Rectangular silicon wafer flower basket

Abstract

The utility model relates to the technical field of silicon wafer flower baskets, and discloses a rectangular silicon wafer flower basket which comprises a fixed bearing plate, a sliding bearing plate, a guide rod and an adjusting part, a first bearing part is arranged on one side, close to the sliding bearing plate, of the fixed bearing plate, and a second bearing part is arranged on one side, close to the fixed bearing plate, of the sliding bearing plate. One end of the guide rod is connected to the fixed bearing plate, the sliding bearing plate is slidably connected with the guide rod, and the adjusting part is used for adjusting the distance between the fixed bearing plate and the sliding bearing plate. According to the rectangular silicon wafer basket, the adjusting part is adjusted to enable the sliding bearing plate to move along the length direction of the guide rod, so that the distance between the fixed bearing plate and the sliding bearing plate is adjusted to adapt to rectangular silicon wafers with different sizes, and then the adjusting part is adjusted to enable the first bearing part and the second bearing part to clamp the rectangular silicon wafers. The first roller and the second roller are attached to the rectangular silicon wafer, and it is guaranteed that the rectangular silicon wafer cannot fall off.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of silicon wafer flower basket more specifically, it relates to rectangle silicon wafer flower basket. BACKGROUND

[0002] The silicon wafer flower basket is a kind of tool widely used in semiconductor manufacturing and photovoltaic industry, mainly for carrying and transporting silicon wafer, and the silicon wafer flower basket can be used in silicon wafer cleaning equipment, carries silicon wafer to carry out cleaning and drying operation, to ensure the cleanliness of silicon wafer surface.

[0003] The existing silicon wafer flower basket can usually only be used to carry single size silicon wafer, and other sizes of rectangular silicon wafer need other suitable silicon wafer flower baskets to carry, and the applicability of the silicon wafer flower basket is poor. UTILITY MODEL CONTENT

[0004] The utility model aims at overcoming the defects in prior art, and provides a rectangle silicon wafer flower basket that can be adjusted to adapt to different size silicon wafer.

[0005] To achieve the above object, the utility model provides rectangle silicon wafer flower basket, including: fixed bearing plate, sliding bearing plate, guide rod and adjusting part, the fixed bearing plate and the sliding bearing plate are oppositely arranged, the fixed bearing plate is close to the first bearing part of the sliding bearing plate side, the sliding bearing plate is close to the fixed bearing plate side and is provided with the second bearing part corresponding with the first bearing part, the first bearing part and the second bearing part are matched for carrying rectangle silicon wafer;

[0006] The guide rod is provided with multiple, one end of the guide rod is connected to the fixed bearing plate, the sliding bearing plate is slidably connected with the guide rod, the adjusting part is connected to the sliding bearing plate and one of the guide rod, and the adjusting part is used to adjust the distance between the fixed bearing plate and the sliding bearing plate.

[0007] By using the rectangle silicon wafer flower basket, the adjusting part is adjusted to make the sliding bearing plate move along the length direction of the guide rod, so that the distance between the fixed bearing plate and the sliding bearing plate is adjusted, to adapt to different size rectangle silicon wafer, so that rectangle silicon wafer can be placed between the first bearing part and the second bearing part, then the adjusting part is adjusted to make the first bearing part and the second bearing part clamp rectangle silicon wafer, to ensure that rectangle silicon wafer does not fall off.

[0008] As preferred, the first bearing part is provided with multiple groups, and multiple groups of the first bearing part are spaced apart in the vertical direction, the second bearing part is provided with multiple groups, and multiple groups of the second bearing part are spaced apart in the vertical direction, and multiple first bearing parts correspond to multiple second bearing parts one by one. Such a design is conducive to improving the cleaning efficiency of the silicon wafer.

[0009] As preferred, the first bearing part includes a first fixed plate, a first backing plate and a first support column, the first fixed plate is fixedly connected to the fixed bearing plate close to the sliding bearing plate, the first backing plate and the first support column are both fixedly connected to the first fixed plate close to the sliding bearing plate, the first support column is located below the first backing plate, and the lower surface of the first backing plate is in close contact with the first support column, and the first support column is spaced apart in the length direction of the first fixed plate.

