CSP (Chip Scale Package) structure and light-emitting equipment

Abstract

The utility model provides a CSP packaging structure and a light-emitting device. The CSP packaging structure comprises a substrate; the plurality of flip chips are arranged on the upper surface of the substrate in an array form; the upper surfaces of the flip chips are coated with the multiple multi-color-temperature fluorescent glue sets in a one-to-one correspondence mode, and the flip chips are wrapped with the two ends of the multiple-color-temperature fluorescent glue sets; the plurality of protection layers are arranged on the upper surface of the multi-color-temperature fluorescent glue group in a one-to-one correspondence manner; different currents are introduced into the flip chip, so that the multi-color-temperature fluorescent glue group on the upper surface of the flip chip realizes conversion of different light colors. Different currents are introduced into the flip chip, so that the multi-color-temperature fluorescent glue group can realize different light color conversion for dimming and lamp modulation, one lamp has multiple purposes, different color temperatures do not need to be independently pasted on a PCB (Printed Circuit Board) for temperature regulation, and the size of the chip does not need to be regulated, so that the cost is greatly increased; and the lamp beads can be effectively prevented from falling off through the protection layer, so that the abnormal appearance and parameters of the lamp beads can be avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip packaging technical field, especially CSP packaging structure and light emitting device of a kind of. BACKGROUND

[0002] CSP (Chip Scale Package) package, the meaning of chip level packaging. CSP package is the latest generation of memory chip packaging technology, and its technical performance has new promotion. CSP package can make the ratio of chip area and packaging area more than 1:1.14, has been quite close to 1:1 ideal situation, absolute size is only 32 square millimeters, about 1 / 3 of ordinary BGA, just equivalent to 1 / 6 of TSOP memory chip area. Compared with BGA package, CSP package can increase storage capacity by three times in the same space.

[0003] In prior art, with the general application of CSP, the demand of market to product is no longer single, and diversified high-performance parameters are pursued; requirement is higher and higher, and traditional CSP manufacturing is all single mould pressing fluorescent glue, and brightness is low, if improving brightness needs to change chip size, will greatly increase cost, needs to adjust light and color while needing to separately paste different color temperatures on PCB. UTILITY MODEL CONTENT

[0004] Therefore, the utility model aims at providing a kind of CSP packaging structure and light emitting device to at least solve the deficiency in prior art.

[0005] First, the utility model provides a kind of CSP packaging structure, comprising:

[0006] Substrate;

[0007] A plurality of flip chips are arranged in the form of array on the upper surface of the substrate;

[0008] A plurality of multi-color temperature fluorescent glue groups are arranged one by one on the upper surface of a plurality of flip chips, and the opposite ends of the multi-color temperature fluorescent glue group are covered on the opposite side walls of the flip chip;

[0009] A plurality of protective layers for protecting the multi-color temperature fluorescent glue group are arranged one by one on the upper surface of the multi-color temperature fluorescent glue group;

[0010] Among them, by passing different current to the flip chip, the multi-color temperature fluorescent glue group on the upper surface of the flip chip realizes the conversion of different light colors.

[0011] Compared with the prior art, the utility model discloses the beneficial effect is: through the different current that goes to the inverted chip, makes multi -color temperature fluorescent glue group can realize different light color conversion to carry out dimming, realizes one lamp multi -use, need not separately stick different color temperature on the PCB board and carry out temperature adjustment, and need not adjust the chip size to the cost of large -scale increase, and the protection layer can effectively avoid the lamp pearl drop to the lamp pearl appearance and the parameter exception can be avoided.

[0012] Further, the multi-color temperature fluorescent glue group includes yellow color temperature glue layer, green color temperature glue layer and blue color temperature glue layer, and the yellow color temperature glue layer, the green color temperature glue layer and the blue color temperature glue layer are sequentially arranged on the upper surface of the inverted chip.

[0013] Further, one end of the yellow color temperature glue layer away from the green color temperature glue layer covers one end of the inverted chip, and one end of the blue color temperature glue layer away from the green color temperature glue layer covers the other end of the inverted chip.

[0014] Further, the upper surface of one end of the yellow color temperature glue layer covering the inverted chip is provided with a rounded corner structure, and the upper surface of the other end of the blue color temperature glue layer away from the green color temperature glue layer covering the inverted chip is provided with a rounded corner structure.

[0015] Further, the color temperature of the yellow color temperature glue layer is 2700K, the color temperature of the green color temperature glue layer is 6500K, and the color temperature of the blue color temperature glue layer is 4000K.

[0016] Further, the area of the yellow color temperature glue layer and the blue color temperature glue layer is greater than the area of the green color temperature glue layer.

