Chip zero-ohm resistor

By attaching a solder resist insulating layer and a solder layer to the surface of a zero-ohm surface mount resistor, and combining them with conductive, thermally conductive, and corrosion-resistant layers, the problems of poor current withstand capability and low precision are solved, enabling high reliability and long-distance cross-line applications.

CN223526944UActive Publication Date: 2025-11-07张国辉
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Patent Information

Application Number
CN202422646786.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-30
Publication Date
2025-11-07
Estimated Expiration
2034-10-30

AI Technical Summary

Technical Problem

Existing surface mount zero-ohm resistors have poor current withstand capability, are prone to melting, have low precision, and are not suitable for long-distance cross-line use.

Method used

A solder resist insulating layer is applied to the surface of the resistor body, and a solder layer is set on the same layer around both ends of the resistor. Combined with a conductive layer, a thermally conductive layer and an anti-corrosion layer, a multi-layer structure is formed to improve the resistance to solder heat, electrical and thermal conductivity and insulation.

Benefits of technology

It improves the reliability and accuracy of surface mount zero-ohm resistors, reduces the risk of meltdown, and is suitable for long-distance cross-line designs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a patch zero-ohm resistor which comprises a resistor body, a functional layer attached to the outer surface of the resistor body, and at least one layer structure of a conductive layer, a heat conduction layer and an anti-corrosion layer which are clamped between the resistor body and the functional layer, the functional layer comprises a solder resist insulating layer and a welding layer; the solder resist insulating layer is attached around the middle part of the resistor body; the welding layer comprises two parts which are attached around the two ends of the resistor body respectively, the solder resist insulating layer is located between the two parts of the welding layer, and the welding layer and the solder resist insulating layer are located on the same layer structure and completely cover the resistor body together; the conductive layer covers the outer surface of the resistor body, the heat conducting layer covers the outer surface of the conductive layer, and the anti-corrosion layer covers the outer surface of the heat conducting layer. Compared with the prior art, the patch zero-ohm resistor is good in reliability, high in precision and wide in application range.
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Description

TECHNICAL FIELD

[0001] The utility model relates to electronic components field especially relates to a patch zero ohm resistance. BACKGROUND

[0002] With the development of science and technology, electronic products are more and more rich, and zero ohm resistance as a commonly used electronic component, its role is very extensive. Such as for the selection of device function or configuration, for reserving resistance position to modify or debug subsequently, as jumper to facilitate circuit board wiring.

[0003] However, the zero ohm resistance in the prior art, especially patch zero ohm resistance, also has some practical defects, such as poor current-carrying capacity, and there is a risk of easy melting during use, and the reliability is poor. For example, the internal resistance of the patch zero ohm resistance is high, which causes low precision, and the length is limited, which is not suitable for long distance cross line use.

[0004] Therefore, it is necessary to provide a new patch zero ohm resistance to solve the above technical problems. UTILITY MODEL CONTENT

[0005] The utility model aims at overcoming the above technical problems, and provides a patch zero ohm resistance with good reliability, high precision and wide application range.

[0006] In order to achieve the above purpose, the utility model provides a patch zero ohm resistance, which comprises a resistance body and a functional layer attached to the outer surface of the resistance body, the functional layer comprises a solder mask insulating layer, and the solder mask insulating layer is attached around the middle region of the resistance body.

[0007] Preferably, the functional layer further comprises a soldering layer, the soldering layer comprises two parts and is attached around the two ends of the resistance body respectively, the solder mask insulating layer is located between the two parts of the soldering layer, the soldering layer and the solder mask insulating layer are located in the same layer structure, and together cover the resistance body completely.

[0008] Preferably, the patch zero ohm resistance further comprises at least one layer structure of a conductive layer, a heat conducting layer and an anticorrosion layer clamped between the resistance body and the functional layer, the conductive layer covers the outer surface of the resistance body, the heat conducting layer covers the outer surface of the conductive layer, and the anticorrosion layer covers the outer surface of the heat conducting layer.

[0009] Preferably, the soldering layer is made of any one of tin, silver, nickel and their alloys.

[0010] Preferably, the solder mask insulating layer is made of high-temperature-resistant insulating solder mask material.

[0011] Preferably, the anticorrosion layer is made of nickel material or nickel alloy.

