Laser projection equipment

Abstract

The utility model relates to the field of projection, and discloses laser projection equipment, which comprises a laser light source; the laser light source comprises a light source shell, the light source shell comprises a light source bottom shell, and the light source bottom shell comprises a containing cavity; the light source cover plate covers the light source bottom shell so as to seal the accommodating cavity; the light source cover plate comprises a first surface which is positioned on one side, facing the accommodating cavity, of the light source cover plate; the second surface is opposite to the first surface; the laser is positioned at one end of the accommodating cavity; and a first fan mounted on the first surface. According to the laser projection equipment provided by the embodiment of the invention, the first fan is arranged in the accommodating cavity to promote air flow, so that the heat dissipation rate of the laser light source in the laser projection equipment can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of projection technology, in particular to a laser projection device. BACKGROUND

[0002] The laser projection device uses laser as light source, and converts input electric energy into light. The core of laser heat dissipation is to reduce the temperature of laser chip. The laser chip is inside the laser light source, and passive heat dissipation can only conduct heat out of the back of the laser, and cannot directly dissipate heat from the chip. At the same time, since the laser light source needs to be airtight, heat is difficult to be directly conducted out of the inside, and the temperature of the lens inside the laser light source is also high. Therefore, how to improve the heat dissipation efficiency of the laser light source is a technical problem to be solved by those skilled in the art. CONTENT OF THE UTILITY MODEL

[0003] The present application discloses a laser projection device for improving the heat dissipation efficiency of the laser light source.

[0004] To achieve the above purpose, the present application provides the following technical scheme:

[0005] A laser projection device comprises:

[0006] A laser light source, wherein the laser light source comprises:

[0007] A light source shell, wherein the light source shell comprises:

[0008] A light source bottom shell, wherein the light source bottom shell comprises a containing cavity; and

[0009] A light source cover plate, wherein the light source cover plate is combined with the light source bottom shell to seal the containing cavity; and the light source cover plate comprises:

[0010] A first surface, which is located on the side of the light source cover plate facing the containing cavity; and

[0011] A second surface, which is opposite to the first surface;

[0012] A laser, which is located at one end of the containing cavity; and

[0013] A first fan, which is installed on the first surface.

[0014] In the above laser projection device, the inside of the light source shell of the laser light source is a sealed containing cavity, and the laser is located at one end of the containing cavity and used for emitting light. The laser emits light and generates a large amount of heat at the same time. The first fan of the containing cavity can generate air flow, so that the heat generated by the laser flows with the air flow and is dissipated in the environment through the light source shell. The first fan is installed on the light source cover plate of the light source shell, which is convenient for installation and maintenance.

[0015] Therefore, the laser projection device provided by the embodiments of the present application can improve the heat dissipation rate of the laser light source in the laser projection device by arranging the first fan inside the accommodating cavity to promote air flow.

[0016] In some embodiments, the first fan comprises:

[0017] an air inlet side facing the bottom of the accommodating cavity; and

[0018] an air outlet side facing the light source cover plate;

[0019] In some embodiments, the laser light source further comprises:

[0020] an optical lens located on the light path of the laser;

[0021] The first fan is configured to form a circulating air flow in the accommodating cavity, and the laser and the optical lens are located on the path of the circulating air flow.

[0022] In some embodiments, the laser light source further comprises:

[0023] a first heat dissipation structure located inside the light source shell and mounted on the first surface of the light source cover plate; the first heat dissipation structure comprises:

[0024] a plurality of first heat dissipation fins; the plurality of first heat dissipation fins are arranged at intervals; and the arrangement direction of the plurality of first heat dissipation fins is not parallel to the light emission direction of the laser.

[0025] In some embodiments, along the light emission direction of the laser, the first heat dissipation structure is located between the laser and the first fan.

[0026] The arrangement direction of the plurality of first heat dissipation fins is perpendicular to the light emission direction of the laser.

[0027] In some embodiments, the laser light source further comprises:

[0028] a first heat sink located outside the light source shell; the first heat sink comprises:

[0029] a heat dissipation member mounted on the second surface of the light source cover plate and in contact with the surface of the light source cover plate.

[0030] In some embodiments, the heat dissipation member comprises:

[0031] a semiconductor refrigeration fin; the semiconductor refrigeration fin comprises:

[0032] a cold end surface in contact with the surface of the light source cover plate.

[0033] a hot end face, the hot end face being located on a side of the semiconductor cooling sheet facing away from the light source cover plate.

[0034] In some embodiments, the second face is recessed towards the first face to form a mounting slot; the semiconductor cooling sheet is mounted in the mounting slot.

[0035] In some embodiments, the first heat sink further comprises:

[0036] a second heat dissipation structure, the second heat dissipation structure being located on a side of the semiconductor cooling sheet facing away from the light source cover plate; the second heat dissipation structure comprises:

[0037] a base plate, the base plate being in contact with the hot end face; and

[0038] a plurality of second heat dissipation fins, the plurality of second heat dissipation fins being arranged in an interval manner on a side of the base plate facing away from the hot end face.

