Wafer grinding head and wafer grinding equipment

Abstract

The utility model provides a wafer grinding head and wafer grinding equipment wherein the wafer grinding head comprises: a grinding head body, the bottom of which is provided with a mounting groove; the cooling part is arranged in the mounting groove, a cooling channel and an adsorption channel are formed in the cooling part, the cooling part is used for adsorbing the wafer through the adsorption channel, and the cooling channel is used for reducing the temperature of the wafer; and the heating element is arranged in the mounting groove, and the heating element is used for heating the wafer. According to the wafer grinding head provided by the utility model, the cooling piece and the heating piece are arranged in the grinding head body and are used for adjusting the temperature of the surface of the wafer when the wafer is ground, so that the condition that the temperature of the surface of the wafer is too high or too low is avoided, and the grinding efficiency of the wafer is improved.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit manufacturing technology in the semiconductor industry, and in particular to a wafer grinding head and wafer grinding equipment. Background Technology

[0002] Chemical mechanical polishing (CMP), also known as chemical mechanical planarization, is a process technology for globally planarizing the surface of a wafer. During the polishing process, the wafer rotates on the polishing table under the action of polishing components. With the help of chemical polishing agents, the material in the uneven areas of the wafer surface is removed through mechanical and chemical etching, thereby achieving the goal of global planarization.

[0003] Existing grinding machines can use temperature sensors to detect the surface temperature of the wafer during grinding, but they cannot control the wafer surface temperature. When the wafer is ground on the grinding pad, the surface temperature of the grinding pad increases with the grinding time. When the temperature is too high, the grinding pad needs to be cooled with water. However, using water to cool the grinding pad can lead to inaccurate temperature control of the wafer, which will greatly affect the grinding efficiency. Utility Model Content

[0004] The purpose of this invention is to provide a wafer grinding head and wafer grinding equipment, which can adjust the wafer temperature during the wafer grinding process, thereby improving the efficiency of wafer grinding.

[0005] To achieve the above objectives, in a first aspect, this utility model provides a wafer grinding head, comprising:

[0006] The grinding head body has a mounting groove at its bottom;

[0007] A cooling component is disposed in the mounting groove. The cooling component has a cooling channel and an adsorption channel. The cooling component is used to adsorb the wafer through the adsorption channel, and the cooling channel is used to reduce the temperature of the wafer.

[0008] A heating element is disposed in the mounting groove, and the heating element is used to heat the wafer.

[0009] The beneficial effects of the wafer grinding head provided by this utility model are as follows: by setting a cooling component and a heating component in the grinding head body, the temperature of the wafer surface is adjusted during wafer grinding, avoiding the wafer surface temperature from being too high or too low, thereby improving the grinding efficiency of the wafer.

[0010] In some embodiments, the bottom of the cooling element is an adsorption surface, and a plurality of adsorption holes are formed on the adsorption surface, the adsorption holes being connected to the adsorption channel. Its advantage is that when adsorption pressure is provided through the adsorption channel, the adsorption surface can adsorb the wafer, thereby achieving wafer fixation.

[0011] In some embodiments, a cooling port is provided on the top of the cooling component, and the cooling port is in communication with the cooling channel;

[0012] When cooling of the wafer is required, cooling gas flows through the cooling port into the cooling channel to lower the wafer's temperature. The beneficial effect is that the cooling gas can enter the cooling channel through the cooling port, and within the cooling channel, the cooling gas cools the adsorption surface, thereby achieving cooling of the wafer that is in contact with the adsorption surface.

[0013] In some embodiments, the cooling element is a disc-shaped structure, and the cooling channel is an arc-shaped groove channel, with several cooling channels of different diameters spaced apart on the cooling element. The advantage is that by opening cooling channels of different diameters spaced apart on the cooling element, uniformity in cooling the wafer is ensured.

[0014] In some embodiments, the wafer grinding head also includes a capping disk;

[0015] The adsorption channel is an arc-shaped groove channel;

[0016] The sealing plate is disposed in the mounting groove and covers the adsorption channel and the cooling port. The sealing plate has a first through hole corresponding to the adsorption channel, and the first through hole communicates with the adsorption channel. The sealing plate has a second through hole corresponding to the cooling port, and the second through hole communicates with the cooling channel.

[0017] In some embodiments, the heating element includes a retaining ring and a heating wire;

[0018] The retaining ring is located in the mounting groove and sleeved on the cooling component, and the open ring has a retaining groove;

[0019] The heating wire is disposed in the slot and is used to heat the wafer.

[0020] In some embodiments, the wafer grinding head further includes a connector and an adjustment component;

[0021] The adjusting member is movably disposed on the grinding head body, and one end of the adjusting member extends into the mounting groove;

[0022] The connector is located in the mounting groove and connected to one end of the adjusting member;

[0023] The retaining ring is connected to the connector;

[0024] When the adjusting component moves, it can drive the retaining ring to move axially along the grinding head body.

