Heat dissipation shell and power adapter

Abstract

The utility model relates to the technical field of power adapters, in particular to a heat dissipation shell and a power adapter. Wherein the heat dissipation shell comprises a heat dissipation shell body, the heat dissipation shell body is provided with a shell body inner cavity, the shell body inner cavity is provided with a heat dissipation fin assembly, the heat dissipation fin assembly is connected to the inner wall of the heat dissipation shell body through integral injection molding or ultrasonic welding, and the heat dissipation fin assembly is made of metal materials. The radiating fin assembly provided by the utility model can accelerate the radiating effect, effectively reduce the internal temperature of the inner cavity of the shell, and protect the internal control circuit board, thereby prolonging the service life of the power adapter. The contact area between the radiating fin assembly and the radiating shell can be increased through the radiating fin assembly made of the metal material, when a heat source on the circuit board works to generate heat, the heat is firstly transferred to the metal radiating fin assembly close to the heat source, and then the heat is quickly transferred to the radiating shell, so that the radiating effect is improved. Therefore, the problem that the circuit board is damaged due to heat accumulation is solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to power adapter technical field, concretely is heat dissipation shell and power adapter. BACKGROUND

[0002] Power adapter is small -size portable electronic equipment and electronic power supply conversion equipment, is widely matched in various electronic equipment, generally is composed by shell and circuit board, can be divided into alternating -current output type and direct current output type according to its output type;It can be divided into wall -type and desktop type according to the connection mode.The shell of traditional power adapter is by plastic injection molding, since the shell of power adapter is completely sealed, heat needs to be dissipated through the plastic shell, since the thermal conductivity of plastic is low, heat is difficult to dissipate, the internal temperature is too high to easily lead to the heat generated in the circuit board cannot be dissipated, thereby damaging the internal control circuit board, influence its service life.

[0003] Therefore, the structure of the shell needs to be improved, and the service life of the power adapter is improved by improving the heat dissipation effect of the shell. INVENTION CONTENTS

[0004] In view of the above-mentioned technical problems that the thermal conductivity of plastic is low, heat is difficult to dissipate, the internal temperature is too high to easily lead to the heat generated in the high-heat power tube of the circuit board cannot be dissipated, thereby damaging the internal control circuit board, influence its service life, the utility model solves its technical problems by adopting the technical scheme of:

[0005] The heat dissipation shell comprises a shell body, a shell cavity is formed in the shell body, a heat dissipation fin assembly is arranged in the shell cavity, the heat dissipation fin assembly is connected to the inner wall of the heat dissipation shell by one-piece injection molding or ultrasonic welding, and the heat dissipation fin assembly is made of metal.

[0006] Further, in some embodiments of the utility model, the heat dissipation shell comprises an upper shell body enclosing the shell cavity, and a lower shell body connected to the upper shell body, and the heat dissipation fin assembly comprises a first heat dissipation fin connected to the upper shell body and a second heat dissipation fin connected to the lower shell body.

[0007] Further, in some embodiments of the utility model, the first heat dissipation fin is connected to the upper top surface of the upper shell body, the second heat dissipation fin is connected to the lower bottom surface of the lower shell body, and the first heat dissipation fin and the second heat dissipation fin are oppositely arranged.

[0008] Further, in some embodiments of the utility model, one side of first fin is connected with first connecting plate, one side of second fin is connected with second connecting plate, first fin is located between upper shell and first connecting plate, second fin is located between lower shell and second connecting plate.

[0009] Further, in some embodiments of the utility model, first connecting plate and / or second connecting plate are provided with connecting plate hollow end, and the connecting plate hollow end is provided in a groove or hole shape.

[0010] Further, in some embodiments of the utility model, first fin and / or second fin are provided with fin hollow end, and the fin hollow end is provided in a groove or hole shape.

[0011] Further, in some embodiments of the utility model, first fin is arranged along the circumferential side of upper shell, and second fin is arranged along the circumferential side of lower shell.

[0012] Further, in some embodiments of the utility model, first fin and second fin are provided in a flat plate or cylinder shape, first fin is connected to the inner side of all or part of upper shell, second fin is arranged on the inner side of all or part of lower shell, and first fin and second fin are made of copper or aluminum material.

