Bidirectional semiconductor wafer test fixture
By designing the clamping and collecting mechanisms of the bidirectional semiconductor wafer testing fixture, the problems of wafer shaking and collection in wafer inspection were solved, achieving stable clamping and convenient collection, thereby improving inspection efficiency and reducing costs.
Patent Information
- Application Number
- CN202422724787.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-08
- Publication Date
- 2025-11-07
- Estimated Expiration
- 2034-11-08
AI Technical Summary
Existing wafer inspection equipment is prone to wafer shaking during inspection, which affects the test results, and wafers are difficult to collect after the test, increasing the inspection cost.
A bidirectional semiconductor wafer testing fixture was designed. The clamping mechanism uses the rotation of the cylinder and connecting plate to drive the sliding of the drive rod and connecting rod to achieve a stable clamping of the wafer. A collection box is set at the bottom of the base plate to facilitate the collection of the wafer.
It effectively avoids wafer shaking during testing, ensuring testing accuracy, and simplifies the wafer collection process through the collection mechanism, reducing wafer loss and testing costs.
Smart Images
Figure CN223527164U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of fixture, especially a bidirectional semiconductor wafer test fixture. BACKGROUND
[0002] Semiconductor wafer (Semiconductor Wafer) refers to the thin sheet for manufacturing semiconductor devices, usually made of high-purity single crystal silicon (Si), but also possible to use other materials, such as gallium arsenide (GaAs), silicon carbide (SiC) etc. Wafer is the basic material of semiconductor manufacturing, its surface can be processed into various microelectronic devices, such as integrated circuit (IC), transistor, diode etc., therefore, in the production process of semiconductor wafer needs to be detected, but the existing wafer detection device when detecting wafer, wafer is easy to shake, influence the test, at the same time after wafer test, it is inconvenient to collect wafer, wafer is easy to lose, increase the cost of detection. SUMMARY
[0003] The utility model discloses a bidirectional semiconductor wafer test fixture to solve the technical problems in the prior art.
[0004] In order to achieve the above object, the utility model adopts the following technical scheme: a bidirectional semiconductor wafer test fixture, including the bottom plate, install the clamping mechanism for clamping semiconductor wafer on the bottom plate,
[0005] The clamping mechanism includes a cylinder, and the cylinder is rotatably connected to the bottom plate, and the two ends of the cylinder are fixedly connected with connecting plates, one end of the connecting plate away from the cylinder is hingedly connected with a driving link, one end of the driving link away from the connecting plate is hingedly connected with a connecting rod, and the connecting rod is fixedly connected with a limiting plate, and the bottom plate is fixedly connected with an electric push rod, and the output end of the electric push rod is fixedly connected with a group of connecting rods.
[0006] Further description of the above technical scheme:
[0007] The bottom plate is fixedly connected with a sliding bar, and the sliding bar penetrates the sliding connection connecting rod, and is used for limiting the movement of the connecting rod.
[0008] Further description of the above technical scheme:
[0009] The bottom plate is fixedly connected with a supporting rod, and one end of the supporting rod away from the bottom plate is fixedly connected with a placing plate for placing wafer, and the placing plate is rotatably connected to the cylinder.
[0010] Further description of the above technical scheme:
[0011] The volume of the placing plate is less than the volume of the wafer.
[0012] As a further description of the above technical solutions:
[0013] The limiting plate is fixedly connected with a protection plate for protecting the wafer.
[0014] As a further description of the above technical solutions:
[0015] The bottom of the bottom plate is fixedly connected with a supporting leg, the supporting leg is fixedly connected with a groove rod, and the supporting leg and the groove rod are both provided with a sliding groove, the sliding groove is installed with a collecting mechanism for placing the collected wafer, the collecting mechanism comprises a sliding plate, the sliding plate is slidingly connected in the sliding groove, one end of the sliding plate away from the sliding groove is fixedly connected with a collecting box, and the collecting box is provided with a placing groove.
[0016] As a further description of the above technical solutions:
[0017] The placing groove is provided with a plurality of groups, and the plurality of groups of placing grooves are uniformly distributed in the collecting box.
[0018] The utility model has the advantages of the following beneficial effects:
[0019] 1、 the utility model discloses, through the rotation of the cylinder drive two groups of connecting plate rotation, two groups of connecting plate rotation drive two groups of drive connecting rod pull two groups of connecting rod on the bottom plate and slide inwards relatively, and then can make two groups of limiting plate clamping and fix the wafer to be tested on the placing plate to can avoid the wafer to shake when testing, influence the test to carry out.
