Wafer glue line detector and multi-station wafer dispensing equipment

Abstract

The utility model discloses a wafer glue line detector and a multi-station wafer dispensing device, the wafer glue line detector comprises a work platform, a three-axis motion platform and a visual inspection mechanism, the work platform is used for bearing a wafer; the three-axis motion platform is arranged above the operation platform and has motion travels in the X direction, the Y direction and the Z direction; the visual detection mechanism is arranged on the three-axis motion platform so that the visual detection mechanism can be driven by the three-axis motion platform to move to the position above the work platform, and the visual detection mechanism located above the visual detection mechanism is suitable for conducting visual detection on the wafer borne on the work platform so as to accurately obtain the dispensing condition of the wafer. According to the utility model, the wafer which is placed stably is subjected to visual inspection, and the visual inspection mechanism is arranged on the three-axis motion platform, so that the visual inspection mechanism is controlled to move in the X, Y and Z directions, and the visual inspection mechanism can be ensured to carry out complete and effective visual inspection on the wafer, thereby accurately obtaining the dispensing condition of the wafer.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer processing equipment technical field especially relates to a wafer glue line detection machine, in addition, it further relates to a multi-station wafer dispensing equipment. BACKGROUND

[0002] At present, after the wafer dispensing is completed, the wafer dispensing situation needs to be manually rechecked, but the manual rechecking cannot accurately and effectively detect the problems existing after the wafer dispensing, and the fine flaws existing after the wafer dispensing can not be checked out manually, and too much human participation in the operation process can easily lead to the reduction of overall operation efficiency.

[0003] Therefore, a wafer glue line detection machine needs to be designed to solve the above problems. UTILITY MODEL CONTENT

[0004] The utility model aims at at least solving one of the technical problems existing in the prior art.

[0005] Therefore, the utility model provides a wafer glue line detection machine, which can accurately and effectively detect the wafer dispensing effect.

[0006] According to the wafer glue line detection machine provided by the utility model, the wafer is placed on the workbench, and then the wafer placed stably is detected visually, the visual detection is realized through the visual detection mechanism, the visual detection mechanism is installed on the three-axis motion platform, the three-axis motion platform can control the movement of the visual detection mechanism in the X, Y and Z directions, and the visual detection mechanism is moved above the wafer during detection to detect the wafer visually, so that the dispensing condition of the wafer is obtained.

[0007] Frame

[0008] Workbench, the workbench is installed on the frame and is used for carrying the wafer

[0009] Three-axis motion platform, the three-axis motion platform is arranged on the frame, and the three-axis motion platform has movement strokes in X, Y and Z directions

[0010] Visual detection mechanism, the visual detection mechanism is arranged on the three-axis motion platform, so that the visual detection mechanism can be moved to the upper side of the workbench through the three-axis motion platform, and the visual detection mechanism is suitable for visually detecting the dispensing state of the wafer carried on the workbench.

[0011] The utility model has the advantages that the wafer is placed on the workbench, and then the wafer placed stably is detected visually, the visual detection is realized through the visual detection mechanism, the visual detection mechanism is installed on the three-axis motion platform, the three-axis motion platform can control the movement of the visual detection mechanism in the X, Y and Z directions, and the visual detection mechanism is moved above the wafer during detection to detect the wafer visually, so that the dispensing condition of the wafer is obtained.

[0012] Preferably, the three-axis motion platform comprises

[0013] a Y-axis moving mechanism arranged respectively at both sides of the work platform along the Y direction;

[0014] an X-axis moving mechanism, both ends of which are arranged on the Y-axis moving mechanism, so that the X-axis moving mechanism moves along the path defined by the Y-axis moving mechanism in the Y direction;

[0015] a Z-axis moving mechanism arranged on the X-axis moving mechanism, which can move in the X direction along the path defined by the X-axis moving mechanism, and has a moving stroke in the Z direction.

[0016] Further preferably, the visual detection mechanism is arranged on the Z-axis moving mechanism, so that the visual detection mechanism can be driven by the Z-axis moving mechanism to move in the Z direction.

[0017] Preferably, the visual detection mechanism at least includes a 2D detection module arranged on the X-axis moving mechanism, so that the 2D detection module can detect the glue shape after the wafer is dispensed.

[0018] Further preferably, the visual detection mechanism can further include a 3D detection module integrated with the 2D detection module and arranged on the X-axis moving mechanism, which is adapted to detect the glue height after the wafer is dispensed.