[0017] Further, the protection layer is a transparent fluorescent glue layer, and both ends of the transparent fluorescent glue layer cover both ends of the multi-color temperature fluorescent glue group.

[0018] In the second aspect, the utility model also provides a kind of light emitting equipment, including the CSP packaging structure as above. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is the structure schematic view that the multi-color temperature fluorescent glue group of CSP packaging structure in the utility model embodiment is combined with inverted chip;

[0020] Figure 2 It is the structure schematic view that the multi-color temperature fluorescent glue group of CSP packaging structure in the utility model embodiment is combined on inverted chip;

[0021] Figure 3 It is the structure schematic view that the protection layer of CSP packaging structure in the utility model embodiment is combined with multi-color temperature fluorescent glue group.

[0022] Figure 4 FIG. 1 is a structural schematic diagram of a CSP packaging structure in an embodiment of the present application;

[0023] Figure 5 FIG. 2 is a structural schematic diagram of a cut and formed single lamp bead of the CSP packaging structure in the embodiment of the present application.

[0024] Main component symbol explanation:

[0025] 10, substrate;

[0026] 20, flip chip;

[0027] 30, multi-color temperature fluorescent glue group; 31, yellow color temperature layer; 32, green color temperature layer; 33, blue color temperature layer;

[0028] 40, protective layer;

[0029] 51, first die; 52, second die.

[0030] The following detailed implementation will further illustrate the present application in combination with the above-mentioned drawings. DETAILED DESCRIPTION

[0031] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The drawings show several embodiments of the present application. However, the present application can be realized in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0032] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can be a middle element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or there can be a middle element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terms used in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0034] Please refer to Figures 1 to 5The utility model discloses CSP packaging structure, including substrate 10, flip chip 20, multicolor temperature fluorescent glue group 30 and protection layer 40.

[0035] The flip chip 20 is provided with several groups, and the several flip chips 20 are arranged in an array on the upper surface of the substrate 20, the multicolor temperature fluorescent glue group 30 is provided with several groups, and the several multicolor temperature fluorescent glue groups 30 are correspondingly arranged on the upper surfaces of the several flip chips 20, and the opposite ends of the multicolor temperature fluorescent glue group 30 cover the opposite side walls of the flip chip 20, the protection layer 40 is provided with several groups, and is used for protecting the multicolor temperature fluorescent glue group 30, and the several protection layers 40 are correspondingly arranged on the upper surfaces of the multicolor temperature fluorescent glue groups 30, wherein the multicolor temperature fluorescent glue group 30 on the upper surface of the flip chip 20 realizes the conversion of different light colors by passing different currents into the flip chip 20.

[0036] Specifically, in the embodiment, the several multicolor temperature fluorescent glue groups 30 all include yellow color temperature glue layer 31, green color temperature glue layer 32 and blue color temperature glue layer 33, the yellow color temperature glue layer 31, the green color temperature glue layer 32 and the blue color temperature glue layer 33 are sequentially arranged on the upper surface of the flip chip 20, one end of the yellow color temperature glue layer 31 away from the green color temperature glue layer 32 covers one end of the flip chip 20, and one end of the blue color temperature glue layer 33 away from the green color temperature glue layer 32 covers the other end of the flip chip 20.In the embodiment, the color temperature of the yellow color temperature glue layer 31 is 2700K, the color temperature of the green color temperature glue layer 32 is 6500K, the color temperature of the blue color temperature glue layer 33 is 4000K, and the areas of the yellow color temperature glue layer 31 and the blue color temperature glue layer 33 are greater than the area of the green color temperature glue layer 32.

[0037] It can be understood that, by different currents, the yellow color temperature glue layer 31 with a color temperature of 2700K, the green color temperature glue layer 32 with a color temperature of 6500K and the blue color temperature glue layer 33 with a color temperature of 4000K on the flip chip 20 can realize different light color conversion for dimming and color adjustment, realizing one lamp with multiple uses.

[0038] It is worth mentioning that, in the embodiment, the upper surface of one end of the yellow color temperature glue layer 31 covering the flip chip 20 is arranged in a rounded corner structure, and the upper surface of the other end of the blue color temperature glue layer 33 covering the flip chip 20 away from the green color temperature glue layer 32 is arranged in a rounded corner structure.

[0039] It can be understood that the rounded corners of the green color temperature glue layer 31 and the blue color temperature glue layer 33 effectively avoid uneven distribution of edge light emission, so that the light-emitting angle of the lamp bead is more widely diffused, and the light intensity is higher.

[0040] Specifically, in the embodiment, the protective layer 40 is a transparent fluorescent glue layer, and two ends of the transparent fluorescent glue layer cover two ends of the multi-color temperature fluorescent glue group 30. The two ends of the transparent fluorescent glue layer, that is, the two ends of the protective layer 40, cover the rounded corner portions of the green color temperature glue layer 31 and the blue color temperature glue layer 33, which can effectively avoid the lamp beads from falling or causing powder dropping in the process, and thus effectively avoid the appearance and parameter abnormalities of the lamp beads.

