Integrated matcher system and semiconductor processing device

Abstract

The utility model discloses an integrated matcher system and a semiconductor processing device, and the integrated matcher system comprises a box body which is internally provided with at least two layers of installation plates; wherein a radio frequency assembly capable of generating radio frequency in the matcher system is arranged on a mounting plate; a control assembly for controlling a radio frequency assembly in the matcher system is arranged on the other mounting plate; and the isolation plate covers the mounting plate where the control assembly is located so as to perform electromagnetic isolation on the radio frequency assembly and the control assembly. According to the utility model, the radio frequency loss and the time delay can be reduced, and the control and the etching effect of the etching process can be optimized.

Description

TECHNICAL FIELD

[0001] The utility model relates to semiconductor processing equipment technical field especially relates to an integrated matching system and semiconductor processing device. BACKGROUND

[0002] Semiconductor processing equipment such as plasma etching equipment for processing substrate by reaction gas, in plasma etching, radio frequency system is indispensable system, the radio frequency system of prior art contains radio frequency power supply, matching device and controller that are separately arranged, the input of radio frequency power supply is controlled through controller, after matching device frequency modulation, together access the vacuum chamber of plasma etching equipment, reaction gas is dissociated into plasma in vacuum chamber and carries out process treatment to substrate to carry out etching.

[0003] However, due to the volume of the existing controller (for example, its high-voltage switch assembly) and the need for electromagnetic isolation with the matching device, placing the controller (for example, its high-voltage switch assembly) directly with the existing matching device together results in a complex overall structure that is not easy to maintain. If the two are not placed together, it will increase the radio frequency loss and cause time delay in radio frequency adjustment, which is not conducive to the control of the etching process and the optimization of the etching effect. SUMMARY

[0004] The utility model discloses an integrated matching system and semiconductor processing device, realize reducing radio frequency loss and time delay, be favorable to the control of etching process and the optimization of etching effect.

[0005] In order to realize above purpose, the utility model discloses the following technical scheme:

[0006] An integrated matching system comprises: a box body, at least two layers of mounting plates are arranged in the box body; wherein, the radio frequency components capable of generating radio frequency in the matching system are arranged on one mounting plate; the control components for controlling the radio frequency components in the matching system are arranged on another mounting plate; and an isolation plate is arranged on the mounting plate where the control components are arranged to electromagnetically isolate the radio frequency components and the control components.

[0007] Optionally, the utility model also comprises: a box cover, which is arranged on the box body.

[0008] Optionally, the materials of the box body, the mounting plates, the isolation plate and the box cover are metal materials.

[0009] Optionally, the two layers of mounting plates are a bottom mounting plate located at the bottom of the box body and a top mounting plate located above the bottom mounting plate; the radio frequency components are arranged on the bottom mounting plate; and the control components are arranged on the top mounting plate.

[0010] Optionally, the top mounting plate comprises a plurality of separate sub-mounting plates; the control assembly comprises a control circuit of a controller, a switch assembly body and a liquid cooling device, which are arranged on the corresponding sub-mounting plates respectively.

[0011] Optionally, a plurality of support columns are further included, each of the support columns is arranged on the bottom of the box body and used for supporting the corresponding sub-mounting plate.

[0012] Optionally, the material of the support column is plastic.

[0013] Optionally, a plurality of shielding springs are further included; each of the sub-mounting plates is provided with a continuous annular groove, and each of the annular grooves is provided with a shielding spring correspondingly, and the isolation plate covers the shielding spring.

[0014] Optionally, a plurality of adapters are further included, the adapters are arranged on the mounting plate where the control assembly is arranged; and the control assembly is electrically connected with the radio frequency assembly through the adapters.

[0015] Optionally, the radio frequency assembly comprises a motor capacitor and a matching inductor of a matcher and an energy storage capacitor and an isolation inductor in a high-voltage switch assembly of the controller.

[0016] In another aspect, the utility model also provides a semiconductor processing device, including vacuum cavity, be located in the vacuum cavity's upper electrode and / or lower electrode, the integrated formula matcher system as described above, the control assembly controls radio frequency that the radio frequency assembly generates, the radio frequency assembly is connected with the upper electrode and / or lower electrode.