[0012] Preferably, the conductive layer is made of copper or copper alloy material.

[0013] Compared with the prior art, the patch zero ohm resistor provided by the utility model has good welding performance, welding heat resistance, electric conductivity and thermal conductivity by pasting the functional layer including the solder mask insulating layer on the surface of the resistor body, effectively reduces the risk of melting during current resistance, improves reliability, and the improvement of the thermal conductivity further improves the precision of the patch zero ohm resistor; moreover, the functional layer also includes the solder layer located at the same plane, the solder layer includes two parts and surrounds the two ends of the resistor body respectively, the solder layer and the solder mask insulating layer are located at the same layer structure, and the solder layer and the solder mask insulating layer completely cover the resistor body, so that the patch zero ohm resistor has high-temperature resistance and greatly improves the mechanical performance through the solder mask insulating layer, and has good insulation due to the solder mask performance of the solder mask insulating layer, and is suitable for long-distance cross-wire design. BRIEF DESCRIPTION OF DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiment description, obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained without creative labor, wherein:

[0015] Fig. 1 It is a schematic diagram of the three-dimensional structure of the patch zero ohm resistor of the utility model;

[0016] Fig. 2 It is a schematic diagram of the sectional structure of the patch zero ohm resistor of the utility model. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the utility model will be described clearly and completely in combination with the drawings in the embodiments of the utility model, obviously, the described embodiments are only some embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.

[0018] The descriptions of the following embodiments are with reference to the additional drawings to illustrate the specific embodiments that the utility model can be used to implement. The directions mentioned in the utility model, such as up, down, front, back, left, right, inside, outside, side, etc. are only the directions of the additional drawings. Therefore, the directions used are used to explain and understand the utility model, not to limit the utility model.

[0019] Referring to Figs. 1-2 As shown in the drawings, the utility model provides a patch zero ohm resistance 100, including resistance body 1 and the functional layer 2 of the outer surface of resistance body 1.

[0020] The functional layer 2 includes a solder mask insulating layer 21, which is attached around the middle region of the resistance body. Thus, the patch zero ohm resistance 100 has good soldering performance, soldering heat resistance, electrical conductivity and thermal conductivity, effectively reduces the risk of melting during current resistance, improves reliability, and the improvement of thermal conductivity further improves the accuracy of the patch zero ohm resistance.

[0021] In this embodiment, more preferably, the functional layer 2 further includes a soldering layer 22. That is, the functional layer 2 includes a solder mask insulating layer 21 and a soldering layer 22. The solder mask insulating layer 21 and the soldering layer 22 are located at the same layer structure position.

[0022] Specifically, the solder mask insulating layer 21 surrounds the middle position of the resistance body 1, the soldering layer 22 includes two parts and surrounds the two ends of the resistance body 1 respectively, and the soldering layer 22 and the solder mask insulating layer 21 together cover the resistance body 1. By the solder mask insulating layer 21, the patch zero ohm resistance 100 has high temperature resistance and greatly improves its mechanical properties. At the same time, due to the solder mask performance of the solder mask insulating layer 21, it has good insulation, which is suitable for long distance cross line design. The soldering layer 22 at the same level as the solder mask insulating layer 21 is located at both ends of the resistance body 1, so that the patch zero ohm resistance 100 has good soldering performance, soldering heat resistance, electrical conductivity and thermal conductivity, effectively reduces the risk of melting during current resistance, improves reliability, and the improvement of thermal conductivity further improves the accuracy of the patch zero ohm resistance 100.

[0023] The solder mask insulating layer 21 is made of high temperature resistant insulating solder mask material.

[0024] The soldering layer 22 is made of any one of tin, silver, nickel, tin alloy, silver alloy and nickel alloy. Or other metals with good solderability can also be selected, and in this embodiment, tin or nickel material is preferred.

[0025] In order to further improve the performance of the patch zero ohm resistance 100, in this embodiment, a conductive layer 3, a thermal conductive layer 4 and a corrosion resistant layer 5 can be respectively arranged below the functional layer 2, that is, the patch zero ohm resistance 100 further includes at least one layer structure of the conductive layer 3, the thermal conductive layer 4 and the corrosion resistant layer 5 arranged between the resistance body 1 and the functional layer 2.

