Steam treatment device and cooking equipment

Abstract

The utility model provides a steam treatment device and cooking equipment, and relates to the technical field of kitchen appliances. The steam treatment device comprises a condensation assembly. The condensation assembly is provided with a protruding condensation end, the condensation assembly is installed on the side wall of an inner container of the cooking equipment, and the condensation end extends into the inner container of the cooking equipment; the condensation assembly is used for refrigerating and reducing the temperature of the condensation end. According to the steam treatment device, the condensation end extending into the inner container of the cooking equipment is cooled through the condensation assembly, steam in the inner container can be condensed into liquid drops at the condensation end, then the liquid drops are discharged through the water outlet in the bottom of the inner container, and therefore the situation that a user is scalded by the steam gushing out is effectively prevented; the situation that steam corrodes the cooling fan is avoided, the situation that accumulated water at the cooling fan flows to the control panel of the cooking equipment is also avoided, and the risk that the control panel is damaged and the whole machine is short-circuited is effectively reduced.

Description

Technical Field

[0001] This utility model relates to the field of kitchen appliances technology, and in particular to a steam treatment device and cooking equipment. Background Technology

[0002] Steam ovens and other cooking appliances with heating functions generate a large amount of high-temperature steam in their inner cavity after cooking. When users open the door of the cooking appliance, the surging high-temperature steam can easily burn them, which is unsafe and results in a poor user experience.

[0003] To address the issue of scalding users due to steam escaping, the inner cavity of existing steam ovens and other cooking appliances is typically connected to a cooling fan via an exhaust pipe. When the appliance is cooking food, the pipe is closed; when cooking is finished, the pipe is opened and the cooling fan is activated, thereby expelling the high-temperature steam from the inner cavity.

[0004] However, as the usage time increases, high-temperature steam will corrode the cooling fan, and the high-temperature steam is easy to adhere to the cooling fan, forming water accumulation. This water accumulation may flow into the control board of the cooking equipment, posing a risk of damaging the control board and short-circuiting the entire machine. Utility Model Content

[0005] The purpose of this utility model is to provide a steam treatment device and cooking equipment to alleviate the technical problems existing in the prior art. In order to prevent users from being scalded by steam, the inner pot of cooking equipment such as steam ovens is usually connected to the cooling fan through a steam exhaust pipe. However, as the usage time increases, high-temperature steam will corrode the cooling fan, and high-temperature steam is easy to adhere to the cooling fan to form water accumulation, which poses a risk of damage to the control board and short circuit of the whole machine.

[0006] In a first aspect, this utility model provides a steam treatment device, including a condensation component;

[0007] The condensing assembly has a protruding condensing end, and the condensing assembly is installed on the inner wall of the cooking equipment, with the condensing end extending into the inner wall of the cooking equipment;

[0008] The condenser assembly is used for cooling and reducing the temperature of the condenser end.

[0009] In an optional embodiment, the condensation assembly includes a cooling element and a condenser element;

[0010] The refrigeration component has a refrigeration end, and the refrigeration component is used for refrigeration and releases cold through the refrigeration end;

[0011] The condenser is made of a thermally conductive material and is attached to the cooling end, with the condensing end formed on the condenser.

[0012] In an optional embodiment, the condenser includes a condenser plate and a condenser column;

[0013] One side of the condenser plate is attached to the cooling end, and the other side is connected to one end of the condenser column, the other end of which is the condenser end.

[0014] In an optional embodiment, the cooling component is disposed outside the inner liner of the cooking equipment, the condensing component is fixed to the mounting hole on the side wall of the inner liner of the cooking equipment, and the condensing end extends into the inner liner of the cooking equipment after passing through the mounting hole.

[0015] In an optional embodiment, the cooling element is a semiconductor refrigeration chip, which is used to cool one side and heat the other side after being energized, and the cooling side of the semiconductor refrigeration chip is the cooling end.

[0016] In optional implementations, a heat dissipation component is also included;

[0017] The heating side of the semiconductor cooling chip is the heating end, and the heat dissipation component is installed on the heating end to dissipate heat from the heating end.

[0018] In an optional implementation, the heat dissipation component includes a cooling fan.