[0039] In some embodiments, the light source bottom shell comprises:

[0040] a side plate, the laser penetrating through the side plate.

[0041] The laser light source further comprises:

[0042] a second heat sink, the second heat sink being located outside the accommodating cavity; the second heat sink comprises:

[0043] a heat conduction member, the heat conduction member being in contact with the laser.

[0044] a phase change heat pipe; the phase change heat pipe comprises:

[0045] a first end, the first end being fixedly arranged on the heat conduction member; and

[0046] a second end; and

[0047] a third heat dissipation structure, the third heat dissipation structure being fixedly arranged on the second end; the third heat dissipation structure comprises:

[0048] a plurality of third heat dissipation fins, the plurality of third heat dissipation fins being arranged in an interval manner.

[0049] In some embodiments, the second heat sink further comprises:

[0050] a second fan, the second fan comprising:

[0051] an air inlet side, the air inlet side being directed towards the third heat dissipation structure; and

[0052] an air outlet side.

[0053] In some embodiments, the laser projection device further comprises:

[0054] An illumination optical path, located on the light-emitting side of the laser source, is used to modulate the beam emitted from the laser source; and

[0055] The lens, located on the light-emitting side of the illumination optical path, is used to image the modulated light beam from the illumination optical path. Attached Figure Description

[0056] Figure 1 This is a schematic diagram of the structure of a laser projection device provided in an embodiment of this application;

[0057] Figure 2 This is a schematic diagram of the structure of a laser light source in a laser projection device provided in an embodiment of this application;

[0058] Figure 3 for Figure 2 Exploded view;

[0059] Figure 4 This is a schematic diagram of the structure of the base shell of a laser light source in a laser projection device provided in an embodiment of this application;

[0060] Figure 5 A cross-sectional view of the internal structure of a laser light source in a laser projection device provided in this application embodiment;

[0061] Figure 6 This is a schematic diagram of the circulating airflow formed by the first fan inside the light source housing.

[0062] Figure 7 This application provides a schematic diagram of the structure of a light source cover plate and components mounted thereon in a laser projection device.

[0063] Figure 8 for Figure 7 Exploded view;

[0064] Figure 9 This is a schematic diagram of the structure of the first fan in the laser projection device provided in the embodiments of this application;

[0065] Figure 10 This is a schematic diagram of the first heat dissipation structure in the laser projection device provided in the embodiments of this application;

[0066] Figure 11 for Figure 10 Enlarged view of point A in the middle;

[0067] Figure 12 A schematic diagram illustrating the installation of the light source cover and semiconductor cooling component in a laser projection device provided in this application embodiment;

[0068] Figure 13 A cross-sectional view of the light source cover plate and the components mounted thereon in the laser projection device provided in the embodiments of this application;

[0069] Figure 14 For Figure 13 Enlarged view at B;

[0070] Figure 15 Structure diagram of the light source cover plate in the laser projection device provided by the embodiment of the present application;

[0071] Figure 16 Structure diagram of the second heat dissipation structure in the laser projection device provided by the embodiment of the present application;

[0072] Figure 17 Structure diagram of another laser projection device provided by the embodiment of the present application;

[0073] Figure 18 Principle diagram of the phase change heat pipe in the second heat sink;

[0074] Figure 19 Structure diagram of another laser projection device provided by the embodiment of the present application;

[0075] Icon: 100-laser light source; 200-illumination light path; 300-lens; 110-light source shell; 120-laser; 130-optical lens; 140-first fan; 150-first heat dissipation structure; 160-first heat sink; 170-second heat sink; 111-light source bottom shell; 112-light source cover plate; 1110-receiving cavity; 1115a-outlet; 112a-first surface; 112b-second surface; 112c-mounting groove; 140a-inlet side; 140b-outlet side; 141-power line; 142-mounting part; 151-first fin; 161-semiconductor refrigeration sheet; 162-second heat dissipation structure; 161a-cold end surface; 161b-hot end surface; 1621-substrate; 1622-second fin; 1111-bottom plate; 1112-first side plate; 1113-second side plate; 1114-third side plate; 1115-fourth side plate; 171-heat conduction part; 172-phase change heat pipe; 173-third heat dissipation structure; 174-second fan; 174a-inlet side; 174b-outlet side. DETAILED DESCRIPTION

[0076] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of the present application. In the description of the embodiments of the present application, unless otherwise specified, " / " represents the meaning of or, for example, A / B can represent A or B; the "and / or" in the text only describes the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B, which means that there are three cases of A alone, A and B together, and B alone. In addition, in the description of the embodiments of the present application, "multiple" means two or more than two.

[0077] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with "first" and "second" can explicitly or implicitly include one or more features. In the description of the embodiments of the present application, unless otherwise specified, the meaning of "multiple" is two or more than two.

[0078] Projection display technology is a visual presentation method that converts image or video signals into visible light and projects them onto a flat screen or other surface. This technology is widely used in education, business presentations, home entertainment, and movie theaters, providing an immersive viewing experience for the audience.