[0010] The second bearing part includes a second fixed plate, a second backing plate and a second support column, the second fixed plate is fixedly connected to the sliding bearing plate close to the fixed bearing plate, the second backing plate and the second support column are both fixedly connected to the second fixed plate close to the fixed bearing plate, the second support column is located below the second backing plate, and the lower surface of the second backing plate is in close contact with the second support column, and the second support column is spaced apart in the length direction of the second fixed plate.

[0011] Such a design, the first support column and the second support column can bear the rectangular silicon wafer, avoiding the rectangular silicon wafer from falling off.

[0012] As preferred, the height of the first backing plate and the second backing plate is greater than the thickness of the rectangular silicon wafer, and the first backing plate and the second backing plate are flexible backing plates. Such a design, the first backing plate and the second backing plate can limit the rectangular silicon wafer in the first direction and the second direction, preventing the rectangular silicon wafer from falling off.

[0013] As preferred, the cross section of the first support column and the second support column is circular. Such a design, the rectangular silicon wafer and the first support column and the second support column are in line contact, the contact area is small, and it is conducive to cleaning the rectangular silicon wafer when cleaning.

[0014] As preferred, the adjusting part includes a screw rod, an adjusting handle and a fixed seat, the screw rod is fixedly connected to the sliding bearing plate away from the fixed bearing plate, the adjusting handle is threadedly connected with the screw rod, and the fixed seat is fixedly connected with one end of the guide rod protruding from the sliding bearing plate, and the fixed seat is rotationally connected with the adjusting handle through a connecting hole. Such a design, by rotating the adjusting handle, the distance between the fixed bearing plate and the sliding bearing plate can be adjusted.

[0015] As preferred, further comprising a positioning part and a limiting part, the positioning part comprises a positioning plate, a first fixed shaft and a first roller, the positioning plate is connected to the guide rod, one side of the positioning plate is provided with a first mounting groove, the first fixed shaft is fixedly installed in the first mounting groove, and the first roller is rotationally connected with the first fixed shaft;

[0016] The limiting part comprises a second fixed shaft, a rotating rod, a third fixed shaft, a second roller and a locking handle, the fixed bearing plate is provided with two second mounting grooves, the second fixed shaft, the rotating rod and the locking handle are all provided with two groups, the two second fixed shafts are fixedly installed in the second mounting grooves respectively, and the two second fixed shafts are both vertically arranged, the two rotating rods are rotationally connected with the two second fixed shafts respectively, the two rotating rods are both fixedly connected with the third fixed shaft, the second roller is rotationally connected with the third fixed shaft, and the two locking handles are both threadedly connected with the fixed bearing plate and abut against the two rotating rods respectively.

[0017] Such design, the first roller and the second roller can limit the long direction silicon wafer in the third direction, prevent the silicon wafer from falling off in the process of cleaning.

[0018] The beneficial effects of the utility model lie in:

[0019] By using the rectangular silicon wafer basket, the adjusting part is adjusted to move the sliding bearing plate along the length direction of the guide rod, so that the spacing between the fixed bearing plate and the sliding bearing plate is adjusted, different sizes of rectangular silicon wafers are adapted, the rectangular silicon wafer can be placed between the first bearing part and the second bearing part, then the adjusting part is adjusted to clamp the rectangular silicon wafer, the first roller and the second roller are attached to the rectangular silicon wafer, and it is guaranteed that the rectangular silicon wafer will not fall off. ACCURATE DRAWINGS

[0020] Figure 1 It is the overall structure schematic view of the rectangular silicon wafer basket;

[0021] Figure 2 It is the three-dimensional structure schematic view of the rectangular silicon wafer basket;

[0022] Figure 3 It is the front view schematic view of the rectangular silicon wafer basket;

[0023] Figure 4 It is the three-dimensional structure schematic view of the first bearing part after the rectangular silicon wafer is completely fixed;