[0019] In an optional embodiment, the heat dissipation assembly further includes a heat sink disposed between the cooling fan and the heating end.

[0020] In an optional embodiment, the heat sink has a plurality of heat dissipation fins on the side near the cooling fan, the plurality of heat dissipation fins are distributed sequentially at intervals, and each heat dissipation fin is perpendicularly connected to the heat sink.

[0021] Secondly, this utility model provides a cooking device, including the steam treatment device described in any of the foregoing embodiments.

[0022] The steam treatment device provided by this utility model includes a condensing component; the condensing component has a protruding condensing end, is installed on the inner wall of the cooking equipment, and the condensing end extends into the inner pot of the cooking equipment; the condensing component is used for cooling and reducing the temperature of the condensing end. The steam treatment device provided by this utility model is applied to cooking equipment with heating or steaming functions, such as steam ovens. When the cooking equipment finishes cooking and a large amount of steam remains in its inner pot, the condensing component can be activated first, allowing it to cool and reduce the temperature of the condensing end through heat conduction. Because the condensing end protrudes from the condensing component and extends into the inner pot of the cooking equipment, after the condensing end cools down, the steam in the inner pot of the cooking equipment will continue to cool and condense into droplets at the condensing end. These droplets will then drip to the bottom of the inner pot and be discharged to the outside or the wastewater tank of the cooking equipment through the drain outlet at the bottom of the inner pot. After being treated by the cooled condensing end, the steam in the inner pot of the cooking equipment will no longer rush out through the door of the cooking equipment, effectively solving the problem of steam burns to users. Furthermore, the steam treatment device provided by this utility model can process steam through the condenser end of the condenser component, eliminating the need to connect the inner liner of the cooking equipment to the cooling fan through the exhaust pipe. This prevents the cooling fan from being corroded by the exhaust steam and also prevents water from accumulating at the cooling fan from flowing onto the control board of the cooking equipment, effectively reducing the risk of damage to the control board and the risk of short circuit in the entire cooking equipment.

[0023] Compared with the prior art, the steam treatment device provided by this utility model cools the condenser end that extends into the inner pot of the cooking equipment through the condenser component. This allows the steam in the inner pot to condense into droplets at the condenser end, and then merge with the wastewater at the bottom of the inner pot and be discharged through the drain at the bottom of the inner pot. This effectively prevents the steam from scalding the user. In addition, this device does not require a cooling fan to discharge steam, so there is no risk of steam corroding the cooling fan, nor is there any risk of water accumulating at the cooling fan flowing onto the control board of the cooking equipment. This effectively reduces the risk of damage to the control board and short circuit of the whole machine.

[0024] The cooking equipment provided by this utility model includes the above-mentioned steam treatment device, and therefore the cooking equipment has the same beneficial effects as the above-mentioned steam treatment device. Attached Figure Description

[0025] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0026] Figure 1 A front view of the steam treatment apparatus provided in an embodiment of this utility model;

[0027] Figure 2 A side view of the steam treatment apparatus provided in an embodiment of this utility model;

[0028] Figure 3 A top view of the steam treatment apparatus provided in an embodiment of this utility model;

[0029] Figure 4 A front view of the steam treatment device and the inner tank sidewall provided in an embodiment of this utility model;

[0030] Figure 5 for Figure 4 Enlarged diagram of part A in the diagram;

[0031] Figure 6 A side view of the steam treatment device and the inner tank sidewall provided for an embodiment of this utility model;

[0032] Figure 7 for Figure 6 Enlarged schematic diagram of part B in the diagram;

[0033] Figure 8 A top view of the steam treatment device and the inner tank sidewall provided in an embodiment of this utility model;

[0034] Figure 9 for Figure 8 Enlarged schematic diagram of part C in the diagram.