[0079] The basic principle of projection display involves the transmission or reflection of light. Simply put, the light emitted by the light source inside the device is processed through a series of processes, carrying image information through or reflected to the lens system, and then the lens focuses and enlarges the light beam, finally forming a clear image projected onto the screen.

[0080] Based on this, the embodiments of the present application provide a laser projection device, Figure 1 is a structural schematic diagram of a laser projection device.

[0081] As Figure 1 shown, the laser projection device includes a laser light source 100, an illumination light path 200, and a lens 300; the laser light source 100 is used to provide a laser beam towards the illumination light path 200; the illumination light path 200 is located on the light emitting side of the laser light source 100, and is used to modulate the light beam emitted by the laser light source 100; the lens 300 is located on the light emitting side of the illumination light path 200, and is used to image the light beam modulated by the illumination light path 200.

[0082] Figure 2 is a structural schematic diagram of a laser light source 100 in a laser projection device provided by the embodiments of the present application.Figure 3 for Figure 2 Exploded view.

[0083] like Figure 2 and Figure 3 As shown, the laser source 100 includes a source housing 110, a laser 120, and an optical lens 130. The source housing 110 includes a base housing 111 and a cover plate 112. The base housing 111 has an opening, forming an internal cavity 1110. In one embodiment, the opening is located at the top of the cavity 1110. The cover plate 112 covers the opening of the base housing 111, sealing the cavity 1110. The cover plate 112 includes opposing first surfaces 112a and second surfaces 112b. When the cover plate 112 is closed on the source housing 110, the first surface 112a faces the cavity 1110. The laser 120 and the optical lens 130 are both located inside the cavity 1110. Specifically, the laser 120 is located at one end of the cavity 1110, and the optical lens 130 is located in the light output path of the laser 120.

[0084] Figure 4 This is a schematic diagram of the structure of the base shell 111 of the laser light source 100 in a laser projection device provided in an embodiment of this application.

[0085] In some embodiments, such as Figure 4 As shown, the base shell 111 of the light source includes a base plate 1111 and a first side plate 1112, a second side plate 1113, a third side plate 1114, and a fourth side plate 1115 surrounding the edge of the base plate 1111. The first side plate 1112 and the third side plate 1114 are opposite each other, and the second side plate 1113 and the fourth side plate 1115 are opposite each other. The first side plate 1112, the second side plate 1113, the third side plate 1114, and the fourth side plate 1115 are connected end-to-end to form a ring, and cooperate with the base plate 1111 to form a receiving cavity 1110. A laser 120 is disposed in the receiving cavity 1110 near the first side plate 1112. Multiple optical lenses 130 are arranged sequentially from the first side plate 1112 to the third side plate 1114 along the light output path of the laser light source 100. The laser outlet 1115a of the laser light source 100 is located on the fourth side plate 1115.

[0086] like Figure 4 As shown, the size of the light source base shell 111 in the first direction is larger than the size in the second direction, wherein: the first direction is the arrangement direction of the first side plate 1112 and the third side plate 1114, and the second direction is the arrangement direction of the second side plate 1113 and the fourth side plate 1115.

[0087] The laser projection device uses laser as light source, input electric energy is converted into light, the conversion efficiency is between 35%-60%, the rest of the electric energy is converted into heat, and part of the light is absorbed by the light source shell 110 and the optical lens 130 in the form of stray light and is also converted into heat. Therefore, it is necessary to export the heat inside the laser light source 100 to the outside.

[0088] The core of the heat dissipation of the laser 120 is to reduce the temperature of the laser chip, and the laser chip is inside the light source shell 110. Since the laser light source 100 needs to be airtight, it is difficult to directly export the heat from the inside of the light source shell 110, and the temperature of the optical lens 130 is also high.

[0089] As shown in Figure 3 , the laser light source 100 includes a light source shell 110, a laser 120 and an optical lens 130, the inside of the light source shell 110 is hollow, and the optical lens 130 is placed inside to form an optical path, as shown in Figure 4 . The laser 120 emits laser, and generates heat at the same time. After the light passes through the optical lens 130 inside the accommodating cavity 1110, it leaves the laser light source 100 through the outlet 1115a. Among them, the laser 120 and the optical lens 130 absorb heat and the temperature rises. At the same time, stray light will be absorbed by the light source shell 110, so that the temperature of the light source shell 110 rises.

[0090] To solve the problem of heat dissipation inside the laser light source 100, in some embodiments, as shown in Figure 2 and Figure 3 , the laser light source 100 includes a first fan 140 located inside the accommodating cavity 1110 for promoting the flow of air in the accommodating cavity 1110. To avoid interference with the optical lens 130, the first fan 140 is installed on the first surface 112a of the light source cover plate 112.

[0091] In the above laser projection device, the inside of the light source shell 110 of the laser light source 100 is a sealed accommodating cavity 1110, and the laser 120 is located at one end of the accommodating cavity 1110 for emitting light. The laser 120 emits light and generates a large amount of heat at the same time. The first fan 140 of the accommodating cavity 1110 can generate air flow, so that the heat generated by the laser 120 flows with the air flow and is dissipated in the environment through the light source shell 110. The first fan 140 is installed on the light source cover plate 112 of the light source shell 110, which is convenient for installation and maintenance.

