;
[0022] Figure 2 FIG. 2 is a schematic diagram of the positional relationship among the heated part, the first heat preservation plate, the second heat preservation plate and the induction coil in the film forming device according to the embodiment of the application;
[0023] Figure 3 FIG. 3 is a schematic diagram of the structure in FIG. 1 in another perspective view; Figure 2
[0024] FIG. 4 is a structural schematic diagram of a second heat preservation plate according to the embodiment of the application, and the stacking direction is shown in the diagram; Figure 4
[0025] FIG. 5 is an assembly relationship schematic diagram of a heat preservation block in the film forming device according to the embodiment of the application, and an insulating sheet is shown in the diagram; Figure 5
[0026] FIG. 6 is an assembly relationship schematic diagram of a heat preservation block in the film forming device according to the embodiment of the application; Figure 6
[0027] FIG. 7 is a front view schematic diagram of FIG. 6; Figure 7 Figure 2 FIG. 8 is a structural schematic diagram of a film forming device according to another embodiment of the application;
[0028] Figure 8 FIG. 9 is a structural schematic diagram of a film forming device according to another embodiment of the application;
[0029] Figure 9 Fig. 1 is a schematic view of the structure in Fig. 2 from another perspective, and the induction coil is omitted in the figure. Figure 8
[0030] Reference signs:
[0031] 1, housing; 10, accommodating cavity; 2, heated member; 210, bearing surface; 3, induction coil; 4, heat preservation member; 41, first heat preservation plate; 411, heat preservation block; X, stacking direction; 412, insulating sheet; 413, first protrusion; 414, second protrusion; 4131, first step surface; 4141, second step surface; Y, up-down direction; 5, rotating assembly; 11, bottom wall; 42, second heat preservation plate; 40, accommodating space; 21, first heated body; 22, second heated body; 23, reaction chamber; 43, third heat preservation plate. DETAILED DESCRIPTION
[0032] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0033] In the description of the present application, it should be understood that the terms "upper", "lower", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or components referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In the description of the present application, the meaning of "multiple" is two or more, at least one of which can be one, two or more, unless otherwise explicitly specified. The terms "first", "second", "third" and the like are only for the convenience of description and are named by numbering the parts or embodiments, and do not imply an important order between the parts or between the embodiments.
[0034] It should also be noted that in the drawings of the present application, the arrow marked X indicates the stacking direction of the layered material, and the arrow marked Y indicates the up-down direction. In the description of the present application, the up-down direction is introduced to more clearly define the structure and relative positional relationship of each part of the film forming device.
[0035] As a preamble of the embodiments of the present application, in the field of film forming device, the induction coil is used to apply an induction magnetic field to the heated member (graphite) to provide the necessary temperature field for the substrate reaction. Generally, it is necessary to set a heat preservation layer in the reaction chamber, and the existing heat preservation layer is sintered by stacking multiple carbon fiber layers and other ceramic layers. The carbon fiber layer has good electrical conductivity, and when the magnetic field of the induction coil passes through the heat preservation layer, eddy current will be generated in the internal carbon fiber layer, thereby causing power loss of the induction coil and affecting the heating efficiency of the heated member (graphite).
[0036] Therefore, the embodiments of the present application provide a film forming device, which aims to solve at least one of the above technical problems.
[0037] Please refer to Figures 1 to 3 The film forming device of the embodiments of the present application comprises a housing 1, a heated member 2, an induction coil 3 and a heat preservation member 4. The housing 1 has a receiving cavity 10. The heated member 2 is plate-shaped and is arranged in the receiving cavity 10, and is generally made of graphite. The heated member 2 comprises a bearing surface 210 for bearing a substrate. The induction coil 3 is arranged outside the housing 1. The heat preservation member 4 is arranged in the receiving cavity 10 and is located between the heated member 2 and the housing 1, and is used for heat preservation of the heated member 2. The heat preservation member 4 is stacked by multiple layered heat preservation materials, and the layered heat preservation material comprises carbon fiber cloth. The heat preservation member 4 comprises a first heat preservation plate 41, which is located at least on the side of the heated member 2 away from the bearing surface 210. The first heat preservation plate 41 comprises multiple heat preservation blocks 411. Adjacent two heat preservation blocks 411 are spliced with each other and form a plate shape matched with the shape of the heated member 2, and the adjacent heat preservation blocks 411 are spaced apart from each other. It should be understood that the direction of the induced current (eddy current) is actually opposite to the current direction of the coil, so by arranging the first heat preservation plate 41 on the side of the heated member 2 away from the bearing surface 210, and by gap fitting between adjacent heat preservation blocks 411, the conductive path between the multiple heat preservation blocks 411 is disconnected; thereby reducing the eddy current generated when the induction coil 3 passes through the heat preservation layer, reducing the power loss of the induction coil 3, and ensuring the heating efficiency of the heated member 2, thereby providing protection for the reaction environment of the substrate.
