Wiring substrate electrostatic discharge device and electrostatic discharge device
By employing a contact-type release process using electrostatic discharge rings and electrostatic dischargers in the electrostatic discharge device for the wiring substrate, the problem of redistribution layer failure caused by electrostatic breakdown is solved, achieving effective elimination of wafer static electricity and wafer protection.
Patent Information
- Application Number
- CN202422944075.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-29
- Publication Date
- 2025-11-07
- Estimated Expiration
- 2034-11-29
AI Technical Summary
In the prior art, Bernoulli chucks are prone to generating static electricity when gripping multilayer wiring layer substrate structures, which can lead to electrostatic breakdown and failure of the redistribution layer. Furthermore, existing static eliminators are complex in structure and large in size, making them difficult to adapt to wafer gripping actions and easily damaging the wafer.
Design an electrostatic discharge device for wiring substrate, including an electrostatic discharge ring and an electrostatic discharger. Employ a contact discharge process, the annular bonding surface of the electrostatic discharge ring contacts the wafer surface, and the electrostatic discharger releases neutral ions to avoid electrostatic breakdown. The device has a simple structure and small size.
It effectively eliminates static electricity on wafers, preventing redistribution layer failure caused by electrostatic discharge. It has a simple structure, small size, and is compatible with wafer gripping actions, thus avoiding wafer damage.
Smart Images
Figure CN223528257U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of semiconductor equipment, in particular to a wiring substrate electrostatic discharge device and an electrostatic discharger. BACKGROUND
[0002] Chiplet technology adopts a new design method to package small chips with different functions together to form a heterogeneous integrated chip packaging structure. With the increasing input / output density of chips and the significant increase in the number of chips integrated in a single package, 2.5D packaging technology as a multi-chip packaging solution improves its performance through multi-layer wiring layer technology.
[0003] In the prior art, a chuck is usually used for wafer grabbing, for example, a Bernoulli chuck is used. However, when the Bernoulli chuck is used to grab a multi-layer wiring layer substrate structure, static electricity is easily generated, which can easily punch through the heavy wiring layer and cause the substrate structure to fail.
[0004] Existing electrostatic discharge devices are usually large and complex in structure, which are difficult to adapt to wafer grabbing actions and need to contact the wafer in a large area, which can easily damage the wafer. CONTENT OF THE INVENTION
[0005] The purpose of the present application is to provide a wiring substrate electrostatic discharge device and an electrostatic discharger, which can effectively eliminate wafer static electricity, avoid static electricity from punching through the heavy wiring layer and causing the substrate structure to fail, and have a simple structure, a small size, and can be adapted to wafer grabbing actions, and have a small contact area to avoid damaging the wafer.
[0006] In order to achieve the above-mentioned purpose, the embodiments of the present application are realized by the following scheme.
[0007] In a first aspect, the present application provides a wiring substrate electrostatic discharge device, comprising an electrostatic discharge ring and an electrostatic discharger, the electrostatic discharge ring is arranged on the bottom side of the electrostatic discharger and has a circular inner groove, the circular inner groove corresponds to the middle part of the electrostatic discharger, the electrostatic discharger is used for releasing neutralizing ions, and the side of the electrostatic discharge ring away from the electrostatic discharger is formed with an annular fitting surface, the annular fitting surface is used for fitting on the surface of static electricity and realizing electrostatic discharge.
[0008] In an optional embodiment, the electrostatic discharger comprises a dissipating seat and an emitter, the emitter is arranged on the top side of the dissipating seat and is used for generating neutralizing ions, and the dissipating seat is provided with a discharge electrode connected with the emitter, the discharge electrode is used for releasing neutralizing ions to the circular inner groove.
[0009] In an optional embodiment, the emitter is protruded on the top side of the dissipating seat.
[0010] In an optional embodiment, the electrostatic discharge ring is arranged on the edge of the dissipating seat, and the outer wall of the electrostatic discharge ring is flush with the outer wall of the dissipating seat.