[0092] Therefore, the laser projection device provided by the embodiment of the present application can improve the heat dissipation rate of the laser light source 100 in the laser projection device by setting the first fan 140 inside the accommodating cavity 1110 to promote air flow.

[0093] Figure 5 The laser light source 100 is provided in the laser projection device provided by the embodiment of the present application.

[0094] In some embodiments, as shown in Figure 5 , the first fan 140 includes an air inlet side 140a and an air outlet side 140b, wherein: the air inlet side 140a is directed towards the bottom of the accommodating cavity 1110; and the air outlet side 140b is directed towards the light source cover plate 112.

[0095] And / or, the first fan 140 is configured to form a circulating air flow in the accommodating cavity 1110, and the laser 120 and the optical lens 130 are located in the path of the circulating air flow.

[0096] Figure 6 A schematic diagram of the circulating air flow formed by the first fan 140 inside the light source housing 110.

[0097] In some embodiments, as shown in Figure 6 , and in combination with Figure 5 , the air inlet side 140a of the first fan 140 is directed towards the bottom of the accommodating cavity 1110, and the air outlet side 140b is directed towards the light source cover plate 112, so that the first fan 140 can guide the air flow at the bottom of the accommodating cavity 1110 to the light source cover plate 112. The first fan 140 forms an air flow in the accommodating cavity 1110 from the third side plate 1114 to the first side plate 1112 at the top of the accommodating cavity 1110, and forms an air flow in the accommodating cavity 1110 from the first side plate 1112 to the third side plate 1114 at the bottom of the accommodating cavity 1110, which promotes the circulating flow of the air flow in the accommodating cavity 1110, thereby improving the heat dissipation efficiency.

[0098] Figure 7 A schematic diagram of the light source cover plate 112 in the laser projection device and the structure of the components mounted thereon according to an embodiment of the present application; Figure 8 A schematic diagram of the light source cover plate 112 in the laser projection device and the structure of the components mounted thereon according to an embodiment of the present application; Figure 7 An exploded view of the light source cover plate 112 in the laser projection device and the structure of the components mounted thereon according to an embodiment of the present application.

[0099] In some embodiments, as shown in Figure 7 and Figure 8 , the laser light source 100 further includes a first heat dissipation structure 150 located inside the light source housing 110 and mounted on the first surface 112a of the light source cover plate 112; the first heat dissipation structure 150 includes a plurality of first heat dissipation fins 151; the plurality of first heat dissipation fins 151 are arranged in an interval; and the arrangement direction of the plurality of first heat dissipation fins 151 is not parallel to the light emitting direction of the laser 120.

[0100] As shown in Figure 7 and Figure 8As shown, the first heat dissipation structure 150 includes a plurality of first heat dissipation fins 151 arranged at intervals. Since hot air has a small density and will gather at the top of the accommodating cavity 1110, fixing the plurality of first heat dissipation fins 151 to the first surface 112a of the light source cover plate 112 can slow down the flow rate of the hot air at the top of the accommodating cavity 1110, thereby increasing the residence time of the hot air, accelerating the heat exchange rate between the hot air and the first heat dissipation fins 151 and the light source cover plate 112, and thus more quickly conducting the heat inside the light source shell 110 to the outside, improving the heat dissipation capacity of the laser light source 100.

[0101] The light emitting direction of the laser 120 is along a first direction, i.e., the arrangement direction of the first side plate 1112 and the third side plate 1114. The arrangement direction of the plurality of first heat dissipation fins 151 is not parallel to the light emitting direction of the laser 120, which can be understood as that the arrangement direction of the plurality of first heat dissipation fins 151 is perpendicular to the first direction; or the arrangement direction of the plurality of first heat dissipation fins 151 has an included angle with the first direction. In combination with Figures 4-6 , the first heat dissipation structure 150 cooperates with the first fan 140 to form an air flow in the direction from the third side plate 1114 to the first side plate 1112 at the top of the accommodating cavity 1110.

[0102] In some embodiments, along the light emitting direction of the laser 120, the first heat dissipation structure 150 is located between the laser 120 and the first fan 140; and the arrangement direction of the plurality of first heat dissipation fins 151 is perpendicular to the light emitting direction of the laser 120.

[0103] As shown in Figure 7 and Figure 8 , in combination with Figures 4-6 , each of the first heat dissipation fins 151 in the first heat dissipation structure 150 extends along the first direction, and all the first heat dissipation fins 151 are arranged along a second direction. An air flow channel is formed between two adjacent first heat dissipation fins 151, which can guide the air flow to flow along the second direction; thereby cooperating with the first fan 140 to form a circulating air flow inside the accommodating cavity 1110. At the same time, the first heat dissipation fins 151 are in direct contact with the light source cover plate 112, which can quickly conduct the absorbed heat in the air to the light source cover plate 112, and then dissipate the heat outside the light source shell 110.