[0041] In addition, it should be noted that the process flow of the CSP packaging structure is as follows:

[0042] Step one, the flip chip 20 is arranged on the upper surface of the substrate 10, and the yellow color temperature glue layer 31, the green color temperature glue layer 32 and the blue color temperature glue layer 33 are coated on the flip chip 20, and then the first mold 51 is used to mold and combine the yellow color temperature glue layer 31, the green color temperature glue layer 32 and the blue color temperature glue layer 33, and the specific structure is as shown in Figure 1 ;

[0043] Step two, after the molding and combining, baking is performed, and the specific structure is as shown in Figure 2 ;

[0044] Step three, a layer of protective layer 40, that is, a transparent fluorescent glue layer, is coated on the upper surface of the yellow color temperature glue layer 31, the green color temperature glue layer 32 and the blue color temperature glue layer 33, and then the second mold 52 is used to mold and combine, and the specific structure is as shown in Figure 3 ;

[0045] Step four, after the molding and combining of the second mold 52, baking is performed in an oven to form, and the overall CSP packaging structure is obtained, and the specific structure is as shown in Figure 4 ;

[0046] Step five, the CSP packaging structure is cut to obtain single lamp beads, and the specific structure is as shown in Figure 5 .

[0047] In addition, the utility model also provides a light emitting device which comprises the above CSP packaging structure.

[0048] In summary, the CSP packaging structure in the above embodiment of the utility model can realize different light color conversion to adjust light and realize one lamp with multiple uses, without the need to separately paste different color temperatures on a PCB to adjust temperature and without the need to adjust the size of the chip, thereby greatly increasing the cost, and the protective layer 40 can effectively prevent the lamp beads from falling, thereby avoiding the appearance and parameter abnormalities of the lamp beads.

[0049] In the description of the specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the utility model. In the specification, the illustrative description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0050] The above-described embodiments only express several implementation manners of the utility model, the description is more specific and detailed, but it cannot be understood as the limitation of the utility model patent scope. It should be pointed out that for ordinary skilled person in the art, without departing from the concept of the utility model, a number of modifications and improvements can be made, which belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent should be subject to the appended claims.

Claims

1. A CSP package structure, characterized by, include: substrate; Several flip chips are arranged in an array on the upper surface of the substrate; Several multi-color temperature fluorescent adhesive groups are disposed one-to-one on the upper surface of several flip chips, and the opposite ends of the multi-color temperature fluorescent adhesive groups cover the opposite sidewalls of the flip chips. Several protective layers for protecting the multi-color temperature fluorescent adhesive group are respectively disposed on the upper surface of the multi-color temperature fluorescent adhesive group; In this method, by applying different currents to the flip chip, the multi-color temperature phosphor group on the upper surface of the flip chip can achieve the conversion of different light colors; The multi-color temperature fluorescent adhesive assemblies each include a yellow color temperature adhesive layer, a green color temperature adhesive layer, and a blue color temperature adhesive layer. The yellow color temperature adhesive layer, the green color temperature adhesive layer, and the blue color temperature adhesive layer are arranged sequentially on the upper surface of the flip chip. The end of the yellow color temperature adhesive layer away from the green color temperature adhesive layer covers one end of the flip chip, and the end of the blue color temperature adhesive layer away from the green color temperature adhesive layer covers the other end of the flip chip. Color adjustment is achieved by converting different light colors through the yellow color temperature adhesive layer, the green color temperature adhesive layer, and the blue color temperature adhesive layer.

2. The CSP package structure of claim 1, wherein, The yellow color temperature adhesive layer covers the upper surface of one end of the flip chip with a rounded corner structure, and the blue color temperature adhesive layer, at the end away from the green color temperature adhesive layer, covers the upper surface of the other end of the flip chip with a rounded corner structure.

3. The CSP package structure of claim 1, wherein, The yellow color temperature adhesive layer has a color temperature of 2700K, the green color temperature adhesive layer has a color temperature of 6500K, and the blue color temperature adhesive layer has a color temperature of 4000K.

4. The CSP package structure of claim 1, wherein, The areas of the yellow and blue color temperature adhesive layers are larger than the area of ​​the green color temperature adhesive layer.

5. The CSP package structure of claim 1, wherein, The protective layer is a transparent fluorescent adhesive layer, and the two ends of the transparent fluorescent adhesive layer cover the two ends of the multi-color temperature fluorescent adhesive group.

6. A light emitting device characterized by Includes the CSP packaging structure as described in any one of claims 1 to 5.

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