[0025] In some embodiments, the wafer grinding head further includes a temperature sensor;

[0026] The bottom of the cooling component has a receiving groove, and the temperature sensor is located in the receiving groove to detect the temperature of the wafer.

[0027] In some embodiments, the wafer grinding head further includes a controller electrically connected to the temperature sensor;

[0028] The controller is used to control the operation of the heating element or the cooling element so that the temperature of the wafer reaches a preset temperature.

[0029] In a second aspect, embodiments of the present invention provide a wafer polishing apparatus, including a support base, a polishing pad, and the aforementioned wafer polishing head;

[0030] The grinding pad is disposed on the support base;

[0031] The wafer grinding head and the grinding pad are spaced apart.

[0032] The beneficial effects of the wafer grinding equipment provided by this utility model are as follows: by setting cooling and heating elements on the wafer grinding head, the wafer temperature can be regulated, avoiding excessively high or low wafer temperatures, thereby ensuring the grinding efficiency of the wafer. Attached Figure Description

[0033] Figure 1 An exploded view of the wafer grinding head provided in the embodiments of this utility model;

[0034] Figure 2 This is a schematic diagram of the structure of the grinding head body in an embodiment of the present invention;

[0035] Figure 3 A schematic diagram of the structure of the cooling component provided in the embodiment of this utility model;

[0036] Figure 4 An assembly drawing of the present invention showing the heating element fitted onto the cooling element in an embodiment;

[0037] Figure 5 A schematic diagram of the structure after the cover plate and the cooling component are connected in an embodiment of this utility model;

[0038] Figure 6 A schematic diagram of the structure of the heating element provided in the embodiment of this utility model;

[0039] Figure 7A cross-sectional view of the adjusting member and connecting member after they are assembled into the grinding head body according to an embodiment of this utility model;

[0040] Figure 8 This is a schematic diagram of the structure of a wafer grinding equipment provided in an embodiment of this utility model.

[0041] Icon labels:

[0042] 1. Grinding head body; 11. Mounting groove; 12. Third through hole; 2. Cooling component; 21. Cooling channel; 22. Adsorption channel; 23. Adsorption surface; 24. Adsorption hole; 3. Heating component; 31. Snap ring; 311. Snap groove; 32. Heating wire; 4. Cover plate; 41. First through hole; 42. Second through hole; 5. Connector; 6. Adjusting component; 10. Wafer grinding head; 20. Support base; 30. Grinding pad; 40. Liquid supply component. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art to which this utility model pertains. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed following the word and its equivalents, but does not exclude other elements or objects. Unless otherwise specified, the term "connection" as used herein can refer to a direct connection or an indirect connection, i.e., a connection through an intermediate object.

[0044] To address the problems existing in the prior art, embodiments of this utility model provide a wafer grinding head, as shown in the reference. Figures 1 to 3 As shown, the wafer grinding head includes a grinding head body 1, a cooling element 2, and a heating element 3. The grinding head body 1 has a mounting groove 11 at its bottom, which is a circular recessed structure. The cooling element 2 is disposed within the mounting groove 11 and has a cooling channel 21 and an adsorption channel 22. The cooling element 2 is used to adsorb the wafer through the adsorption channel 22, and the cooling channel 21 is used to reduce the temperature of the wafer. The heating element 3 is disposed within the mounting groove 11 and is used to heat the wafer.

[0045] In this embodiment, the cooling element 2 and the heating element 3 are provided inside the grinding head body 1 to adjust the temperature of the wafer surface during grinding, thereby avoiding excessively high or low wafer surface temperatures and improving the grinding efficiency of the wafer.

[0046] In some embodiments, reference Figure 1 , Figure 3 and Figure 4 As shown, the cooling component 2 has a disc-shaped structure, and the bottom of the cooling component 2 is an adsorption surface 23. The adsorption surface 23 is provided with a plurality of adsorption holes 24, and the adsorption holes 24 are connected to the adsorption channel 22.

[0047] In this embodiment, the adsorption channel 22 can be connected to an external gas supply device through an air inlet pipe. The gas supply device is used to provide gas so that the adsorption surface 23 can adsorb and fix the wafer.

[0048] In some embodiments, the top of the cooling component 2 is provided with a cooling port, which is connected to the cooling channel 21 so that the cooling channel 21 has a groove-shaped structure. The cooling port can be connected to a cooling gas pipe, which is connected to an external cooling device for supplying cooling gas.

[0049] In this embodiment, when the wafer needs to be cooled, the cooling device provides cooling gas. The cooling gas is delivered to the cooling port through the cooling gas pipe and flows into the cooling channel 21 to reduce the temperature of the wafer located on the adsorption surface 23.