[0104] Figure 9 A structural schematic view of the first fan 140 in the laser projection device provided by the embodiments of the present application is shown.

[0105] In some embodiments, as shown in Figure 9As shown, the first fan 140 further comprises a mounting portion 142 and a power line 141. The mounting portion 142 is located at the air outlet side 140b of the first fan 140, and the first fan 140 is mounted to the first surface 112a of the light source cover plate 112 through the mounting portion 142. In some embodiments, the mounting portion 142 is a plurality of mounting portions 142, and the plurality of mounting portions 142 are arranged in a ring around the first fan 140 to ensure the uniformity of the stress of the first fan 140 and reduce the noise generated by the first fan 140 due to uneven stress. The power line 141 penetrates the light source shell 110 and extends outside the light source shell 110 to connect to a power source, such as Figure 1 As shown, the power line 141 is in sealed connection with the light source shell 110 to ensure the air tightness requirement of the containing cavity 1110.

[0106] As shown, Figure 7 In some embodiments, the first heat dissipation structure 150 is a fin added to the first surface 112a of the light source cover plate 112 to increase the contact area with air. The first heat dissipation fin 151 comprises a fixed end and a free end. The fixed end is connected to the light source cover plate 112, and the free end extends along the normal direction of the first surface 112a.

[0107] Figure 10 A structural schematic diagram of the first heat dissipation structure 150 in the laser projection device provided by the embodiments of the present application is shown in FIG. 6. Figure 11 A structural schematic diagram of the first heat dissipation structure 150 in the laser projection device provided by the embodiments of the present application is shown in FIG. 6. Figure 10 An enlarged view of position A in FIG. 6 is shown in FIG. 7.

[0108] As shown, Figure 10 and Figure 11 As shown, the end surface size of the fixed end of the first heat dissipation fin 151 is greater than the end surface size of the free end. It can also be understood that the thickness of the side of the first heat dissipation fin 151 close to the light source cover plate 112 is greater than the thickness of the side of the first heat dissipation fin 151 away from the light source cover plate 112. That is, the thickness cross section of the first heat dissipation fin 151 is trapezoidal. The space formed between two adjacent first heat dissipation fins 151 is also trapezoidal, and the lateral size of the trapezoidal space gradually increases along the direction from the second surface 112b to the first surface 112a, facilitating the gathering of hot air in the space and increasing the heat exchange efficiency of the hot air and the light source cover plate 112.

[0109] The laser projection device provided by the embodiments of the present application adopts the first fan 140 and the first heat dissipation structure 150 arranged inside the light source shell 110 to concentrate the heat inside the laser light source 100 through the light source cover plate 112 for active heat dissipation, thereby improving the active heat dissipation of the laser light source 100 and the heat dissipation efficiency of the laser light source 100.

[0110] On this basis, the laser projection device provided by the embodiments of the present application further increases the active heat dissipation component of the light source cover plate 112.

[0111] Figure 12The mounting schematic diagram of the light source cover plate 112 and the semiconductor refrigerating piece in the laser projection device provided by the embodiment of the present application is shown.

[0112] In some embodiments, as shown in Figure 12 , the laser light source 100 further comprises a first heat sink 160 located outside the light source shell 110; the first heat sink 160 comprises a heat dissipating piece mounted on the second surface 112b of the light source cover plate 112 and in surface contact with the light source cover plate 112.

[0113] The heat dissipating piece is in surface contact with the light source cover plate 112, so that the heat on the light source cover plate 112 can be dissipated in the environment as soon as possible.

[0114] Figure 13 The cross-sectional view of the light source cover plate 112 and the components mounted thereon in the laser projection device provided by the embodiment of the present application is shown. Figure 14 For Figure 13 , the enlarged view at B is shown.

[0115] In some embodiments, as shown in Figure 13 and Figure 14 , the heat dissipating piece comprises a semiconductor refrigerating sheet 161; the semiconductor refrigerating sheet 161 comprises a cold end surface 161a and a hot end surface 161b; wherein: the cold end surface 161a is in surface contact with the light source cover plate 112; the hot end surface 161b is located on the side of the semiconductor refrigerating sheet 161 away from the light source cover plate 112.

[0116] The semiconductor refrigerating sheet 161, also known as a thermoelectric cooler (TEC), is a solid-state cooling device based on the Peltier effect. It is widely used in situations that require precise temperature control, especially in electronic devices, lasers, optical instruments, and biomedical equipment. The Peltier effect is that when an electric current passes through a closed circuit composed of two different materials, different temperature changes will occur at the two junctions. One junction will heat up, and the other will cool down. The semiconductor refrigerating sheet 161 is composed of multiple layers of semiconductor materials (usually bismuth telluride Bi2Te3), forming a thermocouple pair. When an electric current passes through these materials, one side will cool down (cold end surface 161a, heat absorption), and the other side will heat up (hot end surface 161b, heat emission).

