Laser grooving equipment for wafer production

Abstract

The utility model discloses a laser grooving device for wafer production, relates to the technical field of wafer grooving, solves the problem that a wafer is inconvenient to feed and discharge quickly after being grooved, and comprises a processing table, and the center of the bottom of an inner cavity of the processing table is rotatably connected with a stand column through a bearing. According to the utility model, through the arrangement of the turntable and the wafer positioning groove, a wafer needing to be slotted can be conveniently limited and fixed, through the arrangement of the first electric cylinder and the laser cutting machine, the wafer can be conveniently slotted, and through the arrangement of the driving motor, the driving gear and the driven gear, the stand column and the turntable can be driven to horizontally rotate; according to the laser cutting machine, the wafer positioning groove is formed in the laser cutting machine, then the machined wafer in the wafer positioning groove can be driven to horizontally rotate, the grooved wafer is moved away from the position below the laser cutting machine, discharging is completed, meanwhile, the wafer needing to be machined can be moved to the position below the laser cutting machine, feeding is completed, the wafer can be rapidly discharged and fed in the mode, and the production efficiency is high.

Description

Technical Field

[0001] This utility model relates to the field of wafer grooving technology, and in particular to a laser grooving device for wafer production. Background Technology

[0002] Silicon wafers, also known as silicon tessellation wafers or silicon wafer wafers, are an important material for manufacturing integrated circuits. As a crucial substrate material, silicon wafers require multiple processing steps. Among these, the grooving process is a vital step in silicon wafer manufacturing, used to form grooves of specific depth and width on the silicon wafer to meet the requirements of subsequent processes. To improve wafer grooving efficiency, laser grooving equipment is often used. Although the laser grooving equipment currently in use can meet normal grooving requirements, it still has shortcomings in practical use. For example, the loading and unloading of the current laser grooving equipment is inconvenient. After grooving the wafer, it is not easy to quickly load and unload the wafer, resulting in slow loading and unloading speeds and low production efficiency. Improvements are needed. Therefore, a laser grooving equipment for wafer production is proposed. Utility Model Content

[0003] To address the problem of difficulty in quickly loading and unloading wafers after grooving, this invention provides a laser grooving device for wafer production.

[0004] This utility model provides a laser grooving device for wafer fabrication, which adopts the following technical solution:

[0005] A laser grooving device for wafer fabrication includes a processing table. A column is rotatably connected to the center of the bottom of the processing table's inner cavity via a bearing. A turntable is fixedly installed on the top of the column. Wafer positioning grooves are uniformly formed in a ring on the top of the turntable. A driving mechanism is provided on the surface of the column. A driving box is fixedly installed on the back of the processing table. A moving mechanism is provided in the inner cavity of the driving box. A vertical plate is fixedly installed on the top of the moving mechanism. A first electric cylinder is fixedly installed on the top of the back of the vertical plate. A laser cutting machine is fixedly installed on the telescopic end of the first electric cylinder.

[0006] The driving mechanism includes a drive motor, which is fixedly installed on the left side of the bottom of the inner cavity of the processing table. The output end of the drive motor is fixedly connected to a drive gear, and a driven gear is fixedly installed on the outer surface of the column. The outer surface of the drive gear meshes with the outer surface of the driven gear.

[0007] By adopting the above technical solution, the column and turntable can be driven to rotate horizontally, which in turn can drive the wafers processed in the wafer positioning slots to rotate horizontally, and remove the slotted wafers from under the laser cutting machine to complete the unloading. At the same time, the wafers to be processed can be moved to under the laser cutting machine to complete the loading. This method can quickly unload and load wafers, resulting in high production efficiency.

[0008] Optionally, the moving mechanism includes a servo motor, which is fixedly installed on one side of the drive box cavity. A threaded rod is fixedly connected to the output end of the servo motor. The connection between the threaded rod and the drive box cavity on the side away from the servo motor is rotatably connected by a bearing. A threaded sleeve is threadedly connected to the outer surface of the threaded rod, and the top of the threaded sleeve is fixedly connected to the bottom of the upright plate.

[0009] By adopting the above technical solution, the upright plate and the laser cutting machine can be moved left and right, which facilitates the laser cutting machine to perform grooving processing on both sides of the wafer.