[0038] Please refer to Figure 5As shown, in some embodiments, the film forming device further comprises an insulating sheet 412 arranged between two adjacent heat preservation blocks 411 along the arrangement direction of the heat preservation blocks 411, and the insulating sheet 412 is made of insulating and heat insulating material, preferably quartz sheet, heat insulating ceramic sheet, etc. It should be understood that the two adjacent heat preservation blocks 411 are blocked by the insulating sheet 412 arranged therebetween, so as to avoid electrical connection between the two adjacent heat preservation blocks 411 and to avoid large eddy current in the first heat preservation plate 41; at the same time, the insulating sheet 412 can well control the gap between the two adjacent heat preservation blocks 411 and improve the assembly efficiency, which is convenient for subsequent assembly. Further, the gap between the two adjacent heat preservation blocks 411 is not less than 1 mm, so as to avoid sparking phenomenon due to too close distance.
[0039] Referring to Figure 6 As shown, in some embodiments, along the arrangement direction of the heat preservation blocks 411, the opposite sides of the two adjacent heat preservation blocks 411 are respectively provided with a first protrusion 413 and a second protrusion 414, the first protrusion 413 is connected with one of the heat preservation blocks 411 and forms a first step surface 4131 facing the heated part 2, the second protrusion 414 is connected with the other heat preservation block 411 and forms a second step surface 4141 away from the heated part 2, and the first step surface 4131 corresponds to the second step surface 4141. It should be understood that the step structure is arranged between the two adjacent heat preservation blocks 411, so as to avoid that the heat radiation generated by the heated part 2 is directly transmitted to the inner wall of the shell 1 through the gap; at the same time, the airflow can also be prevented from passing through the gap to a certain extent.
[0040] Referring to Figure 3 In some embodiments, the induction coil 3 is disc-shaped and is arranged corresponding to the heated part 2 in the up-down direction Y, and the plurality of heat preservation blocks 411 are arranged around the disc-shaped center of the induction coil 3, and the heat preservation blocks 411 are fan-shaped blocks. It should be understood that the heat preservation block 411 is a fan-shaped structure, that is, the projection of the heat preservation block 411 on the plane perpendicular to the up-down direction Y is fan-shaped. The heat preservation block 411 is arranged along the surrounding direction of the induction coil 3, so that the stacking direction X of the layered heat preservation material can be consistent with the surrounding direction of the induction coil 3, thereby reducing the eddy current generated when the induction magnetic field of the induction coil 3 passes through the heat preservation layer, reducing the power loss of the induction coil 3, and protecting the heating efficiency of the heated part 2, thereby providing protection for the reaction environment of the substrate.
[0041] It is important to understand that the fan-shaped structure has relatively inner and outer ends, with the arc length of the inner end being smaller than that of the outer end. This results in a larger area of the insulation block 411 near the outer end, allowing the insulation block 411 to retain the ability to generate relatively large eddy currents relative to the edge of the heated component 2. This ensures that it still has a certain heating efficiency in the field where the induction coil 3 is heated, thereby reducing the temperature gradient between the edge area of the heated component 2 and the insulation layer, balancing the temperature of the edge area of the heated component 2, and ensuring the temperature uniformity of each area of the heated component 2.
[0042] Please see Figure 8 In some embodiments, the induction coils 3 are arranged in a row, and at least partially correspond to the heated element 2 in the vertical direction Y. Multiple insulating blocks 411 are arranged side-by-side, and each insulating block 411 is a strip-shaped block. It should be understood that the insulating block 411 is strip-shaped, meaning its projection onto a plane perpendicular to the vertical direction Y is also strip-shaped. The side-by-side arrangement of the insulating blocks 411 allows the stacking direction X of the layered insulating material to be nearly parallel to the circumferential direction of the induction coils 3. This reduces the eddy currents generated when the induced magnetic field of the induction coils 3 passes through the insulating layer, lowers the power loss of the induction coils 3, ensures the heating efficiency of the heated element 2, and provides a safe reaction environment for the substrate.