[0117] As shown in Figure 12 , in combination with Figure 8 , the semiconductor refrigerating sheet 161 in the embodiment of the present application is a flat module composed of multiple pairs of thermocouples in series or parallel. The module has metal electrodes at both ends for connecting the power supply. As shown in Figure 14As shown, the semiconductor cooling sheet 161 has a cold end face 161a and a hot end face 161b, the cold end face 161a is in surface contact with the light source cover plate 112 for absorbing heat transferred by the light source cover plate 112, and the hot end face 161b dissipates the heat absorbed by the cold end face 161a in the environment, in cooperation with the first fan 140 and the first heat dissipation structure 150 to achieve active heat dissipation inside the laser light source 100. The semiconductor cooling sheet 161 can achieve very precise temperature control, and the accuracy is usually ±0.1℃. The semiconductor cooling sheet 161 can also change temperature within a few seconds, suitable for fast changing temperature requirements. The semiconductor cooling sheet 161 has no mechanical moving parts, high reliability and simple maintenance. At the same time, the semiconductor cooling sheet 161 has small volume, suitable for space limited scenes. The laser light source 100 provided by the embodiment of the present application uses the semiconductor cooling sheet 161 for temperature control, to ensure the stability and reliability of the laser output.

[0118] It should be noted that, in order to improve the heat conduction efficiency, a heat-conducting silicone grease or other thermal interface material is used between the semiconductor cooling sheet 161 and the light source cover plate 112.

[0119] In one embodiment, the semiconductor cooling sheet 161 is placed horizontally with the cold end face 161a downward and the hot end face 161b upward. The cold end face 161a can increase the temperature difference between the internal air and the light source cover plate 112, and improve the heat transfer amount; while the hot end face 161b can increase the temperature difference with the external air, and improve the heat transfer amount. Thus, the heat flux inside and outside the laser light source 100 is improved, and the heat dissipation efficiency is improved.

[0120] Figure 15 The structure diagram of the light source cover plate 112 in the laser projection device provided by the embodiment of the present application is shown. Figure 16 The structure diagram of the second heat dissipation structure 162 in the laser projection device provided by the embodiment of the present application is shown.

[0121] In some embodiments, as shown in Figure 15 The second face 112b is recessed to form a mounting groove 112c towards the first face 112a; the semiconductor cooling sheet 161 is mounted in the mounting groove 112c, increasing the contact area between the semiconductor cooling sheet 161 and the light source cover plate 112, and improving the active heat dissipation efficiency of the laser light source 100.

[0122] And / or, as shown in Figure 13 And Figure 14 The first heat sink 160 further includes a second heat dissipation structure 162 located on the side of the semiconductor cooling sheet 161 away from the light source cover plate 112; as shown in Figure 16As shown, the second heat dissipation structure 162 comprises a substrate 1621 and a plurality of second heat dissipation fins 1622; the substrate 1621 is in contact with the hot end face 161b; the plurality of second heat dissipation fins 1622 are fixed on the side of the substrate 1621 away from the hot end face 161b; and the plurality of second heat dissipation fins 1622 are arranged in intervals.

[0123] In some embodiments, the arrangement direction of the second heat dissipation fins 1622 is perpendicular to the arrangement direction of the plurality of first heat dissipation fins 151, which is beneficial to improve the heat dissipation uniformity of the light source cover plate 112. For example, the second heat dissipation fins 1622 are metal sheets.

[0124] In some embodiments, as shown, Figure 14 The substrate 1621 of the second heat dissipation structure 162 is in surface contact with the hot end face 161b of the semiconductor refrigeration fin 161, and there is a gap h between the substrate 1621 and the second face 112b of the light source cover plate 112, so that the heat transfer path is always the light source cover plate 112-semiconductor refrigeration fin 161-second heat dissipation structure 162, further improving the active heat dissipation efficiency.

[0125] In the laser projection device provided by the embodiments of the present application, the first fan 140 and the first heat dissipation structure 150 are arranged inside the light source shell 110, the heat inside the laser light source 100 is concentrated and dissipated through the light source cover plate 112, and the first heat sink 160 is arranged on the light source cover plate 112, so as to increase the temperature difference between the inside and outside of the light source cover plate 112, improve the active heat dissipation inside the laser light source 100, and thus improve the heat dissipation efficiency of the laser light source 100.

[0126] As shown, Figure 14 The first heat sink 160 is located outside the light source shell 110, the cold end face 161a of the semiconductor refrigeration fin 161 is in surface contact with the light source cover plate 112 for heat absorption, and the hot end face 161b is in surface contact with the substrate 1621 of the second heat dissipation structure 162 for heat dissipation through the second heat dissipation structure 162.

[0127] In one embodiment, during the working process, the semiconductor refrigeration fin 161 is supplied with direct current, a temperature difference is generated between the cold end face 161a and the hot end face 161b, the cold end face 161a is in surface contact with the light source cover plate 112, and the hot end face 161b is in surface contact with the second heat dissipation structure 162.

