Polishing machine sliding block capable of reducing wafer falling
By improving the structure of the polishing machine slider, increasing the wafer contact area, and using a sloping surface for buffering, the problem of wafer flipping instability was solved, improving flipping stability, reducing wear, lowering the risk of dropping, and increasing production efficiency.
Patent Information
- Application Number
- CN202423160775.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2025-11-11
- Estimated Expiration
- 2034-12-20
AI Technical Summary
The existing polishing machine slider is unstable during wafer flipping, resulting in large lateral sliding displacement of the wafer, severe wear on the contact surface, easy jamming and falling, and affecting the production line yield.
Design a slider structure including a support block, an elongated connecting part, and a clamping part. The top of the support block is inclined, the clamping part and the elongated connecting part are connected by a groove, and the bottom surface of the clamping part is inclined. This increases the contact area with the wafer and reduces the sliding speed by buffering and limiting the movement through the inclined structure.
It improves the stability of wafer flipping, reduces lateral and longitudinal sliding during sliding, reduces slider wear, avoids the risk of wafer flipping jams and drops, and improves production yield.
Smart Images
Figure CN223532207U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a polishing machine slider that reduces wafer drop. Background Technology
[0002] In semiconductor manufacturing processes, due to process requirements, after the wafer is polished, it needs to be flipped, that is, flipped from a horizontal position to a vertical position, to facilitate its transfer and cleaning. During the flipping, a slider supports the wafer to ensure that it remains stable in the vertical position.
[0003] The original slider design suffered from instability during wafer flipping: During wafer flipping, the wafer experienced significant lateral sliding displacement, and the slider's curved surface resulted in a small contact area with the wafer. Over prolonged use, this led to severe wear on the contact surface, creating grooves and causing the wafer to jam during sliding. When flipping stopped, the wafer's upper edge generated significant inertia, making it prone to over-flipping and even risking wafer drop. Failed flipping required manual wafer retrieval, posing a risk of wafer breakage and impacting production line yield. Utility Model Content
[0004] The purpose of this invention is to provide a polishing machine slider that reduces wafer drop, thereby solving the problem of abnormal alarms caused by frequent wafer drop during flipping.
[0005] To achieve the above-mentioned utility model objectives, this utility model provides a polishing machine slider that reduces wafer drop, including a support block, an elongated connecting part, and a clamping part, wherein the clamping part is connected to one side of the support block through the elongated connecting part;
[0006] The top of the support block is a slope, and the connection between the support block and the elongated connecting part is the highest position.
[0007] As a further improvement of the utility model, the bottom surface of the clamping part is an inclined surface, and the end closest to the bottom surface of the elongated connecting part is the lowest position.
[0008] This invention relates to a polishing machine slider that reduces wafer drop. A slot is formed between the clamping part and the extended connecting part. During polishing, the wafer is horizontally inserted into the slot. After polishing, the wafer flips to a vertical position with the slider. The sloping structure at the top of the support block reduces lateral and longitudinal sliding of the wafer during flipping and also buffers the sliding speed, reducing the likelihood of the wafer falling. Furthermore, compared to the curved surface of existing clamping parts, the structure of the support block increases the contact area with the wafer, reducing wear on the support block surface and preventing grooves from forming on the support block after long-term use, which could cause jamming during wafer flipping.
[0009] The advantages of this new polishing machine slider for reducing wafer drop compared to existing technologies are as follows:
[0010] The easily sliding curved surface structure has been eliminated, reducing the lateral and longitudinal sliding of the wafer. It slides directly into the angled slot by radial displacement, optimizing the contact area between the slider and the wafer, increasing friction, which can slow down the wafer sliding speed and improve the stability of the wafer sliding and flipping. Attached Figure Description
[0011] Figure 1 This is a schematic diagram of a polishing machine slider structure that reduces wafer drop according to the present invention;
[0012] Figure 2 This is a schematic diagram of a wafer in a horizontal position.
[0013] Figure 3 This is a schematic diagram of a wafer in a vertical position.
[0014] Figure 4 This is a schematic diagram of the original slider structure;
[0015] Figure 5 This is a schematic diagram of an abnormal wafer flipping state;
[0016] Figure 6 This is a schematic diagram of an abnormal wafer flipping state. Detailed Implementation
[0017] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings.
[0018] like Figure 1-3 As shown, a polishing machine slider for reducing wafer drop according to the present invention includes a support block 1, an elongated connecting part 2, and a clamping part 3. The clamping part 3 is connected to one side of the support block 1 through the elongated connecting part 2.
[0019] The top of the support block 1 is a slope, and the connection between the support block 1 and the elongated connecting part 2 is the highest position.
[0020] like Figure 3-6 As shown, when the original slider flips the wafer, the wafer is prone to slide laterally along the arc surface 61 of the clamping part 6. When the flipping stops, the upper edge of the wafer will generate a large flipping inertia, resulting in over-flipping. The wafer eventually falls off the slider. After the flipping fails, the wafer must be manually retrieved.
[0021] This utility model discloses a polishing machine slider that reduces wafer drop. The material clamping part 3 and the elongated connecting part 2 form a clamping groove, such as... Figure 2 As shown, when the wafer is in the polishing state, it is horizontally inserted into the slot. After polishing is completed, as... Figure 3As shown, the wafer flips to a vertical position as the slider rotates. The sloping structure at the top of the support block 1 reduces lateral and longitudinal sliding of the wafer during flipping and also buffers the sliding speed, reducing the chance of the wafer falling. At the same time, compared with the arc surface 61 of the existing clamping part 6, the structure of the support block 1 increases the contact area with the wafer, reduces wear on the surface of the support block 1, and avoids jamming of the wafer flipping caused by grooves appearing on the support block 1 after long-term use.
[0022] The bottom surface 4 of the clamping section 3 is a slope, with the lowest position being the end closest to the bottom surface 4 of the elongated connecting section 2. During the wafer flipping process, if the wafer tilts due to inertia, the side of the wafer will return to its original position along the slope of the bottom surface 4 of the clamping section 3. The slope structure of the bottom surface 4 of the clamping section 3 plays a certain role in limiting and guiding the wafer flipping, further improving the stability of the wafer flipping.
[0023] The preferred embodiments of this utility model have been described in detail above, but this utility model is not limited to the embodiments described. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of this utility model, and these equivalent modifications or substitutions are all included within the scope defined by the claims of this application.
Claims
1. A polishing machine slider for reducing wafer drop, characterized in that, It includes a support block, an elongated connecting part, and a clamping part, wherein the clamping part is connected to one side of the support block through the elongated connecting part; The top of the support block is a slope, and the connection between the support block and the elongated connecting part is the highest position.
2. The polishing machine slider for reducing wafer drop as described in claim 1, characterized in that, The bottom surface of the clamping part is a slope, and the end closest to the bottom surface of the elongated connecting part is the lowest position.