IGBT heat dissipation structure of high-power frequency conversion board

Abstract

The utility model discloses an IGBT (Insulated Gate Bipolar Translator) heat dissipation structure of a high-power frequency conversion board, which comprises a PCB (Printed Circuit Board) provided with a plurality of IGBTs, and is characterized in that the plurality of IGBTs are directly welded on the same side of the PCB; each IGBT is provided with a radiating fin, and the radiating fins are welded at the accessory positions on the different sides of the IGBTs on the PCB; the radiating fins are of a flag-shaped structure. According to the utility model, the radiating fins are arranged on each IGBT accessory, so that the radiating efficiency is improved, the problem of serious heating of the existing high-power frequency conversion board is solved, and the defects in the prior art are overcome.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of heat dissipation of circuit board, in particular to a large power frequency conversion board IGBT heat dissipation structure. BACKGROUND

[0002] IGBT device is the core component in the frequency conversion board, and the voltage and frequency can be adjusted by the opening and closing of IGBT in the frequency conversion board. However, IGBT device releases a large amount of heat during work, especially in the large power frequency conversion board, a plurality of IGBT devices are often installed, so that the PCB board generates a large amount of heat, which affects the use performance and service life. The existing frequency conversion board generally dissipates heat through the PCB board, and such a way requires a large PCB board area, which is not conducive to the precision design of electronic products. CONTENT OF THE UTILITY MODEL

[0003] The utility model discloses a large power frequency conversion board IGBT heat dissipation structure, solve the problem of the existing large power frequency conversion board heat serious, overcome the deficiency of prior art.

[0004] The utility model discloses a large power frequency conversion board IGBT heat dissipation structure, including installing a plurality of IGBT's PCB board, its characterized in that, a plurality of IGBTs are directly welded on the same side of the PCB board, each IGBT is allocated a fin, and the fin is welded on the opposite side of the IGBT on the PCB board, and the fin is a flag structure.

[0005] Further, the fin can also be welded on the same side of the IGBT on the PCB board.

[0006] Further, the fin uses brass material.

[0007] Further, the fin is welded on the PCB board using the process of wave soldering.

[0008] Further, the fin includes a flag face at the upper end, a thickened rod body at the middle part and a pin at the lower end.

[0009] The utility model has the advantages that the utility model provides a large power frequency conversion board IGBT heat dissipation structure, installs the fin on each IGBT accessory, improves the heat dissipation efficiency, solves the problem of the existing large power frequency conversion board heat serious, and overcomes the deficiency of prior art. DRAWINGS

[0010] Fig. 1 It is a whole schematic view of the large power frequency conversion board IGBT heat dissipation structure.

[0011] Fig. 2The utility model discloses a high -power frequency conversion board IGBT heat radiation structure another embodiment's whole schematic diagram.

[0012] Fig. 3 The utility model discloses a high -power frequency conversion board IGBT heat radiation structure fin's structure schematic view.

[0013] Among them, Figs. 1-3 The correspondence between the reference signs and the component names in the drawings is as follows:

[0014] 1 IGBT, 2 PCB board, 3 fin, 4 flag surface, 5 pole body, 6 pin, 7 through hole. Specific embodiments

[0015] The technical solutions of the present application will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments.

[0016] The components of the embodiments of the present application described and shown in the accompanying drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but only represents selected embodiments of the present application.

[0017] Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0018] In the description of the present application, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0019] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0020] The following will be described with reference toFigs. 1-3 The application discloses a high-power variable-frequency board IGBT heat dissipation structure.

[0021] The application discloses a high-power variable-frequency board IGBT heat dissipation structure.

[0022] The application discloses a high-power variable-frequency board IGBT heat dissipation structure.

[0023] The application discloses a high-power variable-frequency board IGBT heat dissipation structure.

[0024] The application discloses a high-power variable-frequency board IGBT heat dissipation structure.

Claims

1. A high-power variable frequency board IGBT heat dissipation structure comprising a PCB board on which a plurality of IGBTs are mounted, characterized in that, Several IGBTs are directly soldered on the same side of the PCB board; Each IGBT is assigned a heat sink, which is soldered on the PCB board at a position adjacent to the opposite side of the IGBT; The heat sink is in a flag-shaped structure.

2. The high-power frequency conversion board IGBT heat dissipation structure according to claim 1, characterized in that, The heat sink can also be soldered on the PCB board near the same side of the IGBT.

3. The high-power frequency board IGBT heat dissipation structure according to claim 1, characterized in that, The heat sink is made of brass.

4. The high-power frequency board IGBT heat dissipation structure according to claim 1, characterized in that, The process used to solder the heat sink on the PCB board is wave soldering.

5. The high-power frequency board IGBT heat dissipation structure according to claim 1, characterized in that, The heat sink includes a flag face at the upper end, a thickened rod body at the middle, and a pin at the lower end.

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