[0011] In an optional embodiment, the dissipating seat is cylindrical, and a plurality of discharge channels in a diverging shape are arranged on the side of the dissipating seat away from the emitter, and each of the discharge channels is connected to the electrostatic discharge ring.
[0012] In an optional embodiment, a plurality of guide protrusions are arranged on the electrostatic discharge ring, and a plurality of guide grooves are arranged on the bottom surface of the dissipating seat, and the guide protrusions and the guide grooves are one-to-one correspondingly assembled.
[0013] In an optional embodiment, a graphite layer is arranged on the side of the electrostatic discharge ring away from the dissipating seat, the side surface of the graphite layer away from the dissipating seat forms the annular fitting surface, the guide protrusions are graphite columns and are arranged in the electrostatic discharge ring, and the guide protrusions are connected to the graphite layer.
[0014] In an optional embodiment, a plurality of guide grooves are arranged on the electrostatic discharge ring, and a plurality of guide protrusions are arranged on the side surface of the dissipating seat away from the emitter, and the plurality of guide protrusions are one-to-one correspondingly assembled in the plurality of guide grooves.
[0015] In an optional embodiment, the wiring substrate electrostatic discharge device further comprises a mounting shell, the mounting shell covers the electrostatic discharge ring, and the bottom side of the mounting shell is formed with an electrostatic opening, and the electrostatic discharge ring is exposed to the electrostatic opening.
[0016] In a second aspect, the utility model provides a kind of electrostatic discharge device, including power supply and the wiring substrate electrostatic discharge device of any one of the preceding embodiment, and the power supply is electrically connected with the electrostatic discharge device.
[0017] Through the above technical scheme, the utility model embodiment provides a kind of wiring substrate electrostatic discharge device, electrostatic discharge ring is arranged on the bottom side of electrostatic discharge device, and its circular inner groove is correspondingly arranged in the middle of electrostatic discharge device, electrostatic discharge device can release neutral ion, and the bottom side of electrostatic discharge ring is formed with annular fitting surface, the annular fitting surface can be fitted on the surface of wafer, and realize electrostatic discharge.Compared with prior art, the wiring substrate electrostatic discharge device provided by the utility model is used for electrostatic discharge of wafer, uses contact type release process, can effectively eliminate wafer static electricity, avoids that static breakdown leads to re-wiring layer failure, and structure is simple, small, can be adapted with wafer grabbing action, and annular fitting surface is used, contact area is small, and the damage of wafer is avoided.
[0018] Other features and advantages of the present application will be described in the following detailed description of the embodiments. BRIEF DESCRIPTION OF DRAWINGS
[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some of the embodiments of the present application, and therefore should not be considered as a limitation to the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.
[0020] Figure 1 The exploded structural schematic diagram of the wiring substrate electrostatic discharge device provided by the present application is shown in the figure.
[0021] Figure 2 The overall structural schematic diagram of the wiring substrate electrostatic discharge device provided by the present application is shown in the figure.
[0022] Figure 3 The cross-sectional structural schematic diagram of the wiring substrate electrostatic discharge device provided by the present application is shown in the figure.
[0023] Figure 4 The cross-sectional structural schematic diagram of another wiring substrate electrostatic discharge device provided by the present application is shown in the figure.
[0024] Icon:
[0025] 100-wiring substrate electrostatic discharge device; 110-electrostatic discharge ring; 111-ring-shaped fitting surface; 113-guiding protrusion; 115-graphite layer; 130-electrostatic discharge device; 131-dissipation seat; 133-emitter; 134-discharge electrode; 135-guiding groove; 137-discharge channel; 150-mounting shell; 151- boss. DETAILED DESCRIPTION
[0026] In order to make the purpose, technical solutions and advantages of the embodiments of the present application more clear, the following will combine the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, not all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.