[0017] The utility model has the following technical effects:

[0018] The utility model combines the control assembly and the radio frequency assembly in the matcher system and arranges them in the same box, so that the distance between the two is relatively short, which can significantly reduce the response time, greatly save the occupied space, reduce the radio frequency loss and time delay, facilitate the control of the etching process and improve the etching effect. In addition, the utility model adopts the adapter to electrically connect the devices on the top and bottom mounting plates, which is convenient for maintenance. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a cross-sectional structure schematic view of an integrated matcher system provided by an embodiment of the utility model;

[0020] Figure 2 It is a top view structure schematic view of an integrated matcher system provided by an embodiment of the utility model;

[0021] Figure 3 It is a three-dimensional structure schematic view of an integrated matcher system provided by an embodiment of the utility model. Detailed Implementation

[0022] The integrated matching system and semiconductor processing device proposed in this utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of this utility model will become clearer from the following description. It should be noted that the drawings are in a very simplified form and use non-precise proportions, only for the purpose of conveniently and clearly illustrating the embodiments of this utility model. Please refer to the drawings to make the objectives, features, and advantages of this utility model more apparent and understandable. It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportional relationships, or adjustments to the size, without affecting the effects and objectives achieved by this utility model, should still fall within the scope of the technical content disclosed in this utility model.

[0023] Combination Figure 1 and Figure 3 As shown, this embodiment provides an integrated matcher system, including: a housing 10, wherein the housing 10 is provided with at least two mounting plates (see reference). Figure 1 (As shown in reference numerals 101 and 103); wherein, the radio frequency components in the matching system capable of generating radio frequency ( Figure 1 A component (not shown) is mounted on one of the mounting plates; a control component 40 for controlling the RF component in the matching system is mounted on another mounting plate; an isolation plate 201 covers the mounting plate where the control component 40 is located to electromagnetically isolate the RF component and the control component 40. This embodiment integrates the RF component and the control component in the matching system while maintaining electromagnetic isolation, achieving space saving and ease of maintenance. Furthermore, this integration helps reduce the distance between components in both the RF and control systems, reducing RF loss and time delay, and positively impacting the control and etching effect of the etching process.

[0024] Please continue to refer to this. Figure 1 and Figure 3 As shown, in this embodiment, the bottom mounting plate 103 is located at the bottom of the housing 10, and the top mounting plate 101 is located above the bottom mounting plate 103; the radio frequency component is disposed on the bottom mounting plate 103; and the control component 40 is disposed on the top mounting plate 101. However, this utility model is not limited thereto.

[0025] Please continue to refer to this. Figure 1As shown, in this embodiment, it further includes a cover 20, which covers the housing 10. This cover provides electromagnetic isolation for the matching system within the housing 10, preventing crosstalk to external devices and also preventing external devices from generating electromagnetic interference with the matching system within the housing 10.

[0026] In some other embodiments, the lid 20 and the partition plate 201 can be integrated. However, this invention is not limited thereto.

[0027] Please continue to refer to this. Figure 1 As shown, in this embodiment, the entire housing 10, the top mounting plate 101, the isolation plate 201, and the housing cover 20 are all made of metal materials, thereby achieving electromagnetic isolation of the matching system inside the housing 10, and separating and achieving electromagnetic isolation between the radio frequency components and the control components 40 to prevent electromagnetic crosstalk.

[0028] Combination Figures 1 to 3 As shown, the top mounting plate 101 includes multiple separate sub-mounting plates 1011; the control component 40 includes the control circuit of the controller ( Figure 2 (not shown in the image), switch assembly body ( Figure 2 (not shown in the image) and liquid cooling device ( Figure 2 (Not shown in the image), and they are respectively mounted on the corresponding sub-mounting plates 1011. Therefore, in this embodiment, the control component 40 is divided into three modules: a control circuit, a switch component body (e.g., a high-voltage switch component for regulating the waveform of the current or the input of the power supply), and a liquid cooling device. Each module is mounted on a separate sub-mounting plate 1011 for easy maintenance, installation, and debugging.