[0035] Icons: 1-Condensing assembly; 10-Condensing end; 11-Refrigeration component; 12-Condensing component; 120-Condensing plate; 121-Condensing column; 2-Inner liner sidewall; 3-Heat dissipation assembly; 30-Heat dissipation fan; 31-Heat dissipation fin; 310-Heat dissipation fin. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0037] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0038] The following detailed description, in conjunction with the accompanying drawings, outlines some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0039] Example:

[0040] like Figure 1 , Figure 2 and Figure 3 As shown, the steam treatment device provided in this embodiment includes a condensation assembly 1; the condensation assembly 1 has a protruding condensation end 10, as shown in the figure. Figure 4 , Figure 5 , Figure 6 and Figure 8 As shown, the condenser assembly 1 is installed on the inner wall 2 of the cooking appliance, as... Figure 7 and Figure 9 As shown, the condenser end 10 extends into the inner pot of the cooking device; the condenser assembly 1 is used for cooling and reducing the temperature of the condenser end 10.

[0041] The steam treatment device provided in this embodiment is applied to cooking equipment with heating or steaming functions, such as steam ovens. When the cooking equipment finishes cooking and a large amount of steam remains in its inner pot, the condenser component 1 can be activated first. This allows the condenser component 1 to cool down and lower the temperature of the condenser end 10 through heat conduction. Since the condenser end 10 protrudes from the condenser component 1 and extends into the inner pot of the cooking equipment, after the condenser end 10 cools down, the steam in the inner pot of the cooking equipment will continue to cool and condense into droplets at the condenser end 10. The droplets will then drip to the bottom of the inner pot and be discharged to the outside or the wastewater tank of the cooking equipment through the drain port at the bottom of the inner pot. After the steam in the inner pot of the cooking equipment is treated by the cooled condenser end 10, it will no longer rush out through the door of the cooking equipment, effectively solving the problem of steam burns to users and thus improving the user experience.

[0042] Furthermore, the steam treatment device provided in this embodiment can process steam through the condenser end 10 of the condenser component 1, without having to connect the inner liner of the cooking equipment to the cooling fan through the exhaust pipe. This prevents the cooling fan from being corroded by the exhaust steam and also prevents water from accumulating at the cooling fan from flowing onto the control board of the cooking equipment. This effectively reduces the risk of damage to the control board and the risk of short circuit in the entire cooking equipment, thereby improving the overall lifespan and reliability of the cooking equipment.

[0043] Compared with the prior art, the steam treatment device provided in this embodiment cools the condenser end 10 that extends into the inner pot of the cooking equipment through the condenser component 1. This allows the steam in the inner pot to condense into droplets at the condenser end 10, which then merges with the wastewater at the bottom of the inner pot and is discharged through the drain at the bottom of the inner pot. This effectively prevents the steam from scalding the user. Furthermore, this device does not require a cooling fan to discharge the steam, thus avoiding steam corrosion of the cooling fan and preventing water accumulation at the cooling fan from flowing onto the control board of the cooking equipment. This effectively reduces the risk of damage to the control board and short circuit of the entire machine.

[0044] In order to facilitate the flow of liquid droplets formed after steam condensation to the drain outlet at the bottom of the inner tank, a drainage groove for collecting and guiding the flow can also be provided at the bottom of the inner tank.

[0045] Furthermore, there are no restrictions on the installation position of the condenser assembly 1 on the inner wall 2 of the steam appliance. However, since steam has a low density and usually rises, in this embodiment, the condenser assembly 1 is preferably installed on the inner wall 2 of the cooking appliance near the top of the inner pot. Correspondingly, the condenser end 10 is located in the inner pot near the top of the inner pot.

[0046] When the condenser end 10 is located near the top of the inner liner, it is easy for the condenser end 10 to come into contact with the rising steam, which can effectively improve its condensation efficiency of the steam.

[0047] like Figure 2 and Figure 3 As shown, the condensing assembly 1 includes a cooling element 11 and a condensing element 12; the cooling element 11 has a cooling end, the cooling element 11 is used for cooling and releases cold through the cooling end; the condensing element 12 is made of a thermally conductive material and is attached to the cooling end, and a condensing end 10 is formed on the condensing element 12.

[0048] The refrigeration component 11 can be an existing refrigeration unit capable of refrigeration.

[0049] Since forming a protruding condenser end 10 on the refrigerator would increase manufacturing difficulty and modification costs, this embodiment preferably includes a condenser component 12, and the condenser end 10 is formed on the condenser component 12.