[0027] In the description of the present application, it should be noted that the terms "in", "out" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly used when the product of the present application is used, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second" and the like are only used to distinguish the description and cannot be understood as indicating or implying relative importance.
[0028] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "set", "connected" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be directly connected, or indirectly connected through an intermediate medium, or it can be connected inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0029] Referring to Figures 1 to 3 The utility model embodiment provides a wiring substrate static electricity release device 100, be applicable to chiplet technology, and can effectively eliminate wafer static electricity, avoid static electricity breakdown to lead to rewire layer failure, and simple structure, small, can be adapted with wafer grabbing action, and contact area is small, avoid the damage of wafer.
[0030] The wiring substrate static electricity release device 100 provided by the utility model embodiment includes an electrostatic discharge ring 110 and an electrostatic discharge device 130, the electrostatic discharge ring 110 is arranged on the bottom side of the electrostatic discharge device 130 and has a circular inner groove, the circular inner groove corresponds to the middle part of the electrostatic discharge device 130, the electrostatic discharge device 130 is used to release neutral ions, and the side of the electrostatic discharge ring 110 away from the electrostatic discharge device 130 is formed with an annular fitting surface 111, the annular fitting surface 111 is used to fit on the surface of static electricity and realize static electricity release.
[0031] It should be noted that the electrostatic discharge ring 110 in the embodiment can be arranged on the bottom side of the electrostatic discharge device 130, the electrostatic discharge device 130 can release neutral ions (positive and negative ions) through a high-voltage power supply and an electrode, and release them to the surface of the wafer by the electrostatic discharge ring 110, thereby realizing the function of static electricity release. Since the electrostatic discharge ring 110 is used for static electricity release of the wafer, a contact type release process is adopted, which can effectively eliminate wafer static electricity, avoid static electricity breakdown to lead to rewire layer failure, and has simple structure, small size, can be adapted with wafer grabbing action, and adopts the annular fitting surface 111, the contact area is small, and the damage of the wafer is avoided.
[0032] It is worth noting that the neutralizing ions released by the electrostatic discharger 130 are mostly moved to the annular contact surface 111 through the electrostatic discharge ring 110, and a small part directly contacts the wafer in the circular inner groove, thereby improving the electrostatic discharge effect.
[0033] Further, the electrostatic discharger 130 includes a dissipating seat 131 and an emitter 133 arranged on the top side of the dissipating seat 131 and used for generating neutralizing ions. The bottom side of the dissipating seat 131 is provided with a discharge electrode 134 connected with the emitter 133, and the discharge electrode 134 is used for discharging the neutralizing ions to the circular inner groove and the electrostatic discharge ring 110. Specifically, the emitter 133 is protruded on the top side of the dissipating seat 131, and the electrostatic discharger is formed by using the high-voltage power supply and the discharge electrode 134, and can be used with the electrostatic discharge ring 110. The discharge electrode 134 can be an ion needle, and can ionize the air to form an ion wind of 10 m / s-50 m / s. The structural features and discharge principle of the electrostatic emitter 133 and the discharge electrode 134 can refer to the existing electrostatic discharger.
[0034] In some embodiments, the electrostatic discharge ring 110 is arranged in abutment with the edge of the dissipating seat 131, and the outer side wall of the electrostatic discharge ring 110 is flush with the outer side wall of the dissipating seat 131. Specifically, the outer diameter of the electrostatic discharge ring 110 is the same as the outer diameter of the dissipating seat 131, so as to ensure that the discharge range of the electrostatic discharge ring 110 is adapted to the dissipating seat 131, and the controllability is better.
[0035] In some embodiments, the dissipating seat 131 is in a cylindrical shape, and the side of the dissipating seat 131 away from the emitter 133 is provided with a plurality of discharge channels 137 in a diverging shape, and each discharge channel 137 is connected to the electrostatic discharge ring 110. Specifically, the discharge channel 137 can be composed of a conductive metal strip, and the dissipating seat 131 can be an insulating material. The charge of the neutralizing ions can be guided to the electrostatic discharge ring 110 through the conductive metal strip, and the plurality of discharge channels 137 can be in a uniform diverging state, so as to ensure the uniformity of the discharge.