[0010] Optionally, a second electric cylinder is fixedly installed at the front position of the bottom of the inner cavity of the processing table, and a push plate is fixedly installed at the telescopic end of the second electric cylinder.

[0011] By adopting the above technical solution, it is easy to eject the wafer after the slotting process is completed, making it easier for staff to handle the wafer.

[0012] Optionally, the bottom of the wafer positioning groove is provided with a first through hole for use with a pusher plate, and the top of the processing table is provided with a second through hole for use with a turntable.

[0013] By adopting the above technical solution, the push plate can be moved up and down easily.

[0014] Optionally, a slider is fixedly connected to the bottom of the threaded sleeve, and a groove for cooperating with the slider is opened at the bottom of the inner cavity of the drive box. The outer surface of the slider is slidably connected to the inner surface of the groove.

[0015] By adopting the above technical solution, the movement of the threaded sleeve can be guided and limited.

[0016] Optionally, the top of the drive box is provided with a through slot for use with the upright plate, and the back of the drive box is fixedly connected to a maintenance plate by screws.

[0017] By adopting the above technical solution, it is easy to move the upright panel.

[0018] Optionally, a battery box is fixedly installed on the right side of the bottom of the inner cavity of the processing table, and a storage battery is provided inside the battery box.

[0019] By adopting the above technical solution, it is easy to supply power to the equipment.

[0020] Optionally, the front of the processing table is movably connected to a door via a hinge, and a control panel is provided on the front of the door.

[0021] By adopting the above technical solution, it is easier to control the equipment.

[0022] In summary, this utility model has the following beneficial effects:

[0023] 1. This utility model, by setting up a turntable and a wafer positioning slot, can easily limit and fix the wafer that needs to be slotted. By setting up a first electric cylinder and a laser cutter, it can facilitate the slotting process of the wafer. By setting up a drive motor, a drive gear and a driven gear, it can drive the column and the turntable to rotate horizontally, which in turn can drive the wafer that has been processed in the wafer positioning slot to rotate horizontally, and remove the slotted wafer from under the laser cutter to complete the unloading. At the same time, it can also move the wafer to be processed to under the laser cutter to complete the loading. This method can quickly unload and load wafers, resulting in high production efficiency.

[0024] 2. This utility model, by setting a servo motor, a threaded rod, and a threaded sleeve, can drive the vertical plate and the laser cutting machine to move left and right, which facilitates the laser cutting machine to perform grooving processing on both sides of the wafer. By setting a second electric cylinder and a push plate, the grooved wafer can be easily ejected, making it convenient for workers to pick up the wafer. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of this utility model;

[0026] Figure 2 This is a cross-sectional view of the structure of this utility model;

[0027] Figure 3 This is a rear sectional view of the drive box structure of this utility model;

[0028] Figure 4 This is a bottom view of the turntable and drive mechanism structure of this utility model.

[0029] In the diagram: 1. Processing table; 2. Column; 3. Turntable; 4. Wafer positioning slot; 5. Drive mechanism; 501. Drive motor; 502. Drive gear; 503. Driven gear; 6. Drive box; 7. Moving mechanism; 701. Servo motor; 702. Threaded rod; 703. Threaded sleeve; 8. Vertical plate; 9. First electric cylinder; 10. Laser cutting machine; 11. Second electric cylinder; 12. Push plate; 13. First through hole; 14. Second through hole; 15. Slider; 16. Slide groove. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0031] Example:

[0032] Please refer to Figure 1-4 A laser grooving device for wafer fabrication includes a processing table 1. A column 2 is rotatably connected to the center of the bottom of the inner cavity of the processing table 1 via a bearing. A turntable 3 is fixedly installed on the top of the column 2. Wafer positioning grooves 4 are evenly formed in a ring on the top of the turntable 3. A drive mechanism 5 is provided on the surface of the column 2. A drive box 6 is fixedly installed on the back of the processing table 1. A moving mechanism 7 is provided in the inner cavity of the drive box 6. A vertical plate 8 is fixedly installed on the top of the moving mechanism 7. A first electric cylinder 9 is fixedly installed on the top of the back of the vertical plate 8. A laser cutting machine 10 is fixedly installed on the telescopic end of the first electric cylinder 9.