[0050] Furthermore, since the condenser 12 is made of a thermally conductive material and is attached to the cooling end, it can conduct heat during use, allowing the cooler to transfer the low temperature to the condenser end 10 after cooling, thereby reducing the temperature at the condenser end 10.

[0051] like Figure 2 , Figure 3 , Figure 7 and Figure 9As shown, the condenser 12 includes a condenser plate 120 and a condenser column 121; one side of the condenser plate 120 is attached to the cooling end, and the other side is connected to one end of the condenser column 121, the other end of the condenser column 121 being the condenser end 10.

[0052] During use, after the cooling component 11 cools down, its cooling end will cause the condenser plate 120 that is in contact with it to cool down first through heat conduction, and then the condenser column 121 will cool down through heat conduction.

[0053] The condenser plate 120 is used to increase the heat conduction area between the cooling component 11 and the condenser component 12, thereby improving the cooling effect of the condenser end 10.

[0054] The condenser column 121 is used to reduce its space occupation in the cooking equipment. When part or all of the column body of the condenser column 121 extends into the inner pot of the cooking equipment, not only can the condenser end 10 on the condenser column 121 cool the steam, but the column body of the condenser column 121 located in the inner pot can also cool the steam, thereby improving the steam condensation efficiency.

[0055] To further improve the heat conduction effect of the condenser plate 120, the surface of the condenser plate 120 may be coated with a heat-conducting material layer.

[0056] The thermally conductive material layer can be a silicone grease layer. In this case, the thermally conductive material layer can not only improve the thermal conductivity of the condenser plate 120, but also increase its surface friction, thereby improving the bonding and installation stability between the condenser plate 120 and the cooling component 11.

[0057] In this embodiment, the shape of the condenser column 121 is not limited and can be selected according to actual needs. For example, the condenser column 121 can be cylindrical or prismatic.

[0058] like Figure 8 and Figure 9 As shown, the cooling component 11 is located outside the inner pot of the cooking equipment, and the condensing component 12 is fixed to the mounting hole on the side wall 2 of the inner pot of the cooking equipment, with the condensing end 10 extending into the inner pot of the cooking equipment after passing through the mounting hole.

[0059] When the cooling component 11 is located outside the inner pot of the cooking equipment, it can not only prevent the cooling component 11 from contacting steam, but also cooperate with the condenser component 12 at the mounting hole on the inner pot side wall 2, thereby improving the installation balance of the condenser assembly 1 on the inner pot side wall 2 and thus improving the installation stability of the condenser assembly 1.

[0060] In practical applications, the refrigeration component 11 can be either a heat pump refrigeration chip or a semiconductor refrigeration chip.

[0061] Since the semiconductor refrigeration chip has a simple structure and is easy to use, the refrigeration component 11 in this embodiment is preferably a semiconductor refrigeration chip. The semiconductor refrigeration chip is used to cool one side and heat the other side after being powered on, and the cooling side of the semiconductor refrigeration chip is the cooling end.

[0062] A thermoelectric cooler, also known as a Peltier cooler, utilizes the Peltier effect for cooling and heating. The Peltier effect refers to the phenomenon where, when current flows through a circuit composed of two different conductors, one connection absorbs heat while the other releases it.

[0063] Based on this, when a semiconductor refrigeration chip is powered on, one side will cool and form a cooling end, while the other side will heat and form a heating end.

[0064] It should be noted that the inner wall 2 of the cooking equipment is usually divided into a front side wall, a rear side wall, a left side wall, and a right side wall. Among them, the front side wall refers to the side wall of the cooking equipment with the door that faces the user in daily use. The rear side wall, left side wall, and right side wall are located relative to the front side wall, on the rear, left, and right sides of the front side wall, respectively.

[0065] To make full use of the installation space on the cooking equipment, improve the overall aesthetics of the cooking equipment, and prevent the heating end of the semiconductor cooling chip from coming into contact with the user, this embodiment preferably installs the steam treatment device on the rear side wall of the cooking equipment.