[0019] Preferably, the work platform is provided with a wafer rotating platform having a moving stroke in the vertical direction and being capable of rotating around the vertical direction, so that after the wafer is placed on the work platform, the wafer rotating platform is adapted to lift the wafer and rotate the wafer by a set angle, so as to correct the orientation of the wafer.

[0020] Further preferably, the work platform is further provided with a heating module, and the wafer rotating platform is adapted to separate the heating module into an inner ring heating plate and an outer ring heating plate, and the inner ring heating plate and the outer ring heating plate are adapted to heat the wafer at the same time, so as to keep the glue after the wafer is dispensed in a flowing state during the detection of the wafer by the visual detection mechanism.

[0021] Preferably, the periphery of the heating module is further provided with an anti-warping module, and each side of the anti-warping module is adapted to work independently or in cooperation, and the anti-warping module is adapted to press the side edge of the wafer placed on the heating module downward, so as to compress the warped part of the wafer to be flat.

[0022] Further preferably, the contact of the indenter of the anti-warping module with the wafer is a point contact, and the indenter is adapted to move along the surface of the wafer to adjust its contact position with the wafer according to the warping orientation of the wafer.

[0023] The utility model discloses a second aspect provides a kind of multi-station wafer dispensing equipment, comprising:

[0024] The wafer glue line detection machine of the first aspect of the utility model;

[0025] Dispensing mechanism, the dispensing mechanism is suitable for dispensing to the wafer;

[0026] Feeding and discharging mechanism, the feeding and discharging mechanism is suitable for conveying the wafer that dispensing is completed to the wafer glue line detection machine, to carry out glue shape detection or additional glue height detection to the wafer.

[0027] Other features and advantages of the utility model will be described in the subsequent specification, and, part becomes obvious from the specification, or understand by implementing the utility model. The purpose and other advantages of the utility model are realized and obtained in the structure specially pointed out in the specification, claims and drawings.

[0028] In order to make the above purpose, features and advantages of the utility model more obvious and easy to understand, the following preferred embodiments are specifically described, and the accompanying drawings are described as follows. BRIEF DESCRIPTION OF DRAWINGS

[0029] The utility model is further explained below in connection with the drawings and embodiments.

[0030] Figure 1 It is the first perspective view of wafer glue line detection machine of the utility model for the first view of wafer glue line detection machine of the utility model;

[0031] Figure 2 It is the second perspective view of wafer glue line detection machine of the utility model for the second view of wafer glue line detection machine of the utility model;

[0032] Figure 3 It is the perspective view of operation platform of wafer glue line detection machine of the utility model for the operation platform of wafer glue line detection machine of the utility model.

[0033] EXPLANATION OF REFERENCE NUMERALS:

[0034] 1, operation platform;11, heating module;111, inner ring heating plate;112, outer ring heating plate;12, wafer rotation platform;13, anti-warping module;

[0035] 2, three-axis motion platform;21, Y-axis moving mechanism;22, X-axis moving mechanism;23, Z-axis moving mechanism;

[0036] 3, visual detection mechanism;

[0037] 4. Frame. DETAILED DESCRIPTION

[0038] The utility model will be explained in further detail in combination with the drawings. These drawings are all simplified schematic diagrams, and only illustrate the basic structure of the utility model in a schematic way, so they only show the components related to the utility model. In the description of the utility model, it should be understood that, unless otherwise specified, the meaning of "multiple" is two or more.

[0039] First of all, it needs to be pointed out that the wafer type carried by the work platform in the wafer glue line detection machine disclosed in the application is preferably a large-size square wafer. The present equipment is mainly aimed at the problems existing in the process of large-size square wafers. However, it should be understood that the technical solutions disclosed in the present application are also applicable to the currently mainstream wafer shapes (circular wafers) and their commonly used specifications. However, due to the differences in wafer shape and specification, some functions involved in the present application scheme are not necessary for the process of the currently mainstream wafers.

[0040] Hereinafter, the structure involved in the process of large-size square wafers is described in detail. For the currently mainstream wafer types, those skilled in the art can operate according to experience, so the wafer process of this type will not be described hereinafter.