[0013] Further, in some embodiments of the utility model, first connecting plate and / or upper shell are provided with first groove for accommodating first fin, second connecting plate and / or lower shell are provided with second groove for accommodating second fin, and first connecting plate and second connecting plate are made of plastic material.

[0014] Further, in some embodiments of the utility model, the power adapter comprises the heat dissipation shell.

[0015] The utility model has the advantages of the following:

[0016] The fin assembly of the utility model can accelerate the heat dissipation effect, effectively reduce the internal temperature of the shell cavity, protect the internal parts, thereby prolonging the service life of the equipment device. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 This is a schematic diagram of the heat dissipation shell of this utility model.

[0018] Figure 2 for Figure 1 AA sectional view.

[0019] Figure 3 for Figure 1 AA sectional view and enlarged partial view.

[0020] Figure 4 for Figure 1 AA sectional view and enlarged partial view.

[0021] Figure 5 for Figure 1 AA sectional view and enlarged partial view.

[0022] Figure 6 for Figure 1 AA sectional view and enlarged partial view. Detailed Implementation

[0023] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0024] like Figures 1 to 6 The heat dissipation housing shown includes a heat dissipation housing 1, the heat dissipation housing 1 has a housing cavity 2, the housing cavity 2 has a heat dissipation fin assembly 3, the heat dissipation fin assembly 3 is integrally injection molded or ultrasonically welded to the inner wall of the heat dissipation housing 1, and the heat dissipation fin assembly 3 is made of metal.

[0025] Specifically, in some embodiments, the heat sink assembly of this invention can accelerate heat dissipation, effectively reduce the internal temperature of the housing cavity, protect the internal control circuit board, and thus extend the service life of the power adapter. This invention uses a metal heat sink assembly, fixed to the heat sink housing via integral injection molding or ultrasonic welding, which increases the contact area between the heat sink assembly and the heat sink housing. When a heat source on the circuit board, such as a high-heat power transistor, generates heat, the heat is first transferred to the nearby metal heat sink assembly. Due to the good connection between the metal heat sink assembly and the inner wall of the heat sink housing, the heat is rapidly conducted to the heat sink housing. The heat sink housing, with its large surface area, can dissipate the heat into the surrounding air, forming an efficient heat dissipation channel from the heat source to the heat sink assembly, then to the heat sink housing, and finally to the air, thereby solving the problem of circuit board damage caused by heat accumulation.

[0026] Specifically, the heat sink housing serves as an integral protective and heat dissipation structure, with its internal cavity providing space for components such as the power adapter's circuit board. One-piece injection molding ensures a tight bond between the heat sink assembly and the housing during manufacturing, guaranteeing a good heat conduction path and reducing thermal resistance caused by poor contact. Ultrasonic welding efficiently secures the heat sink assembly within the housing cavity, meeting various production process and cost requirements.

[0027] Specifically, the heat sink assembly is made of a metal material with high thermal conductivity, which has a much better thermal conductivity than plastic. The metal heat sink assembly can effectively absorb and transfer heat from heat sources such as high-heat power tubes on the circuit board. By accelerating the heat dissipation effect, the heat is dissipated to the surrounding environment, effectively reducing the internal temperature of the housing cavity, protecting the internal control circuit board, and thus extending the service life of the power adapter.

[0028] Of course, the heat dissipation shell of this utility model can also be applied to other electrical devices that can generate heat internally, thereby protecting internal components and extending the service life of the device.

[0029] like Figures 2 to 6 The heat dissipation housing shown includes an upper housing 11 that surrounds and forms the inner cavity 2 of the housing, and a lower housing 12 connected to the upper housing 11. The heat sink assembly 3 includes a first heat sink 31 connected to the upper housing 11 and a second heat sink 32 connected to the lower housing 12.

[0030] Furthermore, as a preferred embodiment of this utility model and not a limitation thereof, the upper shell and the lower shell together form the inner cavity of the shell, which serves as the main structural support of the power adapter and can protect the internal components from external environmental factors such as dust and moisture. The upper shell and the lower shell can be connected by snaps, fasteners, mortises, grooves, etc., to ensure good sealing and mechanical strength of the heat dissipation shell, while facilitating the installation and fixing of the heat sink assembly.