[0066] Specifically, the aforementioned mounting hole is provided on the rear side wall of the cooking equipment. The condenser plate 120 of the condenser assembly 1 in the steam treatment device is attached and fixed to the outside of the rear side wall by fasteners such as screws, and the condenser plate 120 covers the mounting hole. The condenser column 121 extends into the inner liner after passing through the mounting hole. The cooling end of the semiconductor cooling chip is attached and fixed to the side of the condenser plate 120 opposite to the condenser column 121, and the heating end of the semiconductor cooling chip is exposed to the external environment.

[0067] The condenser plate 120 is attached and fixed to the outside of the rear side wall. This not only allows the condenser plate 120 to cover the mounting hole and prevent steam from escaping, but also prevents the condenser plate 120 from occupying the inner space of the steam equipment.

[0068] In addition, the inner liner of cooking equipment is usually equipped with heating elements for heating and a fan for uniform temperature distribution within the cavity. Both the heating elements and the fan are installed on the rear wall of the cooking equipment. Therefore, a power supply structure is usually also installed on the rear wall of the cooking equipment. When the steam treatment device is installed on the rear wall of the cooking equipment, the aforementioned power supply structure can also be used to power the semiconductor cooling chip, thereby making full use of the existing components of the cooking equipment and simplifying the structure of the steam equipment.

[0069] Furthermore, such as Figure 3 and Figure 9 As shown, the steam treatment device provided in this embodiment also includes a heat dissipation component 3; the heating side of the semiconductor cooling chip is the heating end, and the heat dissipation component 3 is installed on the heating end for dissipating heat from the heating end.

[0070] Since a thermoelectric cooler generates heat while simultaneously cooling, there is a significant temperature difference between its two sides during operation. This embodiment addresses this by installing a heat dissipation component 3 at the heating end of the thermoelectric cooler. This component accelerates heat dissipation, effectively reducing the temperature difference between the two sides and preventing damage to the thermoelectric cooler due to the large temperature difference.

[0071] To improve the structural stability of the steam treatment device, the heat dissipation component 3, the semiconductor cooling chip and the condenser plate 120 can be sequentially fixed and connected by fasteners such as screws, while the condenser column 121 can be fixed to one side of the condenser plate 120 by welding, integral molding or other methods.

[0072] It should be noted that, since the inner wall 2 of existing cooking equipment is usually equipped with heat insulation cotton for heat preservation, and the temperature in the inner pot is usually high, it is difficult to directly fix the semiconductor cooling chip to the inner side of the inner wall 2 by adhesive bonding.

[0073] Based on this, in this embodiment, the inner liner sidewall 2 is preferably provided with mounting holes. The condenser plate 120 in the condenser 12 is fixed to the outside of the inner liner sidewall 2 by fasteners. The condenser column 121 extends into the inner liner sidewall 2 through the mounting holes. The semiconductor cooling chip can be fixed to the side of the condenser plate 120 opposite to the condenser column 121 by bonding, snapping or fastener connection.

[0074] Furthermore, the heat dissipation component 3 can be fixed to the heating end of the semiconductor cooling chip by means of adhesive bonding, snap-fitting, or fastener connection.

[0075] At this time, the condenser 12 can support the thermoelectric cooler, and the thermoelectric cooler can support the heat dissipation assembly 3. This not only improves the installation stability of the heat dissipation assembly 3, but also prevents the heat insulation cotton on the inner liner side wall 2 from hindering the heat dissipation assembly 3 from dissipating heat to the heating end of the thermoelectric cooler.

[0076] It should also be noted that when the inner liner side wall 2 is provided with mounting holes, a sealing ring can be installed in the mounting holes to seal the gap between the condenser column 121 and the mounting holes, further preventing steam from escaping and affecting the cooking effect.

[0077] Furthermore, such as Figure 3 and Figure 9 As shown, the heat dissipation component 3 includes a cooling fan 30.

[0078] The cooling fan 30 is used to accelerate the airflow on the surface of the heating end and improve heat dissipation efficiency.