[0050] Furthermore, the cooling component 2 has a disc-shaped structure, and the cooling channel 21 is a circular channel opened inside the cooling component 2. Several cooling channels 21 with different diameters are arranged at intervals in the cooling component 2.

[0051] In this embodiment, cooling channels 21 of different diameters are provided at intervals on the cooling element 2 to ensure uniformity in cooling the wafer.

[0052] refer to Figure 3 and Figure 5 As shown, in some embodiments, the adsorption channel 22 is an arc-shaped groove channel, and the wafer grinding head also includes a cover plate 4. The cover plate 4 is disposed in the mounting groove 11 and covers the adsorption channel 22 and the cooling port. The cover plate 4 has a first through hole 41 corresponding to the adsorption channel 22, and the first through hole 41 communicates with the adsorption channel 22. The cover plate 4 has a second through hole 42 corresponding to the cooling port, and the second through hole 42 communicates with the cooling channel 21.

[0053] In this embodiment, the sealing plate 4 can be welded to the top of the cooling component 2. One end of the air inlet pipe can be connected to the first through hole 41, and the other end of the air inlet pipe can be connected to an external air supply device, thereby supplying air to the adsorption channel 22. In addition, one end of the cooling air supply pipe can be connected to the second through hole 42, and the other end of the cooling air supply pipe can be connected to a cooling device, thereby providing cooling air to the cooling conduction.

[0054] In some embodiments, the cooling element 2 and the cover plate 4 may be configured as an integral structure.

[0055] refer to Figure 1 and Figure 6 As shown, in some embodiments, the heating element 3 includes a retaining ring 31 and a heating wire 32. The retaining ring 31 is located in the mounting groove 11 and sleeved on the cooling element 2. A retaining groove 311 is formed on the open ring, and the heating wire 32 is disposed in the retaining groove 311 for heating the wafer.

[0056] In this embodiment, an annular groove 311 is formed on the outer wall of the retaining ring 31. The width of the groove 311 is larger than the diameter of the heating wire 32, so that the heating wire 32 can be wound multiple times within the groove 311. The two ends of the heating wire 32 are electrically connected to an external power source, which supplies power to the heating wire 32, enabling the heating wire 32 to generate heat on the wafer through electromagnetic induction. Specifically, the external power source can provide alternating current with an adjustable frequency. The alternating current generates an alternating magnetic field on the metal film wafer, which can induce eddy currents in the metal film and heat the wafer, thereby increasing the wafer temperature.

[0057] In some embodiments, a plurality of slots 311 are provided at intervals on the outer side wall of the retaining ring 31, and the inner diameter of each slot 311 is adapted to the diameter of the heating wire 32 so that the heating wire 32 can be snapped into the slot 311, and the two ends of the heating wire 32 are electrically connected to an external power source.

[0058] Further, refer to Figure 2 As shown, a third through hole 12 is provided on the top of the grinding head body 1, and the third through hole 12 is connected to the mounting groove 11.

[0059] In this embodiment, by opening a third through hole 12 on the top of the grinding head body 1, it is convenient to connect the air inlet pipe, the cooling air pipe and the wires to the external device.

[0060] refer to Figure 1 and Figure 7As shown, in some embodiments, the wafer grinding head further includes a connector 5 and an adjusting member 6. The adjusting member 6 is movably disposed on the grinding head body 1, and one end of the adjusting member 6 extends into the mounting groove 11. The connector 5 is located in the mounting groove 11 and connected to one end of the adjusting member 6. The retaining ring 31 is connected to the connector 5. When the adjusting member 6 is movable, it can drive the retaining ring 31 to move along the axial direction of the grinding head body 1.

[0061] In this embodiment, the adjusting member 6 can be an adjusting bolt, the connecting member 5 is a connecting ring, and the grinding head body 1 has a through hole. The adjusting member 6 is movably connected to the grinding head body 1 through the through hole. One end of the adjusting member 6 is threadedly connected to the connecting member 5. When the adjusting member 6 is rotated, the retaining ring 31 can be moved up and down along the axial direction of the grinding head body 1 to adjust the height of the retaining ring 31, which facilitates better heating of the wafer.

[0062] In some embodiments, the adjusting member 6 may be an electric push rod, one end of which extends into the mounting groove 11 and connects to the connecting member 5. When the electric push rod is working, it can drive the retaining ring 31 to move up and down.

[0063] Furthermore, in order to reduce the weight of the connector 5, the connector 5 can be designed as a hollow structure.

[0064] In some embodiments, the wafer grinding head further includes a temperature sensor, and the bottom of the cooling element 2 has a receiving groove, and the temperature sensor is disposed in the receiving groove for detecting the temperature of the wafer.

[0065] In this embodiment, the temperature sensor may be a thermocouple sensor, which is embedded in the cavity to continuously detect the temperature of the wafer.