[0031] Specifically, the first heat sink is connected inside the upper housing, which can accelerate the heat dissipation of heat sources near the upper housing. When the power adapter is working, the first heat sink located on the upper housing can effectively absorb the heat generated by heat-generating components such as high-heat power transistors near the upper part of the circuit board. Since the first heat sink is connected to the upper housing, it can quickly conduct heat to the upper housing and dissipate the heat to the surrounding environment using the large surface area of ​​the upper housing.

[0032] Specifically, the second heat sink is connected inside the lower shell, and the second heat sink at the position of the lower shell can absorb the heat generated by the lower part of the circuit board, so as to accelerate the heat dissipation of the heat source near the lower shell and other components needing heat dissipation. The first heat sink and the second heat sink can more comprehensively and evenly transfer the heat generated by different positions of the circuit board, avoid local overheating, and form a more efficient heat dissipation network through cooperative work to improve the heat dissipation efficiency.

[0033] As shown in the heat dissipation shell, Figures 2 to 5 The first heat sink 31 is connected to the upper top surface of the upper shell 11, the second heat sink 32 is connected to the lower bottom surface of the lower shell 12, and the first heat sink 31 and the second heat sink 32 are oppositely arranged.

[0034] Specifically, the first heat sink and the second heat sink are respectively located at the top and bottom of the upper shell and the lower shell. When the power adapter works, the heat generated inside gradually rises. Since the first heat sink and the second heat sink are respectively located at the upper and lower opposite positions, the air will naturally rise after being heated, and the heat will be transferred from the first heat sink above, and the heat near the second heat sink will be quickly transferred from the second heat sink below, avoiding the heat being concentrated in a certain direction or area, so that the temperature distribution around the entire circuit board is more uniform. Such arrangement helps to accelerate the transfer and dissipation of heat and improve the heat dissipation effect.

[0035] As shown in the heat dissipation shell, Figure 3 And Figure 5 The first heat sink 31 is connected with the first connecting plate 41 on one side, the second heat sink 32 is connected with the second connecting plate 42 on one side, the first heat sink 31 is located between the upper shell 11 and the first connecting plate 41, and the second heat sink 32 is located between the lower shell 12 and the second connecting plate 42.

[0036] Further, as a preferred embodiment of the utility model but not limited, the first connecting plate and the second connecting plate serve as a bridge between the heat sink assembly and the heat dissipation shell, and enhance the stability and mechanical strength of the entire heat dissipation structure. The arrangement of the first connecting plate and the second connecting plate can ensure the close connection between the heat sink assembly and the heat dissipation shell, and prevent loosening or damage caused by vibration or impact.

[0037] Specifically, since the first connecting plate and the second connecting plate are closer to the position of the heat source, part of the heat can be transferred from the heat source to the first connecting plate and the second connecting plate through the first connecting plate and the second connecting plate, and then transferred to the heat dissipation shell through the heat sink assembly, and then dissipated to the external environment.

[0038] Optionally, in some embodiments, the first connecting plate and the second connecting plate can be metal materials.

[0039] Optionally, in some embodiments, the first connecting plate and the second connecting plate can be made of plastic.

[0040] Optionally, in some embodiments, the first connecting plate can be connected to the upper shell by snap, fastener, mortise and tenon, slot connection, ultrasonic welding, one-piece molding, etc.

[0041] Optionally, in some embodiments, the second connecting plate can be connected to the lower shell by snap, fastener, mortise and tenon, slot connection, ultrasonic welding, one-piece molding, etc.

[0042] As shown in the heat dissipation shell, Figure 5 the first connecting plate 41 and / or the second connecting plate 42 is provided with a connecting plate hollow end 43, which is in the form of a groove or a hole.

[0043] Optionally, in some embodiments, when the connecting plate hollow end is in the form of a groove or a hole, the air flow around the heat dissipation fins can be effectively increased. During the operation of the power adapter, heat is conducted to the first connecting plate and the second connecting plate through the heat dissipation fins, and hot air can rise or flow from the hole-shaped connecting plate hollow end or the groove-shaped connecting plate hollow end. The connecting plate hollow end provides a passage for air, and part of the air can directly contact the heat dissipation fin assembly made of metal and accelerate the dissipation of heat. On the basis of stable fixation of the heat dissipation fin assembly, the heat dissipation efficiency can be further improved, which helps to more quickly transfer the heat generated by the circuit board to the surrounding environment.