[0043] Please refer to the following: Figure 2 and Figure 4 As shown, or refer to Figure 9 As shown, in some embodiments, the layered insulation material has a stacking direction X, and the induction coil 3 is at least partially disposed in the vertical direction Y corresponding to the heated element 2. The stacking direction X is parallel to or forms an angle with the bearing surface 210 of the heated element 2, with the angle not exceeding 45°. Since the area of the induction coil 3 corresponding to the plate-shaped heated element 2 is generally arranged in a planar shape parallel to the bearing surface 210, when the insulation material of the insulation block 411 is stacked in the aforementioned stacking direction X, according to Faraday's law of electromagnetic induction and Lenz's law, the induced current (eddy current) generated by the insulation block 411 in the alternating magnetic field generated by the induction coil 3 will be significantly reduced, thereby reducing the power loss generated by the induced magnetic field of the induction coil 3 passing through the insulation layer. In a more preferred embodiment, the stacking direction X of a local area of the insulation block 411 directly corresponding to the single induction coil 3 is parallel to or forms an angle with the single induction coil 3, with the angle not exceeding 45°. It should be understood that by limiting the angle between the stacking direction X of the insulation material and the circumferential direction of the induction coil 3 to meet the above conditions, the eddy current generated inside the insulation layer located directly below the heated component 2 is reduced, thereby reducing the power loss generated by the induced magnetic field of the induction coil 3 passing through the insulation layer.
[0044] In some embodiments, along the up-down direction Y, the first heat preservation plate 41 has a first projection on the bearing surface 210, and the substrate has a second projection on the bearing surface 210, and the first projection covers the second projection at least. It needs to be understood that by limiting the projection relationship of the first heat preservation plate 41 and the substrate in the up-down direction Y, the size of the first heat preservation plate 41 is relatively larger than the size of the substrate, thereby ensuring that the reaction temperature uniformity of the substrate provided by the heated part 2 below the substrate is better, reducing the influence of the heat preservation layer on the magnetic field attenuation, reducing the power loss of the induction coil 3, and protecting the heating efficiency of the heated part 2, and providing protection for the reaction environment of the substrate.
[0045] In some embodiments, the film forming device further comprises a rotating assembly 5 penetrating the bottom wall 11 of the shell 1, and a plurality of heat preservation blocks 411 are arranged around the rotating assembly 5 and gap-fitted between the heat preservation blocks 411 and the rotating assembly 5. It needs to be understood that the gap-fitting between the heat preservation blocks 411 and the rotating assembly 5 can avoid stress contact between the heat preservation blocks 411 and the rotating assembly 5, thereby avoiding extrusion deformation caused by thermal expansion between parts.
[0046] In some embodiments, the heat preservation part 4 further comprises a second heat preservation plate 42 located on the side of the first heat preservation plate 41 facing the heated part 2, and at least partially surrounding the first heat preservation plate 41 and forming a receiving space 40 with the first heat preservation plate 41 for accommodating the heated part 2. It needs to be understood that the second heat preservation plate 42 can meet the circumferential heat preservation requirement of the heated part 2, improve the heat preservation capacity, and ensure the temperature uniformity of the outside of the heated part 2, and at the same time, the second heat preservation plate 42 can make up or reduce the assembly gap between the shell 1 and the heated part 2, avoiding the interference of the flow direction of the reaction gas. Further, the stacking direction X of the layered heat preservation material of the first heat preservation plate 41 is the same as the stacking direction X of the layered heat preservation material of the second heat preservation plate 42, and both are circumferentially arranged around the heated body.
[0047] In some embodiments, the heated member 2 comprises a first heated body 21 and a second heated body 22, the first heated body 21 and the second heated body 22 are oppositely arranged along the up-down direction Y and are spaced to form a reaction chamber 23, the bearing surface 210 is located on the side of the first heated body 21 away from the bottom wall 11, and the first heat insulation plate 41 is located on at least one side of the first heated body 21 away from the bearing surface 210; the heat insulation member 4 further comprises a third heat insulation plate 43, the third heat insulation plate 43 is located on at least one side of the second heated body 22 away from the bearing surface 210, along the up-down direction Y, the first heated body 21 is correspondingly connected with the first heat insulation plate 41, the second heated body 22 is connected with the third heat insulation plate 43, and the projection of the third heat insulation plate 43 on the shell 1 along the up-down direction Y covers at least the second heated body 22. It should be understood that the first heated body 21 is accommodated in the accommodation space 40 surrounded by the first heat insulation plate 41 and the second heat insulation plate 42, the second heated body 22 is located directly above the first heated body 21 and defines the reaction chamber 23 with the first heated body 21 to provide a place for the reaction of the reaction gas and the substrate. The third heat insulation plate 43 is arranged between the second heated body 22 and the shell 1, and the third heat insulation plate 43 can be connected with the second heated body 22 and the shell 1 on both sides along the up-down direction Y, respectively, and the second heated body 22 is heat-insulated by the third heat insulation plate 43 to ensure that the reaction chamber 23 can maintain a high temperature to reduce the temperature gradient of the reaction chamber 23 along the up-down direction Y and ensure the uniformity of the substrate reaction temperature. Further, the third heat insulation plate 43 can also be provided in the same manner as the first heat insulation plate and / or the second heat insulation plate to reduce the power loss generated by the induction magnetic field of the induction coil passing through the third heat insulation plate and improve the heating efficiency of the second heated body 22.