[0041] Referring to Figures 1 to 2 , the utility model specific implementation mode's one wafer glue line detection machine, this wafer glue line detection machine includes work platform 1, three -axis motion platform 2, visual detection mechanism 3 and frame 4, wherein, work platform 1 installs on frame 4 and is used to carry wafer, three -axis motion platform 2 sets up on frame 4, and this three -axis motion platform 2 has the movement stroke in X, Y, Z three directions, visual detection mechanism 3 sets up on three -axis motion platform 2, and can drive visual detection mechanism 3 to move to the upper of work platform 1 by three -axis motion platform 2, and visual detection mechanism 3 can carry out visual detection to the wafer carried on work platform 1, to obtain the dispensing condition after the dispensing of wafer.

[0042] It should be pointed out that the frame 4 is a natural marble frame, which can effectively reduce stress release and has good shock absorption, which can effectively reduce the impact caused by high-speed movement. And the natural marble frame can ensure the accuracy unchanged in the use environment of 20~40℃, so as to realize the stability of long-term operation.

[0043] Specifically, the visual detection mechanism 3 at least includes a 2D detection module, and additionally, a 3D detection module can be additionally provided, and after the 3D detection module is additionally provided, it is integrated with the 2D detection module to realize synchronous movement. Among them, the 2D detection module can carry out glue shape detection, and the glue shape detection includes product target position positioning, detection area division, two-dimensional code recognition, foolproof detection, glue point detection, glue shape measurement and the like. The 3D detection mainly includes functions of product four-edge glue height detection, R-angle glue height detection and the like.

[0044] Referring to Figure 2 , the three-axis motion platform 2 includes a Y-axis moving mechanism 21, an X-axis moving mechanism 22 and a Z-axis moving mechanism 23, the Y-axis moving mechanism 21 is arranged on both sides of the workbench 1 along the Y direction, the two ends of the X-axis moving mechanism 22 are respectively arranged on the Y-axis moving mechanisms 21 on both sides, so that the X-axis moving mechanism 22 can move along the path defined by the Y-axis moving mechanism 21, the Z-axis moving mechanism 23 is arranged on the X-axis moving mechanism 22, and the Z-axis moving mechanism 23 can move in the X direction on the path defined by the X-axis moving mechanism 22, and the Z-axis moving mechanism 23 also has a movement stroke in the Z direction.

[0045] Specifically, the 2D detection module and the 3D detection module of the visual detection mechanism 3 are arranged on the Z-axis moving mechanism 23, and then the 2D detection module and the 3D detection module can be driven by the Z-axis moving mechanism 23 to move synchronously in the Z direction.

[0046] Referring to Figure 3 , the workbench 1 is provided with a wafer rotating platform 12, the wafer rotating platform 12 has a movement stroke in the vertical direction and can rotate around the vertical direction, and then after the wafer is placed on the workbench 1, the wafer rotating platform 12 is suitable for lifting the wafer and driving the wafer to rotate by a set angle, so as to realize the rotation correction of the wafer orientation

[0047] In addition, the workbench 1 is also provided with a heating module 11, the heating module 11 is divided into an inner ring heating plate 111 and an outer ring heating plate 112 by the wafer rotating platform 12, and the inner ring heating plate 111 and the outer ring heating plate 112 are installed on the same horizontal plane to avoid causing the height difference of each part of the wafer when the wafer is carried. And the inner ring heating plate 111 and the outer ring heating plate 112 can heat the wafer at the same time, so as to keep the glue in a flowing state after the wafer is glued during the detection of the wafer by the visual detection mechanism 3, thereby facilitating the detection of the glue condition of the wafer by the visual detection mechanism 3.

[0048] More specifically, anti-warping modules 13 are further arranged on the peripheral side of the heating module 11, and each anti-warping module 13 on each side can independently work, and through the cooperation of the anti-warping module 13 and the heating module 11, the wafer in the warped state can be flattened to ensure the overall flatness of the wafer. Moreover, when the pressure head of the anti-warping module 13 contacts the wafer, the contact between the two is point contact, and the pressure head can adjust its pressing orientation with the wafer according to the flatness of the wafer surface, so as to realize flexible adjustment of wafer flattening, and avoid the occurrence of wafer breakage and other adverse conditions caused by forcibly flattening the wafer.

[0049] The utility model discloses a second aspect provides a kind of multi-station wafer dispensing equipment, including the wafer glue line detection machine of any one embodiment described above, dispensing mechanism and feeding mechanism, wherein, dispensing mechanism is suitable for dispensing wafer operation, feeding mechanism can be sent to wafer in wafer glue line detection machine after dispensing wafer, and wafer glue line detection machine is detected or additionally carried out glue height detection after dispensing wafer, by the above detection after dispensing wafer, it can ensure that the state after dispensing wafer is in standard state, guarantee the yield of final product.