[0044] Specifically, when the first connecting plate and the second connecting plate conduct heat slowly, the part of the contact area of the heat dissipation fin assembly and the first connecting plate and the second connecting plate will appear a situation of too high temperature due to heat accumulation. The setting of the connecting part hollow end increases the air flow path, so that the air can flow more smoothly through the local area of the first connecting plate and the second connecting plate, thereby improving the heat dissipation efficiency. Such a setting also reduces the material requirements for the first connecting plate and the second connecting plate.

[0045] As shown in the heat dissipation shell, Figure 5The heat dissipation shell is provided with a heat dissipation fin hollow end 33 on the first heat dissipation fin 31 and / or the second heat dissipation fin 32, and the heat dissipation fin hollow end 33 is provided in a groove shape or a hole shape. Further, as a preferred embodiment of the utility model but not limited, the design of the heat dissipation fin hollow end breaks the continuity of the surface of the heat dissipation fin assembly, the groove-shaped or hole-shaped heat dissipation fin hollow end increases the surface area of the heat dissipation fin assembly in contact with air, the outer surface of the heat dissipation fin assembly and the inner surface of the heat dissipation fin hollow end are involved in the heat exchange process, when the heat dissipation fin hollow end is a groove-shaped or hole-shaped hollow end, the inner wall of each groove or hole increases the additional heat dissipation area, further improves the heat dissipation capacity, and helps to more effectively reduce the temperature around the circuit board, so that air can more easily pass through the heat dissipation fin assembly, forming more effective heat dissipation.

[0046] Optionally, in some embodiments, when the heat dissipation fin assembly is connected to the inner wall of the heat dissipation shell by integral injection molding, the heat dissipation shell can be connected with the heat dissipation fin hollow end, thereby increasing the contact area and further improving the connection strength of the heat dissipation fin assembly and the heat dissipation shell.

[0047] As shown in the heat dissipation shell, Figure 6 The first heat dissipation fin 31 is arranged along the circumferential side of the upper shell 11, and the second heat dissipation fin 32 is arranged along the circumferential side of the lower shell 12.

[0048] Further, as a preferred embodiment of the utility model but not limited, the first heat dissipation fin is arranged along the circumferential side of the upper shell and the second heat dissipation fin is arranged along the circumferential side of the lower shell, which can maximize the use of the surface area of the shell. This arrangement allows the heat dissipation fin to absorb heat from all around the circuit board, while the heat dissipation fin is arranged along the circumferential side of the heat dissipation shell, which can shorten the average heat conduction path length from the heat generating elements around the circuit board to the heat dissipation fin assembly, helping to improve the speed and efficiency of heat conduction. When the power adapter circuit board is working, the heat generated by the electronic elements in the peripheral area can be effectively captured by the heat dissipation fin assembly close to it. Compared with the way of arranging the heat dissipation fin assembly only in a local area, this circumferential arrangement can more comprehensively cover the heat source, reducing the possibility of heat leakage or local overheating.

[0049] As shown in the heat dissipation shell, Figures 2 to 6 The first heat dissipation fin 31 and the second heat dissipation fin 32 are arranged in a flat plate shape or a cylindrical shape, the first heat dissipation fin 31 is connected to the inner side of all or part of the upper shell 11, the second heat dissipation fin 32 is arranged on the inner side of all or part of the lower shell 12, and the first heat dissipation fin 31 and the second heat dissipation fin 32 are made of copper or aluminum.

[0050] Further, as the preferred embodiment of the utility model but not limited, when the first and second heat dissipation fins are flat, they can cover a larger area above or below the circuit board, and they can provide a larger planar area to contact the inner side of the upper and lower shells, and can be closely attached to the inner side of the heat dissipation shell, reducing air gap, reducing thermal resistance, improving heat dissipation efficiency, and transferring heat from various parts of the circuit board to the outside of the heat dissipation shell more evenly.

[0051] Certainly, the first heat dissipation fin can be arranged on the side and top of the upper shell, and the second heat dissipation fin can be arranged on the side and bottom of the lower shell.

