Diode base structure

Abstract

The utility model discloses a diode base structure. The tube socket comprises a tube socket bottom and a tube socket side wall, the tube socket side wall is arranged around the tube socket bottom and forms a tube socket cavity, an annular force exerting groove is formed in the connecting position of the inner wall of the tube socket side wall and the inner bottom face of the tube socket bottom, a welding table top is formed, an arc-shaped downward concave face is arranged on the welding table top, and the arc-shaped downward concave face is arranged on the welding table top. A lead is connected to the welding table top through PI glue, and the lower concave face is used for being filled with the PI glue.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of diodes, in particular to a diode base structure. BACKGROUND

[0002] As a common electronic component, the performance and reliability of diodes are crucial for the normal operation of electronic devices. During the manufacturing process of diodes, the base welding platform is used for welding with the lead. In order to protect the chip surface, polyimide (PI) glue is usually coated on the welding platform.

[0003] The diameter of the welding platform of the existing diode base is much larger than the size of the chip. After coating the PI glue, the PI glue is prone to flow downward under the action of gravity and accumulate on the welding platform, which cannot uniformly cover the chip surface. This results in the formation of a too-thin protective layer of PI glue on the chip surface, which cannot effectively protect the chip.

[0004] Specifically, due to the small size of the diode chip and the large diameter of the base welding platform, the PI glue flows downward along the surface of the welding platform after being coated under the influence of gravity. This flow phenomenon makes the PI glue unable to be uniformly distributed on the chip surface, especially around the chip, the thickness of the PI glue will be significantly reduced. The thin PI glue layer cannot provide sufficient protection, resulting in the chip being more susceptible to physical damage and environmental factors during subsequent use.

[0005] Due to the flow of PI glue, it eventually accumulates on the welding platform, causing material waste. At the same time, the accumulated PI glue may affect the welding quality of the lead, reducing the reliability of the welding and the stability of the electrical performance. When the PI glue flows and accumulates on the welding platform under the action of gravity, not only is material wasted, but also a series of problems can be caused. First, excessive PI glue accumulation on the welding platform will affect the subsequent welding process. The welding of the lead with the base requires a clean and flat surface to ensure good electrical contact and mechanical strength. Excessive PI glue will hinder the welding process, resulting in weak welding and even possible detachment during use. Second, the decline in welding quality will directly affect the electrical performance of the diode, such as increasing the contact resistance, reducing the conductivity, affecting the working efficiency and reliability of the diode. SUMMARY

[0006] To solve the above technical problems, the present application provides a diode base structure, and the technical solutions in the present application are described as follows:

[0007] A diode base structure comprises:

[0008] The tube base bottom and the tube base side wall are arranged around the tube base bottom and form a tube base cavity, an inner wall of the tube base side wall is arranged with an annular force groove at a connection with an inner bottom surface of the tube base bottom and is formed with a welding platform, the welding platform is arranged with an arc-shaped lower concave surface, and a lead wire is connected to the welding platform through PI glue, and the lower concave surface is used for filling the PI glue.

[0009] Optionally, the force groove is a trapezoidal cross section, so that the lower end diameter of the welding platform is smaller than the upper end diameter.

[0010] Optionally, the arc-shaped lower concave surface of the welding platform is circular or elliptical.

[0011] Optionally, when the lead wire is welded on the welding platform, the lower concave surface forms partial covering on the contact between the lead wire and the welding platform.

[0012] From the above technical solutions, the present application has the following advantages:

[0013] 1. The design of the arc-shaped lower concave surface effectively controls the flow of PI glue, avoids the glue from flowing to the tube base bottom and the side wall due to gravity, and ensures that the PI glue is mainly concentrated on the welding platform and the chip surface.

[0014] 2. Through the structural design of the annular force groove and the lower concave surface, the PI glue can uniformly cover the chip surface to form a protective layer with uniform thickness, thereby improving the protection effect of the chip.

[0015] 3. The lower concave surface provides more filling space, so that the PI glue forms a spherical shape on the welding platform, increases the thickness of the PI glue attached to the chip surface, and thereby enhances the mechanical protection and environmental protection performance of the chip.

[0016] 4. Since the PI glue is mainly concentrated on the welding platform and the chip surface, the glue is prevented from accumulating on the welding platform, ensuring good contact between the lead wire and the welding platform, improving the welding quality and the stability of the electrical performance.

[0017] 5. The trapezoidal cross section design of the annular force groove makes the lower end diameter of the welding platform smaller than the upper end diameter, increases the structural strength and stability, and further improves the reliability of the welding. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 For an embodiment provided in the present application, a structure schematic diagram when welding a lead wire is provided.

[0019] Figure 2 For an embodiment provided in the present application, a structure schematic diagram when not welding a lead wire is provided. DETAILED DESCRIPTION

[0020] In the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "transverse", "longitudinal", and the like indicate the orientation or positional relationship shown in the drawings, and are used only to illustrate the relative positional relationship between the components or constituent parts, and do not particularly limit the specific installation orientation of the components or constituent parts.

