Heat dissipation structure of electronic equipment and electronic equipment

Abstract

The utility model is suitable for the technical field of electrical equipment, and provides a heat dissipation structure of electronic equipment and the electronic equipment, the heat dissipation structure comprises a circuit board, a power device and a first metal plate, the circuit board is provided with a first surface and a second surface which are opposite, the power device is arranged on the first surface of the circuit board, and the first metal plate is provided with a bonding pad. The first metal plate is in welded connection with the second surface through the bonding pad, so that the first metal plate receives heat generated by the power device for heat dissipation and conducts current through the circuit board. The first metal plate is directly welded on the circuit board to play roles of heat dissipation and overcurrent, screw fixation is not needed, the product cost is reduced, the first metal plate is welded on the circuit board, deformation of the circuit board caused by heating of the power device can be eliminated, the stress of the power device is reduced, and the reliability of the product is improved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of electrical equipment, and particularly relates to a heat dissipation structure of an electronic device and the electronic device. BACKGROUND

[0002] Electronic devices are usually provided with power devices, for example, the control system built in the electric tool includes MOS tubes and other components, and the components generate relatively large heat, so a heat dissipation fin is usually needed to assist heat dissipation.

[0003] Generally, the installation mode of the heat dissipation fin is a circuit board + a heat conduction pad + a heat dissipation fin + a screw, and the circuit board and the heat dissipation fin are fixed together through the screw.

[0004] However, the installation mode causes the circuit board to deform, resulting in stress of the components, and thus reducing the reliability of the product. SUMMARY

[0005] The embodiment of the application provides a heat dissipation structure of an electronic device, and aims to solve the problem that the existing heat dissipation structure of the electronic device causes the circuit board to deform, resulting in stress of the components and reducing the reliability of the product.

[0006] The embodiment of the application is achieved in the following manner, a heat dissipation structure is provided, which comprises:

[0007] a circuit board, the circuit board has a first surface and a second surface opposite to each other;

[0008] a power device, the power device is arranged on the first surface;

[0009] a first metal plate, the first metal plate is provided with a solder pad, and the first metal plate is welded to the second surface through the solder pad, so that the first metal plate receives heat generated by the power device for heat dissipation and conducts current with the circuit board.

[0010] Further, the heat dissipation structure further comprises a first heat dissipation fin connected to the first metal plate.

[0011] Further, the power device is located in a partial region of the first surface, and a projection of the first metal plate on the first surface overlaps the partial region.

[0012] Further, the heat dissipation structure further comprises a second metal plate, which is arranged on the first surface and in contact with the power device.

[0013] Further, the heat dissipation structure further comprises a pad, which is arranged between the second metal plate and the power device.

[0014] Further, the heat dissipation structure further comprises a second heat dissipation fin connected to the second metal plate.

[0015] Further, the second metal plate and the first metal plate are connected by a screw.

[0016] Further, the first metal plate is provided with a solder pad, and the first metal plate is welded to the second surface through the solder pad.

[0017] In a second aspect, the present application also provides an electronic device comprising the heat dissipation structure as described above.

[0018] Further, the electronic device further comprises a housing, and the housing has a containing space, and the heat dissipation structure is arranged in the containing space.

[0019] Further, the housing comprises at least one of a plastic housing and a metal housing.

[0020] The electronic device provided by the present application comprises a circuit board, a power device and a first metal plate, the circuit board has a first surface and a second surface opposite to each other, the power device is arranged on the first surface of the circuit board, the first metal plate is provided with a solder pad, and the first metal plate is welded to the second surface through the solder pad, so that the first metal plate receives heat generated by the power device for heat dissipation and conducts current with the circuit board. By directly welding the first metal plate on the circuit board, the functions of heat dissipation and overcurrent are realized, and the product cost is reduced without the need of screwing. In addition, the deformation of the circuit board caused by the heat generated by the power device can be eliminated, the stress of the power device is reduced, and the reliability of the product is improved. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 is a structural schematic diagram of an embodiment of the heat dissipation structure of the electronic device provided by the present application;

[0022] Figure 2 is a structural schematic diagram of another embodiment of the heat dissipation structure provided by the present application;

[0023] Figure 3 is a structural schematic diagram of an embodiment of the heat dissipation structure provided by the present application comprising a second metal plate;

[0024] Figure 4 is a structural schematic diagram of an embodiment of the heat dissipation structure provided by the present application, in which the second metal plate and the first metal plate are connected;

[0025] Figure 5 is a structural schematic diagram of an embodiment of the heat dissipation structure provided by the present application comprising a housing.