[0033] The drive mechanism 5 includes a drive motor 501, which is fixedly installed on the left side of the bottom of the inner cavity of the processing table 1. The output end of the drive motor 501 is fixedly connected to a drive gear 502, and a driven gear 503 is fixedly installed on the outer surface of the column 2. The outer surface of the drive gear 502 meshes with the outer surface of the driven gear 503.

[0034] As a further technical optimization of this utility model, the moving mechanism 7 includes a servo motor 701, which is fixedly installed on one side of the inner cavity of the drive box 6. A threaded rod 702 is fixedly connected to the output end of the servo motor 701. The connection between the side of the threaded rod 702 away from the servo motor 701 and the inner cavity of the drive box 6 is rotatably connected by a bearing. A threaded sleeve 703 is threadedly connected to the outer surface of the threaded rod 702. The top of the threaded sleeve 703 is fixedly connected to the bottom of the upright plate 8.

[0035] As a further technical optimization of this utility model, a second electric cylinder 11 is fixedly installed at the front position of the bottom of the inner cavity of the processing table 1, and a push plate 12 is fixedly installed at the telescopic end of the second electric cylinder 11.

[0036] As a further technical optimization of this utility model, the bottom of the inner cavity of the wafer positioning groove 4 is provided with a first through hole 13 for use with the push plate 12, and the top of the processing table 1 is provided with a second through hole 14 for use with the turntable 3.

[0037] As a further technical optimization of this utility model, the bottom of the threaded sleeve 703 is fixedly connected to a slider 15, and the bottom of the inner cavity of the drive box 6 is provided with a groove 16 for use with the slider 15, and the outer surface of the slider 15 is slidably connected to the inner surface of the groove 16.

[0038] As a further technical optimization of this utility model, the top of the drive box 6 is provided with a through groove for use with the upright plate 8, and the back of the drive box 6 is fixedly connected with a maintenance plate by screws.

[0039] As a further technical optimization of this utility model, a battery box is fixedly installed on the right side of the bottom of the inner cavity of the processing table 1, and a storage battery is provided in the inner cavity of the battery box.

[0040] As a further technical optimization of this utility model, the front of the processing table 1 is movably connected to a box door via a hinge, and a control panel is provided on the front of the box door.

[0041] In this embodiment: by setting up a turntable 3 and a wafer positioning slot 4, the wafer to be slotted can be easily positioned and fixed. By setting up a first electric cylinder 9 and a laser cutter 10, the wafer can be easily slotted. By setting up a drive motor 501, a drive gear 502, and a driven gear 503, the column 2 and the turntable 3 can be driven to rotate horizontally, which in turn drives the processed wafer in the wafer positioning slot 4 to rotate horizontally, removing the slotted wafer from under the laser cutter 10 to complete the unloading. At the same time, the wafer to be processed can be moved to under the laser cutter 10 to complete the loading. This method can quickly unload and load wafers, resulting in high production efficiency. By setting up a servo motor 701, a threaded rod 702, and a threaded sleeve 703... It can drive the upright plate 8 and the laser cutting machine 10 to move left and right, so that the laser cutting machine 10 can perform grooving processing on both sides of the wafer. By setting the second electric cylinder 11 and the push plate 12, it can easily push out the grooved wafer, so that the operator can easily pick up the grooved wafer. By setting the first through hole 13 and the second through hole 14, it can easily move the push plate 12 up and down. By setting the slider 15 and the slide groove 16, it can guide and limit the movement of the threaded sleeve 703. By setting the through groove, it can easily move the upright plate 8. By setting the inspection plate, it can easily inspect the inside of the drive box 6. By setting the battery box and the battery, it can easily power the equipment. By setting the box door, it can easily open the processing table 1.