[0036] In some embodiments, a plurality of guide protrusions 113 are arranged on the electrostatic discharge ring 110, and a plurality of guide grooves 135 are arranged on the bottom side surface of the dissipating seat 131, and the guide protrusions 113 and the guide grooves 135 are one-to-one corresponding assembly. Specifically, the guide protrusions 113 can be two, and the two guide protrusions 113 are arranged on the upper side surface of the electrostatic discharge ring 110 in opposition. The bottom side surface of the dissipating seat 131 is provided with two guide grooves 135, and the two guide protrusions 113 and the two guide grooves 135 are distributed and corresponding assembly, so as to realize the fixed limiting between the electrostatic discharge ring 110 and the dissipating seat 131. The guide protrusions 113 and the two guide grooves 135 can be interference fit.
[0037] Referring to Figure 4In some embodiments, the electrostatic discharge ring 110 is provided with a graphite layer 115 away from one side of the dissipating seat 131, the graphite layer 115 forms a ring-shaped fitting surface 111 away from the surface of one side of the dissipating seat 131, the guide protrusion 113 is in the form of a graphite column and is arranged in the electrostatic discharge ring 110, and the guide protrusion 113 is connected with the graphite layer 115. Specifically, the guide protrusion 113 can extend to the discharge channel 137, guide the electric charge to the graphite layer 115, realize electrostatic discharge, and the graphite layer 115 can reduce the probability of wear on the wafer. Of course, in other preferable embodiments of the present application, the electrostatic discharge ring 110 can also be made of a conductive material, such as a copper ring, so as to omit the preparation of the graphite layer 115.
[0038] In other preferable embodiments of the present application, a plurality of guide grooves 135 are arranged on the electrostatic discharge ring, and a plurality of guide protrusions 113 are arranged on the surface of one side of the dissipating seat 131 away from the emitter 133, and the plurality of guide protrusions 113 are correspondingly arranged in the plurality of guide grooves 135.
[0039] Further, the wiring substrate electrostatic discharge device 100 further comprises a mounting shell 150, the mounting shell 150 covers the electrostatic discharger 130 and the electrostatic discharge ring 110, and the bottom side of the mounting shell 150 is provided with a static opening, and the electrostatic discharge ring 110 is exposed to the static opening. The mounting shell 150 can be made of an insulating material, such as plastic, and the mounting shell 150 is provided with a boss 151 for accommodating the emitter 133. The mounting shell 150 can be in interference fit or threaded state with the electrostatic discharge ring 110, so as to realize the detachable fixing between the mounting shell 150 and the electrostatic discharge ring 110.
[0040] The embodiment of the present application further provides an electrostatic discharger 130, which comprises a power supply and a wiring substrate electrostatic discharge device 100, the wiring substrate electrostatic discharge device 100 comprises an electrostatic discharge ring 110 and an electrostatic discharger 130, the electrostatic discharge ring 110 is arranged on the bottom side of the electrostatic discharger 130 and has a circular inner groove, the circular inner groove corresponds to the middle part of the electrostatic discharger 130, the electrostatic discharger 130 is used for discharging neutralized ions, the electrostatic discharge ring 110 is provided with a ring-shaped fitting surface 111 away from one side of the electrostatic discharger 130, the ring-shaped fitting surface 111 is used for fitting on the surface of static electricity and realizes electrostatic discharge, and the power supply is electrically connected with the electrostatic discharger 130.