[0020] 2、 the utility model discloses, through being equipped with the collecting box in the bottom of the bottom plate, and then can place the wafer of testing well in the placing groove on the sliding plate, to make the test personnel collect the wafer conveniently, avoid wafer loss, increase test cost. DRAWINGS
[0021] Figure 1 It is a top view perspective drawing of a bidirectional semiconductor wafer test fixture proposed in the utility model;
[0022] Figure 2 It is a structure diagram of a bidirectional semiconductor wafer test fixture proposed in the utility model Figure 1 ;
[0023] Figure 3 It is a structure diagram of a bidirectional semiconductor wafer test fixture proposed in the utility model Figure 2 ;
[0024] Figure 4 It is a structure diagram of a bidirectional semiconductor wafer test fixture proposed in the utility model Figure 3 ;
[0025] Figure 3 It is Figures 1-5Enlarged view at A.
[0026] Legend:
[0027] 1, bottom plate; 2, clamping mechanism; 21, cylinder; 22, connecting plate; 23, drive connecting rod; 24, connecting rod; 25, limiting plate; 26, electric push rod; 27, sliding bar; 28, baffle; 29, support rod; 210, placement plate; 211, protection plate; 3, support leg; 4, groove rod; 5, sliding groove; 6, collection mechanism; 61, sliding plate; 62, collection box; 63, placement groove; 64, pull rod. DETAILED DESCRIPTION
[0028] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.
[0029] Embodiment: please refer to Figure 1 The utility model provides an embodiment: a bidirectional semiconductor wafer test fixture, including bottom plate 1, bottom plate 1 is installed for clamping semiconductor wafer's clamping mechanism 2;
[0030] Clamping mechanism 2 includes cylinder 21, and cylinder 21 is rotatably connected on bottom plate 1, simultaneously, both ends of cylinder 21 are fixedly connected with connecting plate 22, the end away from cylinder 21 of connecting plate 22 is hinged with drive connecting rod 23, the end away from connecting plate 22 of drive connecting rod 23 is hinged with connecting rod 24, and connecting rod 24 is fixedly connected with limiting plate 25, simultaneously, bottom plate 1 is fixedly connected with electric push rod 26, and the output end of electric push rod 26 is fixedly connected on a group of connecting rods 24.
[0031] Working principle: by starting electric push rod 26, the output end of electric push rod 26 drives a group of connecting rods 24 to move inwards on bottom plate 1, simultaneously, the movement of a group of connecting rods 24 drives drive connecting rod 23 to rotate, drive connecting rod 23 rotates and drives connecting plate 22 to rotate, connecting plate 22 rotates and drives cylinder 21 to rotate, cylinder 21 rotates and drives another group of connecting plates 22 to rotate, another group of connecting plates 22 rotates and drives a group of drive connecting rods 23 to rotate, a group of drive connecting rods 23 rotates and another group of connecting rods 24 moves inwards on bottom plate 1, and then two groups of connecting rods 24 slide inwards on bottom plate 1, and then two groups of limiting plates 25 can clamp and fix the wafer to be tested on placement plate 210, so that the wafer can be prevented from shaking and affecting the test when being tested.
[0032] As a preferable embodiment, the slide strip 27 is fixed on the bottom plate 1, the slide strip 27 penetrates the sliding connection connecting rod 24, and is used for limiting the movement of the connecting rod 24. One end of the slide strip 27 is fixed with the baffle 28.
[0033] As shown in Figure 5 : the slide strip 27 is provided with four groups, and each two groups of slide strips 27 are distributed on one side of the bottom plate 1 and are uniformly distributed at two ends of one group of connecting rods 24.
[0034] As a preferable embodiment, the support rod 29 is fixed on the bottom plate 1, and one end of the support rod 29 away from the bottom plate 1 is fixed with the placement plate 210 used for placing the wafer. The placement plate 210 is rotationally connected to the cylinder 21.
[0035] As shown in Figure 1 : when the two groups of connecting plates 22 rotate to the maximum angle, the support rod 29 is not touched.
[0036] As a preferable embodiment, the volume of the placement plate 210 is smaller than the volume of the wafer.
[0037] As shown in Figure 1 : the placement plate 210 is located in the middle of the bottom plate 1, and the placement plate 210 is located directly above the cylinder 21.