[0026] Reference Signs: 110-circuit board, 111-first surface, 112-second surface, 120-power device, 130-first metal plate, 140-second metal plate, 150-second heat dissipation fin, 160-housing. DETAILED DESCRIPTION

[0027] In order to make the purposes, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings and embodiments. The examples of the embodiments are shown in the drawings, wherein identical or similar labels denote identical or similar elements or elements with identical or similar functions throughout. The embodiments described below by reference to the drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation on the present application. In addition, it should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0028] In the description of the present application, it should be understood that the terms "length", "width", "upper", "lower", "left", "right", "horizontal", "top", "bottom" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0029] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly specified and limited.

[0030] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be a fixed connection, or a detachable connection, or an integral connection; it can be a mechanical connection, or an electrical connection or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, or the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0031] In the present application, unless otherwise explicitly specified and limited, the "upper" or "lower" of the first feature to the second feature can include the direct contact of the first and second features, or can include the contact of the first and second features through another feature between them. Moreover, the "upper", "upper" and "upper" of the first feature to the second feature include the vertical direction of the first feature above and obliquely above the second feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The "below", "below" and "below" of the first feature to the second feature include the vertical direction of the first feature below and obliquely below the second feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0032] The following disclosure provides many different embodiments, or examples, for implementing different structures of the present application. For the purpose of simplifying the present application, the components and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeatedly refer to numerical values and / or reference letters in different examples, and such repetition is for the purpose of simplification and clarity, which does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides examples of various specific processes and materials, but those skilled in the art can realize the application of other processes and / or the use of other materials.

[0033] The heat dissipation structure of the electronic device provided by the present application comprises a circuit board, a power device and a first metal plate. The circuit board has a first surface and a second surface opposite to each other. The power device is arranged on the first surface of the circuit board. The first metal plate is provided with a solder pad. The first metal plate is welded to the second surface through the solder pad, so that the first metal plate receives the heat generated by the power device for heat dissipation and conducts current with the circuit board. By directly welding the first metal plate on the circuit board, the functions of heat dissipation and overcurrent are realized, without the need for screw fixation, reducing product cost, and eliminating the deformation of the circuit board caused by the heat generated by the power device, reducing the stress of the power device, and improving the reliability of the product.

[0034] As shown in Figures 1 to 5 An embodiment of the present application provides a heat dissipation structure, comprising:

[0035] a circuit board 110, the circuit board 110 has a first surface 111 and a second surface 112 opposite to each other;

[0036] a power device 120, the power device 120 is arranged on the first surface 111;

[0037] a first metal plate 130, the first metal plate 130 is provided with a solder pad (not shown in the figure), and the first metal plate 130 is welded to the second surface 112 through the solder pad, so that the first metal plate 130 receives the heat generated by the power device 120 for heat dissipation and conducts current with the circuit board 110.

[0038] In implementation, the circuit board 110 refers to a PCB (Printed Circuit Board, printed circuit board 110), also known as a printed wiring board, which is an important electronic component, a support for electronic components, and a carrier for electrical connection between electronic components.

[0039] Optionally, the circuit board 110 can also be a PCBA (Printed Circuit Board Assembly), which means that the PCB bare board is subjected to SMT (Surface Mount Technology) mounting or DIP (Dual In-line Package) plug-in processing.

[0040] The first surface 111 of the circuit board 110 is provided with a power device 120, which is electrically connected with the circuit of the circuit board 110. The power device 120 includes but is not limited to a diode, a triode, a MOS tube, a thyristor or other semiconductor devices, without limitation.

[0041] It should be noted that the circuit board 110 described above is also provided with other components, including but not limited to resistors, capacitors, inductors and chips, etc., which will not be described in detail.