[0048] In the above embodiments, the description of each embodiment focuses on different aspects, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments.
[0049] The film forming device provided by the embodiments of the present application is described in detail above, and the principles and implementation manners of the present application are described by using specific examples. The above embodiment descriptions are only used to help understand the technical solutions and core ideas of the present application; those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not change the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.
Claims
1. A film forming apparatus characterized by comprising: The film forming device comprises a housing (1) having a receiving cavity (10); a heated part (2) in the form of a plate arranged in the receiving cavity (10), the heated part (2) comprising a bearing surface (210) for bearing a substrate; an induction coil (3) arranged outside the housing (1); and a heat preservation part (4) arranged in the receiving cavity (10) and located between the heated part (2) and the housing (1), the heat preservation part (4) being stacked by a plurality of layered heat preservation materials, the layered heat preservation materials comprising carbon fiber cloth, the heat preservation part (4) comprising a first heat preservation plate (41) located at least on a side of the heated part (2) away from the bearing surface (210), the first heat preservation plate (41) comprising a plurality of heat preservation blocks (411), two adjacent heat preservation blocks (411) being spliced with each other and forming a plate-shaped structure matching the shape of the heated part (2), and the adjacent heat preservation blocks (411) being spaced apart from each other. The film forming device further comprises an insulating sheet (412) arranged between two adjacent heat preservation blocks (411) along the arrangement direction of the heat preservation blocks (411), the insulating sheet (412) being made of an insulating and heat-insulating material. Along the arrangement direction of the heat preservation blocks (411), opposite sides of two adjacent heat preservation blocks (411) are respectively provided with a first protrusion (413) and a second protrusion (414), the first protrusion (413) is connected with one of the heat preservation blocks (411) and forms a first stepped surface (4131) facing the heated part (2), and the second protrusion (414) is connected with the other heat preservation block (411) and forms a second stepped surface (4141) facing away from the heated part (2), the first stepped surface (4131) and the second stepped surface (4141) correspond to each other. The induction coil (3) is in the form of a disc and is arranged corresponding to the heated part (2) in the up-down direction (Y), a plurality of heat preservation blocks (411) are arranged around the disc-shaped center of the induction coil (3), and the heat preservation blocks (411) are in the form of fan-shaped blocks. The induction coil (3) is arranged in the form of a row and at least partially corresponds to the heated part (2) in the up-down direction (Y), a plurality of heat preservation blocks (411) are arranged side by side, and the heat preservation blocks (411) are in the form of strip-shaped blocks.
2. The film forming apparatus according to claim 1, wherein The layered heat preservation material has a stacking direction (X), the stacking direction (X) is parallel to the bearing surface (210) of the heated part (2) or forms an included angle, and the included angle is not greater than 45°.
3. The film forming apparatus according to claim 2, wherein In the up-down direction (Y), the first heat preservation plate (41) has a first projection on the bearing surface (210), and the substrate has a second projection on the bearing surface (210), and the first projection covers at least the second projection.
4. The film forming apparatus according to claim 1, wherein The film forming device further comprises a rotating assembly (5) penetrating through a bottom wall (11) of the housing (1), a plurality of heat preservation blocks (411) are arranged around the rotating assembly (5), and the heat preservation blocks (411) are gap-fitted with the rotating assembly (5).
5. The film forming apparatus according to claim 1, wherein 6. The film forming apparatus according to claim 1, wherein 7. The film forming apparatus according to claim 1, wherein 8. The film forming apparatus according to claim 2, wherein 9. The film forming apparatus according to claim 1, wherein The heat preservation member (4) further comprises a second heat preservation plate (42), which is located on the side of the first heat preservation plate (41) facing the heated member (2), at least partially surrounds the first heat preservation plate (41), and forms a receiving space (40) with the first heat preservation plate (41) to accommodate the heated member (2).
10. The film forming apparatus according to claim 1, wherein The heated member (2) comprises a first heated body (21) and a second heated body (22), the first heated body (21) and the second heated body (22) are oppositely arranged along the up-down direction (Y) and are spaced to form a reaction chamber (23), the bearing surface (210) is located on the side of the first heated body (21) away from the bottom wall (11) of the shell (1), and the first heat preservation plate (41) is located on at least one side of the first heated body (21) away from the bearing surface (210); The heat preservation member (4) further comprises a third heat preservation plate (43), which is located on at least one side of the second heated body (22) away from the bearing surface (210), the first heated body (21) and the first heat preservation plate (41) are correspondingly connected along the up-down direction (Y), the second heated body (22) and the third heat preservation plate (43) are connected, and the projection of the third heat preservation plate (43) on the shell (1) along the up-down direction (Y) at least covers the second heated body (22).