[0052] Certainly, the first heat dissipation fin can be arranged on the side and top of the upper shell, and the second heat dissipation fin can be arranged on the side and bottom of the lower shell.

[0053] Further, as the preferred embodiment of the utility model but not limited, the cylindrical heat dissipation fin assembly surrounds the circuit board to form a three-dimensional heat dissipation structure, which can absorb heat generated by the circuit board from multiple angles, especially for the heat generating elements located in the central area of the circuit board. The cylindrical heat dissipation fin can provide more uniform heat dissipation effect.

[0054] Specifically, copper and aluminum materials both have high thermal conductivity, which can quickly conduct heat from the heat source to the heat dissipation fin assembly and dissipate to the air through the heat dissipation shell. Copper and aluminum materials both have good mechanical properties and corrosion resistance, which can ensure that the heat dissipation fin assembly maintains stable performance in long-term use.

[0055] Specifically, copper has good ductility and plasticity, and is easy to process into various shapes of heat dissipation fins. Whether flat or cylindrical, it can be manufactured accurately through stamping, forging and other processes to meet the design requirements of different power adapters.

[0056] Specifically, aluminum has a small density, and the heat dissipation fin assembly made of aluminum has a small weight, which can reduce the weight of the entire device and improve the portability of the device without affecting the heat dissipation performance.

[0057] Specifically, the heat dissipation fin assembly is arranged in the inner cavity of the shell, which fully utilizes the internal space of the inner cavity of the shell, avoids the need for additional external heat dissipation devices, and helps to maintain the compact structure and neat appearance of the power adapter.

[0058] For example, Figure 4 and Figure 5The first connecting plate 41 and / or the upper shell 11 is provided with a first recess 51 for accommodating the first heat sink 31, and the second connecting plate 42 and / or the lower shell 12 is provided with a second recess 52 for accommodating the second heat sink 32. The first connecting plate 41 and the second connecting plate 42 are made of plastic.

[0059] Further, as a preferred embodiment of the utility model but not limited, the first recess is used for accommodating the first heat sink, which can make the first heat sink have more accurate positioning during installation. The first heat sink can be accurately embedded in the first recess and tightly fit with the surrounding structure, reducing the gap caused by installation deviation or shaking during use. When the first heat sink is embedded in the first recess, the contact area between the first heat sink and the inner wall of the first recess is larger than that of the flat contact mode. The first recess provides a certain protection for the first heat sink, reduces the risk of damage of the first heat sink due to external force without increasing the additional space occupation, and guarantees the integrity and stability of the heat dissipation system.

[0060] Optionally, in some embodiments, the first heat sink connected in the first recess of the upper shell has a thickness less than or equal to the depth of the first recess of the upper shell.

[0061] In some embodiments, the first heat sink is flush with the inner wall of the inner cavity of the shell. Such a setting can reduce the space occupied by the first heat sink in the inner cavity of the shell.

[0062] In some other embodiments, the first heat sink is located on the inner side of the first recess of the upper shell.

[0063] In some other embodiments, the thickness of the first connecting plate and the first heat sink is less than or equal to the depth of the first recess of the upper shell.

[0064] In some embodiments, the first connecting plate is flush with the inner wall of the inner cavity of the shell. Such a setting can reduce the space occupied by the first heat sink and the first connecting plate in the inner cavity of the shell.

[0065] In some other embodiments, the thickness of the first heat sink is greater than the depth of the first recess, and part of the first heat sink is embedded in the first recess of the upper shell and part of the first heat sink is embedded in the first recess of the first connecting plate.

[0066] Similarly, the second recess can make the second heat sink and the lower shell or the second connecting plate have closer connection, larger contact area, better protection and more compact structure layout, and reduce the deformation or damage caused by improper installation of the second heat sink.