[0042] The first metal plate 130 is made of an aluminum substrate, a copper substrate or other metal substrates, without limitation.

[0043] The first metal plate 130 is arranged on the second surface 112 of the circuit board 110, and the first metal plate 130 is directly welded on the second surface 112 of the circuit board 110 by arranging a solder pad on the first metal plate 130. For example, the welding connection between the first metal plate 130 and the circuit board 110 is achieved by SMT machine mounting, on the one hand, without using screws to connect the first metal plate 130 and the circuit board 110, controlling the cost of the product, on the other hand, the first metal plate 130 is attached to the circuit board 110, which is conducive to the heat generated by the power device 120 being transferred to the first metal plate 130 for heat dissipation and overcurrent effect, reducing the deformation of the circuit board 110 and ensuring the flatness of the circuit board 110.

[0044] The heat dissipation structure of the electronic device provided in the present application includes a circuit board 110, a power device 120 and a first metal plate 130, the circuit board 110 has a first surface 111 and a second surface 112 opposite to each other, the power device 120 is arranged on the first surface 111 of the circuit board 110, the first metal plate 130 is provided with a solder pad, and the first metal plate 130 is welded and connected with the second surface 112 through the solder pad, so that the first metal plate 130 receives the heat generated by the power device 120 for heat dissipation and conducts current with the circuit board 110. By directly welding the first metal plate 130 on the circuit board 110, the heat dissipation and overcurrent effects are achieved, without the need for screw fixation, reducing the product cost, and eliminating the deformation of the circuit board 110 caused by the heat generated by the power device 120, reducing the stress of the power device 120 and improving the reliability of the product.

[0045] In some embodiments, a first heat dissipation fin (not shown in the figure) is further included, and the first heat dissipation fin is connected with the first metal plate 130. By further arranging the first heat dissipation fin on the basis of the first metal plate 130, the heat dissipation effect can be effectively improved.

[0046] Further, the power device 120 is located in a partial region of the first surface 111, and the projection of the first metal plate 130 on the first surface 111 overlaps the partial region.

[0047] In implementation, due to wiring and other reasons, the power device 120 is usually concentratedly distributed in a partial region of the first surface 111, for example, a plurality of MOS transistors are arranged in the middle region or the edge region of the first surface 111 of the circuit board 110. At this time, the first metal plate 130 can be arranged in a region corresponding to the position of the power device 120, for example, when a plurality of power devices 120 are arranged in the middle region of the first surface 111 of the circuit board 110, the first metal plate 130 can be arranged in the middle region of the second surface 112. Through the above arrangement, the heat dissipation performance can be ensured while reducing the amount of the first metal plate 130, thereby controlling the product cost.

[0048] Further, a second metal plate 140 is further included, and the second metal plate 140 is arranged on the first surface 111 of the circuit board 110 and in contact with the power device 120. By the contact between the second metal plate 140 and the power device 120, the first metal plate 130 and the second metal plate 140 simultaneously dissipate heat for the power device 120, thereby further improving the heat dissipation effect.

[0049] Further, a gasket is further included, and the gasket is arranged between the second metal plate 140 and the power device 120.

[0050] In implementation, the gasket can be made of a heat-conducting flexible material, such as silica gel, and the gasket is arranged between the second metal plate 140 and the first surface 111 to protect the power device 120.

[0051] Further, a second heat dissipation fin 150 is further included, and the second heat dissipation fin 150 is connected with the second metal plate 140. By arranging the second heat dissipation fin 150, the heat dissipation area can be further improved, the heat dissipation effect can be improved, and the product power density can be improved.

[0052] Further, the second metal plate 140 and the first metal plate 130 are connected by screws, so that the second metal plate 140 and the first metal plate 130 are connected into a whole, the connection is more stable and reliable, and the heat dissipation effect can be further improved.

[0053] As a possible implementation, the second metal plate 140 can be arranged to include the second heat dissipation fin 150, that is, the second metal plate 140 and the second heat dissipation fin 150 are an integral piece, thereby simplifying the assembly process.