[0128] Inside the laser projection device, as shown, Figures 4-6As shown, the semiconductor refrigeration sheet 161 is in surface contact with the light source cover plate 112, thereby reducing the temperature of the light source cover plate 112. The first fan 140 inside the light source housing 110 works, and the air flow direction induced thereby is from bottom to top. After the air flow impacts the light source cover plate 112, the air becomes lower-temperature air and flows in parallel to the light source cover plate 112 to the periphery, and after passing through the first heat dissipation structure 150 at the lower end of the light source cover plate 112, the air becomes even colder and flows to the laser 120, thereby cooling the front surface of the laser 120. Subsequently, the air flows through the optical lens 130 mounted on the light source bottom shell 111, absorbs the heat of the optical lens 130, and finally the air becomes hot air and is recycled by the first fan 140 to become cold air. The active heat transfer process of transferring the internal heat to the outside is completed.

[0129] The laser projection device provided by the embodiment of the present application utilizes active heat dissipation to guide the heat out of the laser light source 100, and simultaneously reduces the temperature of the laser 120 chip through internal convection heat exchange, so that the laser 120 can be densely arranged and the brightness can be improved, thereby improving the product competitiveness.

[0130] On this basis, the laser projection device provided by the embodiment of the present application further comprises a passive heat dissipation component for the laser light source 100, which cooperates with the active heat dissipation component, and is beneficial to improving the system brightness.

[0131] Figure 17 FIG. 4 is a structural schematic diagram of another laser projection device provided by the embodiment of the present application.

[0132] In some embodiments, the light source bottom shell 111 comprises a side plate, and the laser 120 penetrates through the side plate.

[0133] As shown in FIG. 4, the laser light source 100 further comprises a second heat sink 170 located outside the accommodating cavity 1110; the second heat sink 170 comprises a heat conduction member 171, a phase-change heat pipe 172 and a third heat dissipation structure 173; wherein: Figure 17 The heat conduction member 171 is in surface contact with the laser 120; the phase-change heat pipe 172 comprises a first end and a second end; the first end is fixedly arranged on the heat conduction member 171; the second end is fixedly arranged on the third heat dissipation structure 173.

[0134] The third heat dissipation structure 173 comprises a plurality of third heat dissipation fins arranged at intervals.

[0135] As shown in FIG. 4, the laser light source 100 further comprises a second heat dissipation structure 160 located outside the accommodating cavity 1110; the second heat dissipation structure 160 comprises a plurality of second heat dissipation fins 161 arranged at intervals.

[0136] Figure 17 ​As shown, the second heat sink 170 includes a heat conduction member 171, phase change heat pipes 172, and a third heat dissipation structure 173. The heat conduction member 171 is in surface contact with the laser 120. The phase change heat pipes 172 include a first linear heat pipe segment, a second linear heat pipe segment, and a transition heat pipe segment connecting the first linear heat pipe segment and the second linear heat pipe segment. The first linear heat pipe segment is fixedly arranged in the heat conduction member 171. The third heat dissipation structure 173 is fixedly arranged in the second linear heat pipe segment. Due to the limitation of internal structure, the arrangement of each phase change heat pipe 172 is difficult to achieve a parallel state all the time, and therefore, the phase change heat pipes 172 of the same heat sink are parallel to each other only at the end of the heat conduction member 171 and the end of the third heat dissipation structure 173. The bending degree and the inclination of the transition heat pipe segment of each phase change heat pipe 172 are different.

[0137] Figure 18 A schematic diagram of the principle of the phase change heat pipe 172 in the second heat sink 170 is shown.

[0138] The working principle of the phase change heat pipe 172 is shown in Figure 18 As shown, the phase change heat pipe 172 includes an evaporation segment Z and a condensation segment L. The refrigerant liquid in the phase change heat pipe 172 absorbs heat and evaporates into saturated vapor in the evaporation segment Z, Figure 18 The flow direction of the vapor is indicated by a dashed arrow. The gaseous refrigerant flows to the condensation segment L through the channel in the phase change heat pipe 172 under the action of pressure difference. The gaseous refrigerant releases heat and condenses into liquid in the condensation segment L, Figure 18 The flow direction of the liquid is indicated by a solid arrow. The liquid refrigerant returns to the evaporation segment Z through the capillary structure due to the capillary force, thereby forming a cycle. The evaporation segment is usually in contact with the heat source, and the condensation segment is usually connected with the heat dissipation fin. In this embodiment, the evaporation segment is the first linear heat pipe segment, and the condensation segment is the second linear heat pipe segment. The first linear heat pipe segment is fixedly arranged in the heat conduction member 171 in surface contact with the laser 120, and the second linear heat pipe segment is fixedly arranged in the third heat dissipation structure 173, so as to transfer the heat generated by the laser 120 to the external environment.

[0139] Figure 19 A structural schematic diagram of another laser projection device provided by the embodiment of the present application is shown.

[0140] In some embodiments, as shown in Figure 19 The second heat sink 170 further includes a second fan 174. The second fan 174 includes an air inlet side 174a and an air outlet side 174b. The air inlet side 174a is directed towards the third heat dissipation structure 173.