[0042] The implementation principle of this utility model is as follows: In use, the wafer to be slotted is placed in one of the four wafer positioning slots 4. One wafer positioning slot 4 is moved below the laser cutting machine 10. The laser cutting machine 10 is started to slot the surface of the wafer. Then, the control switches for the first electric cylinder 9 and the servo motor 701 are activated. The first electric cylinder 9 drives the laser cutting machine 10 to move back and forth, while the servo motor 701 drives the laser cutting machine 10 to move left and right via the threaded rod 702, the threaded sleeve 703, and the vertical plate 8. This allows the laser cutting machine 10 to perform slotting processing on all sides of the wafer surface. When the slotting of the wafer below the laser cutting machine 10 is completed and loading and unloading are required, the control switch for the drive motor 501 is activated. The drive motor 501 drives the drive gear 502. The drive gear 502 rotates, driving the driven gear 503 to rotate, which in turn drives the column 2 to rotate. The column 2 then drives the turntable 3 to rotate, causing the wafers processed in the wafer positioning slot 4 to rotate horizontally. This moves the slotted wafers away from below the laser cutter 10, completing the unloading process. Simultaneously, it can move wafers to be processed below the laser cutter 10, completing the loading process. When the processed wafers move above the push plate 12, the control switch of the second electric cylinder 11 is activated. The second electric cylinder 11 drives the push plate 12 to move upward, which in turn moves the wafers upward, pushing out the slotted wafers. The operator can then remove the wafers and place new wafers on top. This method allows for rapid wafer unloading and loading, resulting in high production efficiency.

[0043] The above are all preferred embodiments of this utility model, and are not intended to limit the scope of protection of this utility model. Therefore, all equivalent changes made to the structure, shape and principle of this utility model should be covered within the scope of protection of this utility model.

Claims

1. A laser grooving device for wafer fabrication, comprising a processing table (1), characterized in that: At the center of the bottom of the inner cavity of the processing table (1), a column (2) is rotatably connected by a bearing. A turntable (3) is fixedly installed on the top of the column (2). A wafer positioning groove (4) is evenly opened in a ring on the top of the turntable (3). A drive mechanism (5) is provided on the surface of the column (2). A drive box (6) is fixedly installed on the back of the processing table (1). A moving mechanism (7) is provided in the inner cavity of the drive box (6). A vertical plate (8) is fixedly installed on the top of the moving mechanism (7). A first electric cylinder (9) is fixedly installed on the top of the back of the vertical plate (8). A laser cutting machine (10) is fixedly installed on the telescopic end of the first electric cylinder (9). The drive mechanism (5) includes a drive motor (501), which is fixedly installed on the left side of the bottom of the inner cavity of the processing table (1). The output end of the drive motor (501) is fixedly connected to a drive gear (502), and a driven gear (503) is fixedly installed on the outer surface of the column (2). The outer surface of the drive gear (502) meshes with the outer surface of the driven gear (503).

2. The laser grooving equipment for wafer fabrication according to claim 1, characterized in that: The moving mechanism (7) includes a servo motor (701), which is fixedly installed on one side of the inner cavity of the drive box (6). The output end of the servo motor (701) is fixedly connected to a threaded rod (702). The connection between the side of the threaded rod (702) away from the servo motor (701) and the inner cavity of the drive box (6) is rotatably connected by a bearing. The outer surface of the threaded rod (702) is threadedly connected to a threaded sleeve (703). The top of the threaded sleeve (703) is fixedly connected to the bottom of the upright plate (8).

3. The laser grooving equipment for wafer fabrication according to claim 1, characterized in that: A second electric cylinder (11) is fixedly installed at the front position of the bottom of the inner cavity of the processing table (1), and a push plate (12) is fixedly installed at the telescopic end of the second electric cylinder (11).

4. The laser grooving equipment for wafer fabrication according to claim 3, characterized in that: The bottom of the inner cavity of the wafer positioning groove (4) is provided with a first through hole (13) for use with the push plate (12), and the top of the processing table (1) is provided with a second through hole (14) for use with the turntable (3).

5. The laser grooving equipment for wafer fabrication according to claim 2, characterized in that: The bottom of the threaded sleeve (703) is fixedly connected to a slider (15), and the bottom of the inner cavity of the drive box (6) is provided with a groove (16) for use with the slider (15). The outer surface of the slider (15) is slidably connected to the inner surface of the groove (16).

6. The laser grooving equipment for wafer fabrication according to claim 1, characterized in that: The top of the drive box (6) is provided with a through slot for use with the upright plate (8), and the back of the drive box (6) is fixedly connected with a maintenance plate by screws.

7. The laser grooving equipment for wafer fabrication according to claim 1, characterized in that: A battery box is fixedly installed on the right side of the bottom of the inner cavity of the processing table (1), and a storage battery is provided in the inner cavity of the battery box.

8. The laser grooving equipment for wafer fabrication according to claim 1, characterized in that: The front of the processing table (1) is movably connected to a box door via a hinge, and a control panel is provided on the front of the box door.

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