[0038] As a preferable embodiment, the limiting plate 25 is fixed with the protection plate 211 used for protecting the wafer.
[0039] As shown in Figure 2 : the size of the protection plate 211 is smaller than the size of the limiting plate 25, and the material of the protection plate 211 is rubber.
[0040] As a preferable embodiment, the bottom of the bottom plate 1 is fixed with the support leg 3, the support leg 3 is fixed with the slot rod 4, and the support leg 3 and the slot rod 4 are both provided with the sliding groove 5. The sliding groove 5 is installed with the collection mechanism 6 used for placing the collected wafer. The collection mechanism 6 includes the sliding plate 61, the sliding plate 61 is slidingly connected in the sliding groove 5, one end of the sliding plate 61 away from the sliding groove 5 is fixed with the collection box 62, and the collection box 62 is provided with the placement slot 63.
[0041] As shown in Figure 2 : the size of the placement slot 63 is consistent with the size of the wafer to be tested.
[0042] As a preferable embodiment, the placement slot 63 is provided with multiple groups, and the multiple groups of placement slots 63 are uniformly distributed in the collection box 62.
[0043] As shown in : the multiple groups of placement slots 63 are distributed in two columns and four rows in the collection box 62, and the collection box 62 is fixedly installed with the pull rod 64.
[0044] It should be pointed out finally that: the above only for the preferred embodiments of the utility model have, and do not for limiting the utility model, although the utility model has been described in detail with reference to the foregoing embodiments, for the person skilled in the art, it still can modify the technical scheme recorded in the foregoing each embodiment, or make equivalent replacement to part of technical features, any modification, equivalent replacement, improvement etc. made within the spirit and principle of the utility model, should be contained in the protection scope of the utility model.
Claims
1. A bidirectional semiconductor wafer test fixture comprising a base plate (1), characterized in that: The bottom plate (1) is provided with a clamping mechanism (2) for clamping a semiconductor wafer; The clamping mechanism (2) comprises a cylinder (21) which is rotatably connected to the bottom plate (1), and two ends of the cylinder (21) are fixedly connected with connecting plates (22), one end of the connecting plate (22) away from the cylinder (21) is hingedly connected with a driving connecting rod (23), one end of the driving connecting rod (23) away from the connecting plate (22) is hingedly connected with a connecting rod (24), the connecting rod (24) is fixedly connected with a limiting plate (25), and the bottom plate (1) is fixedly connected with an electric push rod (26), one end of the electric push rod (26) is fixedly connected with a group of connecting rods (24).
2. A bidirectional semiconductor wafer test fixture as recited in claim 1, wherein: The bottom plate (1) is fixedly connected with a sliding bar (27), the sliding bar (27) penetrates through the connecting rod (24) in a sliding manner, and is used for limiting the movement of the connecting rod (24).
3. A bidirectional semiconductor wafer test fixture as set forth in claim 2, further comprising: The bottom plate (1) is fixedly connected with a supporting rod (29), one end of the supporting rod (29) away from the bottom plate (1) is fixedly connected with a placing plate (210) for placing the wafer, and the placing plate (210) is rotatably connected to the cylinder (21).
4. The bidirectional semiconductor wafer test fixture of claim 3, wherein: The volume of the placing plate (210) is smaller than that of the wafer.
5. A bidirectional semiconductor wafer test fixture as set forth in claim 4, further comprising: The limiting plate (25) is fixedly connected with a protection plate (211) for protecting the wafer.
6. A bidirectional semiconductor wafer test fixture as set forth in claim 5, further comprising: The bottom plate (1) is fixedly connected with a supporting leg (3), the supporting leg (3) is fixedly connected with a groove rod (4), and the supporting leg (3) and the groove rod (4) are both provided with sliding grooves (5), the sliding grooves (5) are provided with a collecting mechanism (6) for placing collected wafers, the collecting mechanism (6) comprises a sliding plate (61) which is slidably connected to the sliding groove (5), one end of the sliding plate (61) away from the sliding groove (5) is fixedly connected with a collecting box (62), and the collecting box (62) is provided with a placing groove (63).
7. A bidirectional semiconductor wafer test fixture as set forth in claim 6, further comprising: The placing groove (63) is provided with a plurality of groups, and the plurality of groups of placing grooves (63) are uniformly distributed in the collecting box (62).