[0024] Figure 5 It is Figure 3 It is the enlarged view of structure in A of the rectangular silicon wafer basket;

[0025] Figure 6 is a schematic view of the three-dimensional structure of the second bearing part after the rectangular silicon wafer is completely fixed;

[0026] Figure 7 is an enlarged view of the structure at B in Figure 3

[0027] Figure 8 is a schematic view of the three-dimensional structure of the adjusting part;

[0028] Figure 9 is a schematic view of the side view of the positioning part;

[0029] Figure 10 is a schematic view of the three-dimensional structure of the fixed bearing plate.

[0030] In the figure: 100, fixed bearing plate; 110, second mounting groove;

[0031] 200, sliding bearing plate;

[0032] 300, guide rod;

[0033] 400, adjusting part; 410, screw rod; 420, adjusting handle; 430, fixed seat;

[0034] 500, first bearing part; 510, first fixed plate; 520, first pad plate; 521, first side pressing surface; 522, first arc-shaped downward pressing surface; 530, first supporting column;

[0035] 600, second bearing part; 610, second fixed plate; 620, second pad plate; 621, second side pressing surface; 622, second arc-shaped downward pressing surface; 630, second supporting column;

[0036] 700, positioning part; 710, positioning plate; 711, first mounting groove; 720, first fixed shaft; 730, first roller; 740, connecting plate;

[0037] 800, limiting part; 810, second fixed shaft; 820, rotating rod; 830, third fixed shaft; 840, second roller; 850, locking handle;

[0038] 900, rectangular silicon wafer. DETAILED DESCRIPTION

[0039] ​The subject matter described herein will now be discussed with reference to example implementations. It should be understood that discussions of these implementations are intended to enable those with ordinary skill in the art to better understand and thus devise their own implementation of the subject matter described herein. Alterations and modifications to the function and arrangements of elements discussed can be made without departing from the scope of the content of this document. Various examples can omit, substitute, or add various procedures or components as appropriate. Also, features described with respect to some examples can be combined in other examples.

[0040] For better understanding of the present application, the following will be described in detail Figures 1-10 The rectangular silicon wafer basket of the present application will be described in detail.

[0041] Example 1:

[0042] As shown in Figure 1 and Figure 2 , the rectangular silicon wafer basket comprises: a fixed bearing plate 100, a sliding bearing plate 200, a guide rod 300 and an adjusting part 400, the fixed bearing plate 100 and the sliding bearing plate 200 are oppositely arranged, the fixed bearing plate 100 is provided with a first bearing part 500 on the side close to the sliding bearing plate 200, the sliding bearing plate 200 is provided with a second bearing part 600 corresponding to the first bearing part 500 on the side close to the fixed bearing plate 100, the first bearing part 500 and the second bearing part 600 cooperate to bear the rectangular silicon wafer 900;

[0043] The guide rod 300 is provided with a plurality of guide rods 300, one end of the guide rod 300 is connected to the fixed bearing plate 100, the sliding bearing plate 200 is slidingly connected with the guide rod 300, the adjusting part 400 is connected to the sliding bearing plate 200 and one of the guide rods 300, and the adjusting part 400 is used to adjust the distance between the fixed bearing plate 100 and the sliding bearing plate 200.

[0044] It should be noted that the first bearing part 500 and the second bearing part 600 are the same structure, by adjusting the adjusting part 400, the sliding bearing plate 200 moves along the length direction of the guide rod 300, driving the second bearing part 600 to move synchronously, until the first bearing part 500 and the second bearing part 600 abut against the two side edges of the rectangular silicon wafer 900 perpendicular to the first direction, clamping the rectangular silicon wafer 900, so as to limit the rectangular silicon wafer 900 in the first direction, the first direction refers to the length direction of the rectangular silicon wafer 900;

[0045] In the present embodiment, the guide rod 300 is provided with five guide rods 300, the five guide rods 300 are arranged equidistantly along the vertical direction, the guide rod 300 is fixedly connected with the fixed bearing plate 100, the guide rod 300 is slidingly sleeved with the sliding bearing plate 200, and the adjusting part 400 is connected to the guide rod 300 located in the middle of the five guide rods 300.