[0021] In addition, in addition to indicating the orientation or positional relationship, the above-mentioned partial terms can also be used to indicate other meanings, for example, the term "upper" can also be used to indicate a certain dependent relationship or connection relationship in some cases. For those skilled in the art, the specific meaning of these terms in the present application can be understood according to the specific circumstances.

[0022] In addition, the terms "mounting", "setting", "provided with", "connection", "connected" should be broadly understood. For example, it can be fixedly connected, detachably connected, or integrally configured; it can be mechanically connected, or electrically connected; it can be directly connected, or indirectly connected through an intermediate medium, or it can be internal communication between two devices, elements or constituent parts. For those skilled in the art, the specific meaning of the above-mentioned terms in the present application can be understood according to the specific circumstances.

[0023] In addition, the structure, proportion, size, etc. shown in the drawings in the present application are only used to cooperate with the content disclosed in the specification, so that those skilled in the art can understand and read, and do not have technical substantive significance, and any modification of the structure, change of the proportion relationship or adjustment of the size, without affecting the effect and purpose that can be achieved by the present application, still falls within the scope of the technical content disclosed by the present application.

[0024] The technical solutions in the present application will be described clearly and completely in the present application in combination with the drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.

[0025] Referring to Figure 1 and Figure 2 The present application first provides an embodiment of a diode socket structure, which comprises:

[0026] Pipe seat bottom 01 and pipe seat side wall 02, the pipe seat side wall 02 is arranged around the pipe seat bottom 01, and forms a pipe seat cavity 03, the inner wall of the pipe seat side wall 02 is arranged with annular force groove 04 at the junction with the inner bottom surface of the pipe seat bottom 01, and is formed with welding platform 05, the welding platform 05 is arranged with arc-shaped concave surface 06, lead 07 is connected to the welding platform 05 through PI glue, and the concave surface 06 is used for filling PI glue.

[0027] The embodiment provides an improved diode pipe seat structure, aiming at solving the problems of PI glue flow and insufficient chip surface protection in the prior art. The structure comprises the following key components:

[0028] Pipe seat bottom 01 and pipe seat side wall 02

[0029] Pipe seat bottom 01: the base structure of the pipe seat, providing support for the entire diode pipe seat. The pipe seat bottom 01 is usually a flat structure, facilitating the fixation and stability of the diode.

[0030] Pipe seat side wall 02: arranged around the pipe seat bottom 01 to form a closed structure. The height and shape of the side wall are determined according to specific design requirements to adapt to different diode chip sizes.

[0031] Cavity: the cavity formed by the pipe seat bottom 01 and the pipe seat side wall 02, used for accommodating the diode chip and the welding platform 05. The size and shape of the cavity are designed according to the specifications of the diode chip to ensure that the chip can be stably placed in the cavity.

[0032] Annular force groove 04:

[0033] The force groove 04 is arranged at the junction of the inner wall of the pipe seat side wall 02 and the inner bottom surface of the pipe seat bottom 01. The annular design forms a groove at the junction of the pipe seat side wall 02 and the bottom.

[0034] The force groove 04 plays a fixing role during welding, preventing PI glue from flowing to other parts, and increasing the overall stability of the structure.

[0035] Welding platform 05:

[0036] The welding platform 05 is formed by the design of the annular force groove 04. The welding platform 05 provides a special area for lead 07 welding. The welding platform 05 is used to fix the lead 07 on the pipe seat and connect the lead 07 with the chip through PI glue. The design of the welding platform 05 directly affects the quality of welding and the stability of the lead 07.

[0037] Arc-shaped concave surface 06:

[0038] An arc-shaped lower concave surface 06 is provided on the welding platform 05. The arc-shaped lower concave surface 06 is used to fill the PI glue. Its arc-shaped design helps to control the flow of PI glue, making it evenly cover the welding platform 05 and the chip surface, preventing the PI glue from flowing and accumulating. Through the design of the arc-shaped lower concave surface 06, the PI glue forms a spherical shape on the welding platform 05, increasing the thickness of the PI glue attached to the chip surface, thereby improving the protection effect of the chip.

[0039] In this embodiment, the lead 07 is connected to the welding platform 05 through PI glue. The PI glue not only provides mechanical connection, but also plays a role in electrical insulation and protection. The lead 07 is made of metal materials with good electrical conductivity, such as copper or aluminum, to ensure the stability and conductivity of electrical performance.

[0040] The diode tube base structure of this embodiment can effectively control the flow of PI glue: the design of the arc-shaped lower concave surface 06 and the annular force groove 04 effectively prevents the flow of PI glue, ensuring that the PI glue is mainly concentrated on the welding platform 05 and the chip surface. The design of the lower concave surface 06 makes the PI glue form a uniform thickness protective layer on the chip surface, providing better mechanical protection and environmental protection. The optimized design of the welding platform 05 ensures the welding quality of the lead 07 and the tube base, enhancing the stability of electrical performance. By preventing the flow and accumulation of PI glue, material waste is reduced, and production cost-effectiveness is improved.