[0141] As shown in Figure 19As shown, the height of the third heat dissipation structure 173 is higher than the second heat dissipation structure 162, and the height of the second fan 174 is flush with the second heat dissipation structure 162. The third heat dissipation structure 173 is located between the second fan 174 and the second heat dissipation structure 162. The air inlet side 174a of the second fan 174 faces the third heat dissipation structure 173, that is, the air inlet side 174a of the second fan 174 simultaneously faces the third heat dissipation structure 173 and the second heat dissipation structure 162, and the heat dissipated by the third heat dissipation structure 173 and the second heat dissipation structure 162 can be simultaneously dissipated out of the laser projection device.

[0142] Outside the laser light source 100, the heat end temperature is higher than the ambient temperature, and the heat is dissipated out by the second fan 174. The process of passive heat dissipation outside is completed.

[0143] The laser projection device provided by the embodiment of the present application increases an active heat dissipation method for directly cooling the internal optical device, directly reduces the temperature of the internal device, and cooperates the active heat dissipation inside the laser light source with the passive heat dissipation outside the laser light source, which is beneficial to improve the brightness of the laser light source.

[0144] Obviously, those skilled in the art can make various modifications and variations to the embodiments of the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application belong to the scope of the claims of the present application and the equivalent technologies thereof, the present application also intends to include these modifications and variations.

Claims

1. A laser projection device, characterized by, The laser projector comprises: a laser light source; the laser light source comprises: a light source housing, the light source housing comprises: a light source bottom shell, the light source bottom shell comprises a receiving cavity; and a light source cover plate, the light source cover plate covers the light source bottom shell to seal the receiving cavity; the light source cover plate comprises: a first surface, located on the side of the light source cover plate facing the receiving cavity; and a second surface, opposite to the first surface; a laser, located at one end of the receiving cavity; and a first fan, installed on the first surface.

2. The laser projection device of claim 1, wherein, The first fan comprises: an air inlet side, facing the bottom of the receiving cavity; and an air outlet side, facing the light source cover plate. And / or, the laser light source further comprises: an optical lens, located on the light path of the laser; and the first fan is used to form a circulating air flow in the receiving cavity, and the laser and the optical lens are located on the path of the circulating air flow.

3. The laser projection device of claim 2, wherein, The laser light source further comprises: a first heat dissipation structure, located inside the light source housing and installed on the first surface of the light source cover plate; the first heat dissipation structure comprises: a plurality of first heat dissipation fins; the plurality of first heat dissipation fins are arranged at intervals; and the arrangement direction of the plurality of first heat dissipation fins is perpendicular to the light emitting direction of the laser.

4. The laser projection device of claim 3, wherein, Along the light emitting direction of the laser, the first heat dissipation structure is located between the laser and the first fan. The arrangement direction of the plurality of first heat dissipation fins is perpendicular to the light emitting direction of the laser.

5. The laser projection device of claim 1, wherein, The laser light source further comprises: a first heat sink, located outside the light source housing; the first heat sink comprises: a heat dissipation member, installed on the second surface of the light source cover plate and in contact with the surface of the light source cover plate.

6. The laser projection device of claim 5, wherein, The heat dissipation member comprises: a semiconductor refrigeration fin; the semiconductor refrigeration fin comprises: a cold end surface, in contact with the surface of the light source cover plate; a hot end surface, located on the side of the semiconductor refrigeration fin away from the light source cover plate.

7. The laser projection device of claim 6, wherein, The second surface is recessed to form a mounting groove towards the first surface; the semiconductor refrigeration fin is installed in the mounting groove; And / or, the first heat sink further comprises: a second heat dissipation structure, located on the side of the semiconductor refrigeration fin away from the light source cover plate; the second heat dissipation structure comprises: a substrate, in contact with the hot end surface; and a plurality of second heat dissipation fins, fixedly arranged on the side of the substrate away from the hot end surface; the plurality of second heat dissipation fins are arranged at intervals.

8. The laser projection device of any one of claims 1-7, wherein, The light source bottom shell comprises: a side plate, the laser penetrates through the side plate; The laser light source further comprises: a second heat sink, located outside the receiving cavity; the second heat sink comprises: a heat conduction member, in contact with the surface of the laser; a phase change heat pipe; the phase change heat pipe comprises: a first end, fixedly arranged on the heat conduction member; and a second end; and a third heat dissipation structure, fixedly arranged on the second end; the third heat dissipation structure comprises: a plurality of third heat dissipation fins, arranged at intervals.

9. The laser projection device of claim 8, wherein, The second heat sink further comprises: a second fan, the second fan comprises: an air inlet side, facing the third heat dissipation structure; and an air outlet side.

10. The laser projection device of any one of claims 1-7, wherein, The laser projector further comprises: an illumination light path, located on the light outlet side of the laser light source, used to modulate the light beam emitted by the laser light source; and A lens is located on the light exit side of the illumination light path for imaging the modulated light beam of the illumination light path.

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