[0046] By using the rectangular silicon wafer basket of this utility model, the adjusting part 400 can be adjusted to move the sliding support plate 200 along the length direction of the guide rod 300, thereby adjusting the distance between the fixed support plate 100 and the sliding support plate 200 to accommodate rectangular silicon wafers 900 of different sizes, so that the rectangular silicon wafer 900 can be placed between the first support part 500 and the second support part 600. Then, the adjusting part 400 is adjusted to clamp the rectangular silicon wafer 900 between the first support part 500 and the second support part 600, ensuring that the rectangular silicon wafer 900 will not fall off.

[0047] Example 2:

[0048] As an optimization of Example 1, such as Figures 1-3 As shown, a first support portion 500 is provided in multiple sets, and the multiple sets of first support portions 500 are distributed at intervals along the vertical direction. A second support portion 600 is provided in multiple sets, and the multiple sets of second support portions 600 are distributed at intervals along the vertical direction. The multiple first support portions 500 and the multiple second support portions 600 correspond one-to-one.

[0049] It should be noted that by setting multiple sets of first support parts 500 and multiple sets of second support parts 600, the rectangular silicon wafer basket can simultaneously support multiple rectangular silicon wafers 900, so as to clean multiple rectangular silicon wafers 900 at the same time.

[0050] After the rectangular silicon wafer 900 is fixed, it is placed horizontally between the first support portion 500 and the second support portion 600. When the number of rectangular silicon wafers 900 to be cleaned is less than the number of the first support portion 500 (or the second support portion 600), the rectangular silicon wafers 900 are placed from bottom to top between multiple sets of the first support portion 500 and multiple sets of the second support portion 600. The amount of cleaning fluid used is adjusted according to the height of the top rectangular silicon wafer 900 to ensure that all rectangular silicon wafers 900 are immersed in the cleaning fluid, without having to immerse the entire rectangular silicon wafer basket in the cleaning fluid, which helps to save cleaning fluid and avoid waste.

[0051] Example 3:

[0052] As an optimization of Example 2, such as Figures 3-7As shown, the first bearing part 500 comprises a first fixed plate 510, a first backing plate 520 and a first supporting column 530, the first fixed plate 510 is fixedly connected to the fixed bearing plate 100 near the side close to the sliding bearing plate 200, the first backing plate 520 and the first supporting column 530 are both fixedly connected to the first fixed plate 510 near the side close to the sliding bearing plate 200, the first supporting column 530 is located below the first backing plate 520, and the lower surface of the first backing plate 520 is attached to the first supporting column 530, and the first supporting column 530 is spaced apart along the length direction of the first fixed plate 510.

[0053] The second bearing part 600 comprises a second fixed plate 610, a second backing plate 620 and a second supporting column 630, the second fixed plate 610 is fixedly connected to the sliding bearing plate 200 near the side close to the fixed bearing plate 100, the second backing plate 620 and the second supporting column 630 are both fixedly connected to the second fixed plate 610 near the side close to the fixed bearing plate 100, the second supporting column 630 is located below the second backing plate 620, and the lower surface of the second backing plate 620 is attached to the second supporting column 630, and the second supporting column 630 is spaced apart along the length direction of the second fixed plate 610.

[0054] The height of the first backing plate 520 and the second backing plate 620 is greater than the thickness of the rectangular silicon wafer 900, and the first backing plate 520 and the second backing plate 620 are both flexible backing plates.

[0055] The cross section of the first supporting column 530 and the second supporting column 630 is circular.