[0067] As Figures 1 to 6The power adapter shown includes the heat dissipation shell 1. The power adapter can maintain good heat dissipation performance through the design of the heat dissipation shell, and the fin assembly can accelerate the heat dissipation effect, effectively reduce the internal temperature of the cavity of the shell, protect the internal control circuit board, and thus prolong the service life of the power adapter. Specifically, the fin assembly is fixed on the heat dissipation shell by means of one-piece injection molding or ultrasonic welding connection, which can increase the contact area between the fin assembly and the heat dissipation shell. When the heat source on the circuit board, such as a high-heat power tube, works and generates heat, the heat is first transmitted to the metal fin assembly close to it. Since the metal fin assembly is well connected with the inner wall of the heat dissipation shell, the heat is quickly conducted to the heat dissipation shell. The heat dissipation shell has a large surface area and can dissipate heat to the surrounding air, forming an efficient heat dissipation channel from the heat source to the fin assembly, to the heat dissipation shell, and finally to the air, thereby solving the problem of circuit board damage caused by heat accumulation.

[0068] Embodiment 1

[0069] The heat dissipation shell includes a heat dissipation shell 1, the heat dissipation shell 1 is provided with a cavity 2, the cavity 2 is provided with a fin assembly 3, the fin assembly 3 is connected to the inner wall of the heat dissipation shell 1 by one-piece injection molding or ultrasonic welding, and the fin assembly 3 is made of metal material.

[0070] The fin assembly 3 of the utility model can accelerate the heat dissipation effect, effectively reduce the internal temperature of the cavity 2 of the shell, protect the internal parts, and thus prolong the service life of the equipment device. The fin assembly 3 is fixed on the heat dissipation shell 1 by means of one-piece injection molding or ultrasonic welding connection, which can increase the contact area between the fin assembly 3 and the heat dissipation shell 1. When the heat source on the part works and generates heat, the heat is first transmitted to the metal fin assembly 3 close to it, and the heat is quickly conducted to the heat dissipation shell 1, thereby solving the problem of part damage caused by heat accumulation.

[0071] Embodiment 2

[0072] The difference between embodiment 2 and embodiment 1 is that the fin assembly 3 is connected to the inner wall of the heat dissipation shell 1 by ultrasonic welding, and the fin assembly 3 is made of metal material.

[0073] Embodiment 3

[0074] The embodiment 3 is based on the embodiment 1, and has the following implementation: the heat dissipation shell 1 comprises an upper shell 11 enclosing the shell inner cavity 2, and a lower shell 12 connected with the upper shell 11, and the heat dissipation fin assembly 3 comprises a first heat dissipation fin 31 connected with the upper shell 11 and a second heat dissipation fin 32 connected with the lower shell 12. The upper shell 11 and the lower shell 12 are connected by buckling.

[0075] The embodiment 4

[0076] The embodiment 4 is based on the embodiment 3, and has the following implementation: the first heat dissipation fin 31 is connected with the upper top surface of the upper shell 11, the second heat dissipation fin 32 is connected with the lower bottom surface of the lower shell 12, and the first heat dissipation fin 31 and the second heat dissipation fin 32 are oppositely arranged. The upper shell 11 and the lower shell 12 are connected by a fastener connection mode.

[0077] The embodiment 5

[0078] The embodiment 5 is based on the embodiment 4, and has the following implementation: one side of the first heat dissipation fin 31 is connected with a first connecting plate 41, one side of the second heat dissipation fin 32 is connected with a second connecting plate 42, the first heat dissipation fin 31 is located between the upper shell 11 and the first connecting plate 41, and the second heat dissipation fin 32 is located between the lower shell 12 and the second connecting plate 42. The first connecting plate 41 and the second connecting plate 42 are made of plastic material. The first connecting plate 41 is connected with the upper shell 11 by ultrasonic welding connection mode. The second connecting plate 42 is connected with the lower shell 12 by ultrasonic welding connection mode.

[0079] The embodiment 6

[0080] The embodiment 6 is different from the embodiment 5 in that the first connecting plate 41 is connected with the upper shell 11 by buckling connection mode. The second connecting plate 42 is connected with the lower shell 12 by buckling connection mode.

[0081] The embodiment 7

[0082] The embodiment 7 is different from the embodiment 5 in that the first connecting plate 41 is connected with the upper shell 11 by one-piece forming mode. The second connecting plate 42 is connected with the lower shell 12 by one-piece forming connection mode.

[0083] The embodiment 8

[0084] The embodiment 8 is based on the embodiment 5, and has the following implementation: the first connecting plate 41 and the second connecting plate 42 are provided with a connecting plate hollow end 43, and the connecting plate hollow end 43 is provided in a groove shape.