[0079] It should be noted that, since the cooling fan 30 in this embodiment only needs to dissipate heat from the heating end of the semiconductor cooling chip, and the heating end of the semiconductor cooling chip is exposed to the external environment, the cooling fan 30 is also exposed to the external environment and does not need to come into contact with the steam in the inner pot. Therefore, the cooling fan 30 will not be corroded by the steam and will not cause steam condensate to flow to the control board of the cooking equipment.

[0080] To further improve the heat dissipation effect of heat dissipation component 3, such as Figure 3 and Figure 9 As shown, the heat dissipation assembly 3 also includes a heat sink 31, which is disposed between the cooling fan 30 and the heating end.

[0081] The heat sink 31 is made of a good thermally conductive material. The heat sink 31 is used to increase the heat dissipation area, thereby improving the heat dissipation effect.

[0082] like Figure 3 As shown, the heat sink 31 has multiple heat dissipation fins 310 on the side near the cooling fan 30. The multiple heat dissipation fins 310 are distributed in sequence at intervals, and each heat dissipation fin 310 is vertically connected to the heat sink 31.

[0083] The heat dissipation fins 310 are also made of a good thermal conductive material. The heat dissipation fins 310 are used to further increase the heat dissipation area and increase the heat dissipation space between the cooling fan 30 and the heating end, thereby further improving the heat dissipation effect.

[0084] This embodiment also provides a cooking device, which includes the steam treatment device described above.

[0085] The cooking equipment provided in this embodiment is the aforementioned cooking equipment with heating or steaming functions, such as a steam oven.

[0086] Since the cooking equipment includes the aforementioned steam treatment device, it can solve the same technical problems and achieve the same technical effects as the aforementioned steam treatment device, and will not be described in detail here.

[0087] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A steam treatment apparatus, characterized in that, Includes condenser assembly (1); The condensing assembly (1) has a protruding condensing end (10). The condensing assembly (1) is installed on the inner wall (2) of the cooking equipment, and the condensing end (10) extends into the inner wall of the cooking equipment. The condenser assembly (1) is used for cooling and reducing the temperature of the condenser end (10).

2. The steam treatment apparatus according to claim 1, characterized in that, The condensation assembly (1) includes a refrigeration component (11) and a condensation component (12); The refrigeration component (11) has a refrigeration end, and the refrigeration component (11) is used for refrigeration and releases cold through the refrigeration end; The condenser (12) is made of a thermally conductive material and is attached to the cooling end. The condenser (12) has the condensing end (10) formed on it.

3. The steam treatment apparatus according to claim 2, characterized in that, The condenser (12) includes a condenser plate (120) and a condenser column (121); One side of the condenser plate (120) is attached to the cooling end, and the other side is connected to one end of the condenser column (121). The other end of the condenser column (121) is the condenser end (10).

4. The steam treatment apparatus according to claim 2, characterized in that, The refrigeration component (11) is located outside the inner liner of the cooking equipment, and the condenser component (12) is fixed to the mounting hole on the side wall (2) of the inner liner of the cooking equipment, and the condenser end (10) extends into the inner liner of the cooking equipment after passing through the mounting hole.

5. The steam treatment apparatus according to any one of claims 2-4, characterized in that, The cooling component (11) is a semiconductor refrigeration chip, which is used to cool one side and heat the other side after being powered on, and the cooling side of the semiconductor refrigeration chip is the cooling end.

6. The steam treatment apparatus according to claim 5, characterized in that, It also includes a heat dissipation component (3); The heating side of the semiconductor cooling chip is the heating end, and the heat dissipation component (3) is installed on the heating end for dissipating heat from the heating end.

7. The steam treatment apparatus according to claim 6, characterized in that, The heat dissipation component (3) includes a cooling fan (30).

8. The steam treatment apparatus according to claim 7, characterized in that, The heat dissipation component (3) further includes a heat sink (31), which is disposed between the cooling fan (30) and the heating end.

9. The steam treatment apparatus according to claim 8, characterized in that, The heat sink (31) has a plurality of heat dissipation fins (310) on the side near the cooling fan (30). The plurality of heat dissipation fins (310) are distributed in sequence at intervals, and each heat dissipation fin (310) is vertically connected to the heat sink (31).

10. A cooking device, characterized in that, Includes the steam treatment apparatus according to any one of claims 1-8.

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