[0056] It should be noted that the axis direction of the first supporting column 530 and the second supporting column 630 is along the horizontal direction, when placing the rectangular silicon wafer 900, the adjusting part 400 is adjusted so that the distance between the first backing plate 520 and the second backing plate 620 is slightly greater than the length of the rectangular silicon wafer 900, so that the rectangular silicon wafer can be placed on the plurality of first supporting columns 530 and the plurality of second supporting columns 630;

[0057] When the rectangular silicon wafer 900 is placed, the adjusting part 400 is adjusted so that the first pad plate 520 and the second pad plate 620 clamp the rectangular silicon wafer 900, the area of the first pad plate 520 and the second pad plate 620 in contact with the rectangular silicon wafer 900 is depressed and deformed, the surface of the first pad plate 520 close to the rectangular silicon wafer 900 forms a first side pressing surface 521 and a first arc-shaped pressing surface 522, the surface of the second pad plate 620 close to the rectangular silicon wafer 900 forms a second side pressing surface 621 and a second arc-shaped pressing surface 622, the first side pressing surface 521 and the second side pressing surface 621 limit the rectangular silicon wafer 900 in the first direction, and the first arc-shaped pressing surface 522 and the second arc-shaped pressing surface 622 cooperate with the first supporting column 530 and the second supporting column 630 to limit the rectangular silicon wafer 900 in the second direction, the second direction refers to the thickness direction of the rectangular silicon wafer 900.

[0058] The cross sections of the first supporting column 530 and the second supporting column 630 are circular, the rectangular silicon wafer 900 is in line contact with the first supporting column 530 and the second supporting column 630, the contact area is small, and the rectangular silicon wafer 900 can be cleaned easily.

[0059] Embodiment 4:

[0060] As an optimization of embodiment 3, as shown in Figure 2 、 Figure 3 and Figure 8 , the adjusting part 400 comprises a screw rod 410, an adjusting handle 420 and a fixed seat 430, the screw rod 410 is fixedly connected to the side of the sliding bearing plate 200 away from the fixed bearing plate 100, the adjusting handle 420 is threadedly connected with the screw rod 410, and the fixed seat 430 is fixedly connected with the end of one of the guide rods 300 extending out of the sliding bearing plate 200, and the fixed seat 430 is rotationally connected with the adjusting handle 420 through a connecting hole.

[0061] It should be noted that the positions of the fixed bearing plate 100, the guide rod 300, the fixed seat 430 and the adjusting handle 420 are fixed, the length direction of the screw rod 410 is consistent with the length direction of the guide rod 300, the adjusting handle 420 can only rotate relative to the fixed seat 430, rotating the adjusting handle 420 drives the screw rod 410 to move along the length direction of the screw rod 410, thereby driving the sliding bearing plate 200 to move along the length direction of the guide rod 300, and further adjusting the distance between the fixed bearing plate 100 and the sliding bearing plate 200.

[0062] Embodiment 5:

[0063] As an optimization of embodiment 4, as shown in Figure 1 、 Figure 2 、 Figure 9 and Figure 10The device also comprises a positioning part 700 and a limiting part 800. The positioning part 700 comprises a positioning plate 710, a first fixing shaft 720 and a first roller 730. The positioning plate 710 is connected to the guide rod 300. The positioning plate 710 is provided with a first mounting groove 711 on one side. The first fixing shaft 720 is fixedly installed in the first mounting groove 711. The first roller 730 is rotationally connected with the first fixing shaft 720.

[0064] The limiting part 800 comprises a second fixing shaft 810, a rotating rod 820, a third fixing shaft 830, a second roller 840 and a locking handle 850. The fixed bearing plate 100 is provided with two second mounting grooves 110. The second fixing shaft 810, the rotating rod 820 and the locking handle 850 are provided with two groups. Two second fixing shafts 810 are fixedly installed in the second mounting grooves 110, respectively. The two second fixing shafts 810 are vertically arranged. Two rotating rods 820 are rotationally connected with the two second fixing shafts 810, respectively. The two rotating rods 820 are fixedly connected with the third fixing shaft 830. The second roller 840 is rotationally connected with the third fixing shaft 830. The two locking handles 850 are threadedly connected with the fixed bearing plate 100, respectively. The two locking handles 850 are abutted with the two rotating rods 820, respectively.