[0066] Furthermore, the wafer grinding head also includes a controller electrically connected to the temperature sensor, the controller being used to control the operation of the heating element 3 or the cooling element 2 so that the temperature of the wafer reaches a preset temperature.

[0067] Specifically, the controller is electrically connected to the temperature sensor, the gas supply device, the cooling device, and the power supply. The temperature sensor feeds back the detected temperature information to the controller. When the temperature detected by the temperature sensor is higher than a preset temperature, the controller controls the cooling device to operate, so as to input cooling gas into the cooling channel 21 to reduce the temperature of the wafer. When the temperature detected by the temperature sensor is lower than the preset temperature, the controller controls the power supply to operate, so that the heating element 3 heats the wafer to increase the wafer temperature.

[0068] In another embodiment of this utility model, a wafer grinding device is provided, with reference to... Figure 1 and Figure 8 As shown, the wafer polishing equipment includes a liquid supply unit 40, a support base 20, a polishing pad 30, and the aforementioned wafer polishing head 10. The polishing pad 30 is mounted on the support base 20, which can rotate the polishing pad 30. The wafer polishing head 10 is connected to a drive mechanism and is spaced vertically from the polishing pad 30, with the polishing head 10 positioned above the polishing pad 30. The drive mechanism is used to bring the wafer polishing head 10 into contact with the polishing pad 30 and provide a certain pressure. The liquid supply unit 40 is located above the polishing pad 30 and is used to spray polishing fluid onto the polishing pad 30.

[0069] In this embodiment, by providing the cooling element 2 and the heating element 3 on the wafer grinding head 10, the wafer temperature is regulated to avoid excessively high or low wafer temperatures, thereby ensuring the grinding efficiency of the wafer.

[0070] The above description is merely a specific implementation of the embodiments of this application, but the protection scope of the embodiments of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the embodiments of this application should be covered within the protection scope of the embodiments of this application. Therefore, the protection scope of the embodiments of this application should be determined by the protection scope of the claims.

Claims

1. A wafer grinding head, characterized in that, include: The grinding head body has a mounting groove at its bottom; A cooling component is disposed in the mounting groove. The cooling component has a cooling channel and an adsorption channel. The cooling component is used to adsorb the wafer through the adsorption channel, and the cooling channel is used to reduce the temperature of the wafer. A heating element is disposed within the mounting groove, and the heating element is used to heat the wafer; The top of the cooling component has a cooling port, which is connected to the cooling channel so that the cooling channel has a groove-shaped structure. When it is necessary to cool the wafer, cooling gas flows through the cooling port into the cooling channel to reduce the temperature of the wafer; The heating element includes a retaining ring and a heating wire; The retaining ring is located in the mounting groove and sleeved on the cooling component, and the retaining ring has a retaining groove; The heating wire is disposed in the slot and is used to heat the wafer.

2. The wafer grinding head according to claim 1, characterized in that, The bottom of the cooling component is an adsorption surface, and a plurality of adsorption holes are formed on the adsorption surface, which are connected to the adsorption channel.

3. The wafer grinding head according to claim 1, characterized in that, The cooling component has a disc-shaped structure, and the cooling channel is an arc-shaped groove channel. Several cooling channels with different diameters are spaced apart on the cooling component.

4. The wafer grinding head according to claim 1, characterized in that, It also includes a sealing plate; The adsorption channel is an arc-shaped groove channel; The sealing plate is disposed in the mounting groove and covers the adsorption channel and the cooling port. The sealing plate has a first through hole corresponding to the adsorption channel, and the first through hole communicates with the adsorption channel. The sealing plate has a second through hole corresponding to the cooling port, and the second through hole communicates with the cooling channel.

5. The wafer grinding head according to claim 1, characterized in that, It also includes connectors and adjusting components; The adjusting member is movably disposed on the grinding head body, and one end of the adjusting member extends into the mounting groove; The connector is located in the mounting groove and connected to one end of the adjusting member; The retaining ring is connected to the connector; When the adjusting component moves, it can drive the retaining ring to move axially along the grinding head body.

6. The wafer grinding head according to claim 1, characterized in that, It also includes a temperature sensor; The bottom of the cooling component has a receiving groove, and the temperature sensor is located in the receiving groove to detect the temperature of the wafer.

7. The wafer grinding head according to claim 6, characterized in that, It also includes a controller electrically connected to the temperature sensor; The controller is used to control the operation of the heating element or the cooling element so that the temperature of the wafer reaches a preset temperature.

8. A wafer grinding apparatus, characterized in that, Includes a support base, a polishing pad, and a wafer polishing head as described in any one of claims 1 to 7; The grinding pad is disposed on the support base; The wafer grinding head and the grinding pad are spaced apart.

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