[0085] The embodiment 9

[0086] In addition to the implementation of embodiment 5, embodiment 9 also has the following implementation: the first connecting plate 41 and the second connecting plate 42 are provided with connecting plate hollow ends 43, which are arranged in the form of holes.

[0087] Embodiment 10

[0088] In addition to the implementation of embodiment 3, embodiment 10 also has the following implementation: the first fin 31 and the second fin 32 are provided with fin hollow ends 33, which are arranged in the form of holes. The heat dissipation shell 1 has corresponding protrusions and fin hollow ends 33.

[0089] Embodiment 11

[0090] In addition to the implementation of embodiment 3, embodiment 11 also has the following implementation: the fin assembly 3 is connected to the inner wall of the heat dissipation shell 1 by ultrasonic welding. The first fin 31 and the second fin 32 are provided with fin hollow ends 33, which are arranged in the form of grooves.

[0091] Embodiment 12

[0092] The difference between embodiment 12 and embodiment 3 is that the first fin 31 is arranged along the circumferential side of the upper shell 11, and the second fin 32 is arranged along the circumferential side of the lower shell 12.

[0093] Embodiment 13

[0094] In addition to the implementation of embodiment 3, embodiment 13 has the following implementation: the first fin 31 and the second fin 32 are arranged in the form of flat plates. The first fin 31 and the second fin 32 are made of aluminum material.

[0095] Embodiment 14

[0096] In addition to the implementation of embodiment 3, embodiment 14 has the following implementation: the first fin 31 and the second fin 32 are arranged in the form of cylinders. The first fin 31 and the second fin 32 are made of copper material.

[0097] Embodiment 15

[0098] The difference between embodiment 15 and embodiment 4 is that the first fin 31 is arranged on the side surface and the upper top surface of the upper shell 11, and the second fin 32 is arranged on the side surface and the lower bottom surface of the lower shell 12.

[0099] Embodiment 16

[0100] The difference between embodiment 16 and embodiment 4 is that the first fin 31 is arranged on part of the side surface of the upper shell 11, and the second fin 32 is arranged on part of the side surface of the lower shell 12.

[0101] Example 17

[0102] The difference between Example 17 and Example 5 is that the upper shell 11 is provided with a first recess 51 for accommodating the first heat sink 31, and the lower shell 12 is provided with a second recess 52 for accommodating the second heat sink 32. The first heat sink 31 connected to the first recess 51 of the upper shell 11 has a thickness equal to the depth of the first recess 51 of the upper shell 11. The second heat sink 32 connected to the second recess 52 of the lower shell 12 has a thickness equal to the depth of the second recess 52 of the lower shell 12. The first heat sink 31 is flush with the inner wall of the shell cavity 2.

[0103] Example 18

[0104] The difference between Example 18 and Example 5 is that the first connecting plate 41 and the upper shell 11 are both provided with a first recess 51 for accommodating the first heat sink 31, and the second connecting plate 42 and the lower shell 12 are both provided with a second recess 52 for accommodating the second heat sink 32. The first connecting plate 41 and the first heat sink 31 have a thickness equal to the depth of the first recess 51 of the upper shell 11. The first connecting plate 41 is flush with the inner wall of the shell cavity 2. The second connecting plate 42 and the second heat sink 32 have a thickness equal to the depth of the second recess 52 of the lower shell 12. The second connecting plate 42 is flush with the inner wall of the shell cavity 2. The first connecting plate 41 and the second connecting plate 42 are made of aluminum.

[0105] Example 19

[0106] The difference between Example 19 and Example 5 is that the first connecting plate 41 and the upper shell 11 are both provided with a first recess 51 for accommodating the first heat sink 31, and the second connecting plate 42 and the lower shell 12 are both provided with a second recess 52 for accommodating the second heat sink 32. The first heat sink 31 has a thickness greater than the depth of the first recess 51, and part of the first heat sink 31 is embedded in the first recess 51 of the upper shell 11, and part of the first heat sink 31 is embedded in the first recess 51 of the first connecting plate 41. The second heat sink 32 has a thickness greater than the depth of the second recess 52, and part of the second heat sink 32 is embedded in the second recess 52 of the lower shell 12, and part of the second heat sink 32 is embedded in the second recess 52 of the second connecting plate 42.