[0065] It should be noted that when the position of the rectangular silicon wafer 900 is fixed, one side of the rectangular silicon wafer 900 perpendicular to the third direction is abutted with the first roller 730. The other side of the rectangular silicon wafer 900 perpendicular to the third direction is abutted with the second roller 840. Thus, the rectangular silicon wafer is limited in the third direction. The third direction refers to the width direction of the rectangular silicon wafer 900.

[0066] First, the first roller 730 and the second roller 840 are adjusted to abut with the rectangular silicon wafer 900. Then, the adjusting handle 420 is rotated to make the first pad plate 520 and the second pad plate 620 clamp the rectangular silicon wafer 900. Thus, the fixation of the rectangular silicon wafer 900 is completed. In this process, the rectangular silicon wafer 900 moves along the first direction. The first roller 730 and the second roller 840 rotate. The abrasion of the rectangular silicon wafer 900 is extremely small. Thus, the quality of the rectangular silicon wafer 900 is not affected.

[0067] In the embodiment, the positioning part 700 is provided with two groups, and the two positioning plates 710 are slidably sleeved with the five guide rods 300. The two positioning plates are fixedly connected with the sliding bearing plate 200 through the connecting plate 740, that is, the sliding bearing plate 200 and the two positioning plates 710 are fixedly connected with the connecting plate 740. When the sliding bearing plate 200 moves along the length direction of the guide rod 300, the connecting plate 740 and the positioning part are synchronously moved with the sliding bearing plate 200. By arranging two groups of the positioning part 700, each rectangular silicon wafer 900 is abutted with the two first rollers 730, so that after the second roller 840 is rotated, the second roller 840 is abutted with all the rectangular silicon wafers 900 at the same time.

[0068] In use, the two locking handles 850 are loosened first, the rotating rod 820 is rotated away from the positioning plate 710, and then the adjusting handle 420 is rotated to drive the screw rod 410 to move along the length direction of the screw rod 410, so as to drive the sliding bearing plate 200 to move along the length direction of the guide rod 300, and the distance between the first pad plate 520 and the second pad plate 620 is slightly greater than the length of the rectangular silicon wafer 900.

[0069] After the adjustment is completed, the rectangular silicon wafer 900 is placed on the corresponding first supporting column 530 and second supporting column 630, and the rectangular silicon wafer 900 is abutted with the two first rollers 730. After all the rectangular silicon wafers 900 are placed in the above manner, the rotating rod 820 is rotated towards the positioning plate 710, the third fixed shaft 830 and the second roller 840 are driven to rotate, until the second roller 840 is abutted with the rectangular silicon wafer 900, then the two locking handles 850 are tightened to fix the positions of the two rotating rods 820, so as to fix the position of the second roller 840.

[0070] Finally, the adjusting handle 420 is rotated to drive the screw rod 410 to move along the length direction of the screw rod 410, so as to drive the sliding bearing plate 200 to move along the length direction of the guide rod 300, until the first pad plate 520 and the second pad plate 620 clamp the rectangular silicon wafer 900.

[0071] The embodiment of the utility model is described above in combination with the drawings, but the embodiment is not limited to the specific implementation manner described above. The specific implementation manner described above is only illustrative, but not limited. Those skilled in the art can make many forms without departing from the purpose of the embodiment and the scope protected by the claims under the inspiration of the embodiment, which all belong to the protection of the embodiment.

Claims

1. A rectangular silicon wafer basket characterized by, The utility model relates to a kind of long rectangular silicon wafer bearing device, including: Fixed bearing plate (100), sliding bearing plate (200), guide rod (300) and adjusting part (400), the fixed bearing plate (100) and the sliding bearing plate (200) are oppositely arranged, the fixed bearing plate (100) is close to the first bearing part (500) of the sliding bearing plate (200) side arrangement, the sliding bearing plate (200) is close to the second bearing part (600) of the fixed bearing plate (100) side arrangement corresponding with the first bearing part (500), the first bearing part (500) and the second bearing part (600) cooperate for bearing long rectangular silicon wafer (900); The guide rod (300) is provided with multiple, one end of the guide rod (300) is connected to the fixed bearing plate (100), the sliding bearing plate (200) is slidably connected with the guide rod (300), the adjusting part (400) is connected to the sliding bearing plate (200) and one of the guide rod (300), and the adjusting part (400) is used for adjusting the spacing between the fixed bearing plate (100) and the sliding bearing plate (200).