[0050] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0051] The above-described ideal embodiments according to the utility model are for inspiration, and through the above description, relevant personnel can make various changes and modifications without deviating from the technical idea of the utility model. The technical scope of the utility model is not limited to the content in the specification, and the technical scope must be determined by the scope of claims.

Claims

1. A wafer adhesive line inspection machine, characterized by, The utility model relates to a kind of wafer visual inspection device, including: Frame (4); Work platform (1), the work platform (1) is installed on the frame (4), and is used to carry wafer; Three-axis motion platform (2), the three-axis motion platform (2) is arranged on the frame (4), and the three-axis motion platform (2) has the motion stroke in X, Y, Z three directions; Visual inspection mechanism (3), the visual inspection mechanism (3) is arranged on the three-axis motion platform (2), to be able to drive the visual inspection mechanism (3) to move to the above of the work platform (1) via the three-axis motion platform (2), and the visual inspection mechanism (3) is suitable for the visual inspection of the dispensing state of wafer carried on the work platform (1).

2. The wafer adhesive line inspection machine of claim 1, wherein, The three-axis motion platform (2) includes: Y-axis moving mechanism (21), the Y-axis moving mechanism (21) is respectively arranged on the both sides of the work platform (1) along Y direction; X-axis moving mechanism (22), the both ends of the X-axis moving mechanism (22) are erected on the Y-axis moving mechanism (21), to make the X-axis moving mechanism (22) along the path defined by the Y-axis moving mechanism (21) move in Y direction; Z-axis moving mechanism (23), the Z-axis moving mechanism (23) is arranged on the X-axis moving mechanism (22), and the Z-axis moving mechanism (23) can move in X direction in the path defined by the X-axis moving mechanism (22), and the Z-axis moving mechanism (23) also has the movement stroke in Z direction.

3. The wafer adhesive line inspection machine of claim 2, wherein, The visual inspection mechanism (3) is arranged on the Z-axis moving mechanism (23), to be able to drive the visual inspection mechanism (3) to move in Z direction via the Z-axis moving mechanism (23).

4. The wafer adhesive line inspection machine of claim 3, wherein, The visual inspection mechanism (3) at least includes 2D detection module, and the 2D detection module is arranged on the X-axis moving mechanism (22), to be able to detect the glue shape after dispensing of wafer.

5. The wafer adhesive line inspection machine of claim 4, wherein, The visual inspection mechanism (3) can also include 3D detection module, and the 3D detection module is suitable for integration with the 2D detection module and is arranged on the X-axis moving mechanism (22), and the 3D detection module is suitable for detecting the glue height after dispensing of wafer.

6. The wafer adhesive line inspection machine of claim 1, wherein, Wafer rotating platform (12) is provided on the work platform (1), and the wafer rotating platform (12) has the movement stroke in vertical direction and can rotate around vertical direction, so that after wafer is placed on the work platform (1), the wafer rotating platform (12) is suitable for lifting the wafer and driving the wafer to rotate a set angle, to correct the orientation of wafer.

7. The wafer adhesive line inspection machine of claim 6, wherein, Heating module (11) is also provided on the work platform (1), and the wafer rotating platform (12) is suitable for separating the heating module (11) into inner ring heating plate (111) and outer ring heating plate (112), and the inner ring heating plate (111) and the outer ring heating plate (112) are suitable for heating wafer simultaneously, to keep the glue after dispensing of wafer in flowing state in the process of detecting wafer by the visual inspection mechanism (3).

8. The wafer adhesive line inspection machine of claim 7, wherein, The heating module (11) is further provided with anti-warping modules (13) on the circumferential side, each of which is adapted to work independently or in cooperation, and the anti-warping modules (13) are adapted to press down on the side edges of the wafer carried on the working platform (1) to compress the wafer warping part into a flat state.

9. The wafer adhesive line inspection machine of claim 8, wherein, The contact between the pressure head of the anti-warping module (13) and the wafer is point contact, and the pressure head is adapted to move along the surface of the wafer to adjust the contact position thereof with the wafer according to the warping orientation of the wafer.

10. A multi-station wafer dispensing equipment, characterized in that, The application further provides a wafer glue line detection machine comprising: The wafer glue line detection machine according to any one of claims 1 to 9; A dispensing mechanism adapted to dispense glue on the wafer; A feeding and discharging mechanism adapted to transport the wafer on which the dispensing is completed to the wafer glue line detection machine for glue shape detection or glue height detection.

Images