[0054] Further, the first metal plate 130 is provided with a solder pad (not shown in the figure), and the first metal plate 130 is connected to the second surface 112 of the circuit board 110 by soldering through the solder pad. In the SMT production, the first metal plate 130 is mounted on the circuit board 110 by a chip mounter, and then is welded by reflow soldering. The first metal plate 130 plays a role of heat dissipation and overcurrent in the whole system.

[0055] In some possible embodiments, a gasket can also be arranged between the first metal plate 130 and the circuit board 110, and the overall assembly structure of the heat dissipation structure is the first metal plate 130, the gasket, the circuit board 110, the gasket, and the second metal plate 140. Such an installation structure can make the pressure received by the circuit board 110 evenly dispersed, and greatly reduce the stress of the circuit board 110.

[0056] In the second aspect, the present application also provides an electronic device including the heat dissipation structure as described above.

[0057] In implementation, the electronic device includes but is not limited to a communication device, a smart device, a power supply, or an electronic device for automotive electronics, medical equipment, household appliances, and the like, without specific limitation.

[0058] As a possible implementation, the electronic device further includes a housing 160 having a containing space, and the heat dissipation structure is arranged in the containing space to protect the heat dissipation structure.

[0059] Optionally, the housing 160 can adopt at least one of a plastic housing and a metal housing, and preferably adopts a metal housing to further improve the heat dissipation effect and improve the power density of the product.

[0060] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the structure and implementation principle of the electronic device described above can refer to the corresponding structure and implementation principle in the foregoing embodiments, which will not be described herein.

[0061] The heat dissipation structure of the electronic device provided in the application comprises a circuit board 110, a power device 120 and a first metal plate 130, the circuit board 110 has a first surface 111 and a second surface 112 opposite to each other, the power device 120 is arranged on the first surface 111 of the circuit board 110, and the first metal plate 130 is provided with a solder pad and is welded to the second surface 112 through the solder pad, so that the first metal plate 130 receives the heat generated by the power device 120 for heat dissipation and conducts current with the circuit board 110. The first metal plate 130 is directly welded on the circuit board 110 to play the roles of heat dissipation and overcurrent, without the need of screwing, thereby reducing the product cost, and the welding of the first metal plate 130 on the circuit board 110 can eliminate the deformation of the circuit board 110 caused by the heat generated by the power device 120, reduce the stress of the power device 120 and improve the reliability of the product.

[0062] The above only is the preferred embodiment of the application, and does not limit the application, and any modification, equivalent replacement and improvement made within the spirit and principle of the application shall be included in the protection scope of the application.

Claims

1. A heat dissipation structure of an electronic device, characterized by comprising: The application relates to a heat dissipation structure of an electronic device. The heat dissipation structure comprises: a circuit board having a first surface and a second surface opposite to each other; a power device arranged on the first surface; 2. The heat dissipating structure according to claim 1, wherein a first metal plate provided with a soldering pad, the first metal plate being connected to the second surface by the soldering pad, so that the first metal plate receives heat generated by the power device and dissipates the heat and conducts electricity with the circuit board.

3. The heat dissipating structure according to claim 1 or 2, wherein The heat dissipation structure further comprises a first heat dissipation fin connected to the first metal plate.

4. The heat dissipating structure according to claim 1, wherein The power device is arranged on a partial region of the first surface, and a projection of the first metal plate on the first surface overlaps the partial region.

5. The heat dissipating structure according to claim 4, wherein The heat dissipation structure further comprises a second metal plate arranged on the first surface and in contact with the power device.

6. The heat dissipating structure according to claim 4 or 5, wherein The heat dissipation structure further comprises a gasket arranged between the second metal plate and the power device.

7. The heat dissipating structure according to claim 4, wherein The heat dissipation structure further comprises a second heat dissipation fin connected to the second metal plate.

8. An electronic device, comprising: The second metal plate and the first metal plate are connected by a screw.

9. The electronic device of claim 8, wherein, The electronic device comprises the heat dissipation structure as claimed in any one of claims 1 to 7.

10. The electronic device of claim 9, wherein, The electronic device further comprises a housing having a receiving space, and the heat dissipation structure is arranged in the receiving space. The housing comprises at least one of a plastic housing and a metal housing.

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