[0107] Example 20

[0108] Example 20 is based on Example 1 or Example 2, and has the following implementation:

[0109] The power adapter comprises the heat dissipation shell 1. The power adapter can keep good heat dissipation performance through the design of the heat dissipation shell 1, the fin assembly 3 can accelerate the heat dissipation effect, effectively reduce the internal temperature of the cavity 2 of the shell, protect the internal control circuit board, thereby prolong the service life of the power adapter. Specifically, the fin assembly 3 of the metal material is fixed on the heat dissipation shell 1 by means of one-piece injection molding or ultrasonic welding connection, the contact area between the fin assembly 3 and the heat dissipation shell 1 can be increased, when the heat source on the circuit board such as a high heat power tube works to generate heat, the heat is first transmitted to the metal fin assembly 3 close to it, since the metal fin assembly 3 is well connected with the inner wall of the heat dissipation shell 1, the heat is rapidly conducted to the heat dissipation shell 1, the heat dissipation shell 1 has a large surface area and can dissipate heat to the surrounding air, forming an efficient heat dissipation channel from the heat source to the fin assembly 3, to the heat dissipation shell 1 and finally to the air, thereby solving the problem of circuit board damage caused by heat accumulation.

[0110] The above is only to further illustrate the technical content of the present application by way of examples, so that the reader can more easily understand, but does not represent that the embodiments of the present application are limited to this, any technical extension or re-creation made according to the present application is also protected by the present application. The protection scope of the present application is subject to the claims.

Claims

1. Heat dissipating housing, comprising a heat dissipating housing (1) provided with a housing inner chamber (2), characterized in that: The shell inner cavity (2) is provided with a fin assembly (3) which is connected to the inner wall of the heat dissipation shell (1) by integral injection molding or ultrasonic welding, and the fin assembly (3) is made of metal material.

2. The heat dissipating enclosure of claim 1, wherein: The heat dissipation shell (1) comprises an upper shell (11) which encloses the shell inner cavity (2), and a lower shell (12) connected to the upper shell (11), and the fin assembly (3) comprises a first fin (31) connected to the upper shell (11), and a second fin (32) connected to the lower shell (12).

3. The heat dissipating enclosure of claim 2, wherein: The first fin (31) is connected to the upper top surface of the upper shell (11), the second fin (32) is connected to the lower bottom surface of the lower shell (12), and the first fin (31) and the second fin (32) are oppositely arranged.

4. The heat dissipating enclosure of claim 2, wherein: One side of the first fin (31) is connected with a first connecting plate (41), one side of the second fin (32) is connected with a second connecting plate (42), the first fin (31) is located between the upper shell (11) and the first connecting plate (41), and the second fin (32) is located between the lower shell (12) and the second connecting plate (42).

5. The heat dissipating enclosure of claim 4, wherein: The first connecting plate (41) and / or the second connecting plate (42) is provided with a connecting plate hollow end (43) which is arranged in a groove or hole shape.

6. The heat dissipating enclosure of claim 2, wherein: The first fin (31) and / or the second fin (32) is provided with a fin hollow end (33) which is arranged in a groove or hole shape.

7. The heat dissipating enclosure of claim 2, wherein: The first fin (31) is arranged along the circumferential side of the upper shell (11), and the second fin (32) is arranged along the circumferential side of the lower shell (12).

8. The heat dissipating enclosure of claim 2, wherein: The first fin (31) and the second fin (32) are arranged in a flat plate or cylindrical shape, the first fin (31) is connected to the inner side of all or part of the upper shell (11), the second fin (32) is arranged on the inner side of all or part of the lower shell (12), and the first fin (31) and the second fin (32) are made of copper or aluminum material.

9. The heat dissipating enclosure of claim 4, wherein: The first connecting plate (41) and / or the upper shell (11) is provided with a first recess (51) for accommodating the first fin (31), the second connecting plate (42) and / or the lower shell (12) is provided with a second recess (52) for accommodating the second fin (32), and the first connecting plate (41) and the second connecting plate (42) are made of plastic material.

10. A power adapter characterized by: The heat dissipation shell (1) comprises the heat dissipation shell (1) according to any one of claims 1-9.

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