[0041] By the technical scheme, the wiring substrate electrostatic discharge device 100 is provided, the electrostatic discharge ring 110 is arranged at the bottom side of the electrostatic discharger 130, and the circular inner groove of the electrostatic discharge ring 110 is corresponded to the middle part of the electrostatic discharger 130, the electrostatic discharger 130 can release neutralizing ions, and the bottom side of the electrostatic discharge ring 110 is formed with the annular fitting surface 111, the annular fitting surface 111 can be fitted on the surface of the wafer, and the electrostatic discharge is realized. Compared with the prior art, the wiring substrate electrostatic discharge device 100 provided by the utility model can release the static electricity of the wafer by adopting the contact type release process, can effectively eliminate the static electricity of the wafer, can avoid the failure of the rewiring layer caused by the static electricity breakdown, and has the advantages of simple structure, small size, adaptability to the wafer grabbing action, and the annular fitting surface 111, small contact area and prevention of damage to the wafer.
[0042] It should be noted that the features in the embodiments of the present application can be combined with each other without conflict.
[0043] The above only describes the preferred embodiments of the present application and is not used to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A wiring substrate electrostatic discharge device, characterized by comprising: The static electricity releasing ring is arranged on the bottom side of the static electricity releaser, and has a circular inner groove corresponding to the middle part of the static electricity releaser, the static electricity releaser is used for releasing neutralizing ions, and the side of the static electricity releasing ring away from the static electricity releaser is formed with an annular fitting surface used for fitting on the surface of a wafer and realizing static electricity releasing.
2. The wiring substrate electrostatic discharge device according to claim 1, wherein The static electricity releaser includes a dissipating seat and an emitter arranged on the top side of the dissipating seat and used for generating neutralizing ions, and the dissipating seat is provided with a discharge electrode connected with the emitter and used for releasing neutralizing ions to the circular inner groove.
3. The wiring substrate electrostatic discharge device according to claim 2, wherein The emitter is protruded on the top side of the dissipating seat.
4. The wiring substrate electrostatic discharge device according to claim 2, wherein The static electricity releasing ring is arranged on the edge of the dissipating seat, and the outer side wall of the static electricity releasing ring is flush with the outer side wall of the dissipating seat.
5. The wiring substrate electrostatic discharge device according to claim 4, wherein The dissipating seat is in a cylindrical shape, and the side of the dissipating seat away from the emitter is provided with a plurality of divergent discharge channels, and each of the discharge channels is connected to the static electricity releasing ring.
6. The wiring substrate electrostatic discharge device according to claim 4, wherein The static electricity releasing ring is provided with a plurality of guide protrusions, and the bottom side surface of the dissipating seat is provided with a plurality of guide grooves, and the guide protrusions and the guide grooves are one-to-one corresponding assembly.
7. The wiring substrate electrostatic discharge device according to claim 6, wherein The side of the static electricity releasing ring away from the dissipating seat is provided with a graphite layer, the side surface of the graphite layer away from the dissipating seat forms the annular fitting surface, the guide protrusions are in a graphite columnar shape and are arranged in the static electricity releasing ring, and the guide protrusions are connected with the graphite layer.
8. The wiring substrate electrostatic discharge device according to claim 4, wherein The static electricity releasing ring is provided with a plurality of guide grooves, and the side surface of the dissipating seat away from the emitter is provided with a plurality of guide protrusions, and the plurality of guide protrusions are one-to-one corresponding assembly in the plurality of guide grooves.
9. The wiring substrate electrostatic discharge device according to claim 1, wherein The wiring substrate static electricity releasing device further includes a mounting shell covering the static electricity releasing ring, and the bottom side of the mounting shell is formed with a static electricity opening, and the static electricity releasing ring is exposed to the static electricity opening.
10. An electrostatic discharge device, characterized by, The wiring substrate static electricity releasing device further includes a mounting shell covering the static electricity releasing ring, and the bottom side of the mounting shell is formed with a static electricity opening, and the static electricity releasing ring is exposed to the static electricity opening. The wiring substrate static electricity releasing device further includes a mounting shell covering the static electricity releasing ring, and the bottom side of the mounting shell is formed with a static electricity opening, and the static electricity releasing ring is exposed to the static electricity opening.