[0026] That is, any one or more of the conductive layer 3, the heat-conductive layer 4 and the corrosion-resistant layer 5 can be arranged between the resistance body 1 and the functional layer 2.

[0027] In the embodiment, the conductive layer 3, the heat-conductive layer 4 and the corrosion-resistant layer 5 are arranged between the resistance body 1 and the functional layer 2, and the order of the three-layer structure is the conductive layer 3, the heat-conductive layer 4 and the corrosion-resistant layer 5 from the resistance body 1 to the functional layer 2. The conductive layer 3 covers the outer surface of the resistance body 1, the heat-conductive layer 4 covers the outer surface of the conductive layer 3, and the corrosion-resistant layer 5 covers the outer surface of the heat-conductive layer 4. In the above-mentioned order from inside to outside, any one or two of the conductive layer 3, the heat-conductive layer 4 and the corrosion-resistant layer 5 can be removed.

[0028] The corrosion-resistant layer 5 is made of nickel material. The corrosion-resistant layer 5 realizes corrosion protection for the lower layer structure, so that the patch zero ohm resistor 100 has good corrosion resistance, ensures long-term use of the patch zero ohm resistor 100, and improves product reliability. Of course, the corrosion-resistant layer 5 can also be made of nickel alloy, tin alloy, silver alloy, gold alloy or other corrosion-resistant materials.

[0029] The heat-conductive layer 4 is arranged to radiate heat to the outside, achieve cooling effect, thereby reducing the influence on the precision of the patch zero ohm resistor 100, and further improve the precision.

[0030] The conductive layer 3 is made of copper or copper alloy material. Of course, the conductive layer 3 can also be made of other metal or non-metal conductive materials. The arrangement of the conductive layer 3 can further directly transmit current from one point to another point on the circuit board, improve the current resistance of the patch zero ohm resistor 100, further reduce the risk of fusing of the patch zero ohm resistor 100, and improve the reliability.

[0031] Compared with the prior art, the patch zero ohm resistor provided by the utility model has good welding performance, welding heat resistance, electric conduction and heat conduction by pasting the functional layer including the solder mask insulating layer on the surface of the resistor body, effectively reduces the risk of melting at the time of current resistance, improves the reliability, and the improvement of the heat conduction performance further improves the precision of the patch zero ohm resistor; moreover, the functional layer also includes the solder layer located at the same level with the solder layer, the solder layer includes two parts and surrounds the two ends of the resistor body respectively, the solder layer and the solder mask insulating layer are located at the same layer structure, and the solder layer and the solder mask insulating layer completely cover the resistor body, so that the patch zero ohm resistor has high temperature resistance and greatly improves the mechanical performance through the solder mask insulating layer, and the solder mask insulating layer has good insulation due to the solder mask performance, and is suitable for long distance cross line design.

[0032] The above is only the embodiment of the utility model, and does not limit the patent range of the utility model, and any equivalent structure or equivalent flow conversion using the content of the utility model specification and drawings, or direct or indirect application in other related technical fields, are also included in the patent protection range of the utility model.

Claims

1. A patch zero ohm resistor characterized in that, The resistance body, a functional layer attached to the outer surface of the resistance body, and at least one layer structure of a conductive layer, a heat conductive layer and an anti-corrosion layer interposed between the resistance body and the functional layer are included; The functional layer includes a solder mask insulating layer attached around the middle region of the resistance body and a soldering layer including two parts and attached around the two ends of the resistance body, the solder mask insulating layer is located between the two parts of the soldering layer, the soldering layer and the solder mask insulating layer are located in the same layer structure and together completely cover the resistance body; The conductive layer covers the outer surface of the resistance body, the heat conductive layer covers the outer surface of the conductive layer, and the anti-corrosion layer covers the outer surface of the heat conductive layer.

2. The zero ohm patch of claim 1, wherein, The soldering layer is made of any one of tin, silver, nickel and alloys thereof.

3. The zero ohm patch of claim 1, wherein, The solder mask insulating layer is made of a high-temperature-resistant insulating solder mask material.

4. The zero ohm patch of claim 1, wherein, The anti-corrosion layer is made of nickel or nickel alloy.

5. The zero ohm patch of claim 1, wherein, The conductive layer is made of copper or copper alloy material.