[0041] In an alternative embodiment, the force groove 04 has a trapezoidal cross-section, so that the lower end of the welding platform 05 has a smaller diameter than the upper end.

[0042] In an alternative embodiment, the force groove 04 has a trapezoidal cross-section. In this embodiment, the trapezoidal cross-section of the force groove 04 is provided at the junction of the inner wall of the tube base side wall 02 and the inner bottom surface of the tube base bottom 01, which is the same position as the annular force groove 04 in the basic embodiment. The trapezoidal cross-section means that the upper end of the force groove 04 has a larger diameter than the lower end. This trapezoidal design makes the lower end of the welding platform 05 have a smaller diameter than the upper end, providing a more stable structural foundation. The force groove 04 has a trapezoidal cross-section. The main purpose of this design is to form a force point in the force groove 04 after filling the epoxy resin, preventing the epoxy resin from falling off, thereby further improving the reliability and stability of the diode tube base.

[0043] In an alternative embodiment, the arc-shaped lower concave surface 06 of the welding platform 05 is circular or elliptical.

[0044] In this embodiment, the arc-shaped lower concave surface 06 of the welding platform 05 can be circular or elliptical.

[0045] The arc-shaped concave surface 06 on the welding platform 05 can be circular or elliptical, and the specific shape is selected according to actual needs. The circular or elliptical concave surface 06 design enables the PI glue to be more evenly distributed on the welding platform 05 and the chip surface, preventing flow and accumulation. Whether the concave surface 06 is circular or elliptical, it can provide an optimized filling area, enabling the PI glue to uniformly cover the entire welding platform 05. Through this arc-shaped design, the PI glue forms a uniform ball on the welding platform 05, increasing the thickness of the PI glue attached to the chip surface and providing better protection. The lead 07 is connected to the welding platform 05 through the PI glue. The circular or elliptical concave surface 06 design ensures good contact and fixation of the lead 07 with the welding platform 05.

[0046] In this embodiment, the circular or elliptical arc-shaped concave surface 06 enables the PI glue to be more evenly distributed on the welding platform 05 and the chip surface, forming a uniform thickness protective layer.

[0047] The optimized arc-shaped design increases the thickness of the PI glue on the chip surface, improving the mechanical and environmental protection performance of the chip.

[0048] The arc-shaped concave surface 06 effectively prevents the PI glue from flowing to other areas due to gravity, ensuring that the PI glue is concentrated on the welding platform 05 and the chip surface.

[0049] The circular or elliptical concave surface 06 design ensures good contact of the lead 07 with the welding platform 05, improving the stability of the welding quality and electrical performance.

[0050] By optimizing the distribution of PI glue and preventing flow, material waste is reduced, and production cost efficiency is improved.

[0051] In an optional embodiment, when the lead 07 is welded on the welding platform 05, the concave surface 06 forms partial wrapping at the contact between the lead 07 and the welding platform 05.

[0052] In this embodiment, when the lead 07 is welded on the welding platform 05, the concave surface 06 forms partial wrapping at the contact between the lead 07 and the welding platform 05. The arc-shaped concave surface 06 can be circular or elliptical and forms partial wrapping at the welding point of the lead 07. The partial wrapping effect provides additional mechanical support, making the connection of the welded lead 07 more stable and reliable. The lead 07 is welded on the welding platform 05 through the PI glue, and the partial wrapping design of the concave surface 06 enhances the fixation effect of the lead 07. The partial wrapping design helps prevent loosening and falling of the welding point, improving the welding quality and electrical performance.

[0053] It is to be understood that the embodiments that have been described above are merely illustrative of the principles of the application. Numerous modifications can be made to the application described without departing from the scope of the application as defined in the appending claims. Accordingly, the application is not to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A diode package structure, characterized by, The application relates to a pipe socket, which comprises: a pipe socket bottom and a pipe socket sidewall, which is arranged around the pipe socket bottom and forms a pipe socket cavity, an inner wall of the pipe socket sidewall is provided with an annular force receiving groove at a joint with an inner bottom surface of the pipe socket bottom, and a welding platform is formed, the welding platform is provided with an arc-shaped lower concave surface, a lead wire is connected to the welding platform through PI glue, and the lower concave surface is used for filling PI glue.

2. The diode package structure as defined in claim 1, wherein The force receiving groove is in a trapezoidal cross section, so that a lower end diameter of the welding platform is smaller than an upper end diameter.

3. The diode package structure as defined in claim 1, wherein The arc-shaped lower concave surface of the welding platform is circular or elliptical.

4. The diode package structure as defined in claim 1 wherein, When the lead wire is welded on the welding platform, the lower concave surface forms partial covering for the lead wire at a contact position of the lead wire and the welding platform.

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