2. The rectangular wafer basket of claim 1, wherein, The first bearing part (500) is provided with multiple groups, and multiple groups of the first bearing part (500) are spaced apart along the vertical direction, the second bearing part (600) is provided with multiple groups, and multiple groups of the second bearing part (600) are spaced apart along the vertical direction, and multiple first bearing parts (500) and multiple second bearing parts (600) correspond one by one.

3. The rectangular wafer basket of claim 2, wherein, The first bearing part (500) includes first fixed plate (510), first backing plate (520) and first support column (530), the first fixed plate (510) is fixedly connected to the fixed bearing plate (100) close to the sliding bearing plate (200) side, the first backing plate (520) and the first support column (530) are both fixedly connected to the first fixed plate (510) close to the sliding bearing plate (200) side, the first support column (530) is below the first backing plate (520), and the lower surface of the first backing plate (520) is attached to the first support column (530), and the first support column (530) is spaced apart along the length direction of the first fixed plate (510) and is provided with multiple; The second bearing part (600) includes second fixed plate (610), second backing plate (620) and second support column (630), the second fixed plate (610) is fixedly connected to the sliding bearing plate (200) close to the fixed bearing plate (100) side, the second backing plate (620) and the second support column (630) are both fixedly connected to the second fixed plate (610) close to the fixed bearing plate (100) side, the second support column (630) is below the second backing plate (620), and the lower surface of the second backing plate (620) is attached to the second support column (630), and the second support column (630) is spaced apart along the length direction of the second fixed plate (610) and is provided with multiple.

4. The rectangular wafer basket of claim 3, wherein, The first pad (520) and the second pad (620) are both flexible pads and have a height greater than a thickness of the rectangular silicon wafer (900).

5. The rectangular wafer basket of claim 4, wherein, The first support column (530) and the second support column (630) are both circular in cross section.

6. The rectangular wafer basket of claim 1, wherein, The adjusting part (400) comprises a screw rod (410), an adjusting handle (420) and a fixing base (430), the screw rod (410) is fixedly connected to a side of the sliding bearing plate (200) away from the fixing bearing plate (100), the adjusting handle (420) is threadedly connected with the screw rod (410), and the fixing base (430) is fixedly connected with one end of the guide rod (300) extending out of the sliding bearing plate (200), and the fixing base (430) is rotationally connected with the adjusting handle (420) through a connecting hole.

7. The rectangular wafer basket of claim 1, wherein, The positioning part (700) comprises a positioning plate (710), a first fixing shaft (720) and a first roller (730), the positioning plate (710) is connected to the guide rod (300), one side of the positioning plate (710) is provided with a first mounting groove (711), the first fixing shaft (720) is fixedly installed in the first mounting groove (711), and the first roller (730) is rotationally connected with the first fixing shaft (720). The limiting part (800) comprises a second fixing shaft (810), a rotating rod (820), a third fixing shaft (830), a second roller (840) and a locking handle (850), the fixing bearing plate (100) is provided with two second mounting grooves (110), the second fixing shaft (810), the rotating rod (820) and the locking handle (850) are all provided with two groups, the two second fixing shafts (810) are fixedly installed in the second mounting grooves (110) respectively, the two second fixing shafts (810) are both vertically arranged, the two rotating rods (820) are rotationally connected with the two second fixing shafts (810) respectively, the two rotating rods (820) are fixedly connected with the third fixing shaft (830), the second roller (840) is rotationally connected with the third fixing shaft (830), the two locking handles (850) are threadedly connected with the fixing bearing plate (100) respectively, and the two locking handles (850) are abutted with the two rotating rods (820) respectively.

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