[0029] In this embodiment, preferably, the sub-mounting plate 1011 is a horizontal plate, and the box body 10 has an overall cubic structure, which facilitates processing and maintenance.

[0030] Please continue to refer to this. Figure 1 As shown, in this embodiment, it further includes: a plurality of adapters 30, the adapters 30 being disposed on the mounting plate (top mounting plate 101) where the control component 40 is located; the control component 40 is electrically connected to the radio frequency component through the adapters 30, for transmitting signals between the control component and the radio frequency component located on the two mounting plates respectively. When maintaining parts (each module), the control component or radio frequency component can be removed simply by plugging and unplugging the adapters; more specifically, each module can be removed for individual maintenance.

[0031] Please continue to refer to this. Figure 1 and Figure 3As shown, in this embodiment, a plurality of support columns 102 are also included. Each support column 102 is disposed on the bottom of the housing 10 and is used to support the corresponding sub-mounting plate 1011. In this embodiment, the support column 102 is made of plastic. It is understood that the sub-mounting plate 1011 can also be directly or indirectly connected to the side wall of the housing 10, but this utility model is not limited thereto.

[0032] Please continue to refer to this. Figure 2 and Figure 3 As shown, each of the sub-mounting plates 1011 is provided with a continuous annular groove 104, and a corresponding shielding spring (gasket) is provided in each annular groove 104. Figure 2 and Figure 3 (Not shown in the image), the isolation plate 201 covers the shielding spring. This enhances the contact isolation between the sub-mounting plate 1011 and the isolation plate 201, preventing electromagnetic crosstalk from the gap between the sub-mounting plate 1011 and the isolation plate 201 to the control components on the top mounting plate 101.

[0033] It is understandable that a shielding spring can also be provided at the contact point between the cover 20 and the body 10 to prevent electromagnetic interference to external devices from the contact point between the cover 20 and the body 10.

[0034] In this embodiment, the radio frequency components include the motor capacitor and matching inductor of the matching unit, and the energy storage capacitor and isolation inductor in the high-voltage switching assembly of the controller.

[0035] The matching circuit uses a motor capacitor to adjust its size. The capacitor in the high-voltage switching assembly is used for energy storage, and its inductor is used for radio frequency isolation. The control circuit controls the matching circuit and the switching assembly itself.

[0036] It is understood that the matching system involved in this embodiment is the matching system and controller used in existing semiconductor processing devices (such as semiconductor etching equipment), and therefore its specific composition, circuit structure and working principle will not be described in detail here.

[0037] On the other hand, the present invention also provides a semiconductor processing apparatus, including a vacuum chamber, an upper electrode and / or a lower electrode located within the vacuum chamber; an integrated matching system as described above; the control component controls the radio frequency component to generate radio frequency; the radio frequency component is connected to the upper electrode and / or the lower electrode.

[0038] It can be understood that the semiconductor processing device in the embodiment is an existing semiconductor device which needs to use a matching device and a radio frequency system, and thus the specific structure and working principle thereof will not be described herein again. The difference between the embodiment and the existing semiconductor processing device is that the integrated matching device system mentioned in the above embodiment is used, and thus when the semiconductor processing device in the embodiment is a plasma etching device, the integrated matching device system in the embodiment is used to control the etching process when the semiconductor processing device in the embodiment performs etching treatment on a substrate, and the etching effect of the substrate is optimized.

[0039] In summary, the control component and the radio frequency component in the matching device system are combined and arranged in the same box in the embodiment, so that the two components share a cooling system, a shielding structure (the box) and the like, and thus the two components are relatively close to each other while realizing electromagnetic isolation, the response time can be significantly reduced, the occupied space can be greatly saved, the radio frequency loss and the time delay can be reduced, the etching process can be controlled, and the etching effect can be improved. In addition, the adapter is used to electrically connect the devices on the top mounting plate and the bottom mounting plate, and maintenance is facilitated.

[0040] It should be noted that in this document, the terms "comprise", "comprise", or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or other elements inherent to such a process, method, article or device. Without more limitations, the element defined by the statement "comprises a" does not exclude the presence of another identical element in the process, method, article or device comprising the element.

[0041] In the description of the utility model, it should be understood that the orientation or positional relationship indicated by the terms "center", "height", "thickness", "upper", "lower", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation on the utility model. In the description of the utility model, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0042] In the description of the utility model, unless another definite provision and limitation, the term "installation", "link", "connection", "fix" should do broad sense understanding, for example, can be fixed connection, also can be detachable connection, or be integrated;Can be mechanical connection, also can be electrical connection;Can be direct connection, also can pass through intermediate medium indirectly connect, can be two element internal communication or two element's mutual action relationship.For ordinary skilled person in the art, can understand the concrete meaning of above-mentioned term in the utility model according to specific circumstances.

[0043] In the utility model, unless another definite provision and limitation, first feature is "on" or "under" second feature can include that first and second features directly contact, also can include that first and second features are not directly contact but contact through additional feature between them.Moreover, first feature is "on", "above" and "upper surface" of second feature includes that first feature is directly above and obliquely above second feature, or just indicates that the horizontal height of first feature is higher than second feature.First feature is "under", "below" and "lower surface" of second feature includes that first feature is directly below and obliquely below second feature, or just indicates that the horizontal height of first feature is less than second feature.

[0044] Although the content of the utility model has been introduced in detail by the above preferred embodiment, it should be recognized that the above description should not be considered as the limitation of the utility model.After the above content is read by the person skilled in the art, the various modifications and substitutions of the utility model will be obvious.It is therefore that the protection scope of the utility model should be limited by the attached claims.

Claims

1. An integrated matching system, characterized by, The integrated matching system comprises: a box body, at least two installation plates being arranged in the box body; a radio frequency component capable of generating radio frequency in the matching system is arranged on one of the installation plates; a control component for controlling the radio frequency component is arranged on another installation plate; an isolation plate is arranged on the installation plate where the control component is arranged to electromagnetically isolate the radio frequency component and the control component.

2. The integrated matching system of claim 1, wherein, Further comprising: a box cover covering the box body.

3. The integrated matching system of claim 2, wherein, The materials of the box body, the installation plates, the isolation plate and the box cover are metal materials.

4. The integrated matching system of claim 1, wherein, The bottom installation plate is arranged at the bottom of the box body, and the top installation plate is arranged above the bottom installation plate. The radio frequency component is arranged on the bottom installation plate, and the control component is arranged on the top installation plate.

5. The integrated matching system of claim 4, wherein, The top installation plate comprises a plurality of separated sub-installation plates. The control component comprises a control circuit of a controller, a switch component body and a liquid cooling device, which are arranged on the corresponding sub-installation plates.

6. The integrated matching system of claim 5, wherein, Further comprising a plurality of support columns, each of which is arranged on the bottom of the box body to support the corresponding sub-installation plate.

7. The integrated matching system of claim 6, wherein, The material of the support column is plastic.

8. The integrated matching system of claim 5, wherein, Further comprising: a plurality of shielding springs; each of the sub-installation plates is provided with a continuous annular groove, and each of the annular grooves is provided with a corresponding shielding spring, and the isolation plate covers the shielding spring.

9. The integrated matching system of claim 1, wherein, Further comprising: a plurality of adapters, which are arranged on the installation plate where the control component is arranged; the control component is electrically connected to the radio frequency component through the adapter.

10. The integrated matching system of claim 1, wherein, The radio frequency component comprises a motor capacitor and a matching inductor of the matching device, and an energy storage capacitor and an isolation inductor in the high-voltage switch component of the controller.

11. A semiconductor processing apparatus, characterized by comprising: comprising a vacuum cavity, an upper electrode and / or a lower electrode arranged in the vacuum cavity; The integrated matching system according to any one of claims 1-10; The control component controls the radio frequency component to generate radio frequency; The radio frequency component is connected to the upper